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OUTLINE
The R1170x Series are positive voltage regulator ICs by CMOS process. The R1170x Series have features of
high ripple rejection, low dropout voltage, high output voltage accuracy, low consumption current. Each of these
ICs consists of a voltage reference unit, an error amplifier, resistor net for setting output voltage, a current limit
circuit at short mode, a chip enable circuit, and thermal-shunt circuit. Output Voltage of R1170 is fixed in the IC.
Low consumption current by the merit of CMOS process and built-in transistors with low ON-resistance make
low dropout voltage and chip enable function prolong the battery life. These regulators are remarkable
improvement on the current regulators in terms of ripple rejection, input transient response, and load transient
response.
Maximum Output Current is large for its compact size.
Thus, the R1170x Series are suitable for various power sources for portable appliances.
Since the packages for these ICs are the SOT-89-5 package, HSON-6,or HSOP-6J, high density mounting of
the ICs on boards is possible.
FEATURES
• Ultra-Low Supply Current............................................. Typ. 80µA
• Low Standby Current ................................................... Typ. 0.1µA
• Output Current ............................................................. Min. 800mA (VIN=VOUT+1.0V)
• Low Dropout Voltage.................................................... Typ. 0.12V (VOUT=3.0V, IOUT=300mA)
• High Output Voltage Accuracy ..................................... ±2.0%
• Low Temperature-drift Coefficient of Output Voltage ... Typ.±100ppm/°C
• Line Regulation ............................................................ Typ. 0.05%/V
• Output Voltage ............................................................. 1.5V to 5.0V
• Small Package ............................................................. SOT-89-5, HSON-6, HSOP-6J
• Built-in Current Limit Circuit
• Built-in Thermal Shutdown Circuit
APPLICATIONS
• Local Power source for Notebook PC.
• Local Power source for portable appliances, cameras, and videos.
• Local Power source for equipment of battery-use.
• Local Power source for home appliances.
1
R1170x
BLOCK DIAGRAMS
R1170xxx1A R1170Dxxx1B
Vref Vref
SELECTION GUIDE
The output voltage, the chip-enable polarity, the taping type can be selected at the user's request.
The selection can be made with the part number as follows;
Code Contents
Package Type;
H: SOT-89-5
a
D: HSON-6
S: HSOP-6J
Designation of Output Voltage (VOUT)
b
Stepwise setting with 0.1V increment in the range from 1.5V to 5.0V
Designation of option;
c A: Built-in Chip Enable Circuit, Active at "L"
B: Built-in Chip Enable Circuit, Active at "H"
Designation of Taping Type;
d T1 (SOT-89-5), TR (HSON-6), E2 (HSOP-6J)
(Refer to Taping Specifications)
Designation of composition of pin plating
e
-F: Lead free plating (SOT-89-5,HSON-6,HSOP-6J)
2
R1170x
PIN CONFIGURATION
SOT-89-5 HSON-6 HSOP-6J
6 5 4
5 4 Top View Bottom View
6 5 4 4 5 6
Φ1.0
R
1 2 3 3 2 1
1 2 3
1 2 3
PIN DESCRIPTION
• SOT-89-5
Pin No Symbol Description
1 CE or CE Chip Enable Pin
2 GND Ground Pin
3 NC No Connection
4 VDD Input Pin
5 VOUT Voltage Regulator Output Pin
• HSON-6
Pin No Symbol Description
1 VOUT Voltage Regulator Output Pin
2 VOUT Voltage Regulator Output Pin
3 CE or CE Chip Enable Pin
4 GND Ground Pin
5 VDD Input Pin
6 VDD Input Pin
∗ Tab in the parts have GND level. (They are connected to the reverse side of this IC.)
Do not connect to other wires or land patterns.
