SERVICE MANUAL

MT8223L1
Version1
 MT8223L1 Service Manual

Spec Rev. Date Description Prepared By

Ver 1, Rev1.0 02/07/2011 New Document is released. Prashant

 INDEX
Sr. No Contents Page No.

1 Safety Precautions. 01

2 8223L IC introduction. 04
a) IC functional Description. 04

3 Introduction & chassis block diagram. 05

a) IC feature Description. 06

4 System Wiring Diagram. 07

5 Connectors & electronic parameter. 08

a) Connector details. 08
b) Critical component list. 10
c) Critical IC voltages. 11

6 Software Installation Procedure. 14

a) SW installation using USB. 14
b) SW installation using MTK tool kit. 16

7 Design data. 20
a) Audio data. 21
b) Panel data. 22

8 Panel Matrix. 23

9 Troubleshooting. 24
a) Dead or stand by. 24
b) No display or no backlight. 25
c) Back light on & no video. 26
d) No sound. 27
 1 SAFETY PRECAUTIONS.
CAUTION :
Use of controls, adjustments or procedures other than those specified herein may result in
hazardous radiation exposure.

CAUTION
RISK OF ELECTRI
ELECTRIC
SHOCK DO NOT OPEN.

The lighting flash with arrowhead symbol, with an equilateral triangle is intended to
alert the user to the presence of uninsulated dangerous voltage within the products
enclosure that may be of sufficient magnitude to constitute a risk of electric shock to
the person.

The exclamation point within an equilateral triangle is intended to alert the user to the
presence of important operating and maintenance (servicing) instructions in the
literature accompanying the appliance.

WARNING: TO REDUCE RISK OF FIRE OR ELECTRIC SHOCK, DO NOT

EXPOSE THIS APPLIANCE TO RAIN OR MOISTURE.

IMPORTANT SAFETY INSTRUCTIONS

CAUTION:
Read all of these instructions. Save these instructions for later use. Follow all Warnings and
Instructions marked on the audio equipment.
1. Read Instructions- All the safety and operating instructions should be read before the product is operated.
2. Retain Instructions- The safety and operating instructions should be retained for future reference.
3. Heed Warnings- All warnings on the product and in the operating instructions should be adhered to.
4. Follow Instructions- All operating and use instructions should be followed.

01
 SERVICING PRECAUTIONS
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
02
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
03
 2 8223L IC INTRODUCTION.
A) IC FUNCTIONAL DESCRIPTION.

The MediaTek MT8222 is an ultra highly integrated single chip for flat panel TV
supporting multimedia video/audio input and output format up to full HDTV. It includes
advanced 3D comb filter TV decoder to retrieve the best image from popular composite
signals and embedded HDTV/VGA decoders for the high bandwidth input signals perfectly
reproducing. The new 4th generation advanced motion adaptive and motion estimation
de-interlacer converts accordingly the interlace video into progressive one with overlay of a
2D graphic processor. Independent two flexible scalars provide wide adoption to various
LCD panels for two of different video sources at the same time. On-chip audio processor
decodes analog signals from tuner with lip sync control, delivering high quality
post-processed sound effect to customers. On-chi microprocessor reduces the system
BOM and shortens the schedule of UI design by high level C program. The MT8222 is an
ultra low-cost HDTV-ready solution to LCD TV manufactures.

MT8223L1 system Architecture

12V
U9
5V Regulator

P9
Digital IF1 OUT
AV OUT
Tuner
Digital IF2 OUT
HDMI
YPbPr U1 U943
Audio
AV MT8223L Amp
VGA
2D Video decoder
YPbPr 2.5D Interlace 12V
UA1
VGA Audio Audio Processor
Switch
AV Scaling
HDMI 1.3 LVDS
UP6 1.1V DDR RAM
1.1V BLK CNT
Regulator LCD PANEL
DIM
UP5 1.25V
1.25V
3.3V Regulator
24V
3.3V
UP4
3.3V Regulator

5Vsb
UM2 U3
EEPROM FLASH
24V Audio
12V 3.3V 3.3V
Power Power
Supply
Signal
UD1
2.5V Video
5V Regulator

