Vous êtes sur la page 1sur 13



HANDLING AND SOLDERING


RECOMMENDATION
GPS-MS1E Receiver
APPLICATION NOTE





Abstract
Thisapplicationnotedescribestherecommendationsfortheprocessingandhandlingofthe
GPS-MS1Ereceiver.Readersareadvisedthattheresponsibilityovertheactualmanufacturing
processandprocessqualitycontrolliesattheircontractedelectronicmanufacturer.


u-blox ag•Zuercherstrasse68• CH-8800Thalwil• Switzerland•Phone+4117227444 •Fax+4117227447•www.u-blox.com


HandlingRecommendationforGPS-MS1EReceiver-ApplicationNote u-bloxag


Title Handling Recommendation for GPS-MS1E Receiver
Doc Type APPLICATIONNOTE 
Doc Id GPS.G1-X-01021
Author : GuidoHollenstein
Date : 19/11/2001
Formostrecentdocuments,pleasevisitwww.u-blox.com
Wereserveallrightsinthisdocumentandintheinformationcontainedtherein.Reproduction,useordisclosuretothirdpartieswithoutexpressauthorityisstrictlyforbidden.






































Alltrademarksmentionedinthisdocumentarepropertyoftheirrespectiveowners.
Copyright©2001,u-bloxag


THISDOCUMENTCONTAINSINFORMATIONONU-bloxPRODUCTSINTHESAMPLINGANDINITIALPRODUCTIONPHASESOFDEVELOPMENT.THESPECIFICATIONSINTHIS
DOCUMENTARESUBJECTTOCHANGEAT u-blox' DISCRETION.u-blox ASSUMESNORESPONSIBILITYFORANYCLAIMSORDAMAGESARISINGOUTOFTHEUSEOF
THISDOCUMENT, ORFROMTHEUSEOFMODULESBASEDONTHISDOCUMENT, INCLUDINGBUTNOTLIMITEDTOCLAIMSORDAMAGESBASEDONINFRINGEMENTOF
PATENTS, COPYRIGHTS OR OTHER INTELLECTUAL PROPERTY RIGHTS. u-blox MAKES NO WARRANTIES, EITHER EXPRESSED OR IMPLIED WITH RESPECT TO THE
INFORMATIONANDSPECIFICATIONSCONTAINEDINTHISDOCUMENT.PERFORMANCECHARACTERISTICSLISTEDINTHISDOCUMENTAREESTIMATESONLYANDDONOT
CONSTITUTEAWARRANTYORGUARANTEEOFPRODUCTPERFORMANCE.

GPS.G1-X-01021  Page2
HandlingRecommendationforGPS-MS1EReceiver-ApplicationNote u-bloxag

Contents
1 General information.....................................................................................................4
1.1 SSMTConnector ............................................................................................................................. 4
1.2 RF-InputHandling ........................................................................................................................... 4
1.3 GroundingMetalCovers ................................................................................................................. 4
1.4 ModuleRemoval ............................................................................................................................. 4

2 Processing .....................................................................................................................5
2.1 Reflowprofile ................................................................................................................................. 5
2.2 Solderpaste&sensorpositions ........................................................................................................ 5
2.3 ReflowSoldering............................................................................................................................. 5
2.4 Overheating.................................................................................................................................... 6
2.5 ModuleCleaning ............................................................................................................................ 6
2.6 RepeatedReflowSoldering .............................................................................................................. 6
2.7 HandSoldering ............................................................................................................................... 6

3 MSD Handling Instructions ..........................................................................................7


3.1 StandardHandling .......................................................................................................................... 7
3.2 ManualTemperingGuideline ........................................................................................................... 8

A Recommended Reflow Profile.....................................................................................9

B Hand Soldering Of Modules ......................................................................................10

C Examples Of Pictures Indicating Defects ..................................................................11

D Contact .......................................................................................................................13



GPS.G1-X-01021  Page3
HandlingRecommendationforGPS-MS1EReceiver-ApplicationNote u-bloxag

1 GENERAL INFORMATION
TheGPS-MS1Ereceiverisdesignedandpackagedtobeprocessedinanautomaticassemblyline.Howeverdue
tothefactthattheGPS-MS1Eisaspeciallypackagedsubsystem,therearesomerequirementsthatdifferfrom
thehandlingofsinglepackagedparts.
Thisdocumentdescribesarecommendationregardingthesolderingandhandlingprocessinthestartupphase
ofaprojectwithGPS-MS1E.Ofcoursealsospecialconditionsandequipmentatthecustomerssiteshouldbe
considered.u-bloxandTycoisabletosupportcustomerswhohaveproblemsregardingreflowandsoldering
process,whichwearewillingtodo.


