P70-A Service Manual V1.0

Service Manual of
Lenovo P70-A Mobile

Phone
Lenovo
Repair Manual of Lenovo P70-A Mobile Phone
Document name Service Manual of Lenovo P70-A Mobile Phone

Version: V1.0
Date: Nov 3, 2014
Document No.:
Status:
Preface
This manual is intended for online repair guidance and after-sale repair guidance of
Lenovo P70-A mobile phone produced by the Company
The content of this manual will be upgraded according to the needs of technology
development.
Copyright
The copyright of this manual belongs to Lenovo Mobile; anyone who reproduces this
manual without written consent of the Company shall bear legal responsibility.
1
Content
1. Appearance ............................................................................................................................. 5
2. Layout of main board ............................................................................................................. 6
3. Baseband................................................................................................................................. 7
4. Main adverse analysis ............................................................................................................... 8
4.1 LCD DISPLAY ........................................................................................................................... 8

4.1.1 No display on screen after power-on ................................................................................... 8
4.1.2 LCD backlight without lighting ........................................................................................... 9
4.2 CAMERA DEFECTS ................................................................................................................... 10
4.2.1 Rear camera defects .......................................................................................................... 10
4.3 RING AND VIBRATION.............................................................................................................. 11
4.3.1 No vibration ....................................................................................................................... 11
4.3.2 No ring ............................................................................................................................... 12
4.4 CHARGING .............................................................................................................................. 13
4.4.1 No charging display after plugging the charger in ............................................................ 13
4.4.2 Charging shown but not full charging ............................................................................... 14
4.5 KEYBOARD AND KEYBOARD BACKLIGHT ................................................................................ 15
4.5.1 Abnormal operation of side keys ....................................................................................... 15
4.5.2 Abnormal operation of CTP keyboard ............................................................................... 16
4.6 CALLING ................................................................................................................................. 17
4.6.1 No voice heard from the other side during the call............................................................ 17
4.6.2 No voice heard from your side during the call................................................................... 18
4.7 POWER-ON FAILURE ................................................................................................................ 19
4.8 LCD ON WHEN CLOSE TO THE EAR DURING THE CALL; LCD OFF WHEN AWAY FROM THE EAR. 20
4.9 RADIO FREQUENCY (RF)......................................................................................................... 21
4.10 SOFTWARE DOWNLOAD FAILURE............................................................................................ 21
4.11 PRODUCTION CALIBRATION .................................................................................................... 22
4.11.1 AFC calibration ............................................................................................................. 22
4.11.2 AGC ............................................................................................................................... 23
4.11.3 APC ............................................................................................................................... 24
4.12 FAULT IN COMPLETE SET TEST/ REWORK ................................................................................. 26
4.12.1 Switch spectrum & PVT template with excessive standard ........................................... 26
4.12.2 High Frequency Error ................................................................................................... 27
4.12.3 High Phase Error .......................................................................................................... 27
4.12.4 Power output problems .................................................................................................. 28
4.13 3G/4G FORECAST ................................................................................................................... 29
4.13.1 RSSI _Cal ...................................................................................................................... 29
4.13.2 TPC _ Cal ...................................................................................................................... 29
4.14 3G/4G COMPREHENSIVE TEST ................................................................................................. 31
4.14.1 ACLR or SEM ................................................................................................................ 31
4.14.2 ILPC comprehensive test abnormal ............................................................................... 31
2
4.14.3 Frequency Err................................................................................................................ 31
5. Disassembly Guide .............................................................................................................. 32
6. Assemble Guide ................................................................................................................... 40
3
Prepared/
Version Prepared by/ Reason for
Modified Main changes
No. Modified by change
on
1. Appearance
2. Layout of main board

Front of main board:
Back of main board:
6
3. Baseband
Block diagram of hardware system
7
4. Main adverse analysis

4.1 LCD display
4.1.1 No display on screen after power‐on
White screen or blank screen without display; backlight

with lighting
Check the connection of LCD FPC is good and Y

re-assembled FPC whether phone is normal OK
Check the display is normal after replacing LCD, Y