• HSOP-6J
Pin No Symbol Description
1 VOUT Voltage Regulator Output Pin
2 GND Ground Pin
3 CE or CE Chip Enable Pin
4 NC No Connection
5 GND Ground Pin
6 VDD Input Pin
3
R1170x
4
R1170x
ELECTRICAL CHARACTERISTICS
• R1170xxxxA
Topt=25°C
Symbol Item Conditions Min. Typ. Max. Unit
VIN Input Voltage 6.0 V
VIN−VOUT=1.0V,
ISS1 Supply Current1 80 160 µA
VCE=GND
Istandby Standby Current VIN=VCE=6.0V 0.1 1.0 µA
VIN−VOUT=1.0V
VOUT Output voltage ×0.98 ×1.02 V
IOUT=100mA
IOUT1 Output Current VIN−VOUT=1.0V 800 mA
∆VOUT/ VIN−VOUT=1.0V
Load regulation 30 100 mV
∆IOUT 1mA <= IOUT <
= 300mA
VDIF Dropout Voltage IOUT=300mA Refer to Dropout Voltage Table
∆VOUT/ IOUT=100mA
Line regulation 0.05 0.30 %/V
∆VIN VOUT+0.5V <
= VIN <
= 6.0V
f=1kHz, Ripple 0.5Vp−p
1.5V <
= VIN <
= 4.0V:
RR Ripple Rejection VIN−VOUT=1.0V 50 dB
4.1V <
= VIN <
= 5.0V:
VIN−VOUT=0.75V
∆VOUT/ Output Voltage IOUT=10mA
±100 ppm/°C
∆Topt Temperature Coefficient −40°C <= Topt <
= 85°C
Ilim Short Current Limit VOUT=0V 40 mA
RPU Pull-up resistancefor CE pin 1.25 2.50 5.00 MΩ
VCEH CE Input Voltage "H" 1.50 VIN V
VCEL CE Input Voltage "L" 0.00 0.25 V
Thermal Shutdown
TTSD Junction Temperature 150 °C
Detector Threshold Temperature
Thermal Shutdown
TTSR Junction Temperature 120 °C
Released Temperature
5
R1170x
• R1170xxxxB
Topt=25°C
Symbol Item Conditions Min. Typ. Max. Unit
VIN Input voltage 6.0 V
ISS1 Supply Current1 VIN−VOUT=1.0V,VCE=VIN 80 160 µA
Istandby Standby Current VIN=6.0V,VCE=GND 0.1 1.0 µA
Reference Voltage for VIN−VOUT=1.0V
VOUT
Adjustable Voltage Regulator ×0.98 ×1.02 V
IOUT=100mA
IOUT1 Output Current VIN−VOUT=1.0V 800 mA
∆VOUT/ Load regulation VIN−VOUT=1.0V
30 100 mV
∆IOUT 1mA <= IOUT <
= 300mA
VDIF Dropout Voltage IOUT=300mA Refer to Dropout Voltage Table
∆VOUT/ Line regulation IOUT=100mA
0.05 0.30 %/V
∆VIN VOUT+0.5V <
= VIN <
= 6.0V
f=1kHz, Ripple 0.5Vp−p
1.5V <
= VIN <
= 4.0V:
RR Ripple Rejection VIN−VOUT=1.0V 50 dB
4.1V <
= VIN <
= 5.0V:
VIN−VOUT=0.75V
∆VOUT/ Output Voltage < <
Temperature Coefficient −40°C = Topt = 85°C ±100 ppm/°C
∆Topt
Ilim Short Current Limit VOUT=0V 40 mA
RPD Pull-down resistance for CE pin 1.25 2.50 5.00 MΩ
VCEH CE Input Voltage "H" 1.5 VIN V
VCEL CE Input Voltage "L" 0.00 0.25 V
Thermal Shutdown
TTSD Junction Temperature 150 °C
Detector Threshold Temperature
Thermal Shutdown
TTSR Junction Temperature 120 °C
Released Temperature
6
R1170x
TEST CIRCUITS
CE CE
IOUT ISS
R1170xxx1B 10µF R1170xxx1B 10µF
SERIES SERIES
10µF 10µF
GND GND
CE CE
IOUT
R1170xxx1B 10µF R1170xxx1B
SERIES SERIES 10µF
10µF
P.G.
I1 I2
GND GND
Test Circuit for Ripple Rejection, Test Circuit for Load Transient Response
Input Transient Response
7
R1170x
Phase Compensation
In these ICs, phase compensation is made with the output capacitor for securing stable operation even if the
load current is varied. For this purpose, use as much as 10µF Capacitor as CL.
