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Vishay Siliconix
DESCRIPTION
Si9122 is a dedicated half-bridge IC ideally suited to fixed On-chip control of the dead time delays between the primary
telecom applications where efficiency is required at low output and secondary synchronous signals keep efficiencies high
voltages (e.g <3.3 V). Designed to operate within the fixed and prevent accidental destruction of the power transformer.
telecom voltage range 33-72 V and 100 V, 100 ms compliant, An external resistor sets the switching frequency from 200 kHz
the IC is capable of controlling and driving both the low and to 600 kHz.
high-side switching devices of a half bridge circuit and also
controlling the switching devices on the secondary side of the Si9122 has advanced current monitoring and control circuitry
bridge. Due to the very low on-resistance of the secondary which allow the user to set the maximum current in the primary
MOSFETs, a significant increase in the efficiency can be circuit. Such a feature acts as protection against output
achieved as compared with conventional Schottky diodes. shorting and also provides constant current into large
Control of the secondary devices is by means of a pulse capacitive loads during start-up or when paralleling power
transformer and a pair of inverters. Such a system has supplies. Current sensing is by means of a sense resistor on
efficiencies well in excess of 90% even for low output voltages. the low-side primary device.
VIN
+
CVIN1
D1 -
Power To
CBOOST Transformer VCC
VCC
Pre-Reg BST LX
DH
CVCC
(High) VOUT
EP Voltage Primary
Control Drivers
Voltage
Information CLOAD RLOAD
DL
PWM t (Low)
Current
Sense RS
Current Secondary
CS2 Control Timer
Drivers Pulse
CS1 BBM SRH Transformer
RBBM Si9122
Half-Bridge SRL
Synchronous
Controller
Error
Opto
Amp
1.215 V
Figure 1.
TECHNICAL DESCRIPTION
Si9122 is a voltage mode controller for the half-bridge function is included to prevent shoot through current or
topology. With 100-V depletion mode MOSFET capability, the transformer shorting. Adjustable BBM time is incorporated into
Si9122 is capable of powering directly from the high voltage the IC and is programmable by external resistor value.
bus to VCC through an external PNP pass transistor, or may be
powered through an external regulator directly through the
VCC pin. With PWM control, Si9122 provides peak efficiency Si9122 is available in TSSOP-20 and SOIC-20 pin packages.
throughout the entire line and load range. In order to simplify In order to satisfy the stringent ambient temperature
the traditional secondary synchronous rectification, Si9122 requirements, Si9122 is rated to handle the industrial
provides intelligent gate drive signals to control the secondary temperature range of –40 to 85_C. When a situation arises
MOSFETs. With independent gate drive signals from the which results in a rapid increase in primary (or secondary
controller, transformer design is no longer limited by the gate current) such as output shorted or start-up with a large output
to a source rating of the MOSFETs. Si9122 provides constant capacitor, control of the PWM generator is handed over to the
VGS voltage, independent of line voltage to minimize the gate the current loop. Monitoring of the load current is by means of
charge loss as well as conduction loss. A break-before-make a sense resistor on the primary low-side switch.