OK
Check whether the EMI device Z1601--Z1605 of Y

OK
LCD circuit on main board is solder incompletely;
re-solder EMI device
Check whether there is cold solder joint on other

device around LCD and on LCD connector.
8
4.1.2 LCD backlight without lighting
LCD backlight without lighting
Check whether the connection of FPC on

LCD module and connector on main board is Y
OK
good and whether the LCD backlight is
normal after reconnection
Re-verify whether the LCD backlight is Y

OK
normal after replacing LCD.
N
Y
Check whether there are voltages more than If the backlight circuit is
24V between both ends of C1612 when LCD normal, it is the problem
is lit. of LCD
Check the welding condition of U1603 and

peripheral devices, including L1601, Y
D1601, C1612,C1611，R1605,R1606 OK
9
4.2 Camera defects
4.2.1 Rear camera defects
Can not take photos
Check to see whether the camera Y

module is in the right position by OK
disassembling and whether the module
is OK after reassembling module
Whether the camera is OK

Y
after replacing the camera OK
module
Y
Check to see whether the camera
OK
module connector is welded well;
whether the camera is OK after
overlaying welding the connector?
Check to see whether the EMI N

device is complete and welding is Recheck after overlaying welding
in good condition; if not; repair
EMI device(Z1701—Z1705)
Check to see whether

Y
the front camera is Recheck after replacing front
abnormal camera
Check to see whether the main Re-weld or replace U401

N
chip U401 are normally
welded?
10
4.3 Ring and vibration
4.3.1 No vibration
No vibration
Check whether the motor is interfered by

Y
structure; Recheck whether it is normal after OK
reassembling the phone.
Replace the motor to see whether

it is ok? Check to see whether the Y
OK
circuit around the motor is
normal(R1808，C1811)
Replace U503 chip
11
4.3.2 No ring
No ring
Replace Speaker and recheck whether it is

normal? Y
Check to see whether the SPK circuit is OK
normal?(D1405,D1406,C1413,B1405,B1406,R
505,R506)
Use earphone to test whether there is sound; if

there is sound from earphone, there is audio Y
signal to input. Check whether J1803 KB OK
connector device is of cold solder joint; recheck
whether it is ok after re-welding，Replace the
KB connector FPC to try again；
Check to see whether the main chip U503 is Y

damaged. Replace it if damaged. OK
12
4.4 Charging
4.4.1 No charging display after plugging the charger in
No charging display after

plugging the charger in
Y
Check whether the charging is normal
Replace the charger
after replacing the charger (J801).
Y
Replace the battery and see whether the
Replace the battery
charging is normal? Measure the battery
voltage to see whether it is less than 3V
Y
Check to see whether U630 module
OK
device is well welded? Whether it is
normal after re-welding
N
Y
Replace U503 OK
13
4.4.2 Charging shown but not full charging
Charging shown but not

full charging
Y
Replace the battery and then check whether it
OK
is fully charged
N
Re-solder the USB connector
Check to see the Voltage of VCHG is Y
or change for another FPC ;
normal (5.0V), Check the VCDT Circuit
Re-solder or change the
& ISENSE Circuit components is normal
components which is damaged
(R523, R524, R551, R571,R663,R662 )
or in poor soldering
Replace U630 module device and Y

then recheck OK
N
Y
Replace U503 OK
14
4.5 Keyboard and keyboard backlight
4.5.1 Abnormal operation of side keys
Abnormal side key
Check whether there are conditions like cold Y

solder joint and short circuit on keyboard OK
FPC ? Whether it is ok after re-welding?
N
Y
FPC is fracted, Replace
OK
side keys FPC
Check whether there are conditions like cold solder

joint and missing device on the circuit device of side
keys and power key .
( R1806,R1807,D1802,D1803,R1801,D1801,C1801 )
Replace U401/U503
15
4.5.2 Abnormal operation of CTP keyboard
CTP keyboard is invalid
Y CTP damaged,
Whether the CTP test is normal?
replace it
Replace one CTP to see whether Y

