HANDLING AND SOLDERING

RECOMMENDATION
GPS-MS1E Receiver
APPLICATION NOTE

Abstract
This
application
note
describes
the
recommendations
for
the
processing
and
handling
of
the

GPS-MS1E
receiver.
Readers
are
advised
that
the
responsibility
over
the
actual
manufacturing

process
and
process
quality
control
lies
at
their
contracted
electronic
manufacturer.

u-blox ag
•
Zuercherstrasse
68
• CH-8800
Thalwil
• Switzerland
•
Phone
+41
1
722
74
44 •
Fax
+41
1
722
74
47
•
www.u-blox.com

Handling
Recommendation
for
GPS-MS1E
Receiver
-
Application
Note
u-blox
ag

Title Handling Recommendation for GPS-MS1E Receiver
Doc Type APPLICATION
NOTE


Doc Id GPS.G1-X-01021

Author : Guido
Hollenstein

Date : 19/11/2001

For
most
recent
documents,
please
visit
www.u-blox.com

We
reserve
all
rights
in
this
document
and
in
the
information
contained
therein.
Reproduction,
use
or
disclosure
to
third
parties
without
express
authority
is
strictly
forbidden.

All
trademarks
mentioned
in
this
document
are
property
of
their
respective
owners.

Copyright
©
2001,
u-blox
ag





THIS
DOCUMENT
CONTAINS
INFORMATION
ON
U-blox
PRODUCTS
IN
THE
SAMPLING
AND
INITIAL
PRODUCTION
PHASES
OF
DEVELOPMENT.
THE
SPECIFICATIONS
IN
THIS

DOCUMENT
ARE
SUBJECT
TO
CHANGE
AT
u-blox'
DISCRETION.
u-blox
ASSUMES
NO
RESPONSIBILITY
FOR
ANY
CLAIMS
OR
DAMAGES
ARISING
OUT
OF
THE
USE
OF

THIS
DOCUMENT,
OR
FROM
THE
USE
OF
MODULES
BASED
ON
THIS
DOCUMENT,
INCLUDING
BUT
NOT
LIMITED
TO
CLAIMS
OR
DAMAGES
BASED
ON
INFRINGEMENT
OF

PATENTS,
COPYRIGHTS
OR
OTHER
INTELLECTUAL
PROPERTY
RIGHTS.
u-blox
MAKES
NO
WARRANTIES,
EITHER
EXPRESSED
OR
IMPLIED
WITH
RESPECT
TO
THE

INFORMATION
AND
SPECIFICATIONS
CONTAINED
IN
THIS
DOCUMENT.
PERFORMANCE
CHARACTERISTICS
LISTED
IN
THIS
DOCUMENT
ARE
ESTIMATES
ONLY
AND
DO
NOT

CONSTITUTE
A
WARRANTY
OR
GUARANTEE
OF
PRODUCT
PERFORMANCE.

GPS.G1-X-01021

Page
2

Handling
Recommendation
for
GPS-MS1E
Receiver
-
Application
Note
u-blox
ag

Contents

1 General information.....................................................................................................4
1.1 SSMT
Connector ............................................................................................................................. 4
1.2 RF-Input
Handling ........................................................................................................................... 4
1.3 Grounding
Metal
Covers ................................................................................................................. 4
1.4 Module
Removal ............................................................................................................................. 4

2 Processing .....................................................................................................................5
2.1 Reflow
profile ................................................................................................................................. 5
2.2 Solder
paste
&
sensor
positions ........................................................................................................ 5
2.3 Reflow
Soldering............................................................................................................................. 5
2.4 Overheating.................................................................................................................................... 6
2.5 Module
Cleaning ............................................................................................................................ 6
2.6 Repeated
Reflow
Soldering .............................................................................................................. 6
2.7 Hand
Soldering ............................................................................................................................... 6

3 MSD Handling Instructions ..........................................................................................7

3.1 Standard
Handling .......................................................................................................................... 7
3.2 Manual
Tempering
Guideline ........................................................................................................... 8

