Byte by Byte of Memory Chips

DRAM chips are produced in three forms: DIP [dual in-line package] , SOJ [ small
outline J-lead ] and TSOP [ thin ,small outline package ] The DIP package has leads
extending straight down on both sides of the chip and these are inserted into small holes
in the printed circuit board and soldered into place. The DIP package was originally used
to mount system memory directly onto the main board. But now, they are primarily used
for level 2 cache and are interested into sockets rather than soldered.

SOJs are similar to DIPs, but their leads are bent under at the end, thus giving them the
name ‘J-lead’. The TSOP chips are extremely thin [typically, only a few millimeters
thick ] With the leads sort of ‘splayed’ out to the side. SOJ & TSOP packages are
soldered onto the surface of a printed circuit board [called ‘surface’ mounting] Some
video boards have sockets specifically designed for SOJ chips to be inserted.

Semiconductor manufacturers produce these chips in large assembly plants & in huge
quantities. When an assembly line first begins to produce chips, many chips do not
perform as expected and must be discarded or reclassified. As the line ‘matures’, these
defects and substandard chips become fewer and fewer for some time. But eventually, the
equipment itself begins to wear out & so the defect rate begins to rise again. When this
happens, the line must be retooled for a new run.
To ensure that specifications have been met, each chip must be tested for reliability
& speed as it comes off the assembly line. Although a chip may be marked for a specific
speed, it may actually perform faster or slower [ we will discuss timing numbers for
various memory types later ] In such cases, they are classified again. For example, if
tests indicate that a 60ns chips runs at 61ns or 65ns, it gets marked as a 70ns chip. Chips
that pass all reliability tests are classified as A-grade [ regardless of speed ], while those
that have minor defects are classified as C-grade. Chips with serious defects are usually
destroyed.
A-grade chips are the most reliable. These are also the most expensive chips because of
their desirability for most applications. C-grade chips are less expensive and are intended
to be used primarily for devices that are not as demanding as today’s computers & which
do not have the exacting requirements, such as calculators & pagers . Some
manufacturers have additional grades and may use different markings to identify them.
The chip manufacturer imprints a ‘code’ on each IC which indicates the manufacturer,
chip configuration, speed rating and date of manufacturer. This marking is put onto the IC
in such a way that is embedded into the plastic resin coating of the chip. The only way to
remove this marking is to sand or etch it off. After putting the markings on the IC, a
protective coating is placed on the chip, giving it a somewhat stamp small, recessed
polished ‘dots’ into the top of the plastic jacket. This is done both to locate specific pins
[such as pin 1] and to help identify non-factory.