9.1 V
High-Side
VUVLO Primary
REG_COMP Pre-Regulator + Driver
-
8.8 V BST
VINDET Int DH
VFF
+ VUV
OSC LX
VREF -
Ramp
BG Low-Side
+ VSD Driver
132 kW - DL
550 mV
60 kW
EP -
+ Driver
Error Amplifier + Control PGND
-
and
V REF PWM
Timing
2 Comparator
20 mA
ISS SRH
SS OTP
8V SYNC
Driver High
CS2 + Duty Cycle
Peak DET SRL
CS1 - Control
SYNC
Over Current Protection Si9122 Driver Low
Figure 2.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
SPECIFICATIONSa
Test Conditions Limits
Unless Otherwise Specified -40 to 85_C
FNOM = 500 kHz, VIN = 72 V
Parameter Symbol VINDET = 7.2 V; 10 V VCC 13.2 V Minb Typc Maxb Unit
Reference (3.3 V)
Output Voltage VREF VCC = 12 V, 25_C Load = 0 mA 3.2 3.3 3.4 V
Short Circuit Current ISREF VREF = 0 V -50 mA
Load Regulation dVr/dlr IREF = 0 to -2.5 mA -30 -75 mV
Power Supply Rejection PSRR @ 100Hz 60 dB
Oscillator
Accuracy (1% ROSC) ROSC = 30 kW, FNOM = 500 kHz -20 20 %
Max Frequency FMAX ROSC = 24 kW 600
kHz
Foldback Frequencyd FFOBK FNOM = 500 kHz, VCS2 - VCS1 150 mV 100
Error Amplifier
Input Bias Current IBIAS VEP = 0 V -40 -15 mA
Gain AV -2.2
Bandwidth BW 5 MHz
Power Supply Rejection PSRR @ 100Hz 60 dB
Slew Rate SR 0.5 V/ms
SPECIFICATIONSa
Test Conditions Limits
Unless Otherwise Specified -40 to 85_C
FNOM = 500 kHz, VIN = 72 V
Parameter Symbol VINDET = 7.2 V; 10 V VCC 13.2 V Minb Typc Maxb Unit
Current Sense Amplifier
dVCS = 0 120
m
mA
CL_CONT Current ICL_CONT dVCS = 100 mV 0
dVCS = 170 mV 2 mA
IPD = IPU - ICL_CONT = 0
Lower Current Limit Threshold VTLCL 100
See Figure 6
Upper Current Limit Threshold VTHCL IPD 2 mA 150 mV
PWM Operation
DMAX VEP= 0 V 90 92 95
500 kHz
Duty Cyclee VEP= 1.75 V 15 %
DMIN
VCS2 - VCS1 150 mV 3
Pre-Regulator
Input Voltage +VIN IIN = 10 mA 72 V
Input Leakage Current ILKG VIN = 72 V, VCC VREG 10
m
mA
IREG1 VIN = 72 V, VINDET VSD 86 200
Regulator Bias Current
IREG2 VIN = 72 V, VINDET VREF 8 14 mA
ISOURCE -29 -19 -9
Regulator_Comp VCC = 12 V m
mA
ISINK 50 82 110
Pre-Regulator Drive Capacility ISTART VCC VREG 20 mA
7.4 9.1 10.4
VCC Pre-Regulator Turn Off VREG1 VINDET VREF
TA = 25_C 8.5 9.1 9.7
Threshold Voltage
VREG2 VINDET = 0 V 9.2
V
7.15 8.8 9.8
Undervoltage Lockout VUVLO VCC Rising
TA = 25_C 8.1 8.8 9.3
VUVLO Hysteresisg VUVLOHYS 0.5
Soft-Start
Soft-Start Current Output ISS Start-Up Condition 12 20 28 mA
Soft-Start Completion Voltage VSS_COMP Normal Operation 7.35 8.05 8.85 V
Shutdown
VINDET Shutdown FN VSD VINDET Rising 350 550 720
mV
VINDET Hysteresis VINDET 200
SPECIFICATIONSa
Test Conditions Limits
Unless Otherwise Specified -40 to 85_C
FNOM = 500 kHz, VIN = 72 V
Parameter Symbol VINDET = 7.2 V; 10 V VCC 13.2 V Minb Typc Maxb Unit
Output MOSFET DH Driver (High-Side)
Output High Voltage VOH Sourcing 10 mA VBST - 0.3
V
Output Low Voltage VOL Sinking 10 mA VLX + 0.3
Boost Current IBST VLX = 72 V, VBST = VLX + VCC 1.3 1.9 2.7
mA
LX Current ILX VLX = 72 V, VBST = VLX + VCC -1.1 -0.7 -0.4
Peak Output Source ISOURCE -1.0 -0.75
VCC = 10 V A
Peak Output Sink ISINK 0.75 1.0
Rise Time tr 35
CDH = 3 nF ns
Fall Time tf 35
Voltage Mode
td1DH Input to high-side switch off 200
Error Amplifier ns
td2DL Input to low-side switch off 200
Current Mode
td3DH Input to high-side switch off 200
Current Amplifier ns
td4DL Input to low-side switch off 200
Notes
a. Refer to PROCESS OPTION FLOWCHART for additional information.
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum (-40_ to 85_C).
