Vous êtes sur la page 1sur 11

IEEE Transactions on Dielectrics and Electrical Insulation Vol. 11, No.

5; October 2004 797

The Future of Nanodielectrics in the Electrical Power


Industry
Yang Cao, Patricia C. Irwin and Karim Younsi
GE Global Research Center
Niskayuna, NY, 12309 USA

ABSTRACT
While specialty applications of nanotechnology in the photonics and electronics ar-
eas have seen a tremendous growth in the past several years, the use of nanodi-
electrics in the electrical industry (high power density and high voltage) has not
shown the same level of activity. In addition to a review of nanodielectrics, we dis-
cuss in this paper, our perspective on the current status, development needs and
future potential to build or engineer nano-structured materials for dielectric appli-
cations in the electrical power industry. Short and long-term future research and
development needs are considered from the point of view of industrial applica-
tions.
Index Terms — Nanodielectrics, nanocomposites, nano structure, dielectrics,
electrical insulation.

1 INTRODUCTION down’’research styles will continue to be fruitful with many


important engineering applications in the near future.
N ANODIELECTRICS is the study of dielectric phen-
omena and materials on the nanometric scale and the
fabrication of structures, devices and systems that have
Meanwhile, a great deal of progress has been achieved
in fabricating and assembling nanostructures to high pre-
novel dielectric properties and function because of their cision and reproducibility, producing interesting optical,
nanometric structure w1, 2x. The novel and differentiating photonic, electronic, and chemical properties w8᎐13x.
properties of these structures are developed at a critical While some of the nano structures are formed using di-
scale of matter, typically under 100 nanometers. The scope electric methods w14, 15x, the dielectric properties of these
of nanodielectrics however, can be broad and extensive w2, novel structures have not been fully explored. These ‘‘bot-
3x. Therefore, in this paper, we will use ‘‘simple’’ two- tom-up’’ structures not only provide unique opportunity
phase heterogeneous nanodielectric systems as examples for the study of dielectric phenomena at the nanometric
to discuss the long and short-term development needs and level, but also have great potential for groundbreaking ap-
applications of nanodielectrics. plication of nanodielectrics in the long term. As an exam-
ple, a giant dielectric constant of ;10 10 was reported for
Currently, the synthesis and fabrication of nanometer-
a nano silver assembly in a polymer matrix as a result of
sized particles have reached a mature state and they can
quantum confinement of the electronic wave function w16x.
be made with controlled composition and size w1x. Because
It is not difficult to speculate that its potential applica-
of their length scale and high specific surface area,
tions in energy storage and ultra sensitive transducers are
nanoparticles exhibit novel properties as compared with
tremendous.
bulk materials. A lot of research has been carried out re-
cently incorporating various nanoparticles into existing di- 2 CURRENT INDUSTRIAL
electric systems in a cost effective manner, resulting in APPLICATIONS
nanocomposites with improved benefits over conventional Two-phase heterogeneous nanodielectrics, generally
filler systems w4᎐7x. The improvements can be a combina- termed as dielectric nanocomposites, have wide applica-
tion of electrical, mechanical and thermal enhancements tions in the electrical and electronic industries. Various
w5, 6x, and can be further tailored through organic synthe- types of nanocomposites, based on insulating, semicon-
sis, material design optimization. These types of ‘‘top- ducting or metallic nanoparticles, have been developed to
meet the requirements of specific applications. For in-
stance, nanocomposites with anisotropic electrical proper-
Manuscript recei®ed on 21 April 2004, in final form 24 June 2004. ties are desirable for improving partial discharge resis-
tance of the ground wall insulation of rotating machinery.

r04r
1070-9878r r$20.00 䊚 2004 IEEE 797
798 Cao et al.: The Future of Nanodielectrics in the Electrical Power Industry

2.1 ELECTRICAL APPLICATIONS by enabling innovative design and the utilization of re-
Insulation integrity is of great importance for all-electri- newable energy resources.
cal power applications, including energy conversion, power With the ever-growing demand for compact and highly
delivery, energy storage, and power consumption w17᎐20x. efficient electric machines, the electrical insulation sys-
Nanodielectrics can enhance the reliability of current sys- tems are subjected to multiple stresses w21x with greater
tems, and more importantly, can improve their efficiency intensity, and higher repetition rate w18x. While conven-

Figure 1. a, 2-parameter Weibull statistic plot of the breakdown strength of polyimide ŽPI. nanoparticle composites at different loadings of
alumina nanoparticles. The tests were performed with a 500 vrs ramp rate. The samples were 25 ␮ m thick. The inset shows the Weibull
characteristic breakdown strength vs composition with loadings up to 10wt%. The bars in the inset correspond to the 95% Weibull confidence
limits. From the plots, slightly increase of the breakdown strength of PI with loading is observed; b, Breakdown strength plot for PI silica
nanoparticle composites tested under the same conditions.

798 r04r
1070-9878r r$20.00 䊚 2004 IEEE
IEEE Transactions on Dielectrics and Electrical Insulation Vol. 11, No. 5; October 2004 799

tionally filled polymeric insulation offers improved electri-


cal discharge resistance, thermal expansion coefficient ad-
justment, mechanical robustness and heat dissipation, it is
often achieved at the cost of reduced dielectric perfor-
mance w17, 19, 20x. The operational field strength is the
fundamental design limitation for high voltage systems. It
is possible to push back this design barrier by utilizing
nanodielectrics. Several typical nanocomposite systems for
application in this area, which illustrate the current situa-
tion, will now be discussed.

