micromachines

Article
Characteristics of Double Planar Micro-Inductor with
Patterned NiFe Thin-Films for DC/DC Integration
Mingming Chen, Guifu Ding *, Ping Cheng *, Congchun Zhang *, Xiaomin Zhu and Zhe Liu
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Micro/Nano
Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University,
Shanghai 200240, China; cmm0319@sjtu.edu.cn (M.C.); small.sunshine.smile@sjtu.edu.cn (X.Z.);
df2009lz@163.com (Z.L.)
* Correspondence: gfding@sjtu.edu.cn (G.D.); zhcc@sjtu.edu.cn (C.Z.); pcheng2008@sjtu.edu.cn (P.C.);
Tel.: +86-021-3420-6686 (G.D.); +86-021-3420-6687 (C.Z. & P.C.)

Academic Editor: Joost Lötters

Received: 13 February 2017; Accepted: 25 April 2017; Published: 8 May 2017

Abstract: This paper proposes a double-planar-coil microinductor with patterned permalloy magnetic
film for high frequency DC–DC integration. The effects of magnetic film’s patterning and thickness
on the inductance and quality factor of the micro-inductor are investigated by using COMSOL
Multiphysics software. Simulation results indicate that the magnetic film improves the inductance
of microinductor effectively and patterning of the magnetic film reduces eddy current loss in high
frequency range. The micro-inductor is fabricated by using micro-electro-mechanical systems (MEMS)
technique. The inductance of approximately 2.17 µH at 1.5 MHz and the quality factor of 2.8 are
achieved for the microinductor with patterned magnetic film. The performances of the micro-inductor
applied in a low-power DC/DC converter are tested. The results indicate that the micro-inductor
with the patterned magnetic film effectively has improved inductance and quality factor compared to
that with non-patterned magnetic film. The maximum efficiency of measured converter is 67% at
1.5 MHz and the output current is 100 mA.

Keywords: double planar; film inductor; micromachining; patterned magnetic film

1. Introduction
With the decrease of size and weight of portable electronic products, the requirement of a power
management chip for internal integration is becoming urgent. For micro-processors and mobile
devices, thin film magnetic inductors are useful for integrated power delivery solutions, which will
replace conventional wire-wound inductors [1,2]. The miniaturization and integration of the inductor
with electronic circuits are the key to realize electronic products with high performance, small size,
light weight, high saturation current, high efficiency, and low lost [3–5]. In recent years, with the rapid
development of micro-electro-mechanical systems (MEMS) fabrication process and integrated passive
devices (IPD) technology, the thin-film technology combined with MEMS process becomes one of the
most advanced technologies to develop micro-inductive devices [6–8]. Since Soohoo et al. proposed
and prepared the micro-inductors with magnetic thin-film in 1979, many researchers have paid much
attention to this field [9–11]. Sugawara et al. developed a monolithic DC/DC converter by utilizing
a thin-film planar inductor and CoHfTaPd amorphous magnetic film. The inductance and quality
factor of the inductor were 0.96 µH and Q = 4.3 [12].
The use of thin-film magnetic inductors has the advantages of increasing inductance per unit
and decreasing containment of magnetic fields compared to coreless inductors. However, it has the
disadvantage of extra eddy current loss in the magnetic film, especially when the inductor works in
high frequency.

Micromachines 2017, 8, 151; doi:10.3390/mi8050151 www.mdpi.com/journal/micromachines

