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CMOS Fabrication Fabrication Process a chip consists of layers of different materials which are electrically isolated from each other. To make an electrical contact between unlike layers, a contact or via is used. The fabrication sequence consists of a series of steps in which layers of the chip are defined through photolithography.
CMOS Fabrication Fabrication Process a chip consists of layers of different materials which are electrically isolated from each other. To make an electrical contact between unlike layers, a contact or via is used. The fabrication sequence consists of a series of steps in which layers of the chip are defined through photolithography.
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CMOS Fabrication Fabrication Process a chip consists of layers of different materials which are electrically isolated from each other. To make an electrical contact between unlike layers, a contact or via is used. The fabrication sequence consists of a series of steps in which layers of the chip are defined through photolithography.
Droits d'auteur :
Attribution Non-Commercial (BY-NC)
Formats disponibles
Téléchargez comme PDF, TXT ou lisez en ligne sur Scribd
A chip consists of layers of different materials which are electrically
isolated from each other.
Anurup Mitra CMOS Fabrication
Fabrication Process
A chip consists of layers of different materials which are electrically
isolated from each other. To make an electrical contact between unlike layers, a contact or via is used.
Anurup Mitra CMOS Fabrication
Fabrication Process
A chip consists of layers of different materials which are electrically
isolated from each other. To make an electrical contact between unlike layers, a contact or via is used. The fabrication sequence consists of a series of steps in which layers of the chip are defined through photolithography.
Anurup Mitra CMOS Fabrication
Fabrication Process
A chip consists of layers of different materials which are electrically
isolated from each other. To make an electrical contact between unlike layers, a contact or via is used. The fabrication sequence consists of a series of steps in which layers of the chip are defined through photolithography. Photolithography uses ‘masks’ to transfer the patterns for each layer one at a time.
Anurup Mitra CMOS Fabrication
Fabrication Process
A chip consists of layers of different materials which are electrically
isolated from each other. To make an electrical contact between unlike layers, a contact or via is used. The fabrication sequence consists of a series of steps in which layers of the chip are defined through photolithography. Photolithography uses ‘masks’ to transfer the patterns for each layer one at a time. Since many entire chips are printed at once, the cost is proportional to the area rather than the number of devices being used in the chip/s.
Anurup Mitra CMOS Fabrication
CMOS Technologies
The main CMOS technologies are :
n-well The pMOS transistors are placed in the n-well and the nMOS transistors are created on the substrate
Anurup Mitra CMOS Fabrication
CMOS Technologies
The main CMOS technologies are :
n-well The pMOS transistors are placed in the n-well and the nMOS transistors are created on the substrate p-well Guess!
Anurup Mitra CMOS Fabrication
CMOS Technologies
The main CMOS technologies are :
n-well The pMOS transistors are placed in the n-well and the nMOS transistors are created on the substrate p-well Guess! twin-well This technology allows optimisation of each transistor type
Anurup Mitra CMOS Fabrication
CMOS Technologies
The main CMOS technologies are :
n-well The pMOS transistors are placed in the n-well and the nMOS transistors are created on the substrate p-well Guess! twin-well This technology allows optimisation of each transistor type triple-well This process permits excellent isolation between analog and digital circuitry in a mixed signal chip
Anurup Mitra CMOS Fabrication
Photolithography
The primary method for defining areas of interest (i.e. where we
want materials to be absent or present) on a wafer is by the use of photoresists.
Anurup Mitra CMOS Fabrication
Photolithography
The primary method for defining areas of interest (i.e. where we
want materials to be absent or present) on a wafer is by the use of photoresists. The wafer is coated with the photoresist and subjected to selective illumination by the photomask or reticle.
Anurup Mitra CMOS Fabrication
...contd.
A photomask is created with chromium (chrome) covered quartz
glass.
Anurup Mitra CMOS Fabrication
...contd.
A photomask is created with chromium (chrome) covered quartz
glass. An ultraviolet light source is used to expose the photoresist. The UV light floods the mask from the backside of the mask and passes through the clear sections of the mask to expose the PR that has been coated on the wafer.
Anurup Mitra CMOS Fabrication
...contd.
