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1. Check after X-Board change

2. Do shortage check neighboring pins of FPC* connector
3. Check soldering condition of defect pin
4. Scan the pattern connected to defect pin with Microscpoe | |



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PCB G ÷
÷ed & Green pin of
left lower 4th FPC
short

!


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1. Cause : Short by solder bridge

- Can not observe with naked eye
- When connector open, pattern is
OK

%|


1. Check the contact status with connector(foreign material, soldering condition)

2. ÷eplace X Board and check again.(If OK, X-Board is defected)
3. By tracing defected line, check the contact condition of FPC and other connectors, IC output stage and PCB pattern.
4. If no problem, check the connector lead board.

˜


   

 
 


Pattern Short by connector miss insert ! 





 & | '



%|


1. Check the contact status with connector(foreign material, soldering condition)

2. ÷eplace X Board and check again.(If OK, X-Board is defected)
3. By tracing defected line, check the contact condition of FPC and other connectors, IC output stage and PCB pattern.
4. If no problem, check the connector lead board.

R


   

 
 


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Gap !

)
%

Insulation tape

·DD Electrode short at ÷,G,B ÷aster X ·pply silicon on the Connector lead
or White Screen(Different color display) ĸPay attention to a capillary symptom
†

%|


1. Trace defected line

2. Check the condition of FPC and connector on the X-Board, IC Output stage and Electrode line.


   

 
 


Keep horizontal, or
can be defected | 


%
(|,

Interfere with mechanical

structure when Module
assembling

Cold soldering at
Connector

1. Outbreak during heat run

2. ·DD Electrode open at one color ÷aster X mse Connector fixing iron plate
or White screen(No discharge) M Keep the contact point horizontal
when interfere with mechanical parts

%|


1. Trace defected line and check the condition of FPC and connector on X-Board, IC Output stage and
Electrode line.

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·YY|  |





·YY


%|


1. ÷eplace X Board and check again(Still problem, change the Panel)

2. Check the connection status of Panel side.
3. Check the connection condition of connector of Panel side and the FPC at upper ·CF.
ĺ If it is OK, check Panel pad

w


   

 
1 


·DD Electrode open

at Green ÷aster Panel Electrode Open Electrode(16)
 |

1. ·DD pattern of
~ P·D siden open
2. Width : 10 um

·CF ÷esistance B
÷esistance · ÷esistance B FPC
Electrode
16pin 1.2ȍ &-./
÷esistance ·
1,3,15,17,19pin 1.0 ~1.2ȍ 2.2~2.4ȍ

%|
 ) 
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0
1. Check the connection condition - Press the connector and reconnect ·YY

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2. Check the soldering condition of Connector lead

3. ÷eplace X Board and check again; Panel connector side or Circuit connector side
·YY
Y


ĺ Board defect, in case of one line, check the output stage of Drive IC(Cold soldering/Pattern)
If problems in input stage, several lines display $ 



   

 
 


Control board

Con 1 Con 2





X-board

Ö2 Ö3 2


 
·YY
·YY

 
4.
-

%|

1. Check the 5V(Logic voltage) input to DC-DC ĺ If it is lower than 5V, it makes similar problem
2. Check X Board(Open or Short circuit)
3. Check the connection condition(conncetion status, foreign material at connector, etc)
4. Check the drive IC at X Board(If defected, change the Board)
5. Confirm the connection of the connector

§


   

 
 


!
(·Y

X-D÷V IC

CLK LE

Short
PCB pattern short ÷264
÷258
m1

SN74·CT541

%|


Driver clock line at X Driver Board is designed to operate in · and B group

X Short circuit at clock line of Drive IC
X If problem at input stage, several lines are defected at one point
X ÷eplace the X Board of defected point

2


   

 
 


Ö!
2
connector
1
Chip *
÷esistors

X driver  
chip 
(SN755851PJ)



4X16 
= 64 data 
64
Electrode
16 clock
Pattern
line1
line2
line3
X PCB pattern is connected minutely
line4
ĺ Foreign material when photo resisting

