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Single-end operational
amplifier (OPA)
Kanazawa University
Microelectronics Research Lab.
Akio Kitagawa
9.1 Specification of OPA
2
Parameters of OPA
Parameter Design constraint Description
VDD [V] max/typ/min Power supply voltage
IBias [uA] max Total bias current
Open loop gain Ad [dB] min Differential gain
Sampling frequency fS [Hz] max For discrete CMFB OPA
GBP [Hz] min Unity gain frequency
SR [V/us] min >> 2*VDD/fS
Settling time [us] max < 2/fs
Phase margin [deg] min > 60 deg.
Common-mode input range [V] min/max
Differential input range [V] min/max
Output swing [V] min/max > Differential input range
Input-referred noise level [uV @Hz] max In frequency range
Common-mode voltage VCM [V] typ
Input-referred offset VOS [V] max
CMRR min Common Mode Rejection Ratio
PSRR min Power Supply Rejection Ratio
3
Load resistance, capacitance [ohm, F] typ Possible external load
Specification of typical commercial OPA
Parameter Ideal Bipolar CMOS
value Standard High Standard High
performance performance
Ad [dB] ∞ 100 120 90
fu [MHz] ∞ 1 200 2 30
VOS [V] 0 2m 10 < 10m 0.2m
Iin [A] 0 100n 1n 0.1p 0.1p
CMRR [dB] ∞ 100 120 75
SR [V/us] ∞ 0.4 2000 3 20
Noise level [nV/Hz½] 0 10 4 25
IBias [A] 0 1m 1m 1
4
Format of the specification sheet
Parameter Target Simulation Measured value Unit Comment
value
min. typ. max. min. typ. max.
VDD 1.8 V
Bias current 312 uA No input
Open loop gain 82 dB
GBP 320M Hz Load=100fF
SR 244 V/us Load=100fF
Settling time 24n us Error 1%
CMRR -185 dB
PSRR -150 dB
Noise level 50 nV/Hz0.5 @1MHz
Common- upper -0.5 V
mode input
lower 0.9 V
range
6
AC characteristic of OPA
Placed by the phase
RF C F
compensation at u < p2
|A|
Vin
+
u(GBP)
+
A Av 1
Vin
-
- d -20dB/DEC
p2
+
CL Vout
p1
Small-signal
-40dB/DEC
V1 RF C F V2 Placed by CF
Rout 1 Rout 2 Rout 3 Depending on CL
Vin
+
+
CL Vout
+
0
Vin
- + + -90
+ -
Ad (Vin -Vin ) AVV1 V2 -180
1 1
Vout V2 V2
1 j Rout 3C L 1 j / p 2 The phase margin is decreased
for the very large CL. 7
9.2 Analysis of 2-stage CS OPA
8
Configuration of 2-stage OPA
M3 M4 M6
Cc
in
- M1 M2 in
+ out
Bias M7
M5a M5b
Total gain
g m1 g m 6 2 1 6 1
Ad AV 1 AV 2
( g ds 2 g ds 4 )( g ds 6 g ds 7 ) (2 4 )(6 7 ) I DS1 I DS 6
10
Phase compensation (1)
Constraint for p2 and u
Cannot used for the NFB circuit
0
V -20dB/Dec
-40dB/Dec
0dB Phase compensation
p1’ p1 u’ p2 u
・p2 ・p2
p1 p 2 u
(bad stability) Margin
p1 u p 2
(good stability) Phase rotation
11
Phase compensation (2)
Constraint for z and u
p 2 2 u
Constraint for p2 and z
z 10 u
(The generation of zero is inevitable in the
V -20dB/Dec
feedback phase compensation circuit.)
-40dB/Dec
0dB
p1 u p2 Z
Phase margin ° p1 u p 2 z
2 times
10 times 12
Miller capacitance phase
compensation technique
c
-
V1 V2
+
gs6 L
o1 o2
In the frequency range more than u, the input signal and output signal
level is comparable, approximately, AV2=Gm2・Ro2= -gm6・Ro2≒ -1.
14
Constraint of the phase compensation
60°Phase margin Separation between z and u
p 2 2 u Z 10 u
g m6 g m1 g m6 g m1
2 10
CL CC CC CC
Phase compensation g m 6 10 g m1
Constraint CC 0.2C L
15
Control of the zero (1)
The phase compensation using CC requires the constraint
gm6 > 10gm1 to remove the influence of ωZ. this method
requires the very large gm6. RC phase compensation can be
used to evade this problem.
