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INA188
SBOS632 – SEPTEMBER 2015
INA188
Precision, Zero-Drift, Rail-to-Rail Out, High-Voltage Instrumentation Amplifier
1 Features 3 Description
1• Excellent DC Performance: The INA188 is a precision instrumentation amplifier
that uses TI proprietary auto-zeroing techniques to
– Low Input Offset Voltage: 55 μV (max) achieve low offset voltage, near-zero offset and gain
– Low Input Offset Drift: 0.2 μV/°C (max) drift, excellent linearity, and exceptionally low-noise
– High CMRR: 104 dB, G ≥ 10 (min) density (12 nV/√Hz) that extends down to dc.
• Low Input Noise: The INA188 is optimized to provide excellent
– 12 nV/√Hz at 1 kHz common-mode rejection of greater than 104 dB (G ≥
10). Superior common-mode and supply rejection
– 0.25 μVPP (0.1 Hz to 10 Hz) supports high-resolution, precise measurement
• Wide Supply Range: applications. The versatile three op-amp design offers
– Single Supply: 4 V to 36 V a rail-to-rail output, low-voltage operation from a 4-V
single supply as well as dual supplies up to ±18 V,
– Dual Supply: ±2 V to ±18 V
and a wide, high-impedance input range. These
• Gain Set with a Single External Resistor: specifications make this device ideal for universal
– Gain Equation: G = 1 + (50 kΩ / RG) signal measurement and sensor conditioning (such
– Gain Error: 0.007%, G = 1 as temperature or bridge applications).
– Gain Drift: 5 ppm/°C (max) G = 1 A single external resistor sets any gain from 1 to
1000. The INA188 is designed to use an industry-
• Input Voltage: (V–) + 0.1 V to (V+) – 1.5 V
standard gain equation: G = 1 + (50 kΩ / RG). The
• RFI-Filtered Inputs reference pin can be used for level-shifting in single-
• Rail-to-Rail Output supply operation or for an offset calibration.
• Low Quiescent Current: 1.4 mA The INA188 is specified over the temperature range
• Operating Temperature: –55°C to +150°C of –40°C to +125°C .
• SOIC-8 and DFN-8 Packages
Device Information
2 Applications ORDER NUMBER PACKAGE BODY SIZE
INA188 SOIC (8) 4.90 mm × 3.91 mm
• Bridge Amplifiers
INA188 WSON (8)(2) 4.00 mm × 4.00 mm
• ECG Amplifiers
(1) For all available packages, see the orderable addendum at
• Pressure Sensors the end of the data sheet.
• Medical Instrumentation (2) The DRJ package (WSON-8) is a preview device.
• Portable Instrumentation
Simplified Schematic
• Weigh Scales
V+
• Thermocouple Amplifiers
• RTD Sensor Amplifiers VIN- RFI Filter Inputs + 20 k 20 k
• Data Acquisition A1
RFI Filtered Inputs
25 k
A3 VOUT
RG 25 k +
V-
50 k:
VOUT VIN VIN u G VREF G 1
RG
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
INA188
SBOS632 – SEPTEMBER 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................. 18
2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 21
3 Description ............................................................. 1 8 Application and Implementation ........................ 27
4 Revision History..................................................... 2 8.1 Application Information............................................ 27
8.2 Typical Application .................................................. 27
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 9 Power Supply Recommendations...................... 29
6.1 Absolute Maximum Ratings ...................................... 4 10 Layout................................................................... 29
6.2 ESD Ratings.............................................................. 4 10.1 Layout Guidelines ................................................. 29
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 30
6.4 Thermal Information .................................................. 4 11 Device and Documentation Support ................. 31
6.5 Electrical Characteristics: VS = ±4 V to ±18 V (VS = 11.1 Device Support .................................................... 31
8 V to 36 V)................................................................ 5 11.2 Documentation Support ........................................ 31
6.6 Electrical Characteristics: VS = ±2 V to < ±4 V (VS = 11.3 Community Resources.......................................... 31
4 V to < 8 V)............................................................... 7 11.4 Trademarks ........................................................... 31
6.7 Typical Characteristics .............................................. 9 11.5 Electrostatic Discharge Caution ............................ 31
7 Detailed Description ............................................ 17 11.6 Glossary ................................................................ 31
7.1 Overview ................................................................. 17 12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram ....................................... 17 Information ........................................................... 32
4 Revision History
DATE REVISION NOTES
September 2015 * Initial release.