1.1 SSMT Connector


Theantennaplugmaybeputinonlywiththeprescribedstrength
(Typ. 5.5lbs ⇒ 2.4Kg ⇒ 24.5N).
Wherepossiblewerecommendtheuseofthedesignated
engagement/disengagementtoolofTyco.



Seearticleno.0-1221286-1onthewebpage:
http://catalog.tycoelectronics.com/TE/bin/TE.Connect?C=15535&P=&M=PROP&N=1&LG=1&I=13&G=G

ThedatasheetfortheSSMTconnectorisavailableat:
http://catalog.tycoelectronics.com/TE/bin/TE.Connect?C=15475&F=0&M=CINF&N=3&LG=1&I=13


1.2 RF-Input Handling


Ifashort-circuitontheRF-connectortoGNDoccursthenitwilldamagethereceiverpermanently.Ourmoduleis
notprotectedagainstsuchashort-circuitbetweentheinteriorconductorandGND(seedatasheet).Therefore
werecommendthatthehandlingprocessbesuchthatthispossibilitydoesnotoccur.


1.3 Grounding Metal Covers


Reworkingthemodule,alsomakingsolderedconnectionsonthemetalcovers,J-Leadsorownrepairattempts
shouldnotbeattempted.Seriousmechanicalloadscanoccur,whichcanleadtothedestructionofthemodules.
Alsosolderingontheantennaconnectormustbeomittedtoalleviateanymechanicalloadontheconnector.


1.4 Module Removal


TheremovalofGPSmodulesbythecustomershouldbeavoided,sothatmorereliablepredictionsofthe
effectivefaultcanbemade.Duetothis,thecustomershouldreturnthewholeunittou-bloxandshouldnot
removetheGPSmodule.Ifthisisnotpossiblewerecommendusingoursolderoffprocessdocumentationto
removeamodule.


GPS.G1-X-01021  Page4
HandlingRecommendationforGPS-MS1EReceiver-ApplicationNote u-bloxag

2 PROCESSING
2.1 Reflow profile
AccordingtoTycothereflowprofileisextremelyimportanttouseatset-uptime.Ofcourseitdependsonthe
customer’sboardandthereflowovenhowcloselytherecommendedprofilematchestheactualachieved
profile.Herethedangerexiststhatduetotheresultantmechanicalstress,theMicro-VIA’s,ICbondsorGlobTop
canbedamaged.
ThetemperaturegradientforpreheatingwhensolderingtheGPSmodulesmust not be higher than 2°C/sec.
AlsoIRsupportingovensshouldnotbeused,werecommendapurereflowconvectionoven.
⇒ See appendix A Recommended Reflow Profile


2.2 Solder paste & sensor positions


Therecommendationistouse‘noclean’solderpasteduringtheassemblyofthemodules:
Ecorel 802;This‘noclean’solderpastehasbeenusedwiththequalificationsamples.
Tocheckthereflowprofilethefollowingmeasurementpointsmustbeusedonthemodule:

 
Linktotherecommended‘noclean’solderpaste:
http://www.promosol.com/english/cremes01a.html


2.3 Reflow Soldering


Asfaraspossibleanyhandsolderingprocessshouldbeavoidedsincethisprocessisnotcontrolledor
reproducibleandcanresultindamagetothemodulesdelicateinternalcircuitry.Ifnecessarywarmairsupporting
toolsmustbeused,inordertoachievereproducibility.
A convection type soldering oven is strongly recommendedovertheinfraredtyperadiationoven.
Convectionheatedovensallowprecisecontrolofthetemperatureandallpartswillheatedupevenly,regardless
ofmaterialproperties,thicknessofcomponentsandsurfacecolor.

PreheatPhase:
Initialheatingofcomponentleadsandballs.Residualhumiditywillbedriedout.Pleasenotethatthispreheat
phasewillnotreplacepriorbakingprocedures.
 Temperaturerisetime:1-2°C/s
 Reach90-110°C
ActivationPhase:
Thesolderpastedriesoutandthefluxactivates.Theactivationphaseisnormallydependentonyourchosen
solderingpasteandisthereforesubjecttovariations.
 Rampupfrom90-110°Crangeupto150-175°Crange
 Limitto110seconds(knownaswettingtime)

GPS.G1-X-01021  Page5
HandlingRecommendationforGPS-MS1EReceiver-ApplicationNote u-bloxag

ReflowPhase:
Thetemperaturerisesabovetheliquidustemperatureof180°C.
 Limittimeabove180°Cliquidustemperature:35-50s
 Peakreflowtemperature:max.220°C(±10°C)
CoolingPhase:
Acontrolledcoolingavoidsnegativemetallurgicaleffects(solderbecomesmorebrittle)ofthesolderand
possiblemechanicaltensionsintheproducts.Controlledcoolinghelpstoachievebrightsolderfilletswitha
goodshapeandlowcontactangle.
 Temperaturefalltime:max4°C/s

Caution:
Toavoidfallingoff,theGPS-MS1Ereceivershallbeplacedonthetopsideofthemotherboardduringsoldering.