ZC
add Rc
1 1
RO g m (1 )
RO g m (1 j CC ) vout ZC gm
vout gm
vin R
vin 1 j CC RO 1 O
ZC
16
Control of the zero (2)
ZC
1
RO g m (1 )
vout ZC gm
vin R
1 O
ZC
1
RO g m {1 j CC ( RC )}
gm
1 1 j CC ( RO RC )
Z RO g m {1 j / Z }
1
CC ( RC ) 1 j / p 3
gm
Feedback path
-A
in out
iin j C (vin vout )
vout A vin
=
iin
j C (1 A)
vout
19
Indirect phase compensation (2)
Source follower feedback buffer Common-gate feedback buffer
VDD
v1
vout
CC
VBias
VSS
Advantages:
• High SR, High p2, High u, small Cc
Disadvantage:
• Additional power consumption
20
Indirect phase compensation (3)
100/1 Common gate feedback buffer
100/1
100/2
Long L will help the adjustment
100/1 100/1 of the output offset voltage.
100/2
50/2 50/2
200/4 200/4
50/2
The cascode current mirror load is used in place of the feedback buffer.
There is no additional power consumption.
21
9.3 Optimization of MOSFET size
22
ISS and SR
Vin+-Vin-
t out
VCap I DS 5
t
CC c
t in
+
in
-
VCap -Iout
1 I DS 5
IDS5
VCap
CC I DS 5 dt
CC
t Bias
I DS 5
SR
CC
SR is limited by the current ISS (IDS5).
23
Saturation of M4 (1)
GS4 DS4 GS6
VDS 3 VGS 3 VTp VDS 3 VTp
M3 always operates in the saturation region. out
c
+ -
in in
VDS 4 VGS 6
If VGS 4 VGS 6 ,
Bias
VDS 4 VGS 6 VGS 4 VGS 4 VTp
M4 always operates in the saturation region.
If VGS 4 VGS 6 ,
GS4 GS6
W
I DS 6 L 6
out
I DS 4 W c
+ -
L 4 in in
VGS 5 VGS 7
W Bias
I DS 7 L 7 GS5 GS7
I DS 5 W
L 5
25
Saturation of M4 (3)
I DS 6 I DS 7
より
I DS 5 2 I DS 4
GS4 GS6
I DS 6 I DS 7
2
I DS 4 I DS 5 out
c
+ -
in in
Saturation condition of M4
W W
Bias
L 6 L 7
2 GS5 GS7
W W
L 4 L 5
26
Systematic offset (1)
Systematic offset
IDS6 Current balance of M6 and M7
Random offset
Process variation of VT
VA VB
IDS7
27
Systematic offset (2)
3
I DS 3 (V A VTp ) 2
2 This constraint is same as the
5 saturation constraint of M4.
I DS 5 (VBias VTn ) 2
2
6 6 7
I DS 6 (VB VTp ) 2 2
2 3 5
7
I DS 7 (VBias VTn ) 2 W W
2
L 6 L 7
When V A VB , 2
W W
I DS 6 I DS 7
p.27 L 4 L 5
I DS 5
I DS 3
2
28
Input-referred noise (1)
Channel noise model of MOSFET
Kn K p W1 L1 1
Flicker noise V (f)
n
2
(1 )
W1 L1COX K n W3 L3 f
NOTE: Assuming that the differential pair consists n-ch MOFET
and current mirror load consists p-ch MOSFETs.
30
Mismatch of MOSFETs by the
V V
process variation
V OS _ 1 2 GS 1 GS 2 Vout
I DS 5 I DS 5
VTn1 VTn 2
1 2
I DS 5 1
(VTn1 VTn 2 ) [1 ]
1 2
Vin1 – Vin2
1 I DS 5 1 2
(VTn1 VTn 2 ) [ ]
2 1 1 VOS
VGS 1 VTn1
VTn1 2 [ ]1 2 VTn1 2 OV 1 [ ]1 2
2 1 2 1
VOS _ 3 4 VGS 3 VGS 4
VGS 3 VTp 3
VTn 3 4 [ ]3 4 VTn 3 4 OV 3 [ ]3 4
2 2 1
OV 1 g
VOS VTn1 2 [ ]1 2 m 3 [VTn 3 4 OV 3 [ ]3 4 ]
2 g m1 2 31
Optimization for the noise and
process variation
• Thermal noise
– Differential pair MOSFETs: Large W/L
– Current mirror load MOSFETs: Small W/L
• Flicker noise
– Differential pair MOSFETs: Large W*L
– Current mirror load MOSFETs: Large L (Large W causes the
degradation of the voltage gain.)
• Mismatch offset
– Differential pair MOSFETs: Large W*L
– Current mirror load MOSFETs: Small W/L (Small gm3/gm1)
NOTE: Consider that the L and W influences the frequency response too.