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. FMIN when VCL_CONT at clamp level. Typical foldback frequency change +20%, -30% over temperature.
e. Measured on SRL or SRH outputs.
f. See Figure 3 for BBM definition.
g. VUVLO tracks VREG1 by a diode drop
VCC
DL DL GND
SRL SRL
VBST
DH DH
VMID
DH DH
GND
VCC
SRH SRH
GND
Time
DH
tBBM1 tBBM2 tBBM3 tBBM4 BST = LX + VCC
50%
LX
DH, LX
DH, LX VMID
SRH VCC
50%
DH, LX
GND
tBBM3 tBBM4
DL SRL
SRL VCC
GND
PIN CONFIGURATION
Si9122DQ (TSSOP-20)
Si9122DW (SOIC-20)
ORDERING INFORMATION
VIN 1 20 BST Part Number Temperature Range Package
REG_COMP 2 19 DH Si9122DQ-T1 Tape and Reel
VCC 3 18 LX Si9122DQ Bulk
VREF 4 17 DL _
-40 to 85_C
Si9122DW-T1 Tape and Reel
GND 5 16 PGND
Si9122DW Bulk
ROSC 6 15 SRH
EP 7 14 SRL
VINDET 8 13 SS Eval Kit Temperature Range Board Type
CS1 9 12 BBM Si9122DB Surface Mount and
-10 to 70_C
CS2 10 11 CL_CONT Issue 3 Thru-Hole
Top View
PIN DESCRIPTION
Pin Number Name Function
1 VIN Input supply voltage for the start-up circuit.
2 REG_COMP Control signal for an external pass transistor.
3 VCC Supply voltage for internal circuitry
4 VREF 3.3-V reference, decoupled with 1-mF capacitor
5 GND Ground
6 ROSC External resistor connection to oscillator
7 EP Voltage control input
VIN under voltage detect and shutdown function input. Shuts down or disables switching when VINDET falls below
8 VINDET
preset threshold voltages and provides the feed forward voltage.
9 CS1 Current limit amplifier negative input
10 CS2 Current limit amplifier positive input
11 CL_CONT Current limit compensation
12 BBM Programmable Break-Before-Make time connection to an external resistor to set time delay
13 SS Soft-Start control - external capacitor connection
14 SRL Signal transformer drive, sequenced with the primary side.
15 SRH Signal transformer drive, sequenced with the primary side.
16 PGND Power ground.
17 DL Low-side gate drive signal – primary
18 LX High-side source and transformer connection node
19 DH High-side gate drive signal – primary
20 BST Bootstrap voltage to drive the high-side n-channel MOSFET switch
Pre-Regulator
Bandgap VREG +
VREF Reference - 8.8 V
9.1 V
3.3 V
VUVLO
+ +
- -
VUV
VINDET High-Side
VREF Primary
CL_CONT Driver
VSD BST
+
-
Voltage Frequency 160_C Temp High Voltage
Feedforward Foldback DH
550 mV Protection Interface
60 kW DL
EP - -
+ + Logic
VREF/2 PGND
PWM
Generator
Current
Control Gain Timer Synchronous
CS2 Loop Driver
+
- Control (High)
CS1
100 mV SRH
Blanking
GND
Synchronous
Driver
CL_CONT (Low)
VCC
BBM SRL
20 mA Si9122
8V Soft-Start
SS
SS Enable
DETAILED OPERATION
Start-Up of the VCC capacitor, bootstrap capacitor and the soft-start
capacitor. The value of the VCC capacitor should therefore be
When VIN2 rises above 0 V, the internal pre-regulator begins
chosen to be capable of maintaining switch mode operation
to charge up the Vcc capacitor. Current into the external VCC
until the VCC can be supplied from the external circuit (e.g via
capacitor is limited to typically 40 mA by the internal DMOS
a power transformer winding and zener regulator). Feedback
device. When Vcc exceeds the UVLO voltage of 8.8 V a
from the output of the switch mode supply charges VCC above
soft-start cycle of the switch mode supply is initiated. The VCC
VREG and fully disconnects the pre-regulator, isolating VCC
supply continues to be charged by the pre-regulator until VCC
from VIN. VCC is then maintained above VREG for the duration
equals Vreg. During this period, between VUVLO and VREG,
of switch mode operation. In the event of an over voltage
excessive load current will result in VCC falling below VUVLO
condition on VCC, an internal voltage clamp turns on at 14.5 V
and stopping switch mode operation. This situation is avoided
to shunt excessive current to GND.
by the hysteresis between VREG and VUVLO and correct sizing
Care needs to be taken if there is a delay prior to the external linearly from DMIN to DMAX over the soft-start period. Start-up
circuit feeding back to the VCC supply. To prevent excessive from a VINDET power down is also initiated under
power dissipation within the IC it is advisable to use an external soft-start control.