04
 3 INTRODUCTION & CHASSIS BLOCK DIAGRAM.
MT8223L chassis is composed of function circuit following:
1. MT8223L is the Main IC, functions introduction reference next page.
2. Power management of LDO voltage output following:
a. UP2 output volt: 3.3V ±0.1V,
b. UP4 output volt: 3.3V ±0.1V,
c. UD1 output volt: 2.5V ±0.1V,
d. UP5 output volt: 1.25V ±0.1V,
e. UP6 output volt: 1.1V ±0.1V,
3. Tuning circuit of tuner type is HFT2-8C/T116V,The colour system PAL,SECAM and sound system BG/I/DK,
4. UA1, 74HC4052D is the audio signal input switching IC for external AV/YP b Pr/VGA or IDTV source
5. UA2, RC4558 is the audio ADC and amplify IC for headphone audio output,
6. U8, 24C02 DDC data load E2PROM IC for VGA;
7. U9, 24C02 EDID data load E2PROM IC for HDMI;
8. UM2, 24C32 is the E2PROM;
9. U3, MX25L320DM21-12G is the FLASH IC for software storage and operation
10. U943,TDA7491P is the Digital audio amplifier, Output power option 2 x 5W or 2 x 6.5W or 2 x 10 W/stereo,

The block diagram as follow:

Fig A

05
 A) IC FEATURE DESCRIPTION.

Feature
MT8223L Feature 1366x768@60Hz, 1440x900@60Hz, 1920x1080@60Hz
USB HOST Max. 1-ch w/o Hub
HDMI Rx 1-ch (HDMI 1.3)
Servo ADC 2-ch
UART 1-ch
VGA+ YBPPR YPBPR*1+VGA*1
CVBS 3-ch, CVBS out*1
Audio I2S No
Audio DAC 2*DAC (L/R)
Parallel/Serial Flash I/F Serial
LVDS Tx Dual LVDS 10-bits*2 (Two-channel LVDS Tx)
DRAM type MCM 4M*16bit SDR 166MHz
PWM 2-ch
JTAG Yes
MISC IR

！Precaution Before 0N TVset.

1.Power board is high voltage, don ’t touch its metal when it’s working.

2.Please confirm the power to Panel is +5V or +12V when change main board,if not the
panel can’t work or be damage.

06
4 SYSTEM gfwh WIRING DIAGRAM.

07
5 CONNECTORS & ELECTRONIC PARAMETER.
A) CONNECTOR DETAILS.
POWER & INVERTER CONN (CN1)
Measured Voltage
NO. Symbol Function
Standby On State
1 +5V POWER 0 5V
2 +5V POWER 0 5V
3 5V_STB POWER +5V 5V
4 P_ON/OFF ON/OFF 0 4.35V
5 GND GND 0 0
6 GND GND 0 0
7 GND GND 0 0
8 +12V POWER 0 12V
9 +12V POWER 0 12V
Back lamp
10 DIMMING 0 5V
Brightness adjust
11 BLON/OFF BLON/OFF 0 5V

AUDIO OUTPUT CONN (CN17)

NO. Symbol Function
1 L_OUT+ L_OUT+
2 GND GND
3 GND GND
4 R_OUT+ R_OUT+

KEY CONN (CN15)

Measured Voltage
NO. Symbol Function
Standby On State
1 GND GND 0 0
2 KPAD1 KEY VOLTAGE 3.27V 3.27V It Display 3.27V if no
keys is pressed.
3 KPAD2 KEY VOLTAGE 3.27V 3.27V please refer bellow
KEY MATRIX for
4 TOUCHKEY_SCL TOUCHKEY_SCL 3.27V 3.27V pressed key
voltages.
5 TOUCHKEY_SDA TOUCHKEY_SDA 3.27V 3.27V

KEY MATRIX
Function Voltage KPAD1 Voltage KPAD2
VOL+ 0
VOL- 0.5V
CH+ 0.9V
CH- 0
MENU 0.5V
TV/AV 0.9V
STANDBY 1.4V

LED+IR & TOUCHKEY CONN (CN14)

Measured Voltage
NO. Symbol Function
Standby On State
1 IR IR 3.98V 3.98V
2 P_ON/OFF P_ON/OFF 1.84V 0
3 5VSTB POWER 5V 5V
4 LED_R LED Control 0 2.64V
5 KPAD1 KEY1 3.27V 3.27V
6 GND GND 0 0
7 KPAD2 KEY2 3.27V 3.27V
8 GND GND 0 0

