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Cooling Technologies Research Center, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907-2088, USA
Abstract
Laminar convective heat transfer in the entrance region of microchannels of rectangular cross-section is investigated under circum-
ferentially uniform wall temperature and axially uniform wall heat flux thermal boundary conditions. Three-dimensional numerical sim-
ulations were performed for laminar thermally developing flow in microchannels of different aspect ratios. Based on the temperature and
heat flux distributions obtained, both the local and average Nusselt numbers are presented graphically as a function of the dimensionless
axial distance and channel aspect ratio. Generalized correlations, useful for the design and optimization of microchannel heat sinks and
other microfluidic devices, are proposed for predicting Nusselt numbers. The proposed correlations are compared with other conven-
tional correlations and with available experimental data, and show very good agreement.
2006 Elsevier Ltd. All rights reserved.
Keywords: Microchannel; Thermally developing; Electronics cooling; Liquid cooling; Heat sink
0017-9310/$ - see front matter 2006 Elsevier Ltd. All rights reserved.
doi:10.1016/j.ijheatmasstransfer.2006.02.011
P.-S. Lee, S.V. Garimella / International Journal of Heat and Mass Transfer 49 (2006) 3060–3067 3061
Nomenclature
and most studies have employed numerical approaches Lee et al. [3] conducted a detailed, three-dimensional
[5,6]. conjugate heat transfer analysis for the copper microchan-
Accurate prediction of heat transfer coefficients also nel heat sink used in their work (with a uniform heat flux
requires the correct thermal boundary conditions to be imposed on the bottom wall of the substrate). They com-
faithfully simulated. In applications where microchannel pared the results from their analysis to those obtained from
heat sinks are used, a uniform heat flux is usually applied simplified analyses for a microchannel using the H1, H2
to the base of the heat sink substrate, which is often made and T boundary conditions on the channel wall. With the
of a conductive material such as silicon, copper or alumi- three-dimensional conjugate heat transfer model, a compu-
num to reduce overall thermal resistances. Three-dimen- tational grid of 50 · 160 · 100 cells had to be used, whereas
sional conjugate heat transfer thus takes place within the for the simplified analyses only an eighth of the grid size
heat sink, leading to the redistribution of heat flux and (20 · 50 · 100 cells) was required. Predictions from the
temperature along the channel walls. Though three-dimen- H1 thermal boundary condition were found to be in the
sional conjugate heat transfer analyses have been shown to best agreement with the full three-dimensional conjugate
provide satisfactory simulations of experimental conditions analysis, deviating by less than 1.3%. They concluded that
[3,7], they are computationally expensive and case-specific, the H1 thermal boundary condition is the most appropriate
and cannot be generalized to a wide range of microchannel for simplified analyses, when full conjugate analyses are
configurations. To simplify the full three-dimensional con- not affordable. The H1 thermal boundary condition is
jugate analysis, the computational domain has typically common in engineering problems such as electric resistance
been restricted to include only the fluid region, with one heating, nuclear heating, counterflow heat exchangers hav-
of the following alternative thermal boundary conditions ing nearly identical fluid capacity rates, all with highly con-
applied to the channel walls: H1 (circumferentially con- ductive wall materials [9].
stant wall temperature and axially constant wall heat flux), Wibulswas [5] solved the thermal entrance length prob-
H2 (uniform wall heat flux, both axially and circumferen- lem with the H1 boundary condition; fluid axial conduc-
tially), and T (uniform wall temperature, both axially and tion and viscous dissipation were neglected and it was
circumferentially) [8]. While all the details of the actual assumed that no heat sources were present in the domain.
thermal problem are not faithfully represented by means Aparecido and Cotta [6] solved the problem of thermally
of these simplifications, such approaches are more compu- developing flow in square ducts for the T boundary condi-
tationally economical since conduction in the substrate is tion. However, both these sets of results were limited to a
not included in the calculation procedure. Importantly, small range of channel aspect ratios (a = 1–4), and were
the results of such analyses can be generalized to micro- also restricted by the available computational resources
channels of different dimensions, de-coupled from details of the time. With the increased power of the modern com-
of the substrate. puter, much improved computational fluid dynamics
3062 P.-S. Lee, S.V. Garimella / International Journal of Heat and Mass Transfer 49 (2006) 3060–3067
(CFD) computations can be performed with high accuracy aspect ratio of the rectangular channel and its hydraulic
and flexibility. diameter are defined as
In the present work, laminar flow and heat transfer in b 2ab
the thermal entrance region of rectangular ducts with a¼ and Dh ¼ ð1Þ
a aþb
aspect ratios ranging from 1 to 10 is investigated for ther-
mally developing flow with the H1 thermal boundary con- Fig. 1 shows a schematic diagram of the microchannel
dition. A finite volume approach is employed to obtain the cross-section considered. Only a quarter of the microchan-
temperature and heat flux distributions on the channel nel was included in the computational domain, in view of
walls. The local and average Nusselt numbers in the the symmetry conditions.