2.1.1 NANOCOMPOSITES WITH


INSULATING NANOPARTICLES
An important type of nanocomposite is one with insu-
lating nanoparticles such as silica and alumina. As shown
in Figure 1, the electrical breakdown strength of a poly-
imide ŽPI. is not affected by these types of nanofillers for
loadings up to 10wt%. The study of the conduction mech-
anism of these nanocomposites w5x indicates a field en-
hanced, thermally assisted ionic-hopping conduction cur-
Figure 3. Comparison of the conductivity of pure and nano-filled
rent
polyimides. a, conductivity at 100⬚C; b, conductivity at 150⬚C. Circles
denote the bulk conductivity of unfilled polyimides. 2wt% silica
U eEd nanofilled nanocomposites show a significant reduction in conductiv-
js 2 nd ␯ exp y sinh Ž 1.
kT 2 kT ity at both 100⬚C and 150⬚C Ždiamond symbols. whereas 10wt%
nanofilled composites are less dramatic in conductivity changes
Žsquare symbols.. More work is needed to understand the complex
as described earlier w22᎐24x, where U is the activation nature of temperature and filler loading effects on the bulk conduc-
energy, d is the hopping distance, and ␯ is the attempt- tivity of a nanocomposites.
to-escape frequency, n is the carrier density, k is the
Boltzmann constant, T is the temperature and e is the
electronic charge. Figure 2 gives a 3D curve fitting of the
steady-state current density of 10wt% silica filled PI bulk conductivity due to the increased defects and poor
nanocomposites to equation Ž1.. Normally the addition of fillerrpolymer interactions. Interestingly it is found that
conventional micro sized fillers would result in increase of 2wt% silica nanofiller shows a significant reduction in
conductivity at both 100⬚C and 150⬚C whereas 10 wt%
nanofilled composites are less dramatic in conductivity
changes, indicating a complex nature of temperature and
fill loading effects on the bulk conductivity of a nanocom-
posites ŽFigure 3..

In addition to the enhancement of partial discharge or


corona resistance ŽFigure 4., the addition of nanoparticles
shows a marked improvement in ductility and yield
strength, shown in Figure 5, as well as certain improve-
ment of the scratch resistance and thermal conductivity
w6x. The improvement of the mechanical properties is im-
portant, because an insulating material might be subjected
to constant vibration or abrasion by the double power fre-
quency magnetic force andror high shear stress under
rapid thermal loading w25x. As a result, existing high tem-
perature thermosetting insulation, which is inherently
brittle, quite often undergoes voidrcrack formation or de-
lamination under these mechanical stresses with subse-
quent electrical discharge and catastrophic failure.
Figure 2. Field and temperature dependence of the steady-state Overall, these nanocomposites show combined electri-
current density for a PI nanocomposite with 10wt% nano silica. The
3D curve fitting of the data to equation Ž1. gives an activation energy cal, mechanical and thermal improvements over conven-
of 0.68 eV and a hopping distance of 4.3 nm w5x. tional filler systems.

r04r
1070-9878r r$20.00 䊚 2004 IEEE 799
800 Cao et al.: The Future of Nanodielectrics in the Electrical Power Industry

Figure 6. ac breakdown strengths for PI with various nanofillers at


5wt% loading. The tests were performed with 500 vrs ramp rate on
samples of 25 ␮ m thick. The remarkably low breakdown strength of
Figure 4. The enhancement of partial discharge resistance of PI
SiC nanocomposites may be caused by the aggregation of SiC
with a nanofiller at 10 wt% loading. The dotted lines represent the
nanoparticles.
95% confidence limits.

Further investigation shows that for polyethylene filled


with micro and nano ZnO fillers, the decrease in resistiv-
ity starts at the same critical interparticle distance l c of
about 40nm ŽFigure 2 of w26x.. The critical interparticle
distance can be written as

4␲ 1r2

lc s r ž /
3
pc y2 Ž 3.

by assuming a spherical particle shape with a radius of r,


and a uniform size distribution and dispersion. Below the
critical interparticle distance l c , LDPErZnO nanocom-
Figure 5. Example of tensile experiments showing an increase in posites exhibit a smaller decrease in resistivity with filler
ductility of a polymeric system through the addition of nanoparticles. concentration when compared with conventional compos-
‘‘X’’ denotes a mechanical failure during the tensile stress test. An
unfilled polyimide fails at 2% strain and 6=10 7 Pa whereas a 5wt%
ites w26x.
alumina filled PI does not fail until 11% strain and 1.2=10 8 Pa. The The addition of conventional TiO 2 filler to polyethy-
Young’s modulus of the two materials is initially similar but the
nanofilled sample showed significant increase in elongation prior to
lene has been investigated for DC power transmission ap-
failure. plications w28x, in which the space charge accumulation due
to the large thermal gradient across the cable may cause
2.1.2 NANOCOMPOSITES WITH NONLINEAR catastrophic failure of the cable insulation system during
NANOPARTICLES polarity reversal. It was also shown recently that TiO 2
nanoparticles could mitigate such space charge accumula-
Even though the short term breakdown strength is re- tion in an epoxy system, as compared with conventional
duced for nanocomposites with nanofillers shown in Fig- TiO 2 fillers w27x.
ure 6 ŽTiO 2 , ZnO, BaTiO 3 , SiC., they form an important
class of dielectric materials with special dielectric proper- 2.1.3 ANISOTROPIC NANOCOMPOSITES
ties. For instance, SiC and BaTiO 3 composites have been
employed as field grading materials and ZnO is an excel- Anisotropic materials and structures inherently have
lent surge arrestor additive because their electrical prop- unique properties and applications. Polymerrlayered sili-
erties Žconductivity andror permittivity. are strongly field cate nanocomposites represent good examples of such
dependent. Recent studies indicate that nanocomposites materials with attractive properties, including high me-
based on these materials have unique dielectric properties chanical moduli, heat resistance, barrier behavior, ion-ex-
w26, 27x. LDPErZnO nanocomposites exhibit a lower per- change capability. A comprehensive review of the prepa-
colation threshold than classical percolation theory, which ration, characterization, properties and processing of
describes a power law dependence of conductivity on filler polymerrlayered silicate nanocomposites can be found in
w29x. Technologies have been developed so that layered
concentration p above a percolation threshold of pc w26x
n silicates can be incorporated into most types of polymers
␴ A Ž py pc . Ž 2. and nanocomposites can be formed through melt-mixing