08
( Panel LVDS CONN ) CN9
NO. Symbol Function Electronic parameter
1 LVDS_VCC Panel VCC ＋5V/12V
2 LVDS_VCC Panel VCC ＋5V/12V
3 NC
4 LVDS_VCC Panel VCC ＋5V/12V
5 GND 0V
6 GND 0V
7 RXO0+ Vpp：3.3V
8 RXO0- Vpp：3.3V
9 RXO1+ Vpp：3.3V
10 RXO1- Vpp：3.3V
11 RXO2+ Vpp：3.3V
12 RXO2- Vpp：3.3V
13 GND 0V
14 GND 0V
15 RXOC+ Vpp：3.3V
16 RXOC- Vpp ：3.3V
17 RXO3+ Vpp：3.3V
18 RXO3- Vpp：3.3V
19 NC
20 NC
21 RXE0+ Vpp：3.3V
22 RXE0- Vpp：3.3V
23 RXE1+ Vpp：3.3V
24 RXE1- Vpp：3.3V
25 GND 0V
26 GND 0V
27 RXE2+ Vpp：3.3V
28 RXE2- Vpp：3.3V
29 RXEC+ Vpp：3.3V
30 RXEC- Vpp：3.3V
31 GND 0V
32 GND 0V
33 RXE3+ Vpp：3.3V
34 RXE3- Vpp：3.3V
35 NC
36 NC
37 NC
38 NC
39 NC
40 NC

09
B) CRITICAL COMPONENT LIST.

SAP CODE COMPONENT DESCRIPTION QTY LOCATION FUNCTION

1100034808 CRYSTAL,HC49,27MHZ,+/-20PPM,20PF 1 Y1 CRYSTAL

1100064121 TUNER,XUGUANG,HFT2-8C/T126CW,MT8223L 1 T1 DIP tuner
1100064120 IC,CHIP,LQFP128,MT8223LFMU 1 U1 Main IC
1100064119 IC,CHIP,HSOP6,S-1172B11-E6T1G 1 UP6 LDO IC, Power 1.1 VDC
1100058379 IC,CHIP,ST,SOP36,TDA7491P,TP 1 U943 Audio Amplifier IC
1100049334 IC,CHIP,SOP8,MX25L3205DM2I-12G 1 U3 Flash IC
1100047972 IC,CHIP,TO252-3,7805/AZ7805 1 UT4 LDO tuner Power +5V
1100047970 IC,CHIP,SOT223,G1117-3.3V 1 UP2 LDO IC 3.3V regulator
1100041520 IC,CHIP,TO-252,LM1117DTX-ADJ 1 UD1 LDO IC 2.5V DRAM
1100036928 IC,CHIP,SOP8,CD4558 1 UA2 OPERATIONAL IC
P-MOSFET LVDS Power
1100036848 IC,CHIP,SOIC8,CEM9435A/QM3001S 1 U31
Control
1100036840 IC,CHIP,TO223,AZ1117ADJ 1 UP5 LDO IC 1.25V regulator
1100033372 IC,CHIP,TO-252,LM1117DTX-3.3 1 UP4 Regulator 3.3V
1100030407 IC,CHIP,SOP-8,24C02BN,TP 1 U8 VGA EDID IC
1100030406 IC,CHIP,SO-16,74HC4052D,TP 1 UA1 SWITCH IC
1100010610 IC,CHIP,SOIC08,24LC32AT-I/SN,TP 1 UM2 EEPROM IC

10
 C) CRITICAL IC VOLTAGES.

UM2 Pin No. Pin Label Standby (V) On Condition (V) IC Function
1 NC 0 0
2 NC 0 0
3 NC 0 0
4 GND 0 0 System
5 SDA 0 3.1 EEPROM
6 SCL 0 3.1
7 WP 0 3.3
8 VCC 0 3.3