Thefinalsolderingtemperaturechosenatthefactorydependsonadditionalexternalfactorslikechoiceof
solderingpaste,size,thicknessandpropertiesofthebaseboard,etc.Exceedingthemaximumsoldering
temperatureintherecommendedsolderingprofilemaypermanentlydamagethemacro-component.


2.4 Overheating
Careshouldbeusedtoensurethatnooverheatingofthemodulecanoccur. Thatmeansanoverheatingofthe
modulesandalsoatoofastrisetimewhensolderingshouldnotoccur.Ourrecommendedreflowprofileshould
beusedforset-upasolderprocess.


2.5 Module Cleaning


AnycleaningofmoduleswiththeUltrasonicbathorsolventsisprohibited.UseofUltrasonicbathcleaningwill
damagethe32kHzRTCquartz.Alsothehandlingofmodulesdoesnotallowdippingintovarnishetc.under
thesecircumstancesthewarrantywouldbevoid.


2.6 Repeated Reflow Soldering


OnlyasinglereflowsolderingprocessisencouragedforboardswithaGPS-MS1Emoduleonit.


2.7 Hand Soldering


Ahandsolderingprocessinanyformisnotrecommendedforourmodules.Nevertheless,ifit’snecessaryto
handsolder,thenourappropriatedocumentationshouldbetakenforassistance.
⇒ See appendix B Hand Soldering Of Module

GPS.G1-X-01021  Page6
HandlingRecommendationforGPS-MS1EReceiver-ApplicationNote u-bloxag

3 MSD HANDLING INSTRUCTIONS


TheGPS-MS1Ereceiverisamoisturesensitivedevice(MSD)andmustbehandledbythefollowinghandling
instructions.

3.1 Standard Handling


Forstandardshipping,themoduleswillbedeliveredinamoisturesensitivepackage.Thebagswillhavea
shippingslipasfollows:

CAUTION LEVEL
Thisbagcontains
MOISTURE-SENSITIVEDEVICES
5
1. Calculatedshelflifeinsealedbag:12monthsat<40°Cand<90%relativehumidity(RH).
2. Peakpackagebodytemperature:_____°C[Ifblank(220°C)]
3. Afterbagisopened,devicesthatwillbesubjectedtoreflowsolder,orotherhigh
temperatureprocessmustbe:
a)Mountedwithin_____hoursoffactoryconditions<30°C/60%RH,or
b)Storedat10%RH.
4. Devicesrequirebaking,beforemounting,if:
a)Humidityindicatorcardis>10%whenreadat23°C±5°C,or
b)3aor3bisnotmet.
5. Ifbakingisrequired,devicesmaybebakedfor48hoursat125°C±5°C
Note:Ifdevicecontainerscannotbesubjectedtohightemperatureorshorterbaketimesare
desired:ReferenceIPC/JEDECJ-STD-033forbakeprocedure
Bagsealdate:______________________Sign:_________________________
Note:LEVELandbodytemperaturedefinedbyIPC/JEDECJ-STD-020

GPS.G1-X-01021  Page7
HandlingRecommendationforGPS-MS1EReceiver-ApplicationNote u-bloxag

3.2 Manual Tempering Guideline


Sincethereceiver(s)inthispackagecouldnotbepackedintooneofourstandardpackagetypes,westrongly
recommendyoutoobservetherecommendations,basedonIPC/JEDECJ-STD-033Level5below:

1. If the receiver is exposed to a reflow or vapor phase soldering process, the receiver should be pre-
baked at 125°C +5°C /-0°C for at least 48 hours prior to soldering.
In order to prevent thermal shock, the receiver should be inserted into a cold oven (<80°C). After
pre-baking for 48 hours, the oven needs to be shut down but the receivers should not be taken
out before the temperature has dropped to approx. 40°C.

Attention: Do not bake the modules in the tray as the tray will melt. Place the modules
on a big PCB base board in upright position before baking them. See photographs below:


2. For hand soldering, no humidity treatment like pre-baking is necessary.

Please note:
The recommendations above do not apply to GPS-MS1E receivers shipped in one of our standard
package types.