Micromachines 2017, 8, 151 2 of 9

In general, the micro-inductors must have small size which is comparable to the size of the active
components if they are integrated in DC/DC converters successfully. In order to reduce the eddy
current losses resulted
Micromachines 2017, 8, 151from the magnetic film in high frequency, a planar inductor with patterned 2 of 9
magnetic film has been developed in this study. The patterned magnetic film can concentrate the
magnetic In general, the micro-inductors must have small size which is comparable to the size of the
field lines to improve inductance, which reduces eddy current losses to get high quality factor.
active components if they are integrated in DC/DC converters successfully. In order to reduce the
The magnetic film was prepared by electrodepositing Ni80 Fe20 permalloy which has relatively high
eddy current losses resulted from the magnetic film in high frequency, a planar inductor with
saturation flux density (>0.6 T) and initial permeability µ (40–60 mH/m). For comparison, an inductor
patterned magnetic film has been developed in thisi study. The patterned magnetic film can
without magnetic
concentrate the film
magneticandfield
an inductor with inductance,
lines to improve non-patternedwhichmagnetic filmcurrent
reduces eddy were losses
also fabricated.
to get
The three inductors
high quality factor.have
Thethe same film
magnetic planar
wasdouble
preparedcoils. The performances
by electrodepositing Ni80Feat20 1.5 MHz low-power
permalloy which
DC/DChas converter of the
relatively high fabricated
saturation fluxmicro-inductors
density (>0.6 T) are
andpresented. The design
initial permeability and simulation
μi (40–60 mH/m). Forof the
comparison,device
micro-inductor an inductor without magnetic
are described in Sectionfilm and an inductor
2. Inductor with and
fabrication non-patterned
performance magnetic film
characteristics
were alsoin
are described fabricated.
Section 3. The three inductors
Section havemeasurement
4 highlights the same planar double
results coils.
for the The performanceswhen
micro-inductor at 1.5 used
with MHz low-power
a prototype 1.5 DC/DC
MHz DC/DCconverter of the fabricated chip.
down-converter micro-inductors
Conclusions are and
presented.
futureThe design and are
developments
simulation of the micro-inductor device are described in Section 2. Inductor fabrication and
presented in Section 5.
performance characteristics are described in Section 3. Section 4 highlights measurement results for
the micro-inductor
2. Model when used with a prototype 1.5 MHz dc/dc down-converter chip. Conclusions
Design and Simulation
and future developments are presented in Section 5.
The inductance value can be calculated according to following formula [13].
2. Model Design and Simulation
avg n2 d
The inductance value can be calculated
L =according
K1 µ 0 to following formula [13]. (1)
1 + K2 ρ
= (1)
where L is inductance of the inductor, with the unit of nH; n represents the turns of coil; µ0 is
where L ispermeability;
inductance of dthe inductor, with the unit of nH; n represents the turns of coil; μ0 is the
the magnetic avg is the average diameter of the inductance coil; both K1 and K2 are
magnetic permeability; davg is the average diameter of the inductance coil; both K1 and K2 are
constants, which are determined by the shape of the inductance coil; ρ represents the filling rate.
constants, which are determined by the shape of the inductance coil; ρ represents the filling rate.
From the Equation (1), it can be seen that increasing the coil’s turns can achieve large inductance.
From the Equation (1), it can be seen that increasing the coil’s turns can achieve large inductance.
Besides, the inductance is also affected by the coil’s size. In order to achieve more turns in a small
Besides, the inductance is also affected by the coil’s size. In order to achieve more turns in a small
area, area,
double planar
double spiral
planar coils
spiral coilsareareadopted
adoptedin inthe
the design. Figure1 1schematically
design. Figure schematically shows
shows the structure
the structure
of planar micro-inductor
of planar micro-inductor with
withpatterned
patternedmagnetic film.The
magnetic film. Thepatterned
patterned magnetic
magnetic filmfilm is expected
is expected to to
reduce eddyeddy
reduce current lossloss
current at at
highhighfrequency
frequency andand to increase
increasethe thequality
quality factor
factor of the
of the micro-inductor.
micro-inductor.
The slots
The slots in thein magnetic
the magnetic film
film shouldbebesufficiently
should sufficiently narrow
narrowsosothatthatthe vertical
the magnetic
vertical magnetic fieldfield
cannot
cannot
leak through
leak through the patterned
the patterned magnetic
magnetic film.
film. TheThe polyimideis isselected
polyimide selectedasasthe
thedielectric.
dielectric. AA 3D
3D model
model was
was developed
developed to calculate
to calculate the inductance
the inductance L andLquality
and quality factor
factor Q ofQmicro-inductor
of micro-inductorsince
sinceLLandand QQ are
are two
two important parameters to evaluate an inductor.
important parameters to evaluate an inductor.

Figure 1. Structure
Figure 1. Structureofofplanar
planarinductor withpatterned
inductor with patterned magnetic
magnetic film.
film.

2.1. Effect
2.1. Effect of Patterned
of Patterned Magnetic
Magnetic Film
Film ononthe
thePerformances
Performances of
ofMicro-Inductor
Micro-Inductor
Two 3D models were designed to compare the performances of the inductor, as shown in
Two 3D models were designed to compare the performances of the inductor, as shown in Figure 2.
Figure 2. The simulation was carried out by COMSOL software (Comsol Multiphysics 5.2a,
The simulation was carried out by COMSOL software (COMSOL Multiphysics 5.2a, COMSOL Inc.,
COMSOL Inc., Stockholm, Sweden). The two models had the same planar coils, magnetic material of
Stockholm, Sweden). Theatwo
Ni80Fe20 permalloy with models
thickness of 10had
μm the same
in the sameplanar coils,
working magnetic
conditions material
(the voltage of 5ofV Ni80 Fe20
and
permalloy with a of
the frequency thickness of 10 µm in the same working conditions (the voltage of 5 V and the
10 k–10 MHz).
frequency of 10 k–10 MHz).
Micromachines 2017, 8, 151 3 of 9
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Micromachines 2017, 8, 151 333of
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Micromachines 2017,8,8,151
151 of 9