it is the problem of touch screen Replace CTP
or main board?
It is the problem of CTP connector J1601

or main chip U401 welding
16
4.6 Calling
4.6.1 No voice heard from the other side during the call
No voice heard from the other

side during the call
N
Cold solder joint
Use earphone and hands-free to verify of main
whether there is voice? chip(U503) or
main chip(U503)
Y is abnormal
Y
Replace the headphones and then re OK
check whether it is normal
Check whether Y
B1403,B1404,C1428,C1427,D1403,D140 OK
4,are well welded. Re-weld and test
Replace U503
17
4.6.2 No voice heard from your side during the call
No voice heard from your side during the call
Check whether receiver and the peripheral devices are Y

well welded; whether it is ok after re-welding? Re-weld
Check whether receiver module device is well

welded. Replace this device and see whether it is Y
ok? OK
Check U503 and

C1402,C1403,R1401,R1402,R1403R1404 is OK
18
4.7 Power-on failure
Failed to Power-on
Y
Check whether the power key FPC is Re-weld
assembled well , reassembling the
power FPC ?
Power on the phone on separate main Y The main board is damaged;

board , whether there is high current? replace the main board and check
the failure board step by step
N
Check whether the 26MHz on X801
Re-weld and recheck
is normal? Whether there is 26MHz
signal
Y
N
Check whether X801 is well
Re-weld and recheck
welded
Check whether the main power supply of U503 is N Re-weld or

normal? replace device
（VCORE,VPROC,VIO18,VTCXO,VIO28,VRF U301 to recheck
28,VRF18,VMC, etc.）
Replace the main chip U503
19
4.8 LCD on when close to the ear during the call; LCD off
when away from the ear.
Abnormal display of LCD

during the call.
Y
Check whether P-Sensor related circuit is p-sensor FPC
normal? Or replace p-sensor IC U1502 Problem
N
Y Replace the application
Whether the touch screen is well of gum of touch screen
pasted with the shell and re-paste
Check whether G-SENSOR and touch screen

is normal. If G-SENSOR and touch screen is
normal, I2C is normal, or else, U401 is
abnormal..
Check U401
20
4.9 Radio frequency (RF)
4.10 Software Download Failure
　 Faults: Software can’t be normally downloaded.

　 Reason: Baseband chip is oppositely pasted or is in cold solder joint; CRYSTAL is
oppositely pasted (no clock signal) or is in cold solder joint.
　 Shooting:
Software can’t be normally downloaded or the

phone can’t Power-on be turned on.
Y
Check whether USB connector is Re-weld USB connector or
in cold solder joint use another KB to verify it
Check whether TCXO （X801） Y

Re-weld X801
is oppositely pasted?
Whether baseband chip MT6752 Y

Re-weld U401
（U401） is oppositely pasted
Whether flash U701 is Y

Re-weld U701
oppositely pasted
　 Re-download software when it is normal after replacing elements,.
21
4.11 Production calibration
4.11.1 AFC calibration
　 Fault: AFC calibration Fail.

　 Reason: RF test cable is not connected well during calibration; TCXO is oppositely pasted
or in cold solder joint.
　 Shooting:
AFC calibration
Fail
Check whether RF cable and

N
fixture is well connected? Reconnect and calibrate
Check whether TCXO Y Re-weld X201

（ X801 ） is oppositely
pasted?
Check whether TCXO （X801） Y Re-weld X801

is in cold solder joint?
Check whether there is Y Replace PA（U801）

MT6166 (U801)
Recalibrate
　 Notes: Remember to recalibrate after replacing elements.
22
4.11.2 AGC
　 Fault: AGC calibration Fail.

