Sun Ultra 10 Manual

Sun Ultra 10 Service Manual
Sun Microsystems, Inc.

901 San Antonio Road
Palo Alto, CA 94303-4900 USA
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Fax 650 969-9131
Part No.: 805-7764-12

February 2000, Revision A
Send comments about this document to: docfeedback@sun.com

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All rights reserved.
This product or document is protected by copyright and distributed under licenses restricting its use, copying, distribution, and decompilation.
No part of this product or document may be reproduced in any form by any means without prior written authorization of Sun and its licensors,
if any.
Portions of this product may be derived from the UNIX® system, licensed from Novell, Inc., and from the Berkeley 4.3 BSD system, licensed
from the University of California. UNIX is a registered trademark in the United States and in other countries and is exclusively licensed by
X/Open Company Ltd. Third-party software, including font technology in this product, is protected by copyright and licensed from Sun’s
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and FAR 52.227-19(6/87), or DFAR 252.227-7015(b)(6/95) and DFAR 227.7202-3(a).
Sun, Sun Microsystems, the Sun logo, AnswerBook2, docs.sun.com, ShowMe How2, Java, Java Coffee Cup logo, Solaris, The Network Is the
Computer, Ultra, Ultra Port Architecture, SunMicrophone, SunVTS, UltraSPARC, OpenBoot, Solstice DiskSuite, and SunOS are trademarks
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The OPEN LOOK® and Sun™ Graphical User Interfaces were developed by Sun Microsystems, Inc. for its users and licensees. Sun
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Des parties de ce produit pourront être derivées du système UNIX® licencié par Novell, Inc. et du système Berkeley 4.3 BSD licencié par
l’Université de Californie. UNIX est une marque enregistrée aux Etats-Unis et dans d’autres pays, et licenciée exclusivement par X/Open
Company Ltd. Le logiciel détenu par des tiers, et qui comprend la technologie relative aux polices de caractères, est protégé par un copyright et
licencié par des fournisseurs de Sun.
Sun, Sun Microsystems, the Sun logo, AnswerBook2, docs.sun.com, ShowMe How2, Java, Java Coffee Cup logo, Solaris, The Network Is the
Computer, Ultra, Ultra Port Architecture, SunMicrophone, SunVTS, UltraSPARC, OpenBoot, Solstice DiskSuite, et SunOS sont des marques
déposées ou enregistrées de Sun Microsystems, Inc. aux Etats-Unis et dans d’autres pays. Toutes les marques SPARC, utilisées sous licence, sont
des marques déposées ou enregistrées de SPARC International, Inc. aux Etats-Unis et dans d’autres pays. Les produits portant les marques
SPARC sont basés sur une architecture développée par Sun Microsystems, Inc.
Les utilisateurs d’interfaces graphiques OPEN LOOK® et Sun™ ont été développés de Sun Microsystems, Inc. pour ses utilisateurs et licenciés.
Sun reconnaît les efforts de pionniers de Xerox Corporation pour la recherche et le développement du concept des interfaces d’utilisation
visuelle ou graphique pour l’industrie de l’informatique. Sun détient une licence non exclusive de Xerox sur l’interface d’utilisation graphique,
cette licence couvrant aussi les licenciés de Sun qui mettent en place les utilisateurs d’interfaces graphiques OPEN LOOK et qui en outre se
conforment aux licences écrites de Sun.
CETTE PUBLICATION EST FOURNIE "EN L’ETAT" SANS GARANTIE D’AUCUNE SORTE, NI EXPRESSE NI IMPLICITE, Y COMPRIS, ET
SANS QUE CETTE LISTE NE SOIT LIMITATIVE, DES GARANTIES CONCERNANT LA VALEUR MARCHANDE, L’APTITUDE DES
PRODUITS A REPONDRE A UNE UTILISATION PARTICULIERE OU LE FAIT QU’ILS NE SOIENT PAS CONTREFAISANTS DE PRODUITS
DE TIERS.
Please
Recycle
Contents
Preface xix
About the Multimedia Links in This Manual xix
How This Book Is Organized xx
Using UNIX Commands xxi
Typographic Conventions xxii
Shell Prompts xxii
Related Documents xxiii
Ordering Sun Documents xxiv
Sun Welcomes Your Comments xxiv
1. Product Description 1-1