Figure 2. Models of micro-inductors. (a) Non-patterned magnetic film; (b) patterned magnetic film.
Figure
Figure2.
Figure 2.Models
2. Modelsof
Models ofmicro-inductors.
of micro-inductors.(a)
micro-inductors. (a)Non-patterned
(a) Non-patternedmagnetic
Non-patterned magneticfilm;
magnetic film;(b)
film; (b)patterned
(b) patterned magnetic
patterned magneticfilm.
magnetic film.
film.
The AC ripple current and the distribution of magnetic flux are closely related to inductance
The
The AC
and quality ripple
ACfactor. current
current and
rippleTherefore, andthe the distribution
thedistributions
distribution of of
of magnetic
magnetic flux
inductive flux are
currentare closely
densityrelated
closely related to
to inductance
and magnetic inductanceflux
and
densityquality
quality factor.
factor.
at 1.5factor.
and quality Therefore,
Therefore,
MHz Therefore,
for each ofthe the
the
the distributions
distributions
models
distributions were of inductive
of inductive
of calculated.
inductive current current
Thecurrent
simulation
density density
density
results
and and
magnetic magnetic
andweremagnetic
shown
flux flux
flux
in
density
density
density
Figures
at 1.5 MHzat
3atand1.5
1.5 MHz
MHz
for4, for
for each
respectively.
each of the each of
models the
ofAsthe models
models
shown
were were
in were
Figure
calculated. calculated.
calculated.
3,
The the The
maximum
simulation simulation
The simulation
inductive
results results
wereresults were
current
shown were in shown
shown
density
Figures in
ofin
3
Figures
Figures
model
and 4,(b) 3 and 4,
respectively. respectively.
3(micro-inductor
and 4, respectively. AsAs
with patterned
As shown shown
in shown in
Figuremagnetic
3, Figure
in the
Figure 3,
film)
maximum the
3, the maximum
maximum
is obviously
inductive inductive
inductive
reduced
current when current
current
density density
of density
compared model with of
of
(b)
model
model(a)
model (b) (micro-inductor
(b)(non-patterned
(micro-inductor(micro-inductor
with patterned with
with patterned
magnetic patterned magnetic
magnetic
film). Model
magnetic film) film)
film)
(b)obviously
is has isis obviously
more obviously reduced
reduced
low-density-current
reduced when when
when
compared compared
areascompared
than
with with
model
model with
(a)
model
model
(a) (a)
as the(a) (non-patterned
(non-patterned (non-patterned
patterned magnetic
magnetic magnetic
magnetic
film). film
Model film).
film).
can(b) Model
Model
decentralize
has more (b)
(b) hasthemore
has more low-density-current
low-density-current
distribution
low-density-current of areas thanareas
high current areas than
than
density
model (a)model
model
and
as the
(a) as
increase the
(a) as the
patterned patterned
patterned
themagnetic
area of low magnetic
magnetic
film current film
density.
can decentralize can
film canThat decentralize
decentralize
theindicates
distributionthe
the distribution
thatdistribution
patterned
of high current of high
of high
magneticdensitycurrent
current
filmand density
candensity
effectively
increase and
and
the
increase
increase
decrease
area the
the
of low area
area of
thecurrent
eddy low
low current
ofcurrent
density. current
loss
That density.
ofdensity. That
Thatthatindicates
indicates
the micro-inductor.
indicates patterned that
Inthat patterned
patterned
addition,
magnetic as magnetic
film magnetic
indicated film
film
can effectively can
can
in Figure effectively
effectively
decrease4, both the
decrease
decrease
model the
the eddy
(a) and loss
eddy current eddy
model current
current
of the loss
loss of
of
(b) micro-inductor.
show non-uniformthe
the micro-inductor.
micro-inductor.
distribution
In addition, In
In addition,
addition,
of magnetic
as indicated as
as indicated
indicated
flux. 4,
in Figure in
However,in Figure
Figure
both model model 4,
4, both
both
(b)
(a) and
model
shows
modelmuch(a)
(b) and
(a) show
and model
model
higher maximum
non-uniform (b)
(b) show
show non-uniform
non-uniform
magnetic
distribution flux distribution
distribution
density
of magnetic than
flux.modelof
of magnetic
magnetic
However, (a). Hence,
modelflux. it However,
flux.(b) However,
isshows
expectedmuch model
model
that (b)
the
higher(b)
shows much
shows much
micro-inductor
maximum higher
higher maximum
maximum
with patterned
magnetic flux density magnetic
magnetic
magnetic flux
film
than model density
fluxcandensity
(a). achieve
Hence, than
than model
highermodel
it is (a). Hence,
(a). Hence,
inductance
expected and
that the it is expected
itmicro-inductor
is expected
quality factor that
that the
thanthe
with
micro-inductor
micro-inductor
that with non-patterned
patterned with
withfilm
magnetic patterned
patterned
magnetic magnetic
can achieve magnetic
film.higherfilm
film can
can achieve
inductance and higher
achieve higher inductance
quality factor than and
inductance and quality
that quality
with factor
factor than
non-patterned than
that with non-patterned
that with non-patterned
magnetic film. magnetic
magnetic film. film.

Figure 3. Distribution of surface inductive current density of micro-inductor. (a) Non-patterned

Figure 3.
Figure Distribution of
3. Distribution of surface inductive
inductive current
current density
density of micro-inductor. (a) Non-patterned
Non-patterned
Figure 3.film;
magnetic Distribution of surface
(b) patterned surface
magneticinductive
film. current density of
of micro-inductor.
micro-inductor. (a)
(a) Non-patterned
magnetic
magnetic film; (b) patterned magnetic film.
magneticfilm;
film;(b)
(b)patterned
patternedmagnetic
magneticfilm.
film.