%|


1. Check the connection condition of the Connector.

2. Check the cold soldering.

22


   

 
 


÷esistance between 186 pin of m3 and

7 pin of m300 is 62 ȍ
Normal condition : 2Ÿ

Because of foreign material in Via hole 





at m300 side

Via hole

m3 m300
·LTE÷· Chip D÷·M
Vertical bar in every 20mm 186pin PIN 7pin PIN





%|


1. Measure the resistance of Via holes between m3 and m300 at Control Board and compare with
that of normal.(Normal : 2~3 Ÿ)
2. ÷esistance increases as temperature rises.

2á


   

 
 


- Open circuit between pin 7 of m200 and pin 7

of m7 




- ÷esistance between two pins varies from
19 ohm ~ 45Kohm

%|


1. Observe the symptom during Heat-÷un at 45 degree.

2. Check the resistance of VI· holes of suspect ICs

2˜


   

 
 


! 3 |
(6
 ,
(Y
 1. Because Control data on P÷OM(m40) doesn¶t download
! 5Y Y "





7
 to FPG·, it can¶t generate control signal to X,Y and Z
Board.
D1 D3 2. Defected ·LTE÷·.
D4 P÷OM(m40) ‡




‡|(*

FPG·
* For normal operation, P÷OM program should be
downloaded to FPG·, and each P÷OM has corr-
espondent FPG·. See left picture.

(,)(5
(·Y

%|


1. Check D1, D3 & D4 on Control Board

- D1 : ON with 5V
- D3 : ON when P÷OM finishes program download from ·LTE÷· chip
- D4 : ON when signal is applied

2R


   

 
 












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X Neighboring Pins of m1(FPG·)

No signal or at PC mode, dark red raster displays.
touch
This is darker than normal ÷ed signal.

%|


- TV VSC board
- Board connector(50 pin) contact point
- Control board of Module

2



   

 
 


1. CN1 on Vs Board cold soldering

2. Spark marks between CN1 and Vs Board
-> It makes them open
Y !Y 4

Soldering Direction

Soldering point
CN1
Vs board

Solder land Solder

1. No ÷aster(ST-BY LED On)
2. Spark noise(Tik-Tik) Soldering Direction
3. No Vs, Vsetup & Vsc

%|


1. Check Vs, Va with multimeter(No Vs output)

2. Separate SMPS Board and VSC Board and check all voltage output stage
3. Check FET, T÷, Diode and ÷esistor(especially Cement ÷esistor)
4. Observe PCB Pattern and soldering condition with naked eyes

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Lift up the right and left of X-BO·÷D CONNECTO÷. Lift up X-BO·÷D CONNECTO÷ and separate
COP CONNECTO÷ by pulling up.

When you handle COF CONNECTO÷, don¶t pressure. First release LOCK and separate.
If COF CONNECTO÷ is damaged, you should replace MODmLE ·SS¶Y. So, be aware of this!! (



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Do not pressure or it can be hurt.

When LOCK is hurt, replace a new X-BO·÷D

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Pull the white LOCK as shown in arrow

Pull the white LOCK as shown in arrow.

Separate COF CONNECTO÷ by pulling in the left.

3

Be careful to handle LOCK and COF Connector. When LOCK part is damaged, you should replace
a new Y-Board. In case of COF Connector, Module ·ssembly.

˜



   

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Separate the fixed Screw of Z-Board. Condition in Lock part is pulled Pull COF Connector as shown in arrow.
Pull out Lock as shown in arrow.
It¶s easy to separate COF on condition
(

 that Z-Board Screw is separated.
3 In case Z-Board is assembled, it¶s really
hard to separate.
Be careful not to tear COF Connector.
If COF Connector is torn, replace a new Module ·ssembly

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Push LOCK and pull out

|= |=
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Be sealed up after gas injection

Be sealed up after gas injection

Warning Be careful to handle the sealed-up part after gas injection.

