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IEEE 3DIC Conference, Munich, November 18, 2010

Tutorial 1
3D-SIC Design and Test

Speakers and contact:

Paul Franzon
Department of Electrical and Computer Engineering,
NC State University,
Raleigh, NC 27695
Phone: 919.515.7351
E-Mail: paulf@ncsu.edu

Erik Jan Marinissen

IMEC vzw
Kapeldreef 75, B-3001 Leuven
Phone: +32 (16) 28-8755
E-mail: erik.jan.marinissen@imec.be

3D stacking and integration with TSVs provide significant potential system advantages in terms of
power, scale, cost, and performance. However, it also brings challenges in system design, CAD,
thermal design, and test. This tutorial will briefly introduce 3DIC technology and then focus mainly
on solving the challenges.

Further details see next pages.

3 hours
Part 1 - Design of 3D-SICs

1. Introduction

2. 3D-SIC Technology
Application drivers
3D manufacturing steps (incl. TSV formation, wafer thinning, and bonding)
Manufacturing options

3. 3D-SIC System Drivers

Design drivers
Architectural opportunities
Matching technology with application

4. 3D-SIC Design
Floorplanning and partitioning
Usable CAD flows
Thermal, power integrity and codesign
Managing cost

Part 2 - Test of 3D-SICs

5. 3D Test Flows
2D vs 3D test flows: wafer test and final test; pre-bond die testing and post-bond stack
KGD and KGS testing
Test flow cost modeling
The value of pre-bond testing in W2W stacking

6. 3D Test Contents
Tests for new intra-die defects
Tests for TSV-based interconnects

7. 3D Test Access
Wafer probing: from ATE to external I/Os and vice versa:
pre-bond probing and post-bond probing
Design-for-Test: from external I/Os to intra-die circuitry and vice versa:
3D DfT architecture, standardization, EDA flow

8. Conclusion
Tutorial summary
Evaluation with / by audience

Paul D. Franzon is currently a Professor of Electrical and Computer Engineering at North Carolina
State University. He earned his Ph.D. from the University of Adelaide, Adelaide, Australia in 1988.
He has also worked at AT&T Bell Laboratories, DSTO Australia, Australia Telecom and two companies
he cofounded, Communica and LightSpin Technologies. His current interests center on the
technology and design of complex systems incorporating VLSI, MEMS, advanced packaging and nano-
electronics. He has led several major efforts and published over 180 papers in these areas. In 1993
he received an NSF Young Investigators Award, in 2001 was selected to join the NCSU Academy of
Outstanding Teachers, in 2003, selected as a Distinguished Alumni Professor, and in 2005 won the
Alcoa award. He is a Fellow of the IEEE.

Erik Jan Marinissen received the MSc degree in Computing Science and the PDEng degree in Software
Technology from Eindhoven University of Technology in 1990 and 1992, respectively. He is currently
a Principal Scientist at IMEC in Leuven, Belgium. Prior to IMEC, he was with NXP Semiconductors and
Philips Research, both in Eindhoven, The Netherlands. Marinissen’s research interests include all
topics in the domain of test and debug of integrated circuits. He is a co-author of more than 140
journal and conference papers and a co-inventor of nine granted US and EU patent families. He is a
recipient of Best Paper Awards at the Chrysler-Delco-Ford Automotive Electronics Reliability
Workshop in 1995, the IEEE International Board Test Workshop in 2002, and the Most Significant
Paper Award at the IEEE International Test Conference in 2008. Marinissen served as an Editor-in-
Chief of IEEE Std. 1500. He serves on numerous conference committees, including ATS, ETS, DATE,
ITC, and VTS. He is a founder of workshops on ‘Diagnostic Services in Network-on-Chips’ (DSNOC),
‘3D Integration’, and ‘Testing Three-Dimensional Stacked ICs’ (3D-TEST). Marinissen serves on the
editorial boards of IEEE ‘Design & Test of Computers’, IET ‘Computers and Digital Techniques’ (IET-
CDT), and Springer’s ‘Journal of Electronic Testing: Theory and Applications’ (JETTA). He is a Senior
Member of IEEE and a Golden Core Member of Computer Society. Marinissen presented full-day
tutorials at ATS, DATE, ETW, ITC, and VTS.