Figure 4. Distribution of surface magnetic flux density of micro-inductor. (a) Non-patterned magnetic
Figure 4. patterned
film; (b) Distribution of surface
magnetic film. magnetic flux density of micro-inductor. (a) Non-patterned
Figure
Figure 4.
magnetic 4. Distribution
Distribution
film; of surface
surface magnetic
of magnetic
(b) patterned magnetic
film. flux
flux density
density of
of micro-inductor.
micro-inductor. (a)
(a) Non-patterned
Non-patterned
magnetic film; (b) patterned magnetic
magnetic film; (b) patterned magnetic film.film.
Micromachines 2017, 8, 151 4 of 9

Figure 52017,
Micromachines shows
8, 151 the comparison of the simulated inductance and quality factor of the two 4 of 9
models. In Figure 5a, the inductor with patterned magnetic film shows a lower inductance at a low
frequency
Figurethan that
5 shows
Micromachines
with
2017, 8,the
non-patterned magnetic film, because leakage flux results in the reduction
151 comparison of the simulated inductance and quality factor of the 4 of 9two
of the inductance.
models. In FigureNevertheless,
5a, the inductor thewith
inductor with non-patterned
patterned magnetic film magnetic film shows
shows a lower more evident
inductance at a low
eddy current
frequency loss
than than
that with that with patterned
non-patterned magnetic
magnetic film
film, when leakage
because the frequency further
flux results in increases.
the reduction So
Figure 5 shows the comparison of the simulated inductance and quality factor of the two models.
the inductor
of the with patterned
inductance. Nevertheless, magnetic film shows
the inductor with higher inductance
non-patterned than that
magnetic film with
shows non-patterned
more evident
In Figure 5a, the inductor with patterned magnetic film shows a lower inductance at a low frequency
magnetic film loss
eddy current at high
than frequency.
that withIn Figure 5b,
patterned the micro-inductor
magnetic film when thewith patterned
frequency magnetic
further film has
increases. So
than that with non-patterned magnetic film, because leakage flux results in the reduction of the
nearly doublewith
the inductor
inductance.
quality factor magnetic
patterned
Nevertheless,
in the high
film
the inductor
frequency
shows
with
rangeinductance
higher
non-patterned
compared to shows
than
magnetic film
that
thatwith non-patterned
with evident
more non-patterned
eddy
magnetic
magnetic film.
filmloss
current at high
than frequency. In Figure
that with patterned 5b, the film
magnetic micro-inductor with patterned
when the frequency magneticSo
further increases. film
thehas
nearlyinductor
doublewithquality factor in the high frequency range compared to that with non-patterned
patterned magnetic film shows higher inductance than that with non-patterned magnetic
magnetic
film film.
at high frequency. In Figure 5b, the micro-inductor with patterned magnetic film has nearly double
quality factor in the high frequency range compared to that with non-patterned magnetic film.

Figure 5. Simulated results for the micro-inductors with patterned or non-patterned magnetic film.
(a) Inductance as a function of frequency; (b) quality factor as a function of frequency.
Figure 5. Simulated results for the micro-inductors with patterned or non-patterned magnetic film.
Figure 5. Simulated results for the micro-inductors with patterned or non-patterned magnetic film.
2.2. Effect of(a) Inductance
Magnetic
(a) Inductance
as aThickness
as Film
function ofon
a function
frequency; (b) quality factor
the Performances
of frequency;
as a function of frequency.
of Micro-Inductor
(b) quality factor as a function of frequency.
The
2.2.models
Effect ofwith different
Magnetic thickness
Film Thickness onofthemagnetic filmofwere
Performances simulated. The effect of the thickness
Micro-Inductor
2.2. Effect of Magnetic Film Thickness on the Performances of Micro-Inductor
of magnetic films on the inductance and quality factor of the micro-inductor was investigated. The
The models with different thickness of magnetic film were simulated. The effect of the thickness
simulation
The resultswith
models
of magnetic aredifferent
films shown in Figure of
thickness
on the inductance 6a,b, respectively.
magnetic
and quality film of In
factorwere Figure
simulated.
the 6a,Thetheeffect
micro-inductor inductance
wasof of the
the thickness
investigated.
micro-inductor
of magnetic increases
films
The simulation the with
onresults arethe
inductance increasing
shown and thickness
quality
in Figure factor
6a,b, of
of the
the magnetic
respectively. In Figurefilm.
micro-inductor However,
was
6a, the the of
growth
investigated.
inductance theThe
rate decreases
simulation when
results are
micro-inductor the magnetic
shown
increases film
in the
with Figureis thicker than
6a,b, thickness
increasing 15 μm.
respectively. In
of theIn Figure 6b,
Figurefilm.
magnetic the quality
6a, However, factor
the inductance of
of the
the growth the
micro-inductor
micro-inductor
rate decreasesalso increases
increases
when with
the when
the
magnetic the isthickness
increasing
film thickness
thicker than of15
ofthe
the magnetic
µm. magnetic film
film.
In Figure 6b, increases.
the However,
quality factor From
the thethe
ofgrowth
simulation
rate decreasesresults,
micro-inductor
when italso
canincreases
the be concluded
magnetic when
filmtheisthat increasing
thickness
thicker the
μm.thickness
of the15magnetic
than In film of
6b,the
increases.
Figure magnetic
theFrom film of
the simulation
quality factor is an
the
results,
efficient it can
approachalso
micro-inductor be concluded
to achieve that
highwhen
increases increasing
inductance the thickness
and quality
the thickness of the
of factor. magnetic film is an efficient
the magnetic film increases. From the approach
to achieve
simulation high it
results, inductance and quality factor.
can be concluded that increasing the thickness of the magnetic film is an
efficient approach to achieve high inductance and quality factor.