U3 Pin No. Pin Label Standby (V) On Condition (V) IC Function

1 CS# 0 3.3
2 DOUT 0 1.3
3 WP#VPP 0 3.3
4 VSS 0 0
Flash IC
5 DIN 0 0
6 CLK 0 0
7 HOLD# 0 3.3
8 VCC 0 3.3

UA1 Pin No. Pin Label Standby (V) On Condition (V) IC Function
1 VGA_R (Y0) 0 2.5
2 Y1_R (Y2) 0 2.5
3 AUD_ROUT1 (Y) 0.125 2.5
4 Y2_R (Y3) 0 2.5
5 AV2_R (Y1) 0 2.5
6 INH 0 0
7 VEE 0 0
8 GND 0 0 Audio
9 MUX_CTLB (B) 0.145 Multiplexer
Refer Below Table
10 MUX_CTLA (A) 0
11 Y2_L (X3) 0 2.5
12 VGA_L (X0) 0 2.5
13 AUD_LOUT1 (X) 0.173 2.5
14 AV2_L (X1) 0 2.5
15 Y1_L (X2) 0 2.5
16 VCC 0.145 5

Logic for Pin 9(MUX_CTLB) and 10(MUX_CTLA).

AV2 YPbPR1/AV1 YPbPr2/S-Video VGA
Pin 9(MUX_CTLB) 0V 5V 5V 0V
Pin10(MUX_CTLA) 5V 5V 0V 0V

11
 U8 Pin No. Pin Label Standby (V) On Condition (V) IC Function
1 NC 0 0
2 NC 0 0
3 NC 0 0
(SOP8) 4 GND 0 0 VGA EDID
5 SDA 4.8 4.8 EEPROM
6 SCL 4.8 4.8
7 WP 0 4.8
8 VCC 4.8 4.8

UP5 Pin No. Pin Label Standby (V) On Condition (V) IC Function
1 ADJ/GND 0 0
2 OUT/TAB 0 1.2 LDO for 3.3V
3 IN 0 3.3 to 1.2V
4 OUT/TAB 0 1.2

U31 Pin No. Pin Label Standby (V) On Condition (V) IC Function
1 Source 0 12
2 Source 0 12
3 Source 0 12
4 Gate 0 1.15 MOSFET for
5 Drain 0 12 LVDS
6 Drain 0 12
7 Drain 0 12
8 Drain 0 12

Voltage (Volts) Remark

U15 Pin No. Pin Label
WITH SIGNAL
1 AGC 3.3V
2 BT_30 32.4 Voltage
changes
3 AS 0
according
AGC GND
NC1
4 SDA 4.9
AS to freq
SCL 5 SCL 4.9
SDA and Signal
5VA
TUNER
6 5VA 4.9 Strength
5VB
NC3 7 BT_TEST 8.9
33V
IF OUT
8 DIF OUT2 0
9 DIF OUT1 0

12
 Standby
UP6 Pin No. Pin Label On Condition (V) IC Function
(V)
1 VOUT 0 1.07
2 VSS 0 0
3 EN 0 2.47 Core power
4 NC 0 0 1.1V Vdc
5 VSS 0 0
6 VIN 0 2.47

Standby
UT4 Pin No. Pin Label On Condition (V) IC Function
(V)
1 IN 0 12V
Tuner Power
2 GND 0 0
+5V
3 OUT 0 12V

Standby
UP2 Pin No. Pin Label On Condition (V) IC Function
(V)
1 IN 5.13 5.13
Stand By
2 GND 0 0
Power
3 OUT 32
3.2 32
3.2

Standby
UD1 Pin No. Pin Label On Condition (V) IC Function
(V)
1 GND/ADJ 0 1.25
2 OUT 0 2.48 DRAM Power
3 IN 0 5.06

Standby
UP4 Pin No. Pin Label On Condition (V) IC Function
(V)
1 GND/ADJ 0 0
2 OUT 0 3.3 Power 3.3V
3 IN 0 5.06

13
6 SOFTWARE INSTALLATION PROCEDURE.
There are two types of Software Installation we can use any one of this:-
a) SW Installation through USB
b) SW Installation through MTK tool kit

A) SW INSTALLATION USING USB.

STEP 1 Download the bin file “videocon.bin” to the root directory of your USB device (Do
not change the file name);

STEP 2 Turn on the TV set & Then insert the USB device to USB Interface of TV set.

STEP 3 Press TV/AV key & select Multimedia source.

STEP 4 If SW is properly Loaded in connected USB, then it will ask to press Ok key to
upgrade the SW.