GPS.G1-X-01021  Page8
HandlingRecommendationforGPS-MS1EReceiver-ApplicationNote u-bloxag

A RECOMMENDED REFLOW PROFILE


Reflow Profile
Solderpaste L-Sn62Pb36Ag2 Liquidustemperature 180°C Type: Ecorel 802

250
PeakTemperature210-230°

200
LiquidusTemperature180°
Temperature in °C

150

100

50

PreheatPhase ActivationPhase ReflowPhase CoolingPhase

0
0 50 100 150 200 250 300 350 400
Time in Sec

GPS.G1-X-01021  Page9
HandlingRecommendationforGPS-MS1EReceiver-ApplicationNote u-bloxag

B HAND SOLDERING OF MODULES



Hotbar,thicknessmax.1mm SolderIron:50W AdcolaSolderingStation

GPS-MS1Einhousing

Desoldering


Thetemperatureofthesolderingiron(hotbar)hastobeset
toa,value,whichallowsthedesolderingtobefinished
within10seconds.Iffeasible,theprocedurecanbe
supportedwithhotair(max.70°C)fromtheundersideof
themotherboard.

1. Thesolderiron(hotbar)isgentlypressedagainsttheJ-
leadsandthemotherboard.Thereceivermustnotbe
removedbeforeallJ-leadsareloose.
2. Thesolderironshouldbewithdrawn.Atthesametime,
thereceiverneedstobecarefullylifteduntilthetinis
solidified.
3. Step2and3needtoberepeatedontheothersideof
theGPS-MS1E

Thermal Flow 
Thisprocedure(evenwhenappliedtobothsides
simultaneously)limitsthethermalstressfortheGPS-MS1E
andthemotherboardasmuchaspossible.

Soldering

Thetemperatureofthesolderingiron(hotbar)hastobesettoavalue,whichallowsthesolderingofaJ-leadto
befinishedwithin3to6seconds.
Tin:L-Sn60Pb,F-SW32,1.5DIN,d=1.5mm

1. Thepadsneedtobecleaned.
2. TheGPS-MS1EisplacedandfixedbysolderingtwoJ-leads(i.e.pins1&22or21&42)
3. TheremainingJ-leadsaresolderedonebyone.

Please note, the procedure described above is only a recommendation. It needs to be qualified by the
each manufacturer for its equipment.

GPS.G1-X-01021  Page10
HandlingRecommendationforGPS-MS1EReceiver-ApplicationNote u-bloxag

C EXAMPLES OF PICTURES INDICATING DEFECTS


Short-circuitattheantennaplug



Componentresoldered


GPS.G1-X-01021  Page11
HandlingRecommendationforGPS-MS1EReceiver-ApplicationNote u-bloxag


Componentsshifted



Pinbrokenoff


GPS.G1-X-01021  Page12
HandlingRecommendationforGPS-MS1EReceiver-ApplicationNote u-bloxag

D CONTACT
Forfurtherinfo,pleasecontactus:

Headquarters Subsidiaries
u-blox ag u-blox Deutschland Gmbh u-blox Asia Pacific Ltd.
Zuercherstrasse68 BerlinerRing89 22/F.,CityLandmarkI
CH-8800Thalwil D-64625Bensheim 68ChungOnStreet
Switzerland Germany TsuenWan,HongKong
Phone: +4117227444 Phone: +49(0)625117566-0 Phone: +852-2941-8877
Fax: +4117227447 Fax: +49(0)625117566-11 Fax: +852-2615-2285
E-mail: info@u-blox.com E-mail: info_de@u-blox.de E-mail: info_ap@u-blox.com
www.u-blox.com www.u-blox.de www.u-blox.com
Tech. Support: Tech. Support:
Phone:+4117227474 Phone:+4117227474
support_de@u-blox.de support_ap@u-blox.com

 u-blox Europe Ltd. u-blox America, Inc.


BarhamCourt 13800CoppermineRoad
Maidstone,KentME185BZ Herndon,VA20171
UnitedKingdom USA
Phone: +441622618628 Phone: +1(703)2345290
Fax: +441622618629 Fax: +1(703)2345770
E-mail: info_uk@u-blox.co.uk E-mail: info_us@u-blox.com
www.u-blox.co.uk www.u-blox.com
Tech. Support: Tech. Support:
Phone:+441622618628 Phone:+4117227474
support_uk@u-blox.co.uk support_us@u-blox.com



GPS.G1-X-01021  Page13

Centres d'intérêt liés