Figure Figure 6. Effect

6. Effect of ofmagnetic
magnetic film’s
film’sthickness on theoninductance
thickness and qualityand
the inductance factorquality
of the micro-inductor.
factor of the
(a) Inductance as a function of frequency; (b) quality factor as a function of frequency.
micro-inductor: (a) Inductance as a function of frequency; (b) quality factor as a function of
frequency.
Figure 6. Effect of magnetic film’s thickness on the inductance and quality factor of the
micro-inductor: (a) Inductance as a function of frequency; (b) quality factor as a function of
frequency.
Micromachines 2017, 8, 151 5 of 9

3. Fabrication and Characterization

3.1. Fabrication of the Planar Inductor

Three kinds of micro-inductors were fabricated for comparison. The specifications of three
micro-inductors were given in Table 1. Type 1 is an inductor without magnetic films, Type 2 is
an inductor with non-patterned magnetic film, and Type 3 is an inductor with patterned magnetic
film. According to simulated results, the inductance and quality factor increase with the increasing
thickness of the magnetic film. In order to achieve high inductance and quality factor, the magnetic
film’s thickness of Type 3 is 20 µm.

Table 1. Specifications of three planar inductors.

Copper Square Spiral Coil Magnetic Films

Types
Number of Thickness Line Width Material Thickness
Spacing (S) Outer Dimension
Tums (N) (tc ) (wc ) (M) (ts )
1 - - -
2 17 20 µm 20 µm 20 µm Permalloy 10 µm 1.9 mm × 1.9 mm
3 Permalloy 20 µm 1.9 mm × 0.12 mm × 12 mm

Taking Type 3 as an example, the fabrication processes of the micro-inductor are illustrated in
Figure 7a–h and described as follows.

(a) The glass wafer was selected as the substrate. Cr/Cu metal was sputtered on the substrate as
the first seed layer as the Cr can enhance the adhesive force between Cu and glass substrate.
Photoresist was spin coated on the seed layer and patterned by lithography and development.
The bottom magnetic film (Ni80 Fe20 ) was electroplated on Cr/Cu seed layer (thickness 20 µm).
(b) The sodium hydroxide solution (4%) was used to remove the residual photoresist,
and an ammonia/peroxide solution was used to remove the chromium/copper seed layers.
The polyimide was selected as the insulation layer for filling spacing of the single coil after the
photoresist and the seed layer was removed, respectively.
(c) Another Cr/Cu seed layer was sputtered and another layer of photoresist was spin coated and
patterned. The bottom planar coil and the via connecting the two layer of coils was fabricated by
electroplating process (thickness 20 µm), respectively.
(d) The sodium hydroxide solution (4%) was used to remove the residual photoresist. The third
layer of photoresist was spin coated and patterned. The via was further electroplated to a higher
position than the bottom coil in order to connect the top coil (Cu 5 µm). The pad was also
fabricated by multi-step electroplating process.
(e) The residual photoresist and the Cr/Cu seed layer was removed, respectively. The polyimide
was also used as the insulation layer between two layers of the coil.
(f) The third Cr/Cu seed layer was sputtered and the fourth layer of photoresist was spin coated
and patterned. The top planar coil was electroplated (thickness 20 µm).
(g) The fourth Cr/Cu seed layer was sputtered and the fifth layer of photoresist was spin coated and
patterned to electroplate the pad (Cu 5 µm).
(h) The sixth layer of photoresist was spin coated and patterned. The top magnetic film was
electroplated (thickness 20 µm). Acetone was used to remove the positive photoresist,
and ammonia/peroxide solution was chosen to remove the seed layer.

Figure 7i shows the optical image of Cu coil with a thickness of 20 µm.