entrance region are numerically calculated as functions of The governing equations for mass, momentum and
the dimensionless axial distance and channel aspect ratio. energy are solved with boundary conditions as follows.
Generalized correlations for both the local and average The velocity is zero on all wall boundaries, and as the flow
Nusselt numbers in the thermal entrance region are pro- is assumed to be hydrodynamically fully developed, the fol-
posed. The results are compared to predictions from corre- lowing exact analytical solution by Marco and Han [10] is
lations for conventional channels as well as with used as the fully developed inlet velocity profile:
experimental data for microchannels, and good agreement 9
16 dp ðb=2Þ2 >
>
is noted. The proposed correlations are easy to use, provide uðx; y; 0Þ ¼ >
>
p3 dz l >
>
detailed heat transfer coefficient predictions in the entrance >
>
X1 ðn1Þ=2 npx >
=
region of microchannels, and cover a wide parameter ð1Þ coshðnpy=bÞ
1 cos
range. n3 coshðnpa=2bÞ b >
>
n¼1;3;... >
>
>
>
vðx; y; 0Þ ¼ 0 >
>
>
;
2. Mathematical formulation wðx; y; 0Þ ¼ 0
ð2Þ
The following assumptions are made to model the heat
transfer in the rectangular channel: where the pressure gradient dp/dz is given in terms of the
mean fluid velocity, um, by
(1) steady state, " 1 #
1 dp ðb=2Þ
2
192 b X 1 npa
(2) incompressible fluid, um ¼ 1 5 tanh
(3) laminar flow, 3 dz l p a n¼1;3;... n5 2b
(4) constant fluid properties,
ð3Þ
(5) negligible axial conduction and viscous dissipation,
and An outflow boundary condition is specified at the channel
(6) negligible radiative and natural convective heat trans- outlet. A uniform heat flux is applied to all the external
fer from the microchannel heat sink. boundaries of the thin wall region while the liquid at the
inlet is given a uniform temperature profile.
The dimensions of the microchannels considered in this
work are listed in Table 1. To achieve the H1 boundary
condition, a very thin and highly conductive wall (but with
no axial conduction) is included in the model. The width
(a) and axial length (l) of the channel in the computational
model are held constant at 200 lm and 120 mm, respec-
tively, while the height (b) of the channel is varied. The
b
Table 1
Dimensions of the microchannels investigated
a a (lm) b (lm) Dh (lm) L (mm) Mesh (quarter
domain)
1 200 200 200 120 10 · 10 · 400
2 200 400 267 120 10 · 20 · 400
3 200 600 300 120 10 · 30 · 400
4 200 800 320 120 10 · 40 · 400
5 200 1000 333 120 10 · 50 · 400
6 200 1200 343 120 10 · 60 · 400
7 200 1400 350 120 10 · 70 · 400
δ a
8 200 1600 356 120 10 · 80 · 400
9 200 1800 360 120 10 · 90 · 400 Fig. 1. Microchannel with thin conductive wall. The computational
10 200 2000 364 120 10 · 100 · 400 domain chosen from symmetry conditions is indicated with dashed lines.
P.-S. Lee, S.V. Garimella / International Journal of Heat and Mass Transfer 49 (2006) 3060–3067 3063
2.1. Solution method The average Nusselt number, Nuave(z), can similarly be
computed as
The continuity equation and the Navier–Stokes equa-
tions in their steady, incompressible form, along with the Dh 1
Nuave ðzÞ ¼ P
associated boundary conditions were solved using the gen- kf x;y;z dAðx; y; zÞ
eral-purpose finite-volume based computational fluid P 00
x;y;z q ðx; y; zÞdAðx; y; zÞ
dynamics (CFD) software package, FLUENT [11]. An axi- P ð9Þ
ally constant wall heat flux of 50 W/cm2 with circumferen- x;y;z ½T w ðx; y; zÞ T m ðzÞdAðx; y; zÞ
1
Nuz
qðzÞ
hðzÞ ¼ P ð4Þ
AðzÞ x;y ½T w ðx; y; zÞ T m ðzÞdAðx; y; zÞ
where A(z) and q(z) are the total local heat transfer area 10
and total local heat input, respectively, as defined below
X
AðzÞ ¼ dAðx; y; zÞ ð5Þ
x;y
X
qðzÞ ¼ q00 ðx; y; zÞdAðx; y; zÞ ð6Þ 5
0 50 100
x;y
z (mm)
In Eq. (4), Tw(x, y, z) is the local wall temperature and Fig. 2. Variation of local Nusselt number with axial distance for each of
Tm(z) is local fluid bulk-mean temperature given by the different grids considered.