If you use a tantalum type capacitor and ESR value of the capacitor is large, output might be unstable.
Evaluate your circuit with considering frequency characteristics. Further, refer to the Typical Characteristics No.
12.
Mounting on PCB
Make VDD and GND lines sufficient. If their impedance is high, a current flows, the noise picked up or unstable
operation may result. Further use as much as 10µF capacitor between VDD pin and GND pin as close as
possible.
Set an Output capacitor between VOUT pin and GND pin for phase compensation as close as possible.
(Refer to the example of typical application)
CE
CI CL
GND
CI=10µF(Ceramic), CL=10µF(Ceramic)
8
R1170x
TYPICAL CHARACTERISTICS
1) Output Voltage vs. Output Current (Topt=25°C)
R1170x151B R1170x301B
1.8 3.5
VIN=2.5V VIN=5V
1.6 3
Output Voltage VOUT(V)
0 0
0 250 500 750 1000 1250 1500 0 250 500 750 1000 1250 1500
Output Current IOUT(mA) Output Current IOUT(mA)
R1170x501B
6
5
Output Voltage VOUT(V)
VIN=6V
4 VIN=5.5V
0
0 250 500 750 1000 1250 1500
Output Current IOUT(mA)
IOUT=1mA IOUT=10mA
IOUT=10mA 2
1.5 1.9
1.4 1.8
IOUT=100mA IOUT=100mA
1.7
1.3 IOUT=300mA
IOUT=300mA 1.6
1.2 1.5
1.1 1.4
1 2 3 4 5 6 1 2 3 4 5 6
Input Voltage VIN(V) Input Voltage VIN(V)
9
R1170x
R1170x301B R1170x401B
3.2 4.2
R1170x501B
5.2
IOUT=1mA
5.0
Output Voltage VOUT(V)
IOUT=10mA IOUT=100mA
4.8
4.6
IOUT=300mA
4.4
4.2
4.0
3.8
4.0 4.5 5.0 5.5 6.0
Input Voltage VIN(V)
25°C
0.6 0.6
25°C
0.5 85°C 0.5
0.4 0.4 85°C
-40°C
0.3 0.3
-40°C
0.2 0.2
0.1 0.1
0 0
0 100 200 300 400 500 600 700 800 0 100 200 300 400 500 600 700 800
Output Current IOUT(mA) Output Current IOUT(mA)
10
R1170x
R1170x301B R1170x401B
0.50 0.45
0.45 0.40
Dropout Voltage VDIF(V)
R1170x501B
0.35
0.30
Dropout Voltage VDIF(V)
25°C
0.25
85°C
0.20
0.15
-40°C
0.10
0.05
0.00
0 100 200 300 400 500 600 700 800
Output Current IOUT(mA)
1.55 2.05
1.53 2.03
1.50 2.00
1.48 1.98
1.45 1.95
1.43 1.93
1.40 1.90
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Temperature Topt(°C) Temperature Topt(°C)
11
R1170x
R1170x301B R1170x401B
VIN=4V, IOUT=10mA VIN=5V, IOUT=10mA
3.20 4.20
3.15 4.15
Output Voltage VOUT(V)
R1170x501B
VIN=6V, IOUT=10mA
5.20
5.15
Output Voltage VOUT(V)
5.10
5.05
5.00
4.95
4.90
4.85
4.80
-50 -25 0 25 50 75 100
Temperature Topt(°C)
100 100
Supply Current ISS(µA)
80 80
60 60
40 40
20 20
0 0
0 1 2 3 4 5 6 0 1 2 3 4 5 6
Input Voltage VIN(V) Input Voltage VIN(V)
12
R1170x
R1170x301B R1170x401B
120 120
100 100
Supply Current ISS(µA)
60 60
40 40
20 20
0 0
0 1 2 3 4 5 6 0 1 2 3 4 5 6
Input Voltage VIN(V) Input Voltage VIN(V)
R1170x501B
120
100
Supply Current ISS(µA)
80
60
40
20
0
0 1 2 3 4 5 6
Input Voltage VIN(V)
140 140
Supply Current ISS(µA)
Supply Current ISS(µA)
120 120
100 100
80 80
60 60
40 40
20 20
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Temperature Topt(°C) Temperature Topt(°C)
13
R1170x
R1170x301B R1170x401B
VIN=4V VIN=5V
160 160
140 140
Supply Current ISS(µA)
100 100
80 80
60 60
40 40
20 20