1.1 Feature Overview 1-2
1.2 I/O Devices 1-3
1.3 System Description 1-4
1.4 Replaceable Components 1-6
2. SunVTS Overview 2-1

2.1 SunVTS Description 2-1
2.1.1 SunVTS Requirements 2-2
2.1.2 SunVTS References 2-2
iii
3. Power-On Self-Test 3-1
3.1 POST Overview 3-1
3.2 Pre-POST Preparation 3-2
3.2.1 Setting Up a TIP Connection 3-2
3.2.2 Verifying the Baud Rate 3-4
3.3 Initializing POST 3-5
3.4 Maximum and Minimum POST Levels 3-7
3.4.1 diag-level Variable Set to max 3-7
3.4.2 diag-level Variable Set to min 3-15
3.4.3 POST Progress and Error Reporting 3-19
3.5 Bypassing POST 3-22
3.6 Resetting Variables to Default Settings 3-22
3.7 Initializing Motherboard POST 3-23
4. Troubleshooting Procedures 4-1

4.1 Power-On Failure 4-2
4.2 Video Output Failure 4-3
4.3 Hard Drive or CD-ROM Drive Failure 4-4
4.4 Power Supply Test 4-5
4.5 DIMM Failure 4-7
4.6 OpenBoot PROM On-Board Diagnostics 4-8
4.6.1 Watch-Clock Diagnostic 4-8
4.6.2 Watch-Net and Watch-Net-All Diagnostics 4-8
4.6.3 Probe-IDE Diagnostic 4-10
4.6.4 Test device alias, device path, -All Diagnostic 4-10
4.6.5 UPA Graphics Card 4-12
4.7 OpenBoot Diagnostics 4-13
4.7.1 Starting the OBDiag Menu 4-13
4.7.2 OB Diagnostics 4-17
4.7.2.1 PCI/PCIO Diagnostic 4-18
iv Sun Ultra 10 Service Manual • February 2000

4.7.2.2 EBus DMA/TCR Registers Diagnostic 4-19
4.7.2.3 Ethernet Diagnostic 4-19
4.7.2.4 Keyboard Diagnostic 4-20
4.7.2.5 Mouse Diagnostic 4-21
4.7.2.6 Diskette Drive (Floppy) Diagnostic 4-21
4.7.2.7 Parallel Port Diagnostic 4-22
4.7.2.8 Serial Port A Diagnostic 4-22
4.7.2.9 Serial Port B Diagnostic 4-24
4.7.2.10 NVRAM Diagnostic 4-25
4.7.2.11 Audio Diagnostic 4-25
4.7.2.12 EIDE Diagnostic 4-26
4.7.2.13 Video Diagnostic 4-26
4.7.2.14 All Above Diagnostic 4-27
4.7.3 Exiting the OBDiag Menu 4-30
5. Preparing for Component Replacement 5-1