3064 P.-S. Lee, S.V. Garimella / International Journal of Heat and Mass Transfer 49 (2006) 3060–3067
z th*
beginning of the entrance region, but rapidly decreases 0.04
and asymptotically approaches the fully developed values,
given by the formula [8],
0.03
2:0421 3:0853 2:4765 1:0578 0:1861
Nu1 ¼ 8:235 1 þ þ
a a2 a3 a4 a5
0.02
ð10Þ
α =1
The following generalized correlation for local Nusselt
10 number was obtained as a function of axial distance and
channel aspect ratio from a regression analysis with a
residual tolerance of 1 · 1010 applied to 4000 computed
5
values:
1
0 Nuz ¼ C2
þ C4; for 1 6 a 6 10; z < zth
0 0.02 0.04 0.06 0.08 C 1 ðz Þ þ C3
z*
ð12Þ
Fig. 3. Local Nusselt number as a function of dimensionless length and
aspect ratio. in which
P.-S. Lee, S.V. Garimella / International Journal of Heat and Mass Transfer 49 (2006) 3060–3067 3065
25 30
α = 10
α =9
α =8 Nu z - Proposed Correlation
20 α =7 25
Nuave- Proposed Correlation
α =6
α =5
Nu z - Wibulswas [5]
α =4 Nuave- Wibulswas [5]
15 α =3 20
α =2
Nuave
α =1
Nu
10 15
5 10
0 5
0 0.02 0.04 0.06 0.08
z*
15
3.4. Comparison with experimental data for microchannels
30 30
25 25
Experiment [3] Experiment [3]
20 Proposed correlation 20 Proposed correlation
w = 194 μ m, H = 884 μ m w = 229 μ m, H = 1250 μm
Nuave
10 10
5 5
30 30
25 25
Experiment [3] Experiment [3]
20
Proposed correlation 20 Proposed correlation
w = 300 μm, H = 1520 μm w = 534 μ m, H = 2910 μm
15 (D h = 501 μ m) 15 (D h = 902 μ m)
Nuave
Nuave
10 10
5 5
Fig. 8. Comparison of proposed correlation with experimental results of Lee et al. [3].
P.-S. Lee, S.V. Garimella / International Journal of Heat and Mass Transfer 49 (2006) 3060–3067 3067
the present work, which considers heat transfer from all sinks. The proposed correlations allow accurate predictions
four sides of the rectangular channels, were adapted for of the thermal performance of microchannel heat sinks.
comparison with the experiments using the correction fac-
tor proposed by Phillips [16]: Acknowledgements
Nuz;3 ¼ Nuz ðNu1;3 =Nu1 Þ ð15Þ The authors acknowledge the financial support from
This equation assumes that the ratio of developing Nusselt members of the Cooling Technologies Research Center, a
numbers for the three- and four-sided heating cases is iden- National Science Foundation Industry/University Cooper-
tical to the value in fully developed flow. The fully devel- ative Research Center at Purdue University. Professor
oped Nusselt number for four-sided heating is given in Jayathi Murthy is thanked for helpful discussions.
Eq. (10) while that for the three-sided heating case can be
approximated by the following formula [8]: References
[1] C.B. Sobhan, S.V. Garimella, A comparative analysis of studies on
1:883 3:767 5:814 5:361 2:0
Nu1;3 ¼ 8:235 1 þ 2 3 þ 4 5 heat transfer and fluid flow in microchannels, Microscale Thermo-
a a a a a phys. Eng. 5 (2001) 293–311.
ð16Þ [2] S.V. Garimella, C.B. Sobhan, Transport in microchannels – A critical
review, Annu. Rev. Heat Transfer 13 (2003) 1–50.
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rectangular microchannels, Int. J. Heat Mass Transfer 48 (2005)
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