A photomask is created with chromium (chrome) covered quartz
glass. An ultraviolet light source is used to expose the photoresist. The UV light floods the mask from the backside of the mask and passes through the clear sections of the mask to expose the PR that has been coated on the wafer. A developer solvent is then used to dissolve the soluble unexposed PR, leaving islands of insoluble exposed photoresist.
Anurup Mitra CMOS Fabrication
...contd.
A photomask is created with chromium (chrome) covered quartz
glass. An ultraviolet light source is used to expose the photoresist. The UV light floods the mask from the backside of the mask and passes through the clear sections of the mask to expose the PR that has been coated on the wafer. A developer solvent is then used to dissolve the soluble unexposed PR, leaving islands of insoluble exposed photoresist. This, by the way, is known as a negative photoresist.
Anurup Mitra CMOS Fabrication
...contd.
A photomask is created with chromium (chrome) covered quartz
glass. An ultraviolet light source is used to expose the photoresist. The UV light floods the mask from the backside of the mask and passes through the clear sections of the mask to expose the PR that has been coated on the wafer. A developer solvent is then used to dissolve the soluble unexposed PR, leaving islands of insoluble exposed photoresist. This, by the way, is known as a negative photoresist. A positive resist is initially insoluble and becomes soluble after exposure to UV.
Anurup Mitra CMOS Fabrication
...contd.
A photomask is created with chromium (chrome) covered quartz
glass. An ultraviolet light source is used to expose the photoresist. The UV light floods the mask from the backside of the mask and passes through the clear sections of the mask to expose the PR that has been coated on the wafer. A developer solvent is then used to dissolve the soluble unexposed PR, leaving islands of insoluble exposed photoresist. This, by the way, is known as a negative photoresist. A positive resist is initially insoluble and becomes soluble after exposure to UV. Positive resists provide higher resolutions than negative resists but are however, less sensitive to light.
Anurup Mitra CMOS Fabrication
...contd.
A photomask is created with chromium (chrome) covered quartz
glass. An ultraviolet light source is used to expose the photoresist. The UV light floods the mask from the backside of the mask and passes through the clear sections of the mask to expose the PR that has been coated on the wafer. A developer solvent is then used to dissolve the soluble unexposed PR, leaving islands of insoluble exposed photoresist. This, by the way, is known as a negative photoresist. A positive resist is initially insoluble and becomes soluble after exposure to UV. Positive resists provide higher resolutions than negative resists but are however, less sensitive to light. As feature sizes shrink, PR’s are made smaller and this in turn makes them more prone to failure.
Anurup Mitra CMOS Fabrication
Well and Channel Formation
Varying proportions of donor and acceptor impurities can be
achieved by using epitaxy, desposition, or implantation.
Anurup Mitra CMOS Fabrication
Well and Channel Formation
Varying proportions of donor and acceptor impurities can be
achieved by using epitaxy, desposition, or implantation.
Epitaxy Can produce a layer of silicon with fewer defects.
Foundries provide a choice of epi or non-epi wafers.
Anurup Mitra CMOS Fabrication
Well and Channel Formation
Varying proportions of donor and acceptor impurities can be
achieved by using epitaxy, desposition, or implantation.
Epitaxy Can produce a layer of silicon with fewer defects.
Foundries provide a choice of epi or non-epi wafers. Deposition Places dopant material on Si surface and drives it in with thermal diffusion to create deep junctions. CVD can be alternatively be used to lay down thin films of materials.
Anurup Mitra CMOS Fabrication
Well and Channel Formation
Varying proportions of donor and acceptor impurities can be
achieved by using epitaxy, desposition, or implantation.
Epitaxy Can produce a layer of silicon with fewer defects.
Foundries provide a choice of epi or non-epi wafers. Deposition Places dopant material on Si surface and drives it in with thermal diffusion to create deep junctions. CVD can be alternatively be used to lay down thin films of materials. Implantation Ion implantation impinges the Si substrate with highly accelerated donor or acceptor atoms. It is the standard method for well and source/drain formation today.
Anurup Mitra CMOS Fabrication
Silicon Dioxide
Various thicknesses of SiO2 are required. While thin oxides are
used for transistor gates, thick oxides are used for high voltage devices. Even thicker oxides are used for device isolation.