32
9.4 Design example of a single-
end OPA
33
Specification
Power supply voltage VDD/VSS 0.9/-0.9 V
Open loop gain Ad > 35 dB
GBP fu 200 MHz
Phase margin PM 60°
Slew rate SR > 100 V/us
Load capacitance CL 1 pF
Output voltage swing Voutp-p > 1.2 V
Maximum common-mode voltage Vinmax > 0.6 V
Minimum common-mode voltage Vinmin < -0.25 V
Input-referred noise vn2 < 50 uV (BW=0.1Hz~1MHz)
Power consumption PW < 1 mW
34
Parameters of MOSFET
35
Design constraints
(1) Phase compensation -1 (6) Open loop gain/
(4) Maximum common-mode input Phase compensation
VDD
MC3
Iref M3 M4 M6
Cc Vout
Vin +
Vin - M1 M2
MC1
CL 1pF
(3) GBP MC2
M7
M5a M5b MC4
VSS
(5) Minimum common-mode input
(2) Slew Rate (7) Systematic offset
36
Cc, ISS
(1) Phase compensation -1
Load capacitance CL = 1 [pF]
Phase compensation constraint CC 0.2C L
CC = 0.2 [pF]
(2) SR
I DS 5
SR
CC
I DS 5 SR CC 100 M [V / s ] 0.2 p[ F ] 20 [
uA]
I DS 5
I DS 3 I DS 4 I DS 1 I DS 2 10
[uA]
2
37
M1, M2
(3) GBP
g m1
u
CC
g m1 CC u 0.2 p 2 200 M 251[ S ]
38
M3, M4
(4) Maximum common-mode input (Saturation
of M1)
Vinmax VDD OV 3 VTp VTn
2 I DS 3
OV 3 VDD VTp VTn Vinmax
3
2 I DS 3
3
(VDD VTp VTn Vinmax ) 2
W W 2 I DS 3 1
L 3 L 4 p COX (VDD VTp VTn Vin )
max 2
2 10u 1
6
4
46.2 10 (0.9 0.42 0.45 0.6) 2
39
M5
(5) Minimum common-mode input
(Saturation of M5)
Vinmin VSS VTn OV 1 OV 5
2 I DS 5
OV 5 Vinmin OV 1 VTn VSS
5
2 I DS 1 2 10u
OV 1 0.068
[
V]
1 6
215 10 20
2 I DS 5
5
(Vinmin OV 1 VTn VSS ) 2
W 2 I DS 5 1
L 5 nCOX (Vin OV 1 VTn VSS )
min 2
2 20u 1
6
10 40
215 10 (0.25 0.068 0.45 0.9) 2
M6 (without zero cancellation)
(6) Phase compensation -2
If VGS 4 VGS 6
,
g m 6 10 g m1 I DS 6 6
10 2 1 I DS 1 I DS 4 4
10 2 215 10 6 20 10u g m 6 2 6 I DS 6
2.93
(mS ) 4
6 g m6
2 I DS 4
W g m6 4
Bias current:
L 6 p COX 2 I DS 4
192 2.93m 46.2 10 6 4
I DS 6 6 I DS 4 10 480uA
4 4 46.2 10 6 2 10u
192 41
M7
(7) Systematic offset (Saturation of M4)
W
W 1 L
W 6
L 7 2 L 5 W
L 4
1 192
10
2 4 The circuit parameters
240 are decided. Check the
other specification.
42
Output swing
2 I DS 7 max
Vout VDD OV 6
Vmin
VSS OV 7 VSS
W
out
n COX VDD
2 I DS 6
L 7 W
p COX
2 480u L 6
0.9
215 10 6 240 2 480u
0.764 [V ] 0 .9
46.2 10 6 192
0.571 [V]
Ad AV 1 AV 2
g m1 (rds 2 // rds 4 ) g m 6 (rds 6 // rds 7 )
2 1 I DS1 2 6 I DS 6
I DS 1 (n p ) I D 6 (n p )
2 215 10 6 20 2 46.2 10 6 192
10u (0.813 0.590) 480u (0.813 0.590)
20.9 4.33
90.6 39 [
dB] 44
Flicker noise (1)
Kn K p W1 L1 1
V
2
nf {1 [V 2 /Hz]
}
W1 L1COX K n W3 L3 f
fu Kn K p W1 L1
NL
2
f V df
2
nf {1 } ln( f u / f l )
(frequency range f u ~ f u )
fl W1 L1COX K n W3 L3
Kn K p W1
{1 (for L1 L3
} ln( f u / f l ) )
W1 L1COX K n W3
0 Si
COX 5.4 10 3 [
F/m 2 ]
tOX
at T = 300 [K]
6
8 1 60 .8 10
NL2t 1.38 10 23 300 (1 ) f
(50 uV ) 2
NOTE: The thermal noise is reduced for larger gm1 and smaller gm3,
but the larger gm1 causes the larger W/L for M6 for the phase
compensation.
g m1 2 1 I DS1 , g m 3 2 3 I DS 3
2 I DS 3
OV 3
3
Vinmax VDD OV 3 | VTp | VTn
g m 6 10 g m1 48
Finished
50