PNP device. A pin has been incorporated on the IC,
(REG_COMP) to provide compensation when employing the Half-Bridge and Synchronous Rectification Timing
external device. In this case the VIN pin is connected to the Sequence
base of the PNP device and controls the current, while the
REG_COMP pin determines the frequency compensation of The PWM signal generated within the IC controls the low and
the circuit. To understand the operation please refer to high-side bridge drivers on alternative cycles. A period of
Figure 5. inactivity always results after initiation of the soft-start cycle
until the soft-start voltage reaches approximately 1.2 V and
The soft-start circuit is designed to the dc-dc converter to PWM generated switching begins. The first bridge driver to
start-up in an orderly manner and reduce component stress on switch is always the low-side, DL as this allows charging of the
the IC. This feature is programmable by selecting an external high-side boost capacitor.
CSS. An internal 20-mA current source charges CSS from 0 V
to the final clamped voltage of 8 V. In the event of UVLO or The timing and coordination of the drives to the primary and
shutdown, VSS will be held low (<1 V) disabling driver secondary stages is very important and shown in Figure 3. It
switching. To prevent oscillations, a longer soft-start time may is essential to avoid the situation where both of the secondary
be needed for high capacitive loads and high peak output MOSFETs are on when either the high or the low-side switch
current applications. are active. In this situation the transformer would effectively be
presented with a short across the output. To avoid this, a
VSS has a predictable +1.25-mV/C temperature coefficient and dedicated break-before-make circuit is included which will
can be used to continuously monitor the junction temperature generate non overlapping waveforms for the primary and the
of the IC for a given power dissipation. secondary drive signals. This is achieved by a programmable
timer which delays the switching on of the primary driver
Reference relative to the switching off of the related secondary and
subsequently delays the switching on of the secondary relative
The reference voltage of Si9122 is set at 3.3 V. The reference to the switching off of the related primary.
voltage is de-coupled externally with 0.1-mF capacitor. The
VREF voltage is 0 V in shutdown mode and has 50-mA source Typical variation in the BBM3 and BBM4 delay with LX voltage
capability. is shown in graphs BBM3, 4 and for RBBM = 22 kW. This is
due to a reduction in propagation delay through the high-side
Voltage Mode PWM Operation driver path as the LX voltage increases and must be
considered in setting the delay for the system level design.
Under normal load conditions, the IC operates in voltage mode Variation of BBM time with RBBM is shown in graph BBM1 to
and generates a fixed frequency pulse width modulated signal 4 vs. RBBM.
to the drivers. Duty cycle is controlled over a wide range to
maintain output voltage under line and load variation. Voltage Primary High- and Low-Side MOSFET Drivers
feed forward is also included to take account of variations in
supply voltage VIN. The drive voltage for the low-side MOSFET switch is provided
directly from the IC (=VCC). The high-side MOSFET however
In the half-bridge topology requiring isolation between output requires the gate voltage to be enhanced above VIN. This is
and input, the reference voltage and error amplifier must be achieved by bootstraping the VCC voltage onto the LX voltage
supplied externally, usually on the secondary side. The error (the high-side MOSFET source). In order to provide the
information is thus passed to the power controller through an bootstrapping an external diode and capacitor are required as
opto-coupling device. This information is inverted, hence 0 V shown on the application schematic. The capacitor will charge
represents the maximum duty cycle, whilst 2 V represents up after the low-side driver has turned on. The switch gate
minimum duty cycle. The error information enters the IC via pin drive signals DH and DL are shown in Figure 3.