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Temperature Topt(°C) Temperature Topt(°C)
R1170x501B
VIN=6V
160
140
Supply Current ISS(µA)
120
100
80
60
40
20
-50 -25 0 25 50 75 100
Temperature Topt(°C)
0.5 IOUT=600mA
0.4 IOUT=800mA
0.3
0.2
IOUT=100mA
0.1
0.0
1 2 3 4 5
Set Output Voltage VSET(V)
14
R1170x
R1170x301B R1170x401B
VIN=4V+0.5Vp-p, IOUT=100mA VIN=5V+0.5Vp-p, IOUT=100mA
80 80
70 70
Ripple Rejection RR(dB)
60 60
50 50
40 40
30 30
20 20
10 10
0 0
0.01 0.1 1 10 100 0.01 0.1 1 10 100
Ripple Frequency f (kHz) Ripple Frequency f (kHz)
R1170x501B
VIN=5.75+0.5Vp-p, IOUT=100mA
80
70
Ripple Rejection RR(dB)
60
50
40
30
20
10
0
0.01 0.1 1 10 100
Ripple Frequency f (kHz)
15
R1170x
30 f=10kHz 30 f=10kHz
20 20
10 10
0 0
3 3.2 3.4 3.6 3 3.2 3.4 3.6
Input Voltage VIN(V) Input Voltage VIN(V)
R1170x301B
IOUT=100mA, COUT=10µF
60
f=400Hz
Ripple Rejection RR(dB)
50
f=1kHz
40
30
f=10kHz
20
10
0
3 3.2 3.4 3.6
Input Voltage VIN(V)
1.75 3.5
Output Voltage VOUT(V)
1.65 2.5
1.6 2
1.5 1
1.45 0.5
1.4 0
0 20 40 60 80 100 120 140 160 180 200
Time T(µs)
16
R1170x
R1170x301B
tr=tf=10µs, IOUT=100mA, COUT=Ceramic 10µF
3.4 6
3.3 5
Output Voltage VOUT(V)
3.1 3
Output Voltage
3.0 2
2.9 1
2.8 0
0 20 40 60 80 100 120 140 160 180 200
Time T(µs)
R1170x301B
tr=tf=10µs, IOUT=100mA, COUT=Ceramic 4.7µF
3.4 6
3.3 5
Output Voltage VOUT(V)
3.1 3
Output Voltage
3.0 2
2.9 1
2.8 0
0 20 40 60 80 100 120 140 160 180 200
Time T(µs)
R1170x501B
tr=tf=10µs, IOUT=100mA, COUT=Ceramic 10µF
5.20 6.5
5.15 6.0
Output Voltage VOUT(V)
Input Voltage
5.10 5.5
5.05 5.0
Output Voltage
5.00 4.5
4.95 4.0
4.90 3.5
0 20 40 60 80 100 120 140 160 180 200
Time T(µs)
17
R1170x
R1170x501B
tr=tf=10µs, IOUT=100mA, COUT=Ceramic 4.7µF
5.20 6.5
5.15 6.0
Output Voltage VOUT(V)
5.05 5.0
Output Voltage
5.00 4.5
4.95 4.0
4.90 3.5
0 20 40 60 80 100 120 140 160 180 200
Time T(µs)
1.9 100
1.8 80
Output Current
1.7 60
1.6 40
Output Voltage
1.5 20
1.4 0
0 20 40 60 80 100 120 140 160 180 200
Time T(µs)
R1170x301B
tr=tf=3µs, CIN=Ceramic 10µF, VIN=4V, COUT=Ceramic 10µF
3.5 120
3.4 100
Output Current IOUT(mA)
Output Voltage VOUT(V)
3.3 80
Output Current
3.2 60
3.1 40
Output Voltage
3.0 20
2.9 0
0 20 40 60 80 100 120 140 160 180 200
Time T(µs)
18
R1170x
R1170x301B
tr=tf=3µs, CIN=Ceramic 10µF, VIN=4V, COUT=Ceramic 4.7µF
3.5 120
3.4 100
3.3 80
Output Current
3.2 60
3.1 40
Output Voltage
3.0 20
2.9 0
0 20 40 60 80 100 120 140 160 180 200
Time T(µs)
R1170x501B
tr=tf=3µs, CIN=Ceramic 10µF, COUT=Ceramic 10µF
5.20 150
5.15 100
Output Current
5.10 50
5.05 0
Output Voltage
5.00
4.95
4.90
0 20 40 60 80 100 120 140 160 180 200
Time T(µs)
R1170x501B
tr=tf=3µs, CIN=Ceramic 10µF, COUT=Ceramic 4.7µF
5.20 150
5.15 100
Output Current IOUT(mA)
Output Voltage VOUT(V)
Output Current
5.10 50
5.05 0
Output Voltage
5.00
4.95
4.90
0 20 40 60 80 100 120 140 160 180 200
Time T(µs)
19
R1170x
12) Stable Area (Topt=25°C, VIN = Set Output Voltage+1V, CIN = Ceramic 10µF)
CE VOUT
R1170xxxxB Ceramic
Capacitor Spectrum
S.A.