800 r04r
1070-9878r r$20.00 䊚 2004 IEEE
IEEE Transactions on Dielectrics and Electrical Insulation Vol. 11, No. 5; October 2004 801

Figure 7. Chemical structure of phyllosilicates, a typical nanoclay whose crystal structure consists of layers made up of two tetrahedrally
coordinated silicon atoms fused to an edge-shared octahedral sheet of either aluminum or magnesium hydroxide w29x. The layer thickness is
about 1 nm, and the lateral dimensions of these layers may vary from 30 nm to more than several microns. There are three different types of
thermodynamically achievable polymerrlayered silicate nanocomposites, namely, intercalated, intercalated-and-flocculated and exfoliated w29x.
With proper orientation, such layered silicate nanocomposites have remarkable anisotropic properties as shown schematically, i.e., vertical
barrier Žcorona resistance . properties and lateral energy dissipation through confined ionic conduction. Such anisotropic electrical and thermal
properties are of great use for rotating machine insulation.

w30x. As shown in Figure 7, the barrier behavior of their tures, low k dielectrics Žbelow 3 as compared with 4.5 for
layered structure and the adjustable anisotropic ionic con- silicon dioxide. are needed to reduce the signal transition
ductivity between the layers w31x for such polymerrlayered time, power consumption as well as crosstalk through ca-
silicate nanocomposites make them particularly interest- pacitive coupling w36᎐38x. Nanoporous dielectrics com-
ing for electrical applications. posed of an insulating matrix embedded with pores of
Mica based insulation systems are used extensively in nanometer size are candidates. For example, silica aero-
HV rotating machines for the exceptional partial dis- gelsrxerogels having closed pores with porosity as high as
charge resistance. The discharge resistance lies perpen- 90% while retaining good dielectric properties have been
dicular to the alumino-silicate plane axis due to the strong developed w39x. The relative permittivity can be controlled
in-plane bonding. However, the graphitic, layered mica through porosity adjustment and can be as low as 1.3. The
structure can delaminate under thermal-mechanical challenges lie in the compatibility with current systems and
stresses, forming voids to support partial discharge. As a in the mechanical robustness to chemical-mechanical pol-
result, the design field for micarepoxy or micarpolyester ishing ŽCMP .. Research shows that polymer based
systems is limited to ; 3 kVrmm w17x. Fully exfoliated nanoporous low-k materials used in a spin-on process
and orientated Žfor example through shear orientation w32, compete with modified chemical vapor deposition ŽCVD.
33x. silicate nanocomposites can potentially be engineered films w40, 41x. In addition to interconnections in the high-
with good discharge resistance and with improved me- density integration, advanced packaging requires also low
chanical properties. Moreover, supramolecules with simi- permittivity dielectrics for RF applications w42x. Mean-
lar structure have been fabricated in the laboratory, tar- while, polymer-ceramic nanocomposites with high dielec-
geting anisotropic ionic conduction, for applications such tric constant are needed for ‘‘System-On-Package’’ and
as fuel cells w34x. embedded capacitors applications w43᎐45x.
Carbon nanotubes potentially can find their applica-
tions in electric power engineering also. Because of their 2.3 OTHER APPLICATIONS
high aspect ratio, randomly distributed carbon nanotubes
There are many other applications of nanodielectrics
can induce significant property change at only 1᎐5% load-
such as ionic conductors, nanoceramics for electronics ap-
ing w35x. Compared with conventional carbon black filler,
plications w46x and effective EMIrEMC ŽElectromagnetic
properly distributed and oriented nanotubes within the
InterferencerCompatibility. shielding. High frequency
matrix will lead to many applications, including field grad-
EMIrEMC designs require better solutions than conven-
ing.
tional metallic shielding in electronic enclosures in order
to attenuate unwanted electromagnetic radiation without
2.2 ELECTRONIC APPLICATIONS reflection. For wave propagation in inhomogeneous me-
The electronics industry is driving a significant portion dia, RF ‘‘resonant cavity’’ reflections due to the mismatch
of the nanocomposites research and development. With of the intrinsic impedances at the enclosure interface are
the continuing miniaturization of microelectronic struc- problematic. Dissipative dielectric absorbers with con-

r04r
1070-9878r r$20.00 䊚 2004 IEEE 801
802 Cao et al.: The Future of Nanodielectrics in the Electrical Power Industry

Figure 8. Stealth-like dielectric absorbing materials with controlled


permittivity Ž ⑀ ., permeability Ž ␮ . and conductivity Ž ␴ . can offer more
flexible EMIrEMC designs than traditional enclosure confinement
by attenuating incident electromagnetic radiation. A conventional
metallic enclosure can be viewed as a resonant cavity because of re-
flections by mismatching of the intrinsic impedances Ž Ž ␮r⑀ . .. Soft
'
ferrite nanoparticles are useful not only for permeability adjustment
but also for the enhancement of electromagnetic absorption at high
frequency.