EP, and is passed to the PWM generator via an inverter
amplifier. The relationship between Duty cycle and VEP is Secondary MOSFET Drivers
shown in the Typical Characteristic Graph,Duty Cycle vs. VEP
25_C , page 13. Voltage feedforward is implemented by taking The secondary side MOSFETs are driven from the IC via a
the attenuated VIN signal at VINDET and directly modulating the center tapped pulse transformer and inverter drivers. The
duty cycle. The relationship between Duty cycle and VINDET is waveforms from the IC SRH and SRL are shown in Figure 3.
shown in the the Typical Characteristic Graph, Duty Cycle vs. Of importance is the relative voltage between SRH and SRL,
VINDET, page 12. i.e. that which is presented across the primary of the pulse
transformer. When both potentials of SRL and SRH are equal
At start-up, i.e. once VCC is greater than VUVLO, switching is then by the action of the inverting driver both secondary
initiated under soft-start control which increases pulse width MOSFETs are left on.
The soft-start function does not apply under current limit as this Figure 5. High-Voltage Pre-Regulator Circuit
would constitute hiccup mode operation.
AV OSC
IPU
120 mA (nom)
+
GM
Peak Detect - VOFFSET CL_CLAMP
CL_CONT
CS1 -
AV AV 150 mV
CS2
+
REXT
Blank
+ CEXT
GM IPD
- 0 - 240 mA (nom)
AV 100 mV
TYPICAL CHARACTERISTICS
BBM1, 2 vs. Temperature vs VCC (RBBM = 22 kW) BBM3, 4 vs. LX vs. VCC (RBBM = 22 kW)
50 60
BBM1, 10 V
BBM4, 10 V
45 50
BBM4, 12 V
40 40
Delay (ns)
Delay (ns)
BBM2, 10 V
BBM1, 12 V BBM4, 13.2 V
BBM1, 13.2 V
35 30
BBM2, 13.2 V
BBM3, 10 V
BBM2, 12 V
30 20
BBM3, 13.2 V
BBM3, 12 V
25 10
-50 0 50 100 150 20 30 40 50 60 70 80
70
500
BBM2
60
450
FOSC (kHz)
Delay (ns)
50 BBM1 BBM3
400
40
350
30
300
20
10 250
0 200
10 15 20 25 30 35 40 45 50 20 30 40 50 60 70 80 90
3.290
8.15
9.5 3.288
TC = +1.25 mV/C
3.286
8.10
9.0 3.284
V REF (V)
V REG(V)
V SS (V)
TYPICAL CHARACTERISTICS
VOUT vs. VIN (VCC = 8.5 V, 10 V and 13.2 V) VOUT (%) Variation vs. VIN
3.38 0.10
3.36 0.08
3.34 VCC = 10 V 0.06
3.32
0.04 VCC = 8.5 V
V OUT % Change
3.30
0.02 VCC = 10 V
V OUT (V)
3.16 -0.10
25 30 35 40 45 50 55 60 65 70 75 33 38 43 48 53 58 63 68 73
VOUT and IOUT vs. ILOAD, VIN = 72 V Percentage Change VOUT vs. ILOAD
4.0 0.2
3.5 0.1
VOUT ILOAD
3.0 -0.0 VIN = 36 V
2.5 -0.1
% Change
V OUT (V)
2.0 -0.2
VIN = 72 V
1.5 -0.3
1.0 -0.4
VOUT ILOAD
0.5 -0.5
0.0 -0.6
0 5 10 15 20 25 0 2 4 6 8 10
VIN = 36 V
90
90
80
80
Efficiency (%)
Duty Cycle %
VIN = 72 V
70 SRL/SRH
70
60
DL/DH
60
50