D Package
SOIC-8 DRJ Package
Top View WSON-8
Top View
RG 1 8 RG
RG 1 8 RG
VIN- 2 7 V+ Exposed
VIN- 2 7 V+
Thermal
VIN+ 3 6 VOUT
Die Pad on
VIN+ 3 6 VOUT
Underside
V- 4 5 REF
V- 4 5 REF
Pin Functions
PIN
I/O DESCRIPTION
NO. NAME
REF 5 I Reference input. This pin must be driven by low impedance or connected to ground.
RG 1, 8 — Gain setting pin. For gains greater than 1, place a gain resistor between pin 1 and pin 8.
V– 4 — Negative supply
V+ 7 — Positive supply
VIN– 2 I Negative input
VIN+ 3 I Positive input
VOUT 6 O Output
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
±20
Supply V
40 (single supply)
Voltage
Current ±10 mA
Analog input range (2) (V–) – 0.5 (V+) + 0.5 V
(3)
Output short-circuit Continuous
Operating range, TA –55 150
Temperature Junction, TJ 150 °C
Storage temperature, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails must be
current limited to 10 mA or less.
(3) Short-circuit to ground.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(5) See Typical Characteristics curves, Output Voltage Swing vs Output Current (Figure 19 to Figure 22).
(5) See Typical Characteristics curves, Output Voltage Swing vs Output Current (Figure 19 to Figure 22).
600 15
550 14
13
500
12
450 11
400 10
Population (%)
350 9
Count
8
300
7
250 6
200 5
150 4
3
100
2
50 1
0 0
-30
-25
-20
-15
-10
-5
10
15
20
25
30
0.0075
0.015
0.0225
0.0375
0.045
0.0525
0.0675
0.075
0.0825
0.0975
0.105
0.03
0.06
0.09
0
VOSI (µV) D001
Figure 1. Input Voltage Offset Distribution Figure 2. Input Voltage Offset Drift Distribution
1000 45
900 40
800 35
700
30
Population (%)
600
25
Count
500
20
400
15
300
200 10
100 5
0 0
0.0425
0.085
0.1275
0.2125
0.255
0.2975
0.3825
0.17
0.34
0
0
-80
-60
-40
-20
20
40
60
80
-100
100
VOSO (µV/°C)
–40°C to +125°C
Figure 3. Output Voltage Offset Distribution Figure 4. Output Voltage Offset Drift Distribution
20 18
18 16
16 14
14
12
Population (%)
Population (%)
12
10
10
8
8
6
6
4
4
2 2
0 0
-1.53
-1.36
-1.19
-1.02
-0.85
-0.68
-0.51
-0.34
-0.17
-1.7
0.17
0.34
0.51
0.68
0.85
1.02
1.19
1.36
1.53
0
1.7
-1.4
-1.26
-1.12
-0.98
-0.84
-0.7
-0.56
-0.42
-0.28
-0.14
0
0.7
0.14
0.28
0.42
0.56
0.84
0.98
Figure 5. Input Bias Current Distribution Figure 6. Input Offset Current Distribution
Population (%)
17.5
15 25
12.5 20
10
15
7.5
10
5
2.5 5
0 0
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
15
20
25
30
35
40
45
50
-1
-0.9
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
-0
1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Common-Mode Rejection (µV/V) Common-Mode Rejection (µV/V)
G=1 G = 100
0.75 12000
0.7 10000
0.65
8000
0.6
0.55 6000
0.5 4000
0.45
2000
0.4
IIB ±2 V 0
0.35 IIB ±15 V
0.3 -2000
-15 -12 -9 -6 -3 0 3 6 9 12 15 -75 -50 -25 0 25 50 75 100 125 150 175
