LEADFRAME

data sheet
TSOP 1
Features: Amkor’s TSOP 1 packages offer:
• 28 to 48 lead counts
• 8 x 14 mm to 12 x 20 mm package sizes
• Hi-conductivity copper leadframes
• JEDEC standard compliance
• Low stress die attach adhesive
• Precisely controlled wire loop height
• Enhanced design for memory applications
• Die stacking applications

Thin Small Outline Thermal Resistance: Forced Convection, Single-Layer PCB

Package 1 (TSOP 1): g
Body Theta JA (°C/W) by Velocity (LFPM)
Amkor offers a full family of popular Pkg Size (mm) 0 200 500
TSOP 1 packages to serve the needs of 32 ld 8 x 14 85.2 66.6 58.5
IC designers, PCB/system engineers and 40 ld 10 x 20 75.0 57.2 48.6
component specifiers. Small and thin, 48 ld 12 x 20 80.1 62.4 54.2
these 1.0 mm body packages were
designed and introduced to operate Forced Convection, Multi-Layer PCB
reliably in a variety of environments. Body Theta JA (°C/W) by Velocity (LFPM)
Particular attention was focused on Pkg Size (mm) 0 200 500
material sets and assembly processes to 32 ld 8 x 14 53.2 46.4 43.0
address user issues such as flatness, 40 ld 10 x 20 44.6 37.6 34.2
coplanarity, wire sweep, delamination, 48 ld 12 x 20 50.8 43.7 40.0
solderability and more. JEDEC Standard Test Boards

Self Self Self

Body Inductance Capacitance Resistance
Electrical:
Pkg Size (mm) Lead (nH) (pF) Ω)
(mΩ
Applications: 48 ld 12 x 20 Longest 4.310 0.695 35.0
The prime application for this technology Shortest 2.130 0.474 19.6
is memory. SRAM, FLASH, FSRAM and Simulated Results @ 100 MHz
E2PROM find this package symbiotic with
end-use products. Amkor answers the
needs required by pagers, telecom, cellular, Reliability: TSOP 1 packages are tested to assure reliable, long term
memory modules, PC (PCMCIA) cards, operation for your die.
wireless and countless other product • PCT 121 °C, 15 PSI, 168 hours
applications. These products demand • Temp cycle -65/+150 °C, 1000 cycles
more of IC packages and Amkor delivers. • Temp/Humidity 85 °C/85% RH, 1000 hours
• High temp storage 150 °C, 1000 hours

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION .

DS 330G
Rev Date: 02’01
www.amkor.com
 LEADFRAME
data sheet
TSOP 1
Cross-section TSOP 1
Process Highlights
Die thickness 11-12 mil
Bond pad pitch 0.13 mm
Strip solder plating 85/15 Sn/Pb
Strip marking Laser/pad
Lead inspection Optical
Pack/ship options Bar code, dry pack,TNR
Wafer backgrinding Available
Coplanarity (max) 0.08 mm

Test Services
• Program generation/conversion
• Product engineering
• Wafer sort
Stacked TSOP • Ambient to +165 °C test available
• Burn-in
• Tape and reel services

Shipping
JEDEC outline CS-020 low profile tray

Configuration Options:

TSOP 1 Nominal Package Dimensions

(Units in mm)
Body Lead Body Lead Tip To Body Overall Tray Units
Size Count Length Length Tip Thck Standoff Height JEDEC Matrix Per Tray
8 x 14 32 12.4 0.80 14.0 1.00 0.10 1.10 MO-142 16 x 13 208
8 x 20 28 18.4 0.80 20.0 1.00 0.10 1.10 MO-142 13 x 12 156
8 x 20 32 18.4 0.80 20.0 1.00 0.10 1.10 MO-142 13 x 12 156
10 x 14 40 12.4 0.80 14.0 1.00 0.10 1.10 MO-142 10 x 16 16
10 x 20 40 18.4 0.80 20.0 1.00 0.10 1.10 MO-142 10 x 12 120
12 x 20 48 18.4 0.80 20.0 1.00 0.10 1.10 MO-142 8 x 12 96
Stacked TSOP 1
12 x 20 48 18.4 0.80 20.0 1.00 0.10 1.10 N/A* 8 x 12 96
*Amkor PO Dwg# 46252

www.amkor.com

With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.