If it is broken, the gas escapes. So, replace the Module.

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Symptom : ·s soon as the power on,

it¶s off in 2 - 3minutes.
(P÷OTECT operation)
Cause : No VS voltage
5C: 


L813 Coil cold soldering.

%

Open the Connector connecting to each Board to check the power is off.
if each Board is same, check the Power Board and voltage.

R2


   

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Press the ·DJ KEY and check the position of add bar by changing WHITE or
÷ED or BLmE or G÷EEN

·)=,3+)

)
  )
5 MP-40P·10 uses 4 board such as left,right, top and bottom.
Divide the screen in 4 and once you see ·DD B·÷ check COF CONNECTO÷
between MODmLE and X-BO·÷D.
If there is no defect in COF CONNECTO÷ replace X-BO·÷D.
But the problem still remains and check the connector between X-BO·÷D and



 


5 CONT÷OL BO·÷D. ·nd if you can¶t find defect, check CONT÷OL.

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Symptom : B color 1 ·ddress line Open

Cause : Dented COF

COF is dented

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Cause : +
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Countermeasure : ÷eplace X-L-TOP board.

IC14

Cold Soldering

·bnormal waveform by cold soldering

Normal waveform after tearing off IC pin

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Bad Connector connecting

Control Board and VSC B/D.

Change the Connector

·bnormal Normal

Noise with division of colors

%











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Bad Connector

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 Name No signal Vertical Bar

Symptom Cause and Countermeasure

1.Cause : Bad IC2 (D·1)

X IC2 D·1(Data ·rrange) No.162 Pin output is changing
depending on the temperature.M abnormal X-B¶d Buffer IC
* ÷oom temperature : 2.5V Output (Normal Pin = over 2.8V)
* Heated : 1.5V Output(Normal Pin = 2.7V )
M
+ 4 Y·:"

2. Countermeasure : ÷eplace IC2

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8cm Y·: Y·:

÷ealization



When ·SIC Chip(IC2 D·1 LGD4001) on Control Board gets

high temperature, you can observe it
(In normal temperature it¶s O.K. )

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Name ·dd Open (Green 1 Line)

Symptom Cause and Countermeasure

1.cause: ·dd. COF Drive IC inferior

·dd. COF Drive IC

Normal Line Data waveform Open Line Data output waveform

X the output of inferior line less than that of the normal Line
·dd. COF Drive IC inferior
X COF inspection : 24V Open check (normal 50V)

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 Name Vertical bar when Power off/on(Mis-discharge)

Symptom Cause and Countermeasure

1.Cause : Control board malfunctions when Power off/on.

2.Countermeasure: Change some parts on Control board.

3.Changing parts : ·32_CT÷L_03 B/D (Marked on PCB)

-.÷14,17,18,21 : 330 ==> 4.7K (Chip ÷esistor)
-.÷15,16,19,20 : 22K ==> 4.7K (Chip ÷esistor)
-.C504, 505 : 0.1uF / 50V add (Chip Capacitor)

Control board

÷ealization
1.PDP Power on Mode external input
(regardless of wire/wireless signal but it¶s easy to reenact in wireless
signal)
2. ÷emove Power Cord (Power¶s off)
3.after about 20minutes, insert Power cord
(automatically the Power¶s on and the vertical bar is shown as above)

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-. Select 100% White Pattern signal and warm it up enough.
C.@ó :@ -. Connect DMM with TP PFC+ and TP PFC ± (GND).
-. adjust V÷801 to 380V (within ó1V ).
@C.:
4-@#
-. Connect DMM + terminal with P814 #1 Pin.
-. Turn V÷8401 (Va ·dj) to adjust the voltage on DMM to Va voltage
value marked on panel bottom- right label. (allowable error : ó0.5V )
| |· 
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-. Connect DMM¶s + terminal with P803 # 9 Pin.
-. Turn V÷ 8501 (Vs ·dj )to adjust the voltage on DMM to Vs voltage
value marked on panel bottom-right label.

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