Common-Mode Voltage (V) Temperature (°C) D001
Figure 9. Input Bias Current vs Common-Mode Voltage Figure 10. Input Bias Current vs Temperature
700 6
Change in Input Offset Voltage (µV)
650
4
Input Offset Current (pA)
600
2
550
500 0
450
-2
400
-4
350
300 -6
-75 -50 -25 0 25 50 75 100 125 150 175 0 10 20 30 40 50 60 70 80 90 100
Temperature (°C) D001
Time (s) D001
Figure 11. Input Offset Current vs Temperature Figure 12. Change in Input Offset Voltage vs Warm-Up Time
90 90
70 70
50 50
30 30
10 10
-10 -10
10 100 1k 10k 100k 1M 10 100 1k 10k 100k 1M
Frequency (Hz) Frequency (Hz)
At RTI
Figure 13. Positive PSRR vs Frequency Figure 14. Negative PSRR vs Frequency
70 160
65 G=1 150
35 90
30 80
25 70
20 60
15 50
10 40 G=1
5 30 G=10
0 20 G=100
-5 10 G=1000
-10 0
10 100 1k 10k 100k 1M 10M 10 100 1k 10k 100k
Frequency (Hz) D001
Frequency (Hz) D001
At RTI At RTI
140 G>1
130 30
120
110 20
100 10
90
80 0
70
60 -10
50 -20
40 G=1
30 G=10 -30
20 G=100 -40
10 G=1000
0 -50
10 100 1k 10k 100k -75 -45 -15 15 45 75 105 135
Frequency (Hz) D001
Temperature (ºC) D001
At RTI, 1-kΩ Source Imbalance
Figure 17. CMRR vs Frequency Figure 18. Common-Mode Rejection Ratio vs Temperature
Figure 19. Positive Output Voltage Swing vs Figure 20. Negative Output Voltage Swing vs
Output Current Output Current
2 0
-40°C
1.8 -0.2 125°C
1.6 -0.4 25°C
1.4 -0.6
Output Voltage (V)
1.2 -0.8
1 -1
0.8 -1.2
0.6 -1.4
0.4 -40°C -1.6
0.2 125°C -1.8
25°C
0 -2
0 2 4 6 8 10 12 14 16 18 20 0 2.5 5 7.5 10 12.5 15 17.5 20 22.5
Output Current (mA) D001
Output Current (mA) D001
VS = ±2 V VS = ±2 V
Figure 21. Positive Output Voltage Swing vs Figure 22. Negative Output Voltage Swing vs
Output Current Output Current
100 2
50 1.6
20 1.2
Voltage Noise (nV/—Hz)
10
0.8
5
Noise (µV)
0.4
2
0
1
0.5 -0.4
-0.8
0.2
G=1
0.1 G = 10 -1.2
0.05 G = 100 -1.6
G = 1000
0.02 -2
1 10 100 1k 10k 100k 0 1 2 3 4 5 6 7 8 9 10
Frequency (Hz) Time (s/div)
G=1
Figure 23. Voltage Noise Spectral Density vs Frequency Figure 24. 0.1-Hz to 10-Hz RTI Voltage Noise
40 580
560
0
540
-40 520
500
-80
480
-120 460
440
-160
420
-200 400
0 1 2 3 4 5 6 7 8 9 10 10 100 1k 10k 100k
Time (s/div) Frequency (Hz)
G = 1000
Figure 25. 0.1-Hz to 10-Hz RTI Voltage Noise Figure 26. Current Noise Spectral Density vs Frequency
10 35
32.5 VS = 30 V
8 VS = 4 V
30
6 27.5
4 25
Output Voltage (V)
22.5
Noise (pA)
2
20
0 17.5
15
-2
12.5
-4 10
-6 7.5
5
-8
2.5
-10 0
0 1 2 3 4 5 6 7 8 9 10 10 100 1k 10k 100k
Time (s/div) Frequency (Hz) D001
Figure 27. 0.1-Hz to 10-Hz RTI Current Noise Figure 28. Large-Signal Response vs Frequency
6 6
4 4
2 2
Amplitude (V)
Amplitude (V)
0 0
-2 -2
-4 -4
-6 -6
0 50 100 150 200 250 300 350 400 0 50 100 150 200 250 300 350 400
Time (µs) D001
