Fiber 

Optics


Fibers
200/230 PolyCladTM Fiber
• 200µm HPCF for Data-Communications
Polymicro 200/230
• Crimp & Cleave Compatible PolyClad™ Fiber
200μm HPCF for Data-Communications
Crimp and Cleave Compatible
Characteristics
Step Index
❍CHARACTERISTICS ❍ Large Core and high NA provides easy
❍ Low –OH, Synthetic Fused Silica Core, termination and high coupling efficiency to
Step index
PolyClad™ High tensile
Hard Polymer Clad, ETFE Buffer lightstrength
source and minimal bend Chemically resistant
or Jacket radius❍ forCrimp/Cleave
high reliability
and Epoxy/Polish Compatible
Flame retardant
❍Low –OH, synthetic fused silica core,
Broad Operating Wavelength Range, ❍ Radiation Resistant
PolyClad™ hard polymer clad, ETFE Crimp/cleave and epoxy/polish
Optimized at 650 & 850nm ❍ Chemically Resistant Short-to-medium distance data
buffer or jacket compatible
❍ Minimal Connector Offsets Due to High ❍ Flame Retardant communications for factory automation
Clad/Core
Broad Diameter
operating Ratio range,
wavelength Large ❍coreShort-to-Medium Distance Data Communications
and high na provides for Factory
and process control
High Tensile
❍optimized Strength
at 650 and Minimal Bend easy termination
and 850nm Automationand&high coupling
Process Control
Radius for High Reliability efficiency to light
❍ Euro source
RoHS Compliant Euro rohs compliant
Minimal connector offsets due to high
Typical Applications:
clad/core diameter ratio Radiation resistant
Chemical Plants, Refineries, Avionics, Automotive, Production/Manufacturing Plants, Mobile Platforms, Wind
Power, Power Plants, PLC’s. Low –OH Silica Core
Spectral Attenuation
200µm Hard Clad Fiber
Hard Polymer Clad

ETFE Buffer/ Jacket

Specifications Applications

Parameters Specifications
Chemical plants

Core Diameter 200 +/- 4µm Refineries

Cladding Diameter 230 +/- 10µm Avionics

Buffer Diameter 500 +/- 30µm Automotive
Core/Clad Offset ≤5µm Production/manufacturing plants
Core Material Low–OH Synthetic Fused Silica, SiO2 Mobile platforms
Cladding Material PolyClad™ Hard Polymer Wind power
Buffer Material ETFE
Power plants
Numerical Aperture (NA) 0.37 +/- 0.02
PLC’s
03/19 / V04 / IF / polymicro/hpcf-low-oh

Attenuation ≤ 6 dB/km at λ=850nm ≤ 10 dB/km at λ=650nm

Short-term Bend Radius ≥10mm

Long-term Bend Radius ≥16mm

Proof Test Level 18019 N. 25th Avenue • ≥150

Phoenix,
kpsiAZ 85023-1200
(1.03GPa) • Flexible Capillary
Voice: (602) 375-4100 Fax: (602) 375-4110 • Multimode Optical Fiber
Operating Temperature -65 to +125°C
E-Mail: polymicrosales@molex.com • Specialty Assemblies
URL: http://www.polymicro.com • Micro-Components
Bandwidth at 850nm ≥20MHz-km

Standard Reel Length 2200m +/- 5% Copyright © 2011 Polymicro Technologies

Order No. 987650-8931 Printed in USA/GF/2013.09 ©2013 Molex

Germany & Other Countries France Nordic Countries

Laser Components GmbH Laser Components S.A.S. Laser Components Nordic AB
Tel: +49 8142 2864 – 0 Tel: +33 1 39 59 52 25 Tel: +46 31 703 71 73
Fax: +49 8142 2864 – 11 Fax: +33 1 39 59 53 50 Fax: +46 31 703 71 01
info@lasercomponents.com info@lasercomponents.fr info@lasercomponents.se
www.lasercomponents.com www.lasercomponents.fr www.lasercomponents.se