Analyzer
VIN GND
ESR
VIN Ceramic
Capacitor IOUT
As an output capacitor for this IC, Ceramic capacitor is recommendable. However, other low ESR type
capacitor can be used with this IC.
For your reference, noise level is tested with the circuit as shown above, and if the noise level is 40µV or less
than 40µV, the ESR values are plotted as stable area. Upper limit is described in the next four graphs, or ESR vs.
Output Current. (Hatched area is the stable area.)
R1170x151B R1170x151B
COUT=Ceramic 10µF COUT=Ceramic 4.7µF
100 100
f=400Hz
f=1kHz
10 10
ESR(Ω)
ESR(Ω)
f=10kHz
1 1
0.1 0.1
0 200 400 600 800 0 200 400 600 800
Output Current IOUT(mA) Output Current IOUT(mA)
R1170x301B R1170x301B
COUT=Ceramic 10µF COUT=Ceramic 4.7µF
100 100
10 10
ESR(Ω)
ESR(Ω)
1 1
0.1 0.1
0 200 400 600 800 0 200 400 600 800
Output Current IOUT(mA) Output Current IOUT(mA)
20
R1170x
R1170x501B R1170x501B
COUT=Ceramic 10µF COUT=Ceramic 4.7µF
100 100
10 10
ESR(Ω)
ESR(Ω)
1 1
0.1 0.1
0.01 0.01
0 100 200 300 400 500 600 700 800 0 100 200 300 400 500 600 700 800
Output Current IOUT(mA) Output Current IOUT(mA)
21
PACKAGE INFORMATION PE-SOT-89-5-0611
• SOT-89-5 Unit: mm
PACKAGE DIMENSIONS
4.5±0.1
1.6±0.2 1.5±0.1
0.42±0.1
0.4±0.1
0.4
5 4
2.5±0.1
+0.5
−0.3
∅1.0
4.5
Min.
0.9
1 2 3
0.4±0.1
0.47
±0.1
0.42±0.1 0.42±0.1
1.5±0.1 1.5±0.1
+0.1 4.0±0.1
∅1.5 0
0.3±0.1 2.0±0.05
5.65±0.05
5.0
12±0.3
4.7
8.0±0.1
2.5Max.