Micromachines 2017, 8, 151 6 of 9
Micromachines 2017, 8, 151 6 of 9
Micromachines 2017, 8, 151 6 of 9

Figure 7. Main fabrication processes of the micro-inductor (a)–(h) and optical photograph of the
Figure 7.
Figure 7. Main
single coil Main fabrication processes of the micro-inductor (a)–(h) and optical photograph of the single
(i). fabrication processes of the micro-inductor (a)–(h) and optical photograph of the
coil (i).
single coil (i).
Figure 8 shows scanning electron microscope (SEM, Carl Zeiss Jena, Jena, Germany) images of
Figure
the fabricated shows
8 shows scanningelectron
scanning
micro-inductor electron
with microscope
microscope
patterned (SEM,Carl
(SEM,
permalloy Carl Zeiss
Zeiss
magnetic Jena,
Jena,
films. Jena,
Jena, Germany)
Germany)
Figure 8a images
showsimages
SEM of
of the
image
the
of fabricated
fabricated
the upper micro-inductor
micro-inductor with
with
Cu coils fabricated patterned
patterned permalloy
permalloy magnetic
magnetic
by electroplating. films.
Figurefilms.
8b Figure
Figure
indicates8a 8a shows
shows
SEM SEM
SEM
image image
image
of of
the
of
the the upper
upper Cu Cu
coils coils fabricated
fabricated by by electroplating.
electroplating. Figure 8b Figure
indicates8b indicates
SEM image SEM
of the
micro-inductor, where the patterned magnetic film (Ni80Fe20) was electroplated. Figure 8c shows the image of the
micro-inductor,
micro-inductor,
where where
the patterned
cross-sectional images thethe
patterned
magnetic
of film (Ni
fabricated magnetic filmelectroplated.
Fe20 ) was (Ni80Fe20) wasFigure
80micro-inductor. electroplated.
8c shows Figure 8c shows the
the cross-sectional
cross-sectional images ofmicro-inductor.
images of the fabricated the fabricated micro-inductor.

Figure 8. Scanning electron microscope (SEM) images of the fabricated planar inductor with
Figure Scanning electron
8. Scanning electron microscope
microscope (SEM)
(SEM) images
images of of the
the fabricated
fabricated planar
planar inductor with
patterned magnetic film.(a) Upper Cu coil; (b) profile of the mocro-inductor; (c) crossinductor
section of the
patterned
patterned magnetic film. (a) Upper Cu coil; (b) profile of the mocro-inductor; (c) cross
magnetic film.(a) Upper Cu coil; (b) profile of the mocro-inductor; (c) cross section
section of
of the
micro-inductor.
the micro-inductor.
micro-inductor.
3.2. Application of the Micro-Inductor in a Buck DC/DC converter
3.2. Application
Application of
of the
the Micro-Inductor
Micro-Inductor in a Buck DC/DC converterConverter
The micro-inductors were developed for its application in a DC/DC buck converter. The
DT8515The (Dorsent
micro-inductors
micro-inductors weredeveloped
were
Technologies developed for for
Inc., Shanghai, itsChina)
application
its application in a DC/DC
in a selected
was DC/DC buck buck converter.
converter.
as DC/DC The
The DT8515
converter. The
DT8515
(Dorsent (Dorsent
TechnologiesTechnologies
Inc., Inc.,
Shanghai, Shanghai,
China) was China) was
selected as selected
DC/DC as DC/DC
converter.
application circuit of the DC/DC buck converter is shown in Figure 9a. A testing Printed Circuit converter.
The The
application
application
Board of thecircuit
circuit (PCB) DC/DC of the
buck
was designed DC/DC buckisthe
converter
to enable converter
shown in is shown
Figure
high-frequency 9a.inAFigure
testing9a.
measurement A testing
Printed
for Printed
theCircuit Board
converter Circuit
and(PCB)
the
Board
was (PCB)
designed was
to designed
enable the to enable the
high-frequency high-frequency
measurement measurement
for the converterfor the
and
micro-inductor, as shown in Figure 9b. The fabricated micro-inductors were connected with the PCB converter
the and the
micro-inductor,
micro-inductor,
as shown
by using a in as shown
Figure
wire-bond 9b. in Figure
The
connection. 9b. The
fabricated fabricated micro-inductors
micro-inductors were connectedwere with
connected withby
the PCB theusing
PCB
by using a wire-bond
a wire-bond connection.connection.
 Micromachines
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Micromachines 2017, 8, 151 7 of 9

Figure 9.
Figure 9. Application
Application circuit
circuit of
of the
the DC/DC
DC/DC Buck
Buck Converter.
Converter. (a)
(a) Schematic
Schematic circuit
circuit diagram; (b) PCB
diagram; (b) PCB
Figure (Printed
9.(Printed Circuit
Application Board) used
circuitused
Circuit Board) of thefor testing.
DC/DC Buck Converter. (a) Schematic circuit diagram; (b)
for testing. PCB
(Printed Circuit Board) used for testing.
4. Results
4. Results and
and Discussion
Discussion

4. Results and
4.1.
4.1. Discussion
Electrical
Electrical Properties of
Properties of the
the Fabricated
Fabricated Micro-Inductors
Micro-Inductors
The frequency
The frequency characteristics
characteristics of
of the
the fabricated
fabricated micro-inductors
micro-inductors were
were measured
measured by
by using
using Agilent
Agilent
4.1. Electrical
E4294AProperties
impedanceof the Fabricated
analyzer Micro-Inductors
(Agilent Technologies, Santa Clara, CA, USA) and Agilent16334A test
E4294A impedance analyzer (Agilent Technologies, Santa Clara, CA, USA) and Agilent16334A test
fixture at
fixture at 0.5
0.5 V,
V,as
asshown
shownininFigure
Figure10.
10.
The frequency characteristics of the fabricated micro-inductors were measured by using Agilent
E4294A impedance analyzer (Agilent Technologies, Santa Clara, CA, USA) and Agilent16334A test
fixture at 0.5 V, as shown in Figure 10.