STEP 5 Once you start SW loading process please don't power OFF the TV set until it loads
complete SW.

14
STEP 6 When SW is completely loaded, TV set will automatically go to standby mode.

STEP 7 Turn On TV & Please refer below steps :

Steps to refer After SW installation.

Press Menu key by remote & select audio menu option. ( Only
a)
select audio option don’t go to audio Submenu ).

Press 8 5 3 2 keys in sequence then design menu OSD will appear

b)
on screen.

Go to setup submenu & select last option "CLEAR EEPROM" press

c)
ok key, now TV will go to standby mode.

Mains ON/OFF the TV set & again enter in design data mode.
d)
Select required panel, audio, video data & again mains ON/OFF.

e) To check SW date Select "Firmware Version" from Design menu.

f) Check your TV Set is working properly.

Note:
• Don’t Power OFF TV set Once you start SW loading process.
You can't use "SW installation through USB" if your TV set is on Permanent
• standby ( LED is RED) in this case you must use JIG installation process.

15
 B) SW INSTALLATION USING MTK TOOL KIT.

STEP 1 Select Mtk Tool from the stored Folder/desktop

(Pre-required Installation of CP210x_VCP_Win2K_XP or
CP210x_VCP_Win_XP_S2K3_Vista_7(depending on Operating System)
programming Jig Software's)

STEP 2 Connect software installation jig to PC and MTK chassis..

STEP 3 Double click on MtkTool Icon to select and install software.Mtk Tool
window will appear on screen as shown.

STEP 4 To Check and Select correct COM port where Jig is connected right click
on My Computer & select Manage option.

16
STEP 5 Click Device Manager ,from Right pane click Ports, you will find Com
Port where(Silicon Labs) Jig is connected.

STEP 6 Select respective COM port in COM port option as shown in image.

STEP 7 Select Baud rate (ex.115200)or any supported Baud Rate in “Baud
Rate” option.

STEP 8 Now in browse option select the software file (.bin extension) you want
to install

17
STEP 9 Now click on Upgrade, software upgrade will start as in fig .

STEP 10 Flash Upgrade will start and new software loading will be processed

Note: if there is error while loading software , reset TV/Chassis by

mains Off>>On

STEP 11 When installation completes it will display 100% as a finish indication.

(software is upgraded within 2 to 3 minutes)

STEP 12 Now Power Off/On the TV set Verify & refer below steps.

18
 Steps to refer After SW installation.

Press Menu key by remote & select audio menu option. (Only
a)
select audio option don’t go to audio Submenu ).

Press 8 5 3 2 keys in sequence then design menu OSD will appear

b)
on screen.

Go to setup submenu & select last option "CLEAR EEPROM" press

c)
ok key, now TV will go to standby mode.

Mains ON/OFF the TV set & again enter in design data mode.
d)
Select required panel, audio, video data & again mains ON/OFF.

e) To check SW date Select "Firmware Version" from Design menu.

f) Check your TV Set is working properly.

19
7 DESIGN DATA.

20
 A) AUDIO DATA
Audio data for 5W/6.5W/10W speaker selection

SPEAKER SELECTION =5W

Audio Data
Frequency Response
Front Speakers
RF AV Y HDMI USB Freq BAND MAX
Volume 0 12 12 12 5 5 100hz 24
Volume 25 40 38 38 38 38 300hz 33
Volume 50 55 60 60 60 59 1k 30
Volume 75 68 75 75 80 75 3k 39
Volume 100 70 92 92 82 75 10k 40

SPEAKER SELECTION =6.5W

Audio Data
Frequency Response
Front Speakers
RF AV Y HDMI USB Freq BAND MAX
Volume 0 15 13 13 15 15 100hz 24
Volume 25 36 30 30 40 38 300hz 33
Volume 50 56 52 52 67 60 1k 30
Volume 75 68 92 92 86 76 3k 39
Volume 100 100 100 100 100 100 10k 40

SPEAKER SELECTION =10W

Audio Data
Frequency Response
Front Speakers
RF AV Y HDMI USB Freq BAND MAX
Volume 0 8 11 11 6 4 100hz 24
Volume 25 30 33 33 33 32 300hz 33
Volume 50 33 45 45 51 49 1k 30
Volume 75 50 58 58 60 54 3k 39
Volume 100 58 65 65 64 60 10k 40