　 Reason: RF test cable is not connected well during calibration; the devices in receiving
cable are in cold solder joint (such as RF connectors, antenna switch, saw the filter and
the surrounding capacitance).
　 Shooting：
Rx path lo
calibration fails
N Check calibration report to see Y

whether the two frequency
bands fail?
GSM frequency Y Whether X801 is Y Re-weld Check whether RF cable

N Reconnect and
band fails? in cold solder joint and fixtures are well
calibrate
connected?
N
N
Y
Whether Rx is in cold
Y Whether U1001Rx is in solder joint? Check whether RF
Re-weld Y Re-weld or
cold solder joint? Y Re-weld
replace connector J1001 is in cold
solder joint? J1001
N N
Y N
Whether U1002 Whether C809 are in cold Y Re-weld or
Re-weld Rx is in cold Whether R137 is in cold
solder joint? replace Y Re-weld
solder joint? solder joint?
N
N
Whether U801 Rx is in cold
Re-weld Y
solder joint?
N
Check the baseband chip
U401
　 Notes: Remeber to recalibrate after replacing compoments.
23
4.11.3 APC
Fault 1
　 Fault: APC calibration Fail.
Cause: RF test cable is not connected well during calibration; PA is oppositely pasted; PA
and peripheral circuit are in cold solder joint; The patch of RF input circuit of PA is deviated
with short-circuit shield box.
　 Shooting:
PCL calibration Fail
N Check calibration report to Y

see whether each frequency
bands fail?
2G/3G N LTE frequency fail Check whether RF

N Reconnect
frequency fails? cable and fixtures are
and calibrate
well connected?
Y Y
Y
PA input circuit are PA input circuit are
Re-weld Replace
welded with welded with Y Whether RF connector
disconnection？ components Y Re-weld
disconnection? are in cold solder joint?
N
N Whether PA is in N
cold solder joint? Y Replace PA
Weld PA Y Whether PA is in Whether related Y Re-weld
cold solder joint? components is in cold
solder joint?
24
Fault 2:
　 Fault: The output power of the mobile phone is too high.
　 Cause: The cable isn't well connected in calibration.
　 Shooting:
Calibration power is too high
Check RF cable and fixtures to

ensure well connection
Reconnect and calibrate
Fault 3:
　 Fault: After repeated calibration, the power is still low.
　 Cause: Some element patches of PA and surrounding VAPC input are displaced or PA is
damaged.
　 Shooting:
After repeated calibration, the

power is still low.
Related PA may be
partially damaged; N Replace Vramp
recalibrate. circuit
25
4.12 Fault in complete set test/ rework
4.12.1 Switch spectrum & PVT template with excessive
standard
　 Fault: The switch spectrum and PVT template of GSM and DCS frequency bands are
excessive.
　 Cause: The cold solder joint or damage to components in V_ramp of PV may result in the
excessive switch spectrum.
　 Shooting:
Switch spectrum and Ramp

Mask with excessive standard
Measure to see whether the voltage of PA is in the normal

range (1.8V or less)?
Check whether the input and output

matching is in cold solder joint?
Replace the elements in cold

solder joint
Replace PA if necessary
26
4.12.2 High Frequency Error
　 Fault: Frequency Error exceeds standard in complete set test.

　 Cause: There is problem in VAFC input circuit of TCXO.
　 Shooting:
Excessive Frequency Error
Recalibrate
Check whether X801 is in cold solder
joint or damaged
Replace the elements in cold solder

joint
4.12.3 High Phase Error
　 Fault: Phase Error exceeds standard in complete set test.

　 Cause: The capacitors of power supply part of PA and transceiver are in cold solder joint
or in short circuit with other resistance.
　 Shooting:
27
Excessive Phase Error
Check the power supply part of PA（and transceiver
Replace the elements in cold

solder joint
4.12.4 Power output problems
　 Fault: Normally power-on and receive, but when outputting two frequency bands or single
frequency band power, there is no input power or the input power is very low.
　 Cause: There are many reasons for no output power or very low power, which may be the
results of faults of Transceiver output part, PA input and output circuit, antenna connector
and antenna switch control signal or power supply circuit. Specific circumstances are:
RF connector（J1001/J1002）
Checking: Whether RF connector J1001/J1002 and the test probe of RF test cable are
well connected or the patch is oppositely pasted or the antenna connector is damaged.
Shooting: Replace antenna connector and ensure right direction of patch.
RF power amplifier (PA)