Figure 10. Frequency testing setup for the micro-inductor.

micro-inductor.

Figure 11a,b
Figure 11a,b shows
shows thethe dependence
dependence of of the
the inductance
inductance L L and
and the
the quality
quality factor
factor Q Q ofof the
the three
three
micro-inductors on frequency, respectively. As shown in Figure 11a, although
micro-inductors on frequency, respectively. As shown in Figure 11a, although the measured inductance the measured
inductance
of of three micro-inductors
three micro-inductors decreased graduallydecreased gradually
with the increasewith the increase
of frequency, of frequency,
the inductance of Type the
3
inductance of Type 3 with patterned magnetic films is 2.17 μH at 1.5 MHz, which
with patterned magnetic films is 2.17 µH at 1.5 MHz, which is three times larger than that of Type 1. is three times
larger
The than that
maximum ofFigure
qualityType 1. of
factor
10.The maximum
Type 3 is about
Frequency quality
2.8 at
testing factor
1.5
setup for of
MHz. Type
The
the 3 is about
inductance
micro-inductor. 2.8 at3 1.5
of Type MHz.
is much The
larger
inductance
than of Type
that of Type 3 is much
2 because eddylarger than
current that
loss of Type 2forbecause
is reduced eddy current
the patterned loss
magnetic is reduced
films. In Figure for11b,
the
patterned magnetic
the micro-inductor films. In Figure 11b, the micro-inductor with patterned magnetic film is nearly
Figure 11a,b shows with patterned magnetic
the dependence of the film is nearly two
inductance L times
and thethequality
quality factor
factorof that
Q of with
the three
two times the quality
non-patterned magnetic factor
film.of that with non-patterned magnetic film.
micro-inductors on frequency, respectively. As shown in Figure 11a, although the measured
inductance of three micro-inductors decreased gradually with the increase of frequency, the
inductance of Type 3 with patterned magnetic films is 2.17 μH at 1.5 MHz, which is three times
larger than that of Type 1. The maximum quality factor of Type 3 is about 2.8 at 1.5 MHz. The
inductance of Type 3 is much larger than that of Type 2 because eddy current loss is reduced for the
patterned magnetic films. In Figure 11b, the micro-inductor with patterned magnetic film is nearly
two times the quality factor of that with non-patterned magnetic film.
Micromachines 2017, 8, 151 8 of 9
Micromachines 2017, 8, 151 8 of 9
Micromachines 2017, 8, 151 8 of 9

FigureFigure
Figure 11. 11. Measured
11. Measured
Measured inductances
inductances andquality
and qualityfactors
quality factors of
factors ofthree
of threeplanar
three planar
planarinductors. (a) (a)
inductors.
inductors. Inductance L as aLLasasa
(a)Inductance
Inductance
function
afunction
function of frequency;
ofoffrequency;
frequency; (b)(b)
(b) quality
quality
quality factorQQ
factor
factor Qas
asaaafunction
as function
functionof
ofoffrequency.
frequency.
frequency.

4.2. Characteristics of Analog Circuit Testing

4.2.Characteristics
4.2. CharacteristicsofofAnalog
AnalogCircuit
CircuitTesting
Testing
The fabricated inductors were tested by an electronic system, as shown in Figure 12a. The
The
The
ITECH fabricated
fabricated inductors
inductors
DC ELECTRONIC were
were
LOAD tested
tested by an
(IT8510, by an electronic
120electronic
V/20 A/120 W, system,
system, as shown
as shown
ITECH, Yorba inLinda,inCA,
Figure Figure
12a. The12a.
USA) The
ITECH
was
ITECH
DC DC
ELECTRONIC ELECTRONICLOAD LOAD
(IT8510, (IT8510,
120 V/20 120 V/20
A/120 A/120
W, W,
ITECH, ITECH,
Yorba Yorba
Linda,
used as the simulation load. Agilent 6000 oscilloscope (MSO6034A, Agilent Technologies, Santa Linda,
CA, CA,
USA) USA)
was was
used
used
as as theCA,
theClara,
simulationsimulation
load.
USA) was load.
used Agilent
Agilent to6000 6000 oscilloscope
oscilloscope
collect the output voltage.(MSO6034A,
(MSO6034A, ITECH Agilent
TRIPLEAgilent Technologies,
Technologies,
OUTPUT DC Santa
POWER Santa
Clara,
Clara,
CA, SA) CA,
wasUSA)
SUPPLY used was
to
(IT6322, used
collect
0–3 tooutput
V)the
was collect thetheoutput
used voltage.
for ITECH
power voltage.
TRIPLE
supply ITECH
OUTPUT
providing TRIPLE
DC POWER
typical OUTPUT
converter DC POWER
SUPPLY (IT6322,
parameters,
0–3 V)such
SUPPLY was asused
5 V input
(IT6322, for voltage,
0–3the was0–1.2
V)power used V output
supply thevoltage,
power100
for providing mA load
supply
typical DC current.
providing
converter The measured
typical
parameters, such efficiency
converter asparameters,
5 V input
versus
such as
voltage, 50–1.2output
V input current
voltage,
V output of the V
0–1.2
voltage, 1.5-MHz
mA switching
output
100 voltage,
load DC100 buck mADC/DC
current. load
TheDC converter (Viefficiency
current.
measured = 5 V,
The Vo versus
= 1.2 efficiency
measured V)output
is
shown
versus of
current output in Figure 12b. For Type
current switching
the 1.5-MHz 3
of the 1.5-MHz micro-inductor,
buck DC/DCswitching the converter
buck DC/DC
converter has a 67%
(Vi = 5 V,converter maximum
Vo = 1.2 V) efficiency
(Viis=shown
5 V, Vo at an
= 1.2 V)
in Figure is
12b.
output current of 100 mA. The energy loss of Type 3 decreases by 15% compared to that of Type 2.
shown
For Typein3 Figure 12b. For Type
micro-inductor, 3 micro-inductor,
the converter the converter
has a 67% maximum has a 67%
efficiency at anmaximum efficiency
output current of 100at an
mA.
output
The current
energy loss of
of 100
TypemA. The energy
3 decreases loss of
by 15% Type 3 decreases
compared to that of by Type15%2. compared to that of Type 2.