∅1.6±0.1
T1
User Direction of Feed
2±0.5
∅ 180 –1.5
∅ 60 +1
0
0
21±0.8
PACKAGE INFORMATION PE-SOT-89-5-0611
Measurement Conditions
High Wattage Land Pattern Standard Land Pattern
Environment Mounting on Board (Wind velocity=0m/s) Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plactic (Double sided) Glass cloth epoxy plactic (Double sided)
Board
30mm × 30mm × 1.6mm 50mm × 50mm × 1.6mm
Dimensions
Top side : Approx. 20% , Top side : Approx. 10% ,
Copper Ratio
Back side : Approx. 100% Back side : Approx. 100%
Through-hole φ0.85mm × 10pcs -
1500
1400 On Board 30
1300 (High Wattage Land Pattern)
7.5 15
Power Dissipation PD(mW)
1200 50
1100 On Board
1000 (Standard Land Pattern)
900
800
700 Free Air
600
50
30
15
500
400
300
200
7.5
100
0
0 25 50 75 85 100 125 150
Ambient Temperature (°C) High Wattage Standard
Power Dissipation Measurement Board Pattern
IC Mount Area (Unit : mm)
45°
1.5
2.0
1.5 1.5
(Unit : mm)
PACKAGE INFORMATION PE-HSON-6-0611
• HSON-6 Unit: mm
PACKAGE DIMENSIONS
2.9±0.2
(1.5)
(0.2)
0.5Typ.
6 4
(0.15)
2.8±0.2
3.0±0.2
(1.6)
(0.65)
1 3
(0.2)
0.15±0.05
Bottom View
TAPING SPECIFICATION
1.75±0.1
4.0±0.1
+0.1
∅1.5 0
0.2±0.1 2.0±0.05 3.5±0.05
8.0±0.3
3.2
3.3
2.0Max. 4.0±0.1
∅1.1±0.1
TR
User Direction of Feed
2±0.5
180 −1.5
+1
60 0
0
21±0.8
PACKAGE INFORMATION PE-HSON-6-0611
Measurement Conditions
Standard Land Pattern
Environment Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plactic (Double sided)
Board Dimensions 40mm × 40mm × 1.6mm
Copper Ratio Top side : Approx. 50% , Back side : Approx. 50%
Through-hole φ0.5mm × 44pcs
Measurement Result
(Topt=25°C,Tjmax=125°C)
Standard Land Pattern Free Air
Power Dissipation 900mW 400mW
Thermal Resistance θja=(125−25°C)/0.9W=111°C/W 250°C/W
1200
1100
On Board 40
1000
Power Dissipation PD(mW)
900
800
700
Free Air
600
500
400
40
300
200
100
0
0 25 50 75 85 100 125 150
Ambient Temperature (°C)
1.6
1.15
1.7
(Unit: mm)
PACKAGES INFORMATION PE-HSOP-6J-0701
• HSOP-6J Unit: mm
PACKAGE DIMENSIONS
5.02±0.3
6 5 4
6.0±0.3
3.9±0.2
0.60±0.2
1 2 3
3.81 0.2 +0.10
−0.05
0.605Typ.
1.5±0.1
0.15±0.1
1.67±0.1
0.10
0.4±0.1
0.12 M
4.0±0.1
0.3±0.1 1.5 +0.1
0
2.0±0.05
5.5
5.5±0.05
12±0.3
6.7
2.7Max.
8.0±0.1 2.05±0.1
E2
User Direction of Feed
21±0.8
∅ 180 −1.5
∅ 60 +1
0
0
2±0.5
PACKAGES INFORMATION PE-HSOP-6J-0701
Measurement Conditions
High Wattage Land Pattern Standard Land Pattern
Environment Mounting on Board (Wind velocity=0m/s) Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plactic (Double sided) Glass cloth epoxy plactic (Double sided)
Board Dimensions 50mm × 50mm × 1.6mm 50mm × 50mm × 1.6mm
Copper Ratio 90% 50%
Through-hole φ0.5mm × 44pcs φ0.5mm × 44pcs
Measurement Result
(Topt=25°C,Tjmax=125°C)
High Wattage Land Pattern Standard Land Pattern Free Air
Power Dissipation 2000mW 1700mW 540mW
Thermal Resistance 50°C/W 59°C/W 185°C/W
2600
2400
2200 On Boad (High Wattage Land Pattern)
Power Dissipation PD(mW)
2000
1800 1700
On Boad (Standerd Land Pattern) 50 50
1600
18 20
1400
1200 Free Air
1000
800
600 540
49
10
40
20
400
200
0
0 25 50 75 85 100 125 150
Ambient Temperature (°C)
Power Dissipation High Wattage Standard
Measurement Board Pattern
IC Mount Area Unit : mm
1.905 1.905
5.35
0.6 1.87
(Unit: mm)
MARK INFORMATIONS ME-R1170H-0310