Time (µs) D001
RL = 10 kΩ, CL = 100 pF, G = 1 RL = 10 kΩ, CL = 100 pF, G = 10
Figure 29. Large-Signal Pulse Response Figure 30. Large-Signal Pulse Response
4 4
2 2
Amplitude (V)
Amplitude (V)
0 0
-2 -2
-4 -4
-6 -6
0 50 100 150 200 250 300 350 400 0 0.5 1 1.5 2 2.5 3 3.5 4
Time (µs) D001
Time (µs) D001
RL = 10 kΩ, CL = 100 pF, G = 100 RL = 10 kΩ, CL = 100 pF, G = 1000
Figure 31. Large-Signal Pulse Response Figure 32. Large-Signal Pulse Response
100 60
75
40
50
20
Amplitude (mV)
Amplitude (mV)
25
0 0
-25
-20
-50
-40
-75
-100 -60
0 50 100 150 200 250 300 350 400 0 50 100 150 200 250 300 350 400
Time (µs) D001
Time (µs) D001
RL = 10 kΩ, CL = 100 pF, G = 1 RL = 10 kΩ, CL = 100 pF, G = 10
Figure 33. Small-Signal Pulse Response Figure 34. Small-Signal Pulse Response
60 60
40 40
20 20
Amplitude (mV)
Amplitude (mV)
0 0
-20 -20
-40 -40
-60 -60
0 50 100 150 200 250 300 350 400 0 0.5 1 1.5 2 2.5 3 3.5 4
Time (µs) D001
Time (µs) D001
RL = 10 kΩ, CL = 100 pF, G = 100 RL = 10 kΩ, CL = 100 pF, G = 1000
Figure 35. Small-Signal Pulse Response Figure 36. Small-Signal Pulse Response
50
0.05
0.03
0.02
0
0.01
0.005
-50
0.003
0.002
-100 0.001
0 20 40 60 80 100 120 100 1k 10k
Time (µs) Frequency (Hz)
G=1
Figure 37. Small-Signal Response vs Capacitive Load Figure 38. Total Harmonic Distortion + Noise vs Frequency
1.5 1.38
1.45 1.36
1.34
1.4
Supply Current (mA)
1.32
1.35
1.3
1.3
1.28
1.25
1.26
1.2
1.24
1.15 1.22
1.1 1.2
-75 -50 -25 0 25 50 75 100 125 150 0 5 10 15 20 25 30 35 40 45
Temperature (°C) D001
Supply Voltage (V) D001
Figure 39. Supply Current vs Temperature Figure 40. Supply Current vs Supply Voltage
10k 4
3.2
1k 2.4
1.6
Nonlinearity (ppm)
100 0.8
ZO (W)
0
10
-0.8
-1.6
1
-2.4
-3.2
0.1
1 10 100 1k 10k 100k 1M 10M -4
Frequency (Hz) -10 -8 -6 -4 -2 0 2 4 6 8 10
Output Voltage (V) D001
G=1
Figure 41. Open-Loop Output Impedance
Figure 42. Gain Nonlinearity
Nonlinearity (ppm)
0.8 3
0 0
-0.8 -3
-1.6 -6
-2.4 -9
-3.2 -12
-4 -15
-10 -8 -6 -4 -2 0 2 4 6 8 10 -10 -8 -6 -4 -2 0 2 4 6 8 10
Output Voltage (V) D001
Output Voltage (V) D001
G = 10 G = 100
4
Nonlinearity (ppm)
120
2
100
0
80
-2
60
-4
40
-6
-8 20
-10 0
-10 -8 -6 -4 -2 0 2 4 6 8 10 10M 100M 1G 10G
Output Voltage (V) Frequency (Hz) D001
D001
G = 1000
7 Detailed Description
7.1 Overview
The INA188 is a monolithic instrumentation amplifier (INA) based on the 36-V, precision zero-drift OPA188
(operational amplifier) core. The INA188 also integrates laser-trimmed resistors to ensure excellent common-
mode rejection and low gain error. The combination of the zero-drift amplifier core and the precision resistors
allows this device to achieve outstanding dc precision and makes the INA188 ideal for many high-voltage
industrial applications.
