ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted)
PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Drain-Source Voltage VDS 25 V Gate-Source Voltage VGS ±20 TC = 25 °C 56 Continuous Drain Current ID TC = 100 °C 35 1 A Pulsed Drain Current IDM 160 Avalanche Current IAS 34 Avalanche Energy L = 0.1mH EAS 60 mJ TC = 25 °C 49 Power Dissipation PD W TC = 100 °C 20 Junction & Storage Temperature Range TJ, TSTG -55 to 150 °C
THERMAL RESISTANCE RATINGS
THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Case RqJC 2.55 °C / W Junction-to-Ambient RqJA 63 1 Pulse width limited by maximum junction temperature.
Ver 1.1 1 2013-3-15
P0903BDL N-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted)
LIMITS PARAMETER SYMBOL TEST CONDITIONS UNIT MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250mA 25 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250mA 1.0 1.6 3.0 Gate-Body Leakage IGSS VDS = 0V, VGS = ±25V ±100 nA VDS = 20V, VGS = 0V 1 Zero Gate Voltage Drain Current IDSS mA VDS = 20V, VGS = 0V , TJ = 125 °C 10 Drain-Source On-State VGS = 5V, ID = 20A 12 19 RDS(ON) mΩ Resistance1 VGS = 10V, ID = 25A 7 9.5 Forward Transconductance1 gfs VDS = 15V, ID = 20A 60 S DYNAMIC Input Capacitance Ciss 1400 Output Capacitance Coss VGS = 0V, VDS = 15V, f = 1MHz 300 pF Reverse Transfer Capacitance Crss 190 Gate Resistance Rg VGS = 0V, VDS = 0V, f = 1MHz 1.3 Ω Qg(VGS = 10V) 25 Total Gate Charge2 Qg(VGS = 5V) 11 2 VDS = 0.5V(BR)DSS, ID = 25A nC Gate-Source Charge Qgs 6 Gate-Drain Charge2 Qgd 5 2 td(on) Turn-On Delay Time 16 2 tr Rise Time VDS = 15V, RL = 15Ω 25 nS Turn-Off Delay Time 2 td(off) ID @ 1A, VGS = 10V, RGEN = 6Ω 60 Fall Time2 tf 16 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TJ = 25 °C) Continuous Current IS 37 A 1 VSD IF = 25A, VGS = 0V Forward Voltage 1.3 V Reverse Recovery Time trr 35 nS IF = 25A, dlF/dt = 100A / μS Reverse Recovery Charge Qrr 61 nC 1 Pulse test : Pulse Width 300 msec, Duty Cycle 2%. 2 Independent of operating temperature.