Anurup Mitra CMOS Fabrication
Silicon Dioxide
Various thicknesses of SiO2 are required. While thin oxides are
used for transistor gates, thick oxides are used for high voltage devices. Even thicker oxides are used for device isolation. Oxidation is achieved by heating Si wafers in an oxidising atmosphere. A variety of processes are used: Wet Ox This is when the oxidising atmosphere contains water vapour. It is a rapid process. It is used for fox.
Anurup Mitra CMOS Fabrication
Silicon Dioxide
Various thicknesses of SiO2 are required. While thin oxides are
used for transistor gates, thick oxides are used for high voltage devices. Even thicker oxides are used for device isolation. Oxidation is achieved by heating Si wafers in an oxidising atmosphere. A variety of processes are used: Wet Ox This is when the oxidising atmosphere contains water vapour. It is a rapid process. It is used for fox. Dry Ox Here, the oxidising atmosphere is pure oxygen. This forms better quality oxides and are used for thinox.
Anurup Mitra CMOS Fabrication
Silicon Dioxide
Various thicknesses of SiO2 are required. While thin oxides are
used for transistor gates, thick oxides are used for high voltage devices. Even thicker oxides are used for device isolation. Oxidation is achieved by heating Si wafers in an oxidising atmosphere. A variety of processes are used: Wet Ox This is when the oxidising atmosphere contains water vapour. It is a rapid process. It is used for fox. Dry Ox Here, the oxidising atmosphere is pure oxygen. This forms better quality oxides and are used for thinox. ALD Atomic Layer Deposition is a process in which a thin chemical layer is attached to a surface and a second (different) chemical layer is used to react with the first and produce a thin layer of the required product.
Anurup Mitra CMOS Fabrication
Wafer
A bare Si wafer is chosen
The type will be n or p depending upon the technology
Anurup Mitra CMOS Fabrication
Oxidation of Wafer
The wafer is oxidised at a high temperature
This must be patterned to define the n-well
Anurup Mitra CMOS Fabrication
PR deposition
The photoresist is deposited throughout the wafer
The PR has to be patterned to allow formation of the well
Anurup Mitra CMOS Fabrication
n-well Mask
The PR is exposed through the n-well mask
The softened PR is is removed to expose the oxide
Anurup Mitra CMOS Fabrication
Oxide Etch
The oxide is etched with HF acid where unprotected by PR
The wafer is now exposed to the n-well area
Anurup Mitra CMOS Fabrication
PR removal
The remaining PR is removed via piranha etch
The well is ready to be formed
Anurup Mitra CMOS Fabrication
n-well Formation
The diffusion process can make the the n-well
Ion implantation can also form the same
Anurup Mitra CMOS Fabrication
Oxide Removal
The remaining oxide is stripped with HF acid
This leaves the exposed wafer with the n-well formed
Anurup Mitra CMOS Fabrication
Gate Formation
The gates are made up of polysilicon over thinox
CVD is used to grow the poly (heavily doped) layer
Anurup Mitra CMOS Fabrication
Poly Patterning
The wafer is now patterned with PR and the poly mask
Finally this leaves the device gates
Anurup Mitra CMOS Fabrication
Diffusion Pattern
Again, a protective oxide is grown and PR deposited
PR is patterned according to the diffusion mask
Anurup Mitra CMOS Fabrication
Wafer Exposure for Diffusion
The protective oxide is etched away
The wafer is exposed for S/D/B formation
Anurup Mitra CMOS Fabrication
n-Diffusion Regions
The n+ diffusion regions are formed
Polysilicon blocks the channel area
Anurup Mitra CMOS Fabrication
Self-Aligned Process
This is a self-aligned process
S/D are automatically formed adjacent to the gate
Anurup Mitra CMOS Fabrication
p-Diffusion
The p-diffusion mask is used next
This completes creation of all active regions
Anurup Mitra CMOS Fabrication
Field Oxide
The field oxide is grown to insulate wafer and metal
It is patterned with the contact mask
Anurup Mitra CMOS Fabrication
Metal Formation
Al is sputtered over the entire area filling contact cuts too