trolled permittivity, permeability and conductivity can po-


tentially offer near stealth-like functionality to eliminate
undesirable RF reflections, as shown schematically in Fig-
ure 8. Such development will have wide applications in
the electronics, telecommunications and automotive in-
Figure 9. Thermally stimulated current ŽTSC. data for polyimide
dustries. nanocomposites with various filler loading. Poling was performed with
a field of 20 kVrmm at 250⬚C for 10 minutes. A heating rate of
3 DEVELOPMENT NEEDS AND 2⬚Crmin was used during the TSC acquisition. Since dynamic
thermo-mechanical analysis ŽDTMA. shows no major dipolar relax-
FUTURE TRENDS ation in this temperature range the peaks are likely to correspond to
the release of trapped carriers by the thermally stimulated process.
It would be desirable if nanocomposites could be fabri-
The shift of the TSC peak temperature indicates deep trapping of
cated with tailored dielectric properties, i.e., controllable carriers by the incorporated nanoparticles.
permittivity and conductivity as a function of temperature,
electric field and frequency. As particles shrink to nano-
metric sizes the interface becomes increasingly important temperature reduces to about 210⬚C. Because a higher
and ultimately totally dominant. The understanding of the peak current temperature usually corresponds to a higher
role interface in nanodielectric is far from being satisfac- activation energy for trapped charges, deeper trapping is
tory. Success is limited to a qualitative level for even a introduced by incorporating nano silica fillers.
simple nanostructure w1, 47x and, quite often, classical ap- In addition to such physical modifications, nanofillers
proximations such as the effective medium method are can induce chemical modifications. A nano TiO 2 filler in
used in practice w45x. Therefore, a good understanding of polyethylene induces a dielectric response by a slight oxi-
the interaction between nanoparticle and matrix, inter- dation of the polymer such that a previously not visible
play between particles, and associated transport phenom- dielectric response is seen clearly on the relaxation maps
ena is of great importance. of polyethylene w48x. Dielectric models need to be devel-
Incorporating particles of nanometric scale has ren- oped to better describe such physicalrchemical modifica-
dered interesting physical, chemical modifications of the tions by nanofillers as well as the dipolar activities at the
matrix dielectric system. Again, if we take silica-filled PI interface and the associated transport phenomena.
nanocomposites Ž nanocomposites with insulating While these approaches through incorporation of
nanoparticles . as an example ŽFigure 9., main thermally nanoparticles will make progressive improvements in im-
stimulated current measurements show clearly the shift of portant engineering fields in a cost effective way, they have
the peak current temperature from 185⬚C for pure poly- limitations such as wide particle size distribution, particle
imides to about 200⬚C for polyimides with 2 wt% nanofiller agglomeration, etc. Nanocomposites based on semicon-
and almost 220⬚C for polyimides with 5 wt% nanofiller. ductive nanofillers like TiO 2 have been studied exten-
When the filler loading increases to 10 wt%, the peak sively not only because of a chemically active surface, but

802 r04r
1070-9878r r$20.00 䊚 2004 IEEE
IEEE Transactions on Dielectrics and Electrical Insulation Vol. 11, No. 5; October 2004 803

also because of their electronic and optical confinement model’’ - a real crystalline compound consisting of a sys-
capability w1x. Semiconductive particles Žquantum dots. tem of collinear metallic strands, each of which is inter-
have been assembled into arrays using pattern-formation rupted by a series of perfectly insulating lattice defects
block co-polymers as templates w49x and more importantly, w51x. According to such a strand model, the dielectric con-
their photonicrelectronic properties can be altered with stant can be written as
the particle size, showing clearly quantization effects in
which the energy levels available for electrons and holes 1 2
⑀ f Ž qs l 0 . Ž 4.
become discretized and confined in a nanometer size 2
range. This unique property has led to many applications
in electronics, photonics and potentially dielectrics also. where q s is the Fermi-Thomas screening wave vector of
In 1965, Gor’kov and Eliashberg, predicted an enormously the conduction electrons and l 0 is the strand length.
enhanced polarizability of a sufficiently minute metallic Many attempts failed because of the poor control of the
particle having discrete energy levels w50x. However, such structure at the nanoscale w52᎐56x. It is reported only re-
prediction had to be corrected for the depolarization field cently that, using a polymer nano template Žwith 15 nm
within the particle and the results of high dielectric con- pores., researchers w16x were able to fabricate and assem-
stant were interpreted using an ‘‘interrupted-strand ble a silver nanowire as shown in Figure 10. By applying a
bias, the wire turns into an assembly of ultrafine metal
particles with localized electronic wave function. A dielec-
tric constant of 10 10 was reported for such a dielectric-

Figure 10. Formation of an assembly of ultrafine metal particles


connected to each other to form an interrupted metal strand by the
application of electric field to an assembly of isolated minute metal
particles. The strong electrostatic force due to the high electric field
Ž10 6 Vrcm. in the nanometric air gap between the particles causes
them to deform in the direction of the electric field and finally to
attain a percolation configuration with the formation of a metal
filament. The electronic wave functions of these assembly are local-
ized due to lattice defects at the interfaces between the particles w16x.
a, Transmission electron micrograph ŽTEM. of nanowires; b, diame-
ter of the wire, 15 nm in the magnified view of the wire of Ža.. From
the figure it is evident that the wire is formed by the metal nanopar-
ticles; c, TEM photo of the wire after the application of voltage pulse; Figure 11. Capacitance and resistance under bias. a, 20 Hz; b, 1
d, filamentary growth of ultra fine particles. KHz, indicating a giant ⑀ of 10 10 w16x.