21
 B) PANEL DATA.
Panel Design data as per panel selection.

Panel Type SS_LTM216AT01

Lvds Mapping 1
design Set SS_LTM216AT01
Back Light 0 --> 15
Panel Control
Back Light Curve Back Light 5 --> 100
Back Light 10 -->255
BackLight Way DC

Source TV AV YPbPr ,VGA,Multimedia HDMI

Contrast 0 0 0 0 0
Contrast 50 50 45 70 77
Contrast 100 75 63 90 95
Brightness 0 75 75 80 80
Picture Curve
Brightness 50 132 129 121 127
Brightness 100 170 170 170 170
Saturation 0 0 0 0 0
Saturation 50 78 70 105 86
PICTURE Saturation 100 150 240 150 150
Source TV AV YPbPr ,VGA,Multimedia HDMI
Color Temp Mode: Normal Warm Cool Normal Warm Cool Normal Warm Cool Normal Warm Cool
R_Gain 147 157 127 164 168 106 157 176 109 170 178 106
G_Gain 120 120 126 120 115 114 127 124 114 150 130 125
White Balance
B_Gain 139 109 171 135 113 169 145 110 173 160 110 179
R_Offeset 57 35 42 55 25 47 50 30 58 49 30 44
G_Offeset 63 25 45 61 24 47 58 37 64 52 37 36
B_Offset 48 47 37 48 24 33 48 45 48 50 44 28
Tuner AGC Value 5

Panel Type AUO_T260XW04_V7

Lvds Mapping 1
design Set AUO_T260XW04_V7
Back Light 0 --> 255
Panel Control
Back Light Curve Back Light 5 --> 100
Back Light 10 -->15
BackLight Way DC

Source TV AV YPbPr ,VGA,Multimedia HDMI

Contrast 0 0 0 0 0
Contrast 50 30 30 55 65
Contrast 100 45 50 68 85
Brightness 0 95 95 85 85
Picture Curve
Brightness 50 133 135 124 128
Brightness 100 150 150 180 150
Saturation 0 0 0 0 0
Saturation 50 80 70 92 95
PICTURE Saturation 100 180 150 180 180
Source TV AV YPbPr ,VGA,Multimedia HDMI
Color Temp Mode: Normal Warm Cool Normal Warm Cool Normal Warm Cool Normal Warm Cool
R_Gain 165 170 110 172 176 112 140 165 128 150 170 105
G_Gain 138 128 120 140 129 119 110 110 105 120 112 107
White Balance
B_Gain 170 130 175 165 112 165 168 125 175 160 120 150
R_Offeset 35 51 72 36 51 72 42 66 60 30 66 75
G_Offeset 45 51 63 48 51 63 47 60 60 40 63 60
B_Offset 35 49 55 45 44 55 35 65 60 30 65 56
Tuner AGC Value 5

22
 8 PANEL MATRIX.
Backlight Way

Screen Size Panel Type Panel Supply LVDS Conn LVDS Mapping
AUO_M185XW01,V1.0 5V 1100053906 1 DC
LG-LC185TLG1 5V 1100053906 1 DC
19" SAM_185AT02 5V 1100053906 0 DC
SS_LTM190M2-L31 5V 1100059980 1 DC
IVO_M190MWW3R0 5V 1100059980 1 DC
LC220WXE-TBA1 5V 1100053906 1 DC
22" LCD CLAA 216WA01 5V 1100053906 1 DC
SAM_LTA216AT01 5V 1100053906 1 DC
AUO_T240XW01 5V 1100062050 1 DC
24" LCD
KAIL_T240XW01 5V 1100062050 1 DC
LED_AUOT240HW01V0 12V 1100064619 1 PWM
24" LED LED_AUOM240HW01VB PWM
5V 1100059980 1
LED_CMOM236H1LE2 5V 1100059980 1 DC
SAM-LTA260AP02 12V 1100053903 0 DC
26" LG- LC260WXNSBA1 12V 1100053904 1 PWM
AUO- T260XW04 V7 12V 1100053904 1 DC
SAM-LTA320AP02 12V 1100053903 0 DC
32"
SHARP-LK315T3LZ31 12V 1100053904 1 DC
HD Ready
AUO- T315XW03 V3 12V 1100053904 1 DC
Note: For PWM panels delete C11,C199 from main board

23
 9 TROUBLESHOOTING.
A) DEAD OR STAND BY.
(fault description: LED is off or red LED is always on )

N 1. Check the 5V_STB have +5V or not. If OK

Firstly confirm if the AC power supply please check main chassis.
mains Switch is ok, and then Check if the 2. If 5V_STB abnormality, pull out the power
LED Not on
red LED is on supply connector, Then retest the 5V_STB, if
become OK main chassis problem, if still
can’t power on Y abnormality the power supply board problem.

