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MACHININH
PROCESSES
(MEE-377)
{Assignment}
Name-Nishant
Adm. No.- 16SCME101167
Batch-2
Submitted to- Dr. S.Kennedy
Q. Working principle of the following processes: -
1. Chemo-mechanical machining
Chemo-mechanical machining is basically used to polish the
silicon wafer. The reaction between
CHEMICAL + MECHANICAL = CHEMO-MECHANICAL
Principle-
CMP uses both chemical and mechanical type or material
removal mechanisms
Chemical reaction to soften material and then mechanically
polish off this layer.
Mechanical removal takes place due to abrading.
Limitations-
This process is used for only flat surfaces.
CMP is not deterministic in nature.
End point of CMP is a difficult to control for a desired thickness
Disadvantages
–Fixtures can be expensive
–High capital investment
–Can’t process blind holes.
Disadvantages-
It is difficult to implement Magnetic abrasive finishing in mass
production operation.
Not applicable for some ordinary finishing task where
conventional finishing technique can be easily implemented.
Time consuming process.
The cost of process is high
Q. Comparison between the above processes