r04r
1070-9878r r$20.00 䊚 2004 IEEE 803
804 Cao et al.: The Future of Nanodielectrics in the Electrical Power Industry

dipolar polarization, it can be developed into an ultra sen-


sitive airborne sensor.
Dielectrics research should also benefit from dramatic
progress in nanotechnology where supramolecular struc-
tures have been assembled for novel properties w57x. For
example, an electrostatic self-assembled monolayer
ŽESAM. technique for fabricating non-centrosymmetric
structures has been reported w58x. Such a technique re-
sults in tens of microns thick films with large, stable sec-
ond order nonlinear optical responses without electric
field poling. As shown in Figure 12, a multi-layer film is
formed by alternately immersing the substrate in aqueous
solutions of a polyanion and a polycation, with one or both
the polyanion and polycation containing polarizable chro-
mophores. Similar self-assembly methods have been de-
veloped to generate superlattices with oriented giant
Figure 12. Electrostatic self-assembled monolayer ŽESAM. tech- dipoles for electro-optic applications w59,60x. Nanostruc-
nique for fabricating non-centro symmetric structures w58x. tured materials with giant electrostriction as well as or-
ganic composite actuator material with high k have also
conducting particle assembly w16x. Extremely high dielec- been reported w61,62x.
tric constant materials would be useful as ultracapacitors While current research is focused on filled systems, in
for energy storage. In addition, because of the surface the long run, nanostructured dielectric materials and de-
sensitivity of such a nano assembly and because of its ul- vices will have many intentionally designed novel dielec-
tra fast response, since it relies on electronic rather than tric properties and have wide applications. Figure 13 shows

Figure 13. Time scale in the development of nanodielectrics with novel propertiesrapplications for illustration only: a, TEM photo of alumina
nano particles dispersion; b, a bright-field TEM detail of the PSroctadecyl-ammonium silicate intercalate and the simulation of the structure: a
styrene 12mer and the octadecyl-ammonium surfactant molecule w63x; c, SEM photo of carbon nanotube filled PolyŽmethyl methacrylate . with
unique mechanical, electrical and thermal properties w64x; d, Proposed supramoleculesrassembly with design-in dielectric properties. Some of
the structures taken from w8, 65x.

804 r04r
1070-9878r r$20.00 䊚 2004 IEEE
IEEE Transactions on Dielectrics and Electrical Insulation Vol. 11, No. 5; October 2004 805

schematically our perspective for the time scale in the de- electrics , IEEE Conf. Electr. Insul. Dielectr. Phenomena, Kitch-
ener, Canada, pp. 92᎐99, 2001.
velopment of nanodielectrics. Other than heterogeneous w4x J. K. Nelson, J. C. Fothergill, L.A. Dissado, and W. Peasgood,
nanodielectric systems as discussed in this paper, homoge- ‘‘Towards an Understanding of Nanometric Dielectrics’’, IEEE
neous nanodielectrics such as ferroelectrics materials with Conf. Electr. Insul. Dielectr. Phenomena, pp. 295᎐298, 2002.
nanosized domains have also many interesting properties w5x Y. Cao and P. C. Irwin, ‘‘Electrical Conduction in Polyimide
Nanocomposites’’, IEEE Conf. Electr. Insul. Dielectr. Phenom-
for us to explore. ena, pp. 116᎐119, Albuquerque, USA, 2003.
w6x P. C. Irwin, Y. Cao, A. Bansal and L. S. Schadler, ‘‘Thermal and
4 CONCLUSIONS Mechanical Properties of Polyimide Nanocomposites’’, IEEE
Conf. Electr. Insul. Dielectr. Phenomena, pp. 120᎐123, Albu-

