IC PACKAGING

Kalindi Deshmukh
Mohit Kulkarni
 Contents
● Packaging Overview
● Package Types
● Electronics Package
Reliability
 Packaging Overview
● In electronics manufacturing, integrated circuit packaging is
the final stage of semiconductor device fabrication, in which
the tiny block of semiconducting material is encased in a
supporting case that prevents physical damage and
corrosion. The case, known as a "package", supports the
electrical contacts which connect the device to a circuit
board.

● Development of IC package is Dynamic Technology. It

allows the chip to be integrated to a larger system.

● From mobile technology and satellite broadcasting to

aerospace and automobile application each imposes its own
demands on electronic package.
 Packaging Overview
Chip characteristics that affect packaging:

● Integration

● Wafer Thickness

● Dimensions

● Environmental Sensing

● Physical Vulnerability

● Heat Generation and Heat Sensitivity

 Packaging Overview

Steps in Packaging process:

1. Backside Preparation
2. Die Separation
3. Die Pick
4. Die Inspection
5. Die Attached Process and Die Bonding
 Package Types
To meet a diverse range of
requirements, IC package range
encompasses over 30 different types.
A few are listed below:
● Surface Mount Packages (Plastic or Ceramic)
● Chip Scale Packaging
● Bare Die
● Through Hole Packages
● Module Assemblies
 Surface Mount
Packages
● In SMT, the plastic is molded around lead frame of the
device. Plastic parts shipped in sealed bags with
dessicant are designed for 12- month storage and
should be opened only when parts are to be used.
● Plastic packages are hydroscopic ad absorb moisture
to a level dependent on the storage environment.
● The moisture can vapourise due to rapid heating,
allowing contaminants to enter the IC and can cause
package cracking (popcorn effect) and corrosion,
leading to device failure.
 Surface Mount
Packages
● Hermetic packages such as older flatpack design or
ceramic leadless chip carriers are used in harsh
applications that shorten life of the device. Hence, they
are used in mission-critical communication, navigation,
avionic systems.
● Metal packages, with glass seals provide highest level
of hermetic sealing followed by glass and ceramics.
They have higher temperature range than plastic
encapsulated parts.
● These devices are made up of three ceramic layers
which result in hight cost. And, its availability is limited.
 Surface Mount
Packages
Surface Mount packages include the following:
● First is Ball Grid Array (BGA), developed by IBM. Leads,
or pads, are replaced by solder balls that replace high
pin count quad flatpacks (QFP). Several hundred
arrayed leads can be accomodated in a less area.
It dissipates heat quite efficiently, there is a metal lid
BGA that uses metal ribbons and thermal silicon to
transfer heat to the package's metal lid. It acts as a heat
sink and popcorning is eliminated.
 Surface Mount
Packages
Other Surface Mount Packages include the following:
● Ceramic Ball Grid Array
● Cerpack
● Cerquad
● Chip Carrier
● Chip Scale Grid Array
● Flatpack
● Gull Winged Leadless Chip Carrier
● Leadless Chip carrier
 Chip Scale Packaging

● This form of packaging technique is designed to have

the size and performance of bare die parts but with the
handling and tesatbility of packaging devices.
● The package size is no more than 1.2 times the
original chip.
● Flip chips have enlarged solder pads (bumps or balls)
● Flip chip packages include the controlled collapse chip
connection (CA), developed by IBM and the direct chip
attachment (DCA), developed by Motorola
 Chip Scale Packaging

Some general designations are as follows:

● Bumped Chip
● Flip Chip, where I/O terminations are in form of bumps on one
side of the package. After surface passivation, it is flipped and
attached to a matching substrate.
● Mini BGA, uses a predetermined grid array for solder bumps.
● Repatterned Die.
● Microsurface Mount Packages (MSMT), a deposited horizontal
metallisation, instead of bond wires, goes from bond area to
connection port.
● Slightly Larger than IC Carrier (SLICC)
 Bare Die
● Bare, or unpacked, offer the smallest size, with no
signal delays associated with the device package.
● Current issues related to unpackaged devices are
packaging, handling and testing.
● Some of the most common bare die and tape
packages are as follows:
● C4BGA
● Chip Scale Package (CSP)
● Chip on Board (COB), Chip on Flex (COF)
● Tape Carrier Packages(TCP), Tape Carrier Ring (TCR)
 Through Hole Packages

● These packages as the name implies, mount in holes

on the printed circuit boards. It involves lead on
components inserted into the holes and soldered to
the pads on opposite side.
● It provides strong mechanical support compared to
SMT.
● The additional drilling makes the board more
expensive to produce.
● These techniques are usually reserved for bulkier
components, such as electrolytic capacitors that
require mounting strengths.
 Through Hole Packages

● Some of the device packages are as follows:

● Batwing
● Ceramic Dual In-line Package (CERDIP)
● Plastic DIP (PDIP)
● Pin Grid Array (PGA)
● Quad In-line Package (QIP)
● Single In-line (SIP)
● Vertical In-line Package (VIL)
 Module Assemblies
● This terminology is used to refer to packaging
schemes that take either packaged parts or bare die
and use them to make an assembly. This maybe by
either mounting parts to a substrate or PCB or by
stacking parts or die to create dense memory
modules.
● The packaging scheme maybe surface mount or
through-hole.
● The circuit board assemblies maybe through hole
(having pins) or designed for socket mounting (with
conductive traces).
 Module Assemblies

Variations include the following:

● Dual In-line Memory Module (DIMM)
● Full Stack Technology
● Leaded Multichip Module (LMM)
● Multichip Module (MCM)
● Memory Cube
● Single In-line Memory Module (SIMM)
● VDIP module
 Electronics Package
Reliability
● Once the wafers are fabricated, the chips are separated
and tested. The succesful chips are sent for packaging.
● It is of utmost importance for a device to qualify
reliability test before they are sent to the market.
● The reliability of a device is defined as its ability to
perform as intended under given conditions and for a
specific period of time.
● The devices should perform within acceptance levels
without failing in different conditions during shipping and
storage. The reliability is tested by performing
accelerated testing during which device package is
subjected to extreme conditions.