A. Whether the control signal of PA(U901,U902) is high level (about 2.8V); if it is low
level, there is no output of PA;
B. Check the PA power supply part to see whether the power supply voltage is in the
normal range (typically 3.6V ~ 4.2V);
C. Whether the RF input parts of PA are in cold solder joint;
D. Whether the RF output parts of PA is in cold solder joint;
E. Part circuit of VPA_PMU control signal of PA: if it is in old solder joint or in interruption
of circuit, PA also has no output power.
Transceiver（U801）
A. Whether the power supply voltage of Transceiver（U801） is within normal range;
check the power supply voltage between power supply filtration capacitor and U801
connection and then check whether the surrounding circuit is in cold solder joint.
B. Whether there is cold solder joint or short circuit in Transceiver （U801）.
28
If it is possible to repair the complete set, the output power of each module on
transmission channel can be detected through spectrum analyzer probes when keeping the
phone in the constant state of maximum power. Under normal circumstances,
A. About GSM 33dBm and DCS/PCS 30dBm output power can be detected on the
output end of RF connector.
B. About 3dBm output power can be detected on matching circuit parts of PA input end;
C. About 32dBm or 29dBm output power can be respectively detected on pinD11
connection of PA output end;
D. About 3dBm output power can be detected on Transceiver (U801) output end.
4.13 3G/4G forecast
4.13.1 RSSI _Cal
Fault: RSSI fails

Cause: There are problems in receiving channel
Repair manner:
RSSI _cal
RSSI Fail？
Whether TX module Y
U801,U901,U902 and RF Re-weld
connector J1001 are in cold
Check whether U801 and the

surrounding circuit devices are Y
Re-weld
in cold solder joint or partially
pasted
4.13.2 TPC _ Cal
Fault: TPC fails

Cause: There are problems in transmission channel
Repair manner:
29
TPC
Check whether RF cable and fixtures are Y Reconnect and

well connected? calibration
Whether Rf connector J1001 ， Tx module

U901 and the surrounding circuit devices are Y Re-weld
in cold solder joint？
Whether 3G/4G PA U901

Y Re-weld
U902 is oppositely pasted
or in cold solder joint?
Whether the duplexer

Y
U1001 through which Re-weld
3G/4G transmission
channel passes is in cold
solder joint?
30
4.14 3G/4G comprehensive test
4.14.1 ACLR or SEM
Fault: ACLR or SEM

Cause: No calibration or PA（U901,U902） is in cold solder joint; check the Point problem circuit
components or RF transceiver (U801) doesn’t work well.
Repair manner:
ACLR or SEM
Whether it is OK after recalibrating WCDMA/LTE?
Re-weld PA or replace PA and the devices in

transmission circuit?
Re-weld or replace
transceiver
4.14.2 ILPC comprehensive test abnormal
Fault: ILPC
Cause: No calibration or just passing calibration.
Repair manner: The same as 4.5.1.
4.14.3 Frequency Err
Fault: Frequency Err

Cause: No calibration, or suffered outside interference
Repair manner: Recalibrate 3G/4G and test; replace X801.
31
5. Disassembly Guide
（1） Remove the battery cover
Divides the battery cover is separated from B shell from your mobile phone at the
bottom right hand, as shown in figure 1 and 2
Figure 1
Figure 2
32
（2） Remove the screws

Use a screwdriver to take out the 8 screws, 8 red circle marked, as shown in figure 3.
Figure 3
（3） Remove the B shell
Break open outward the top right corner to B shell. According to the order(1-4) of the
figure 4 in turn to open B shell. Or use A teardown piece is separated from A shell.
Figure 4
33
Apart after B shell as shown in figure 5, and then remove the red circle marked two screws of antenna
pedestal.
Figure 5
（4） Separate the A shell and PCB mainboard LCD/motor/TP/side key/camera/battery
FPC.
Open the CTP,LCD’s FPC cover, then pull out the FPC Then separate the A shell of the joint
surface and side key/camera/battery FPC/moto,as shown in figure 6.
Figure 6
34
（5） Remove the mainboard.