B ASED on recent progress in the nanodielectrics field


and the electrical power industry needs, we have
summarized in the present paper our perspective on the
w7x
querque, USA, 2003.
C. Zilg, D. Kaempfer, R. Thomann, R. Muelhaupt and G. C.
Montanari, ‘‘Electrical Properties of Polymer Nanocomposites
Based Upon Organophilic Layered Silicates’’, IEEE Conf.
development, applications and time scale in the develop- Electr. Insul. Dielectr. Phenomena, pp. 546᎐550, Albuquerque,
ment of nanodielectrics in the areas shown schematically USA, 2003.
in Figure 13. w8x G. Wegner, ‘‘Functional Polymers’’, Acta Mater, Vol. 48, pp.
253᎐262, 2000.
In the short term, incorporation of nanoparticles will w9x George M. Whitesides and Bartosz Grzybowski, ‘‘Self-assembly
make combined progressive electrical, mechanical and at All Scales’’, Science, Vol. 295, pp. 2418᎐2421, 2002.
thermal improvements in important engineering fields, re- w10x Babak Amir Parviz, Declan Ryan and George M. Whitesides,
‘‘Using Self-assembly for the Fabrication of Nano-scale Elec-
sulting in many interesting applications such as enamel tronic and Photonic Device’’, IEEE Trans Advanced Packing,
insulation, electrical grading, EMI shielding, in a cost ef- Vol. 26, pp. 233᎐241, 2003.
fective manner. w11x M. T. Bohr, ‘‘Nanotechnology Goals and Challenges for Elec-
tronic Applications’’, IEEE Trans. Nanotechnol., Vol. 1, pp.
With proper materialrprocessing developments, 56᎐62, 2002.
nanocomposites based on preformed Žmineral or syn- w12x A. P. Alivisatos, ‘‘Semiconductor Clusters, Nanocrystals, and
thetic. anisotropic fillers will have unique anisotropic Quantum Dots’’, Science, Vol. 271, pp. 933᎐937, 1996.
w13x M. Li, H. Schnablegger, and S. Mann, ‘‘Coupled Synthesis and
properties suitable for applications such as electrical dis-
Self-assembly of Nanoparticles to Give Structures with Con-
charge resistant machine insulation. trolled Organization’’, Nature, Vol. 402, pp. 393᎐395, 1999.
In the long run, with the improving of understanding of w14x H. O. Jacobs and George M. Whitesides, ‘‘Submicrometer Pat-
terning of Charge in Thin-Film Electrets’’, Science, Vol. 291, pp.
dielectric physics at nanoscale, nanostructured dielectric 1763᎐1765, 2001.
materialsrdevices could be engineered with many novel w15x E. Schaeffer, T. Thurn-Albrecht, T. P. Russell and U. Steiner,
dielectric properties and wide applications in energy stor- ‘‘Electrically Induced Structure Formation and Pattern Trans-
age, electro-optic, electro-strictive, and insulating areas. fer’’, Nature, Vol. 403, pp. 874᎐877, 2000.
w16x S. K. Saha, ‘‘Observation of Giant Dielectric Constant in an As-
Fundamental understanding of dielectric properties at sembly of Ultrafine Ag Particles’’, Phys. Rev. B, Vol. 69, pp.
the nanoscale level is of great importance in the develop- 1254161᎐125464, 2004.
w17x C. Mayoux, Whitehead Memorial Lecture, ‘‘Degradation of In-
ment of functional nanodielectrics for the electric power
sulating Materials Under Electrical Stress’’, IEEE Trans. Di-
industry. More than ever such development needs will re- electr. Electr. Insul., Vol. 7 no. 5, pp. 590᎐601, 2000.
quire close cooperation between industry and academia. w18x J. A. Oliver and G. C. Stone, ‘‘Implications for the Application
Major original equipment manufacturers for example are of Adjustable Speed Drive Electronics to Motor Stator Winding
Insulation’’, IEEE Electr. Insul. Mag., Vol. 11, No. 4, pp. 32᎐36,
already investing tremendous research and development 1995.
effort and resources to position themselves for the coming w19x Engineering Dielectrics, Vol IIA, Electrical Properties of Solid
challenging decade. Insulating Materials: Molecular Structure and Electrical Beha®ior,
R. Bartnikas and R. M. Eichorn, eds, ASTM STP 783, Philadel-
phia, chapter 8, 1983.
ACKNOWLEDGMENTS w20x M. Kaufhold, K. Schafer, K. Bauer, A. Bethge, J. Risse, ‘‘Inter-
face Phenomena in Stator Winding Insulation - Challenges in
The authors are indebted to the kind help and guidance Design, Diagnosis, and Service Experience’’, IEEE Electr. Insul.
from the editors, Prof. L.A. Dissado and Prof. J.C. Mag., Vol. 18, No. 2, pp. 27᎐36, 2002.
Fothergill. The authors would like to thank Drs. Randall w21x V. K. Agarwal, H. M. Banfor, B. S. Bernstein, E. L. Brancato,
Carter, George Gao, Clive Reed, Nancy Frost, Michael R. A. Fouracre, G. C. Monanari, J. L. Parpal, J. N Seguin, D.
M. Ryder, J. Tanaka, ‘‘The Mysteries of Multifactor Aging’’,
Takemori, Michael Minnick, and Mr. Michael Brown for IEEE Electrical Insulation Magazine, Vol. 1, No. 3, 37᎐43, 1995.
support and helpful discussions. w22x M. A. Lampert and P. Mark, Current Injection in Solids, Aca-
demic, London, UK, 1970.
w23x M. Ieda, ‘‘Electrical Conduction and Carrier Traps in Polymeric
REFERENCES Materials’’, IEEE Trans Electr. Insul., Vol. 19, pp. 162᎐178, 1984.
w1x M-I. Baraton, Eds, Synthesis, Functionalization and Surface w24x L. A. Dissado and J. C. Fothergill, Electrical Degradation and
Treatment of Nanoparticles, American Scientific Publishers, Los Breakdown in Polymers, Peter Peregrinus, London, UK, 1992.
Angeles, USA, 2003. w25x G. Griffith, S. Tucker, J. Milsom and G. Stone, ‘‘Problems with
w2x T. J. Lewis, ‘‘Nanometric Dielectrics’’, IEEE Trans. Dielectr. Modern Air-cooled Generator Stator Winding Insulation’’, IEEE
Electr. Insul., Vol. 1, pp. 812-25, 1994. Electr. Insul. Mag., Vol. 16, No. 6, 6᎐10, 2000.
w3x M. F. Frechette, et al., ‘‘Introductory remarks on Nanodi- w26x J. Hong, L. S. Schadler, R. W. Siegel and E. Martensson, ‘‘Re-

r04r
1070-9878r r$20.00 䊚 2004 IEEE 805
806 Cao et al.: The Future of Nanodielectrics in the Electrical Power Industry