A Recommended Reflow Profile.....................................................................................9

B Hand Soldering Of Modules ......................................................................................10

C Examples Of Pictures Indicating Defects ..................................................................11

D Contact .......................................................................................................................13

GPS.G1-X-01021

Page
3

Handling
Recommendation
for
GPS-MS1E
Receiver
-
Application
Note
u-blox
ag

1 GENERAL INFORMATION
The
GPS-MS1E
receiver
is
designed
and
packaged
to
be
processed
in
an
automatic
assembly
line.
However
due

to
the
fact
that
the
GPS-MS1E
is
a
specially
packaged
subsystem,
there
are
some
requirements
that
differ
from

the
handling
of
single
packaged
parts.

This
document
describes
a
recommendation
regarding
the
soldering
and
handling
process
in
the
startup
phase

of
a
project
with
GPS-MS1E.
Of
course
also
special
conditions
and
equipment
at
the
customers
site
should
be

considered.
u-blox
and
Tyco
is
able
to
support
customers
who
have
problems
regarding
reflow
and
soldering

process,
which
we
are
willing
to
do.

1.1 SSMT Connector

The
antenna
plug
may
be
put
in
only
with
the
prescribed
strength

(Typ. 5.5lbs ⇒ 2.4Kg ⇒ 24.5N).

Where
possible
we
recommend
the
use
of
the
designated

engagement/disengagement
tool
of
Tyco.

See
article
no.
0-1221286-1
on
the
web
page:

http://catalog.tycoelectronics.com/TE/bin/TE.Connect?C=15535&P=&M=PROP&N=1&LG=1&I=13&G=G



The
datasheet
for
the
SSMT
connector
is
available
at:

http://catalog.tycoelectronics.com/TE/bin/TE.Connect?C=15475&F=0&M=CINF&N=3&LG=1&I=13

1.2 RF-Input Handling

If
a
short-circuit
on
the
RF-connector
to
GND
occurs
then
it
will
damage
the
receiver
permanently.
Our
module
is

not
protected
against
such
a
short-circuit
between
the
interior
conductor
and
GND
(see
data
sheet).
Therefore

we
recommend
that
the
handling
process
be
such
that
this
possibility
does
not
occur.

1.3 Grounding Metal Covers

Reworking
the
module,
also
making
soldered
connections
on
the
metal
covers,
J-Leads
or
own
repair
attempts

should
not
be
attempted.
Serious
mechanical
loads
can
occur,
which
can
lead
to
the
destruction
of
the
modules.

Also
soldering
on
the
antenna
connector
must
be
omitted
to
alleviate
any
mechanical
load
on
the
connector.

1.4 Module Removal

The
removal
of
GPS
modules
by
the
customer
should
be
avoided,
so
that
more
reliable
predictions
of
the

effective
fault
can
be
made.
Due
to
this,
the
customer
should
return
the
whole
unit
to
u-blox
and
should
not

remove
the
GPS
module.
If
this
is
not
possible
we
recommend
using
our
solder
off
process
documentation
to

remove
a
module.

GPS.G1-X-01021

Page
4

Handling
Recommendation
for
GPS-MS1E
Receiver
-
Application
Note
u-blox
ag

2 PROCESSING
2.1 Reflow profile
According
to
Tyco
the
reflow
profile
is
extremely
important
to
use
at
set-up
time.
Of
course
it
depends
on
the

customer’s
board
and
the
reflow
oven
how
closely
the
recommended
profile
matches
the
actual
achieved

profile.

Here
the
danger
exists
that
due
to
the
resultant
mechanical
stress,
the
Micro-VIA’s,
IC
bonds
or
GlobTop

can
be
damaged.

The
temperature
gradient
for
preheating
when
soldering
the
GPS
modules
must not be higher than 2°C/sec.

Also
IR
supporting
ovens
should
not
be
used,
we
recommend
a
pure
reflow
convection
oven.