50
40
40 30
0 2 4 6 8 10 12 14 2.5 3.5 4.5 5.5 6.5 7.5
ILOAD (A) VINDET (V)
TYPICAL CHARACTERISTICS
Duty Cycle vs. VEP 25_C, VINDET = 3.75 V, 7.2 V IOUT vs. RLOAD (VIN = 7.2 V)
50 60 500
Frequency
45
50
40 400
DL/DH D%
Frequency (kHz)
Duty Cycle %
30 300
25 30
20 200
SRL/SRH 3.75 V 20
15
IOUT
7.2 V
10 100
10
5 VOUT
0 0 0
0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0
45
V ROSC (V), SRL, SRH, Duty Cycle(%)
Frequency
40 400
D%
35
Frequency (kHz)
30 300
25 DDL
DSRL
20 200
15
10 100
VROSC
5
0 0
1 2 3 4 5
VCLCONT (V)
TYPICAL WAVEFORMS
DL 10 V/div DL 5 V/div
CS2 5 V/div
CS2 50 mV/div
2 ms/div 2 ms/div
VEP 2 V/div
IL 10 A/div
VOUT 2 V/div
VCC 2 V/div
LX 20 V/div
SRL 5 V/div
DL 5 V/div
SRH 2 V/div
SRH 5 V/div
SRL 2 V/div
P1
V IN
1 VIN
36 - 72 V C1
R1 R27 5.6
P2 1 mF
90 kW 1 MW 100 V 7, 8
1 Q2 D2
Q1 FZT953 10MQ100N
GND 4
FMMT493 3 3
R3 1 1 1 D1 3 Q3 1, 2, 3
Si4486EY LX
470 kW PNP BAS19
2 2
R2 R5
1 MW 10 kW
R2 1 20
10 W VIN BST
C8
2 19 0.1 mF
VCC REG_COMP DH 5.6
2 nF
7, 8
3 18
VCC LX D3
JP1 10MQ100N
1 C9 C29 4 17 4
VREF DL
2 SD C10
4.7 mF 5 16 Q4
3 EN GND PGND 1, 2, 3
16 V Si4486EY
1 mF 470 pF
P3 10 V 6
10 V 15
ROSC SRH
1 C30
R6 200 - 800 pF 7 14
AGND EP SRL
35 kW C11
R7 1000 pF 8 13
VINDET SS
2 kW
9 12
CS1 BBM
C12
15 pF 10 11 C14
CS2 CL_CONT
R9 4.7 nF
R8
27 kW
5 kW
C13
4700 pF
R10
2 kW R12
0.02 W
Vishay Siliconix
R11 1/ W
2
2 kW
SRH
SRL
www.vishay.com
Si9122
VCC
EP
15
Si9122
16
www.vishay.com
Vishay Siliconix
VCC
4
2 Si3552DV
5.6
7, 8 1, 2, 3 3
C17 R16
Q5 0.1 mF 10 W
VIN Si4886DY
Q7B 4
C2 + C1 + C4
1 mF 15 mF 15 mF 4
Q7A 6
50 V 50 V 50 V 5.6
7, 8 1, 2, 3 3
1 D8
T1 1, 2
BAS19
Q6 1
Si4886DY
5 T3
5, 6 LEP-9080
LX D4 30BQ040
5 4
R14 C15
R13 3.3 V P4
15 W 11, 12 3.3 V
3.3 W 1000 pF 7, 8, 9 1, 2, 3
800 mW 1
C20 R15 C16 15 A
9, 10
680 pF
100 V C22 C23 C24 C32
D7 R17 P5
3.3 W 1000 pF 47 mF 47 mF 47 mF 10 mF
30BQ040 NU
D5 30BQ040 10 V 10 V 10 V 6.3 V
7, 8
3, 4
1
5.6
EPC19 7, 8 1, 2, 3 D6
MBR0520
3.3 V
Q8 C25 R21
C33
0.033 mF 51 W
4 Si4886DY 0.1 mF TP1
C5 + C6 + C7
5.6 1
1 mF 15 mF 15 mF C26
7, 8 1, 2, 3
50 V 50 V 50 V R26 0.1 mF
5.6 kW R22
Q8 R18 33 kW
Si4886DY R20
4 20 kW
300 kW (5)
7
U3 (3)
2 5
Q10B AD820 3
C18 6 +
LM4041CIM3-1.2
3 0.1 mF (1) 8 - 2
C19 R23
4.7 mF 1 (4) 18.6 kW
16 V U03 R25
6 LM7301 4 2 kW P6
(2) 1
4 R19 C27 1
C28
PGND
D9 3.9 kW 1000 pF 0.1 mF 3
C21 3 2 1 2 P7
0.047 mF 1
25 V 1 Q10A
T2 6
S-22379—Rev. D, 30-Dec-02
SRH
5 MOC207
6 1
3 4 D10
SRL 3 2 5
EP7 2
1 R24
BAV99 7
VCC 1 MW
EP
C34, 0.1 mF
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