Figure 12. (a) Testing setup; (b) Efficiency versus output current of the DC/DC buck converter using
fabricated micro-inductors.

Figure
Figure 12.
As (a)
(a) Testing
12.shown setup;
setup;(b)
in Figures
Testing (b)Efficiency
11 and versus
12, the
Efficiency output
outputcurrent
micro-inductor
versus ofofthe
with
current theDC/DC
patterned
DC/DC buck
buck converter
magnetic film has
converter using
the
using
improved
fabricated inductance
micro-inductors.
fabricated micro-inductors. and quality factor compared to that without magnetic film or with
non-patterned magnetic film. The patterning of magnetic film is useful in controlling the distribution
of magnetic field and current according to the simulation results, which is closely related to the
As
Asshown
showninin Figures 11 and
Figures 12, the
11 and 12,micro-inductor with patterned
the micro-inductor magneticmagnetic
with patterned film has the filmimproved
has the
inductance and quality factor of the inductor. The measured results are consistent with the
inductance
improved and quality factor
inductance and compared to thatcompared
quality factor without magnetic
to thatfilm or withmagnetic
without non-patternedfilm magnetic
or with
simulation results.
film. The patterning
non-patterned of magnetic
magnetic film. Thefilm is useful
patterning of in controlling
magnetic film the distribution
is useful of magnetic
in controlling field and
the distribution
current
5. according
of magnetic fieldtoand
Conclusions the current
simulation results, which
according to the issimulation
closely related to the
results, inductance
which and related
is closely quality to
factor
the
of the inductor.
inductance andThe measured
quality results
factor are inductor.
of the consistent The
withmeasured
the simulation results.
results are consistent with the
The micro-inductor has been successfully developed by using patterned permalloy thin-film.
simulation results.
The effects of magnetic film and its thickness on the performances of the micro-inductor were
5. Conclusions
simulated. Simulation results show that the patterning of the magnetic film effectively improves the
5. Conclusions
The micro-inductor has been successfully developed by using patterned permalloy thin-film.
The effects of magnetic filmhas
The micro-inductor andbeen
its thickness on the
successfully performances
developed of the patterned
by using micro-inductor were simulated.
permalloy thin-film.
Simulation results show that the patterning of the magnetic film effectively improves
The effects of magnetic film and its thickness on the performances of the micro-inductor the inductance
were
and quality factor of the micro-inductor. The inductance and quality factor of the fabricated
simulated. Simulation results show that the patterning of the magnetic film effectively improves theinductors
Micromachines 2017, 8, 151 9 of 9

in high frequency range (>1 MHz) were measured by Agilent E4294A. The inductance of Type 3 is
approximately four times greater than Type 1, and the quality factor of Type 3 at 1.5 MHz is enhanced
by 64% compared to that of Type 2. The converter with the fabricated micro-inductor has a 67%
maximum efficiency at an output current of 100 mA, and has a margin of error of plus or minus
0.6 percent. The micro-inductor with a height of 100 µm is beneficial to packaging requirements for
DC/DC integration.

Acknowledgments: This study has received funding from the National Basic Research Program of China
(973 Program). The authors would like to thank the mentor Guifu Ding, Ping Cheng, Congchun Zhang,
and laboratory colleagues Xiaomin Zhu and Zhe Liu for their help with the microfabrication.
Author Contributions: Mingming Chen designed, fabricated, and tested the micro-inductor; analyzed the results;
and wrote the paper. Xiaomin Zhu and Zhe Liu helped to fabricate and characterize the micro-inductor. Guifu Ding
and Congchun Zhang gave suggestions and helpful discussions on the microfabrication, characterization,
and manuscript writing. Ping Cheng reviewed the paper.
Conflicts of Interest: The authors declare no conflict of interest.

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