⇒ See appendix A Recommended Reflow Profile

2.2 Solder paste & sensor positions

The
recommendation
is
to
use
‘no
clean’
solder
paste
during
the
assembly
of
the
modules:

Ecorel 802;
This
‘no
clean’
solder
paste
has
been
used
with
the
qualification
samples.

To
check
the
reflow
profile
the
following
measurement
points
must
be
used
on
the
module:

Link
to
the
recommended
‘no
clean’
solder
paste:

http://www.promosol.com/english/cremes01a.html

2.3 Reflow Soldering

As
far
as
possible
any
hand
soldering
process
should
be
avoided
since
this
process
is
not
controlled
or

reproducible
and
can
result
in
damage
to
the
modules
delicate
internal
circuitry.
If
necessary
warm
air
supporting

tools
must
be
used,
in
order
to
achieve
reproducibility.

A convection type soldering oven is strongly recommended
over
the
infrared
type
radiation
oven.


Convection
heated
ovens
allow
precise
control
of
the
temperature
and
all
parts
will
heated
up
evenly,
regardless

of
material
properties,
thickness
of
components
and
surface
color.



Preheat
Phase:

Initial
heating
of
component
leads
and
balls.

Residual
humidity
will
be
dried
out.

Please
note
that
this
preheat

phase
will
not
replace
prior
baking
procedures.


Temperature
rise
time:
1
-
2°C/s


Reach
90
-
110°C

Activation
Phase:

The
solder
paste
dries
out
and
the
flux
activates.

The
activation
phase
is
normally
dependent
on
your
chosen

soldering
paste
and
is
therefore
subject
to
variations.


Ramp
up
from
90-110°C
range
up
to
150-175°C
range


Limit
to
110
seconds
(known
as
wetting
time)

GPS.G1-X-01021

Page
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Handling
Recommendation
for
GPS-MS1E
Receiver
-
Application
Note
u-blox
ag

Reflow
Phase:

The
temperature
rises
above
the
liquidus
temperature
of
180°C.


Limit
time
above
180°C
liquidus
temperature:
35
-
50s


Peak
reflow
temperature:
max.
220°C
(±
10°C)

Cooling
Phase:

A
controlled
cooling
avoids
negative
metallurgical
effects
(solder
becomes
more
brittle)
of
the
solder
and

possible
mechanical
tensions
in
the
products.

Controlled
cooling
helps
to
achieve
bright
solder
fillets
with
a

good
shape
and
low
contact
angle.


Temperature
fall
time:
max
4°C
/
s




Caution:
To
avoid
falling
off,
the
GPS-MS1E
receiver
shall
be
placed
on
the
topside
of
the
motherboard
during
soldering.



The
final
soldering
temperature
chosen
at
the
factory
depends
on
additional
external
factors
like
choice
of

soldering
paste,
size,
thickness
and
properties
of
the
base
board,
etc.

Exceeding
the
maximum
soldering

temperature
in
the
recommended
soldering
profile
may
permanently
damage
the
macro-component.

2.4 Overheating
Care
should
be
used
to
ensure
that
no
overheating
of
the
module
can
occur.
That
means
an
overheating
of
the

modules
and
also
a
too
fast
rise
time
when
soldering
should
not
occur.
Our
recommended
reflow
profile
should

be
used
for
set-up
a
solder
process.

2.5 Module Cleaning

Any
cleaning
of
modules
with
the
Ultrasonic
bath
or
solvents
is
prohibited.
Use
of
Ultrasonic
bath
cleaning
will

damage
the
32
kHz
RTC
quartz.
Also
the
handling
of
modules
does
not
allow
dipping
into
varnish
etc.
under

these
circumstances
the
warranty
would
be
void.

2.6 Repeated Reflow Soldering

Only
a
single
reflow
soldering
process
is
encouraged
for
boards
with
a
GPS-MS1E
module
on
it.

2.7 Hand Soldering

A
hand
soldering
process
in
any
form
is
not
recommended
for
our
modules.
Nevertheless,
if
it’s
necessary
to

hand
solder,
then
our
appropriate
documentation
should
be
taken
for
assistance.