V1 = VCM ± G1 (VDIFF / 2)
VIN- = VCM ± VDIFF / 2 V+
V+
±
+
RFI Filter V+
25 k 20 k
- A3 VOUT
RG V+ Zero-Drift
V-
+ + Amp
VCM 25 k 20 k
+
±
RFI Filter V-
V+ RLOAD VO = G1 x G2 (VIN+ - VIN-)
V+ -
V- - A2 20 k
Zero-Drift
VIN+ + Amp REF
+
±
G1 = 1 + 2RF / RG G2 = R2 / R1 V-
V-
V-
VIN+ = VCM + VDIFF / 2
V2 = VCM + G1 (VDIFF / 2)
VIN-
INA188
RG Simplified VOUT
Form
VIN+ +
REF
VIN-
INA188
RG Simplified VOUT
Form
VIN+ +
REF
(1) NC denotes no connection. When using the SPICE model, the simulation does not converge unless a resistor is connected to the RG
pins; use a very large resistor value.
C2
Zero-Drift Amplifier Inside the INA188
Notch
CHOP1 GM1 CHOP2 Filter GM2 GM3
+IN OUT
-IN
C1
GM_FF
180 160
160 140
140 120
120
EMIRR (dB)
EMIRR (dB)
100
100
80
80
60
60
40
40
20 20
0 0
10M 100M 1G 10G 10M 100M 1G 10G
Frequency (Hz) C035 Frequency (Hz) C036
Figure 49. Common Mode EMIRR Testing Figure 50. Differential Mode (VIN+) EMIRR Testing
VIN- - V+
RG INA188
100 µA
½ REF200
VIN+ +
REF
100
OPA333
+ 10 k
±10 mV Adjustment
Range 100
100 µA
½ REF200
V-
Microphone,
hydrophone, RG INA188
and so forth.
47 k 47 k
Thermocouple RG INA188
10 k
RG INA188
VIN- VIN-
REF REF
VIN+ + 5V VIN+ +
5V
2.5 V
+ REF3225
a) Level shifting using the OPA330 as a low-impedance buffer. b) Level shifting using the low-impedance output of the REF3225.
10 k
-
+
VDIFF = 1 V RG
5.49 k INA188 VOUT
- 10 k
REF
VCM = 10 V +
-15 V
Figure 54. Example Application with G = 10 V/V and a 1-V Differential Voltage
Resistor-adjustable INAs such as the INA188 show the lowest gain error in G = 1 because of the inherently well-
matched drift of the internal resistors of the differential amplifier. At gains greater than 1 (for instance, G = 10 V/V
or G = 100 V/V) the gain error becomes a significant error source because of the contribution of the resistor drift
of the 25-kΩ feedback resistors in conjunction with the external gain resistor. Except for very high-gain
applications, gain drift is by far the largest error contributor compared to other drift errors, such as offset drift. The
INA188 offers the lowest gain error over temperature in the marketplace for both G > 1 and G = 1 (no external
gain resistor). Table 3 summarizes the major error sources in common INA applications and compares the two
cases of G = 1 (no external resistor) and G = 10 (5.49-kΩ external resistor). As explained in Table 3, although
the static errors (absolute accuracy errors) in G = 1 are almost twice as great as compared to G = 10, there are
much fewer drift errors because of the much lower gain error drift. In most applications, these static errors can
readily be removed during calibration in production. All calculations refer the error to the input for easy
comparison and system evaluation.
2
eNO 6
(eNI2 + eNI = 18,
Voltage noise (1 kHz) BW ´ ´ 9 47
G VDIFF eNO = 110
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
2.5
2
1.5
1
0.5
0
-10 -8 -6 -4 -2 0 2 4 6 8 10
Input (V) D001
Figure 56. Plot of PLC Input Transfer Function
10 Layout
Bypass
Capacitor
R6 R6
– V+
VIN V–IH V+
VIN V+IH VO VOUT
+
V– REF
GND
Bypass
Capacitor
V– GND
11.4 Trademarks
E2E is a trademark of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
PhotoMOS is a registered trademark of Panasonic Electric Works Europe AG.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 26-May-2017
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
INA188ID ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 INA188
& no Sb/Br)
INA188IDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 INA188
& no Sb/Br)
INA188IDRJR ACTIVE SON DRJ 8 1000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 INA188
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 26-May-2017
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
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EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND
4214825/C 02/2019
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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