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PP
3% 2%
3%
ABS
50%
ABS/PC
42%
Before : contact angle > 90 deg After cleaning : contact angle < 90 deg
CL/COVENTYA/ SEMPA 2015 PLATING ON PLASTICS
FIRST IMPORTANT STEP : ETCHING
CONVENTIONNAL
40%CrO3 40%H2SO4
2003 COVENTYA
Patent : Silken process
6% CrO3 + Catalyst
65% H2SO4 2014 COVENTYA
KMnO4
H3PO4 solution
ETD
GSED
HIGH
ESEM
VACUUM
Up to <1.2 10-2 Pa
2600 Pa
STEM II
400 Pa 10 Pa
GAD CBS
LOW 130 Pa
TE
VACUUM
SE LFD
BSE
CL/COVENTYA/ SEMPA 2015 PLATING ON PLASTICS
SEM PICTURES OF ABS
Ra= 25 nm
Ra= 240 nm
CONVENTIONNAL
40%CrO3 40%H2SO4
Ra= 48 nm
2003 COVENTYA
patent: SILKEN Process
6% CrO3
65% H2SO4
Ra= 78 nm
2014 COVENTYA
KMnO4
H3PO4 solution
Reducing solution
Hydrate hydrazine, Ascorbic acid,
…
Reducing solution
CrVI is reduced into CrIII
PdSn colloid
( <10 nm diameter)
stabilized in hydrochloride acid
Oxidizing solution
Sn2+ is oxidized into Sn4+
and « liberates » Palladium as metal
Electroless Processes
The plastic part becomes
CONDUCTIVE
Nickel Copper
ABS
ABS
Electrolytic process
Cu deposit levels the surface to
ensure the brightest finish
CuSO4
Sulfuric acid
Organic additives :
Base Cathode
Brightener Cu++ + 2e- Æ Cu
Leveler
Current density : 2-3 A/dm²
Thickness :
up to 25 µm Hull cell
CL/COVENTYA/ SEMPA 2015 PLATING ON PLASTICS
CROSS SECTION – EDX phases analysis
Electrolytic Copper
Electroless Nickel
ABS
Mate
Satin
Bright
Pits
Salt spray test ( NaCl spray) or Cass Test ( NaCl +Cuproacetic spray)
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