⇒ See appendix B Hand Soldering Of Module

GPS.G1-X-01021

Page
6

Handling
Recommendation
for
GPS-MS1E
Receiver
-
Application
Note
u-blox
ag

3 MSD HANDLING INSTRUCTIONS

The
GPS-MS1E
receiver
is
a
moisture
sensitive
device
(MSD)
and
must
be
handled
by
the
following
handling

instructions.

3.1 Standard Handling

For
standard
shipping,
the
modules
will
be
delivered
in
a
moisture
sensitive
package.
The
bags
will
have
a

shipping
slip
as
follows:

CAUTION LEVEL
This
bag
contains

MOISTURE-SENSITIVE
DEVICES

5
1.
Calculated
shelf
life
in
sealed
bag:
12
months
at
<40°C
and
<90%
relative
humidity
(RH).

2.
Peak
package
body
temperature:
_____
°C
[If
blank
(220°C)
]

3.
After
bag
is
opened,
devices
that
will
be
subjected
to
reflow
solder,
or
other
high

temperature
process
must
be:

a)
Mounted
within
_____
hours
of
factory
conditions
<30°C
/
60%RH,
or

b)
Stored
at
10%RH.

4.
Devices
require
baking,
before
mounting,
if:

a)
Humidity
indicator
card
is
>10%
when
read
at
23°C
±5°C,
or

b)
3a
or
3b
is
not
met.

5.
If
baking
is
required,
devices
may
be
baked
for
48
hours
at
125°C
±5°C

Note:
If
device
containers
cannot
be
subjected
to
high
temperature
or
shorter
bake
times
are

desired:
Reference
IPC/JEDEC
J-STD-033
for
bake
procedure

Bag
seal
date:
______________________
Sign:
_________________________

Note:
LEVEL
and
body
temperature
defined
by
IPC/JEDEC
J-STD-020

GPS.G1-X-01021

Page
7

Handling
Recommendation
for
GPS-MS1E
Receiver
-
Application
Note
u-blox
ag

3.2 Manual Tempering Guideline

Since
the
receiver(s)
in
this
package
could
not
be
packed
into
one
of
our
standard
package
types,
we
strongly

recommend
you
to
observe
the
recommendations,
based
on
IPC/JEDEC
J-STD-033
Level
5
below:



1. If the receiver is exposed to a reflow or vapor phase soldering process, the receiver should be pre-
baked at 125°C +5°C /-0°C for at least 48 hours prior to soldering.
In order to prevent thermal shock, the receiver should be inserted into a cold oven (<80°C). After
pre-baking for 48 hours, the oven needs to be shut down but the receivers should not be taken
out before the temperature has dropped to approx. 40°C.

Attention: Do not bake the modules in the tray as the tray will melt. Place the modules
on a big PCB base board in upright position before baking them. See photographs below:

2. For hand soldering, no humidity treatment like pre-baking is necessary.


Please note:
The recommendations above do not apply to GPS-MS1E receivers shipped in one of our standard
package types.

GPS.G1-X-01021

Page
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Handling
Recommendation
for
GPS-MS1E
Receiver
-
Application
Note
u-blox
ag

A RECOMMENDED REFLOW PROFILE

Reflow Profile
Solderpaste L-Sn62Pb36Ag2 Liquidustemperature 180°C Type: Ecorel 802

250
Peak
Temperature
210-230°

200
Liquidus
Temperature
180°

Temperature in °C

150

100

50

Preheat
Phase
Activation
Phase
Reflow
Phase
Cooling
Phase

0
0 50 100 150 200 250 300 350 400
Time in Sec

GPS.G1-X-01021

Page
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 Handling
Recommendation
for
GPS-MS1E
Receiver
-
Application
Note
u-blox
ag

B HAND SOLDERING OF MODULES

Hot
bar,
thickness
max.1mm

Solder
Iron:
50W
Adcola
Soldering
Station




GPS-MS1E
in
housing




Desoldering




The
temperature
of
the
soldering
iron
(hot
bar)
has
to
be
set

to
a,
value,
which
allows
the
desoldering
to
be
finished

within
10
seconds.
If
feasible,
the
procedure
can
be

supported
with
hot
air
(max.
70°C)
from
the
underside
of

the
motherboard.