Remove the antenna bracket on mall plate, then remove the battery and the main board
and small plate connection coaxial line. Use the screwdriver loosen three screws(shown as the
figure 7,8,9)from A shell motherboard, Loosen screws from small plate, also will be
motherboard cock as a whole.
Figure 7
Figure 8
35
Figure 9
36
（6） Remove the telephone receiver
Take off the receiver from A shell with forceps, don't bend the shrapnel. Remove the
light induced rubber lining,as shown in figure 10.
Figure 10
（7） Remove the TP
Oven heated the TP (temperature at 80℃ for 10 minutes), with suction cups on the TP from A
shell will be removed.Notice: First from the right side of the TP split up in central, with teardown
card along the clockwise direction, TP is separated from A shell, In separate to the top when
should pay attention to protect the FPC, slow down to action ，avoid the FPC is torn. After the
TP removed, use film to protective the LCD and TP,as shown in figure 11/12/13.
Figure 11
37
Figure 12
Figure 13
（8） Remove the motor/camera/FPC side key
Use the soldering iron to remove the motor wire/side key FPC from the motherboard,as shown
in figure 14.
38
Figure 14
39
（9） The motor/camera/side key FPC samples as shown in the figure 15
Figure 15
6. Assemble Guide
Please refer to disassembly Guide , assembly process in contrary to the disassemble process.
40

P70-A Service Manual V1.0

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Service Manual of

Lenovo P70-A Mobile

Document name Service Manual of Lenovo P70-A Mobile Phone

2. Layout of main board ............................................................................................................. 6

4. Main adverse analysis ............................................................................................................... 8

4.1 LCD DISPLAY ........................................................................................................................... 8

4.14.3 Frequency Err................................................................................................................ 31

5. Disassembly Guide .............................................................................................................. 32

6. Assemble Guide ................................................................................................................... 40

2. Layout of main board

Back of main board:

Block diagram of hardware system

4. Main adverse analysis

White screen or blank screen without display; backlight

Check the connection of LCD FPC is good and Y

Check the display is normal after replacing LCD, Y

Check whether the EMI device Z1601--Z1605 of Y

Check whether there is cold solder joint on other

LCD backlight without lighting

Check whether the connection of FPC on

Re-verify whether the LCD backlight is Y

Check the welding condition of U1603 and

4.2 Camera defects

Can not take photos

Check to see whether the camera Y

Whether the camera is OK

Check to see whether the EMI N

Check to see whether

Check to see whether the main Re-weld or replace U401

4.3 Ring and vibration

Check whether the motor is interfered by

Replace the motor to see whether

Replace U503 chip

Replace Speaker and recheck whether it is

Use earphone to test whether there is sound; if

Check to see whether the main chip U503 is Y

No charging display after

Charging shown but not

Replace U630 module device and Y

4.5 Keyboard and keyboard backlight

Abnormal side key

Check whether there are conditions like cold Y

Check whether there are conditions like cold solder

CTP keyboard is invalid

Replace one CTP to see whether Y

It is the problem of CTP connector J1601

No voice heard from the other

No voice heard from your side during the call

Check whether receiver and the peripheral devices are Y

Check whether receiver module device is well

Check U503 and

4.7 Power-on failure

Power on the phone on separate main Y The main board is damaged;

Check whether the main power supply of U503 is N Re-weld or

Replace the main chip U503

Abnormal display of LCD

Check whether G-SENSOR and touch screen

4.9 Radio frequency (RF)

4.10 Software Download Failure

Faults: Software can’t be normally downloaded.

Software can’t be normally downloaded or the

Check whether TCXO （X801） Y

Whether baseband chip MT6752 Y

Whether flash U701 is Y

　 Faults: Software can’t be normally downloaded.

　 Re-download software when it is normal after replacing elements,.

　 Fault: AFC calibration Fail.

　 Notes: Remember to recalibrate after replacing elements.

　 Fault: AGC calibration Fail.

　 Notes: Remeber to recalibrate after replacing compoments.

　 Fault: Frequency Error exceeds standard in complete set test.

　 Fault: Phase Error exceeds standard in complete set test.

RF power amplifier (PA)