scaled Electrical Properties of ZnOrlow Density Polyethylene tures: Electrical Properties and Modeling’’, IEEE Trans Di-
Nanocomposites’’, Appl. Phys. Lett., Vol. 82, pp. 1956᎐1958, electr. Electr. Insul., Vol. 9, pp. 809᎐828, 2002.
2003. w48x P. Fruebling, D. Blischke, R. Gerhard-Multhaupt and M. S.
w27x J. Keith Nelson and John C. Fothergill, ‘‘Internal Charge Be- Khalil, ‘‘Complete Relaxation Map of Polyethylene: Filler-in-
haviour of Nanocomposites’’, Nanotechnology, Vol. 15, pp. duced Chemical Modifications as Dielectric Probes’’, J. Phys. D:
586᎐595, 2004. Appl. Phys., Vol. 34, pp. 3051᎐3057, 2001.
w28x M. S. Khalil, ‘‘On the Effect of TiO 2 Additive on DC Conduc- w49x National Research Council, Condensed-Matter and Materials
tivity and Morphology of Polyethylene’’, Int. J. Polym. Mater., Physics, Basic Research for Tomorrow’s Technology, National
Vol. 41, pp. 171᎐183, 1998. Academy Press, Washington D.C., USA, 1999.
w29x Suprakas Sinha Ray, Masami Okamoto, ‘‘Polymerrlayered Sili- w50x L. P. Gor’kov and G. M. Eliashberg, ‘‘Minute Metallic Particles
cate Nanocomposites: A Review from Preparation to Processing’’, in an Electromagnetic Field’’, Sov. Phys. JETP, Vol. 21, pp.
Prog. Polym. Sci., Vol. 28, pp. 1539᎐1641, 2003. 940᎐947, 1965.
w30x R. A. Vaia, H. Ishii, E. P. Giannelis, ‘‘Synthesis and Properties w51x M. J. Rice and J. Bernasconi, ‘‘Gor’kov-Eliashberg Effect in
of Two-dimensional Nanostructures by Direct Intercalation of One-Dimensional Metals?’’, Phys. Rev. Lett., Vol. 29, pp.
Polymer Melts in Layered Silicates’’, Chem. Mater, Vol. 5, pp. 113᎐116, 1972.
1694-6, 1993. w52x B. Roy and D. Chakravorty, ‘‘High Dielectric Permittivity in
w31x Tae-Woo Lee, O Ok Park, Jae-Min Hong, Dong Young Kim, Glass-ceramic Metal Nanocomposites’’, J. Mater. Res., Vol. 8,
Young Chul Kim, ‘‘Carrier Mobilities of Polymerrorgano-clay pp. 1206᎐1208, 1993.
Nanocomposite Electroluminescent Devices’’, Thin Solid Films, w53x T. K. Kundu and D. Chakravorty, ‘‘Nanocomposites of Lead-
Vol. 393, pp. 347᎐351, 2001. zirconate-titanate Glass Ceramics and Metallic Silver’’, Appl.
w32x Matthew M. Malwitz, Sheng Lin-Gibson, Erik K. Hobbie, Paul Phys. Lett., Vol. 67, 2732, 1995.
D. Butler, Gudrun Schmidt, ‘‘Orientation of Platelets in Multi- w54x P. K. Mukherjee and D. Chakravorty, ‘‘Growth of Silver
layered Nanocomposite Polymer Films’’, J. Polymer Sci.: Part B: Nanowires Using Mica Structure as a Template and Ultrahigh
Polymer Phys., Vol. 41, pp. 3237᎐3248, 2003. Dielectric Permittivity of the Nanocomposite’’, J. Mater. Res.,
w33x Clive Reed, private communication. Vol. 17, pp. 3127᎐3132, 2002.
w34x Yunfeng Lu, Yi Yang, Alan Sellinger, Mengcheng Lu, Jinman w55x G. Rubio, N. Agrait, and S. Vieira, ‘‘Atomic-Sized Metallic
Huang, Hongyou Fan, Raid Haddad, Gabriel Lopez, Alan R. Contacts: Mechanical Properties and Electronic Transport’’,
Burns, Darryl Y. Sasaki, John Shelnutt and C. Jeffrey Brinkers, Phys. Rev. Lett., Vol. 76, pp. 2302᎐2305,1996.
‘‘Self-assembly of Mesoscopically Ordered Chromatic Polydi- w56x G. C. Das and D. Chakravorty, ‘‘Memory Switching in Glass-
acetylenersilica Nanocomposites’’, Nature, Vol. 410, pp 913᎐917, metal Particulate Systems’’, J. Appl. Phys., Vol. 51, pp.
2001. 3896᎐3901, 1980.
w35x L. Utracki, Presentation at Nanodielectrics Workshop, IEEE w57x Samuel I. Stupp, Martin U. Pralle, Gregory N. Tew, Leiming Li,
Conf. Electr. Insul. Dielectr. Phenomena, Albuquerque, USA, Mehmet Sayar, and Eugene R. Zubarev, ‘‘Self-assembly of Or-
2003. ganic Nano-Objects into Functional Materials’’, MARS Bulletin,
w36x A. S. Brown, ‘‘Fast Films’’, IEEE Spectrum, pp. 36᎐40, Febru- pp. 42᎐48, April 2000.
ary 2003. w58x X. Wang, S. Balasubramanian, L. Li, X. Jiang, D. J. Sandman 1,
w37x G. Maier, ‘‘The Search for low-k and ultra-low-k dielectrics: How M. F. Rubner, J. Kumar and S. K. Tripathy, ‘‘Self-assembled
Far Can You Get with Polymers? Part I: Background’’, IEEE Second Order Nonlinear Optical Multilayer Azo Polymer’’,