1.
The
solder
iron
(hot
bar)
is
gently
pressed
against
the
J-
leads
and
the
motherboard.
The
receiver
must
not
be

removed
before
all
J-leads
are
loose.

2.
The
solder
iron
should
be
withdrawn.
At
the
same
time,

the
receiver
needs
to
be
carefully
lifted
until
the
tin
is

solidified.

3.
Step
2
and
3
need
to
be
repeated
on
the
other
side
of

the
GPS-MS1E

Thermal Flow

This
procedure
(even
when
applied
to
both
sides

simultaneously)
limits
the
thermal
stress
for
the
GPS-MS1E

and
the
motherboard
as
much
as
possible.

Soldering



The
temperature
of
the
soldering
iron
(hot
bar)
has
to
be
set
to
a
value,
which
allows
the
soldering
of
a
J-lead
to

be
finished
within
3
to
6
seconds.


Tin:
L-Sn60Pb,


F-SW32,

1.5
DIN,

d=1.5mm



1.
The
pads
need
to
be
cleaned.

2.
The
GPS-MS1E
is
placed
and
fixed
by
soldering
two
J-leads
(i.e.
pins
1
&
22
or
21
&
42)

3.
The
remaining
J-leads
are
soldered
one
by
one.

Please note, the procedure described above is only a recommendation. It needs to be qualified by the
each manufacturer for its equipment.

GPS.G1-X-01021

Page
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Handling
Recommendation
for
GPS-MS1E
Receiver
-
Application
Note
u-blox
ag

C EXAMPLES OF PICTURES INDICATING DEFECTS

Short-circuit
at
the
antenna
plug

Component
resoldered

GPS.G1-X-01021

Page
11

Handling
Recommendation
for
GPS-MS1E
Receiver
-
Application
Note
u-blox
ag

Components
shifted

Pin
broken
off

GPS.G1-X-01021

Page
12

Handling
Recommendation
for
GPS-MS1E
Receiver
-
Application
Note
u-blox
ag

D CONTACT
For
further
info,
please
contact
us:



Headquarters Subsidiaries
u-blox ag
u-blox Deutschland Gmbh
u-blox Asia Pacific Ltd.

Zuercherstrasse
68
Berliner
Ring
89
22/F.,
City
Landmark
I


CH-8800
Thalwil
D-64625
Bensheim
68
Chung
On
Street

Switzerland
Germany
Tsuen
Wan,
Hong
Kong

Phone:
+41
1
722
74
44
Phone:
+49
(0)
6251
17566-0
Phone:
+852-2941-8877

Fax:
+41
1
722
74
47
Fax:
+49
(0)
6251
17566-11 Fax:
+852-2615-2285








E-mail:
info@u-blox.com
E-mail:
info_de@u-blox.de
E-mail:
info_ap@u-blox.com

www.u-blox.com
www.u-blox.de
www.u-blox.com

Tech. Support: Tech. Support:
Phone:
+41
1
722
74
74
Phone:
+41
1
722
74
74

support_de@u-blox.de support_ap@u-blox.com

u-blox Europe Ltd.
u-blox America, Inc.

Barham
Court
13800
Coppermine
Road

Maidstone,
Kent
ME18
5BZ
Herndon,
VA
20171

United
Kingdom
USA

Phone:
+44
1622
618628
Phone:
+1
(703)
234
5290

Fax:
+44
1622
618629
Fax:
+1
(703)
234
5770





E-mail:
info_uk@u-blox.co.uk
E-mail:
info_us@u-blox.com

www.u-blox.co.uk
www.u-blox.com

Tech. Support: Tech. Support:
Phone:
+44
1622
618628
Phone:
+41
1
722
74
74

support_uk@u-blox.co.uk
support_us@u-blox.com

GPS.G1-X-01021

Page
13