Check if the voltage of the UP2 output is

N
3.3V, Then check the 3.3V is get to the
MT8223L IC Pin: 29, 39, 74

Check if the crystal is work, The frequency N

is 27M, Check the Q4 reset circuit normal
working.

N
Check if the +5V from power supply is
normal, Then check the LDO output voltage
of UP5:1.25V; UP4: 3.3V; UD1: 2.5V; UP6: 1.1V

Check if all the working voltage are get to

MT8223L IC VCC Pin, And the U3 FALSH IC N
UM2 E2PPROM IC working voltage is OK,
Check the I2C data waveform is normal.
Check the FALSH IC load normal software.

If all the working condition are ready but

still can’t power on ,Please try to change
MT8223L main IC.

24
B) NO DISPLAY OR NO BACKLIGHT.
(

Firstly check if the power supply N Check the PSU of LCD or LED. Y
output 12V of LCD PSU or output 24V Check LED Driver Board of LED
of LED PSU is normal. Panel and the connector to Panel.

Check the pin voltage of socket
N
CN1 pin 11 Backlight on/off control is
high level to 4.0V~5V; (Pin12:ON:
4.0V~5V; OFF:0~0.8V)
Check the transistor Q49 and the
relevant circuit work is normal.
Then check MT8223L pin95 IO
control level is low.

Check the pin voltage range of socket Y

CN1 Pin10 following:
Software of 18.5”~21.6” Panel (range
0.08~5V),0.08V= Max. brightness;
Check the transistor Q48 and the
Software of 26” ~32” Panel
relevant circuit work is normal
(3.3~0.08V),3.3V= Max. brightness; N
Then check the IO Pin94 of IC
PWM control Panel: The PWM
MT8223L.
frequency is 200HZ.

Check the LVDS connector is OK, And

Y
check the Panel power supply voltage
is normal.

If check the IO control of MT8223L Backlight ADJ Pin94 or Backlight on/off Pin95 or
LVDS Power soupy control Pin96 is abnormal and check the MT8223L working condition
is normal, Please try to change MT8223L main IC.

25
C) BACK LIGHT ON & NO VIDEO.
(white screen or no picture)

Firstly check the LVDS connector 1. Change the LVDS connector.

from main board to panel interface N 2. If have not +5V/12V Panel power
is OK, then check the panel supply supply, Check U31 switch IC and
power +5V or 12V is normal. MT8223L I/O control circuit.

Check LVDS Socket solder is OK or 1. Check the component of CN9

N
not, Then check LVDS signal data 2. Check the MT8223L IC working
waveform output is normal form IC circuit.
Pin.

Y Y

As per input source picture If all the work condition are ready but
abnormality, Check the TV source still picture abnormality try to change
tuner ,AV ,VGA, Ypbpr, HDMI socket to MT8223L main IC.
MT8223L input Pin circuit.

26
D) NO SOUND.

Firstly check all audio source no sound or N Which source no sound check which audio
which source no sound. input circuit before audio switching IC 4052.

All no sound

Check the audio switch IC 4052 working is Check the IC4052 around circuit or change
N
OK, Then check the audio signal get to IC 4052.
MT8223L IC Pin:78,80.

Check the audio signal output from Check MT8223L audio part circuit or Audio
N
MT8223L IC Pin:102,103. Then check the DAC circuit.
DAC circuit of QA8, QA9, KQ2, QA5.

Check the power supply L82 12V is OK, And

N Check the power supply board or try to
the 12V is get to the TDA7491P VCC Pin.
change new power supply board.
Then check the TDA7491P IC “MUTE” Pin
level is high,

If all the working condition is OK, but still

no sound, Please try to change the audio
AMP. IC TDA7491P

27
28