EI Magazine, Vol. 20, No. 2, pp. 6᎐17, 2004. Macromol. Rapid Commun., Vol. 18, pp. 451᎐459, 1997.
w38x International Technology Roadmap for Semiconductors ŽITRS.. w59x Peiwang Zhu, Milko E. van der Boom, Hu Kang, Guennadi
http:rrwww.itrs.net Evmenenko, Pulak Dutta, and Tobin J. Marks, ‘‘Realization of
w39x Y. Cao, Z. F. Xia, Q. Li, L. Y. Chen and B. Zhou, ‘‘Study of Expeditious Layer-by-Layer Siloxane-Based Self-assembly as an
Porous Dielectrics as Electret Materials’’, IEEE Trans Dielectr. Efficient Route to Structurally Regular Acentric Superlattices
Electr. Insul., Vol. 5, pp. 58᎐62, 1998. with Large Electro-optic Responses’’, Chem. Mater., Vol. 14, pp.
w40x 4982᎐4989, 2002.
Shou-Yi Chang, Hui-Lin Chang, Yung-Cheng Lu, Syun-Ming
w60x Taek Seung Lee, Changduk Yang, Won Ho Park, ‘‘Synthesis and
Jang, Su-Jien Lin, Mong-Song Liang, ‘‘Mechanical Property
Evaluation of Multilevel-interconnect Structure’’, Thin Solid Electrostatic Multilayer Assembly of An Acridine-containing
Film, in press, 2004. Polymer with Properties of An Optical Sensor’’, Macromol.
w41x Rapid Commun., Vol. 21, pp. 951᎐955, 2000.
Chyi-Ming Leu, Yao-Te Chang, and Kung-Hwa Wei, ‘‘Polyim-
w61x W. Lehmann, H. Skupin, C. Tolksdorf, E. Gebhard, R. Zentel,
ide-Side-Chain Tethered Polyhedral Oligomeric Silsesquioxane
Nanocomposites for Low-Dielectric Film Applications’’, Chem. P. Krueger, M. Loesche & F. Kremer, ‘‘Giant Lateral Elec-
Mater., Vol. 15, pp. 3721᎐3727, 2003. trostriction in Ferroelectric Liquid-crystalline Elastomers’’, Na-
w42x ture, Vol. 410, pp. 447᎐450, 2001.
Technical Report of Agere Systems Inc., Allentown, PA, USA.
w62x Q. M. Zhang, Hengfeng Li, Martin Poh, Feng Xia, Z.-Y. Cheng,
w43x H. Windlass, P. M. Raj, D. Balaraman, S. K. Bhattacharrya and
Haisheng Xu, & Cheng Huang, An All-Organic Composite Ac-
Rao R. Tummala, ‘‘Processing of Polymer-ceramic Nanocom-
tuator Material with a High Dielectric Constant , Nature, Vol.
posites for System-on-package Applications’’, IEEE 51st Elec-
419, pp. 284᎐287, 2002.
tronic Components and Technology Conf., pp. 1201᎐1206, 2001.
w63x D. B. Zax, D.-K. Yang, R. A. Santos, H. Hegemann, E. P. Gian-
w44x Y. Rao, J. Yue and C. P. Wong, ‘‘Material Characterization of
nelis, and E. Manias, ‘‘Dynamical Heterogeneity in Nanocon-
High Dielectric Constant Polymer-Ceramic Composite for Em-
fined PolyŽstyrene. Chains’’, J. Chem. Phys., Vol. 112, pp.
bedded Capacitor to RF Application’’, International Symposium
2945᎐2951, 2000.
on Advanced Packaging Materials: Processes, Properties and In-
w64x F. Du, J. E. Fischer and, K. I. Winey, ‘‘Coagulation Method for
terfaces, pp. 280᎐285, 2001.
Preparing Single-Walled Carbon NanotuberPoly Ž methyl
w45x Y. Rao, Jianmin Qu, T. Marinis and C. P. Wong, ‘‘A Precise methacrylate . Composites and Their Modulus, Electrical Con-
Numerical Predication of Effective Dielectric Constant for Poly- ductivity, and Thermal Stability’’, Journal of Polymer Science:
mer Ceramic Composite Based on Effective-medium Theory’’, Part B: Polymer Physics, Vol. 41, 3333᎐3338, 2003.
IEEE Trans Components and Packaging, Vol. 23, pp. 680᎐683,
w65x Alberto Ciferri, ‘‘Supramolecular Polymerizations’’, Macromol.
2000.
Rapid Commun. Vol. 23, pp. 511᎐529, 2003.
w46x R. Popielarz, C. K. Chiang, R. Nozaki, and J. Obrzut, ‘‘Dielec-
Editor’s note: Web sites references are no longer used in IEEE journals be-
tric Properties of PolymerrFerroelectric Ceramic Composites
cause they are not permanent and therefore are not archi®al. Howe®er, since
from 100 Hz to 10 GHz’’, Macromolecules, Vol. 34, pp. the nanodielectric area is still emerging at the present time some rele®ant in-
5910᎐5915, 2001. formation can only be found on web sites and therefore an exception is made
w47x E. Tuncer, Y. V. Serdyuk and S.M. Gubanski, ‘‘Dielectric Mix- for this paper.

806 r04r
1070-9878r r$20.00 䊚 2004 IEEE
IEEE Transactions on Dielectrics and Electrical Insulation Vol. 11, No. 5; October 2004 807

r04r
1070-9878r r$20.00 䊚 2004 IEEE 807

Vous aimerez peut-être aussi