5.8 Safety Requirements 5-2
5.9 Safety Symbols 5-2
5.10 Safety Precautions 5-3
5.10.1 Modification to Equipment 5-3
5.10.2 Placement of a Sun Product 5-3
5.10.3 Power Cord Connection 5-3
5.10.4 Electrostatic Discharge 5-4
5.10.5 Lithium Battery 5-4
5.11 Tools Required 5-5
5.12 Powering Off the System 5-5
5.13 Removing the System Cover 5-8
5.14 Attaching the Wrist Strap 5-10
5.15 Removing a Filler Panel 5-11
Contents v
6. Major Subassemblies 6-1
6.1 Power Supply 6-1
6.1.1 Removing the Power Supply 6-1
6.1.2 Replacing the Power Supply 6-3
6.2 Cable Assemblies 6-4
6.2.1 Removing the Diskette Drive Cable Assembly 6-4
6.2.2 Replacing the Diskette Drive Cable Assembly 6-6
6.2.3 Removing the Hard Drive Cable Assembly 6-6
6.2.4 Replacing the Hard Drive Cable Assembly 6-7
6.2.5 Removing the Serial/Parallel Cable Assembly 6-8
6.2.6 Replacing the Serial/Parallel Cable Assembly 6-9
6.2.7 Removing the Audio Cable Assembly 6-9
6.2.8 Replacing the Audio Cable Assembly 6-10
6.3 Speaker Assembly 6-11
6.3.1 Removing the Speaker Assembly 6-11
6.3.2 Replacing the Speaker Assembly 6-12
6.4 CPU Fan Assembly 6-13
6.4.1 Removing the CPU Fan Assembly 6-13
6.4.2 Replacing the CPU Fan Assembly 6-14
6.5 Front Bezel 6-15
6.5.1 Removing the Front Bezel 6-15
6.5.2 Replacing the Front Bezel 6-16
6.6 Rear Hard Drive Bracket 6-17
6.6.1 Removing the Read Hard Drive Bracket 6-17
6.6.2 Replacing the Rear Hard Drive Bracket 6-19
7. Storage Devices 7-1

7.1 Diskette Drive 7-1
7.1.1 Removing the Diskette Drive 7-1
7.1.2 Replacing the Diskette Drive 7-2
vi Sun Ultra 10 Service Manual • February 2000

7.2 Hard Drives 7-4
7.2.1 Removing a Hard Drive 7-4
7.2.2 Replacing a Hard Drive 7-6
7.2.3 Hard Drive Mirroring 7-8
7.2.3.1 Hard Drive Mirroring Configuration 7-8
7.2.3.2 Hardware Considerations 7-8
7.2.3.3 Required Software and Patches 7-9
7.2.3.4 Software Constraints 7-10
7.2.3.5 Recovery Procedure for Broken Database Replicas 7-11
7.3 CD-ROM Drive 7-13
7.3.1 Removing a CD-ROM Drive 7-13
7.3.2 Replacing a CD-ROM Drive 7-14
8. Motherboard and Component Replacement 8-1

8.1 CPU Module 8-1
8.1.1 Removing the CPU Module 8-1
8.1.2 Replacing the CPU Module 8-3
8.2 NVRAM/TOD 8-4
8.2.1 Removing the NVRAM/TOD 8-4
8.2.2 Replacing the NVRAM/TOD 8-5
8.3 DIMM 8-6
8.3.1 Removing a DIMM 8-6
8.3.2 Replacing a DIMM 8-8
8.4 Graphics Card 8-9
8.4.1 Removing a Graphics Card 8-9
8.4.2 Replacing a Graphics Card 8-10
8.4.3 Elite3D m3 and Elite3D m6 UPA Graphics Card Patch
Information 8-11
8.5 PCI Card 8-12
8.5.1 Removing a PCI Card 8-12
8.5.2 Replacing a PCI Card 8-13
Contents vii
8.6 PCI Riser Board 8-15
8.6.1 Removing the PCI Riser Board 8-15
8.6.2 Replacing the PCI Riser Board 8-16
8.7 Motherboard 8-17
8.7.1 Removing the Motherboard 8-17
8.7.2 Replacing the Motherboard 8-19
9. Illustrated Parts List 9-1
10. Finishing Replacement Procedures 10-1

10.1 Replacing the System Cover 10-1
10.2 Powering On the System 10-3
A. Product Specifications and Reference Information A-1

A.1 Physical Specifications A-1
A.2 Electrical Specifications A-2
A.3 Modem Setup Specifications A-2
A.3.1 Setting Up the Modem A-2
A.3.2 Serial Port Speed Change A-3
A.3.3 Modem Recommendations A-4
A.3.3.1 Cable A-4
A.3.3.2 Modem Switch Settings (AT Commands) A-4
A.4 Environmental Requirements A-5
A.5 Reference Information A-6
A.5.1 CD-ROM Drive Cabling Configuration A-6
A.5.2 Ultra 10 Hard Drive Cabling Configuration A-7
A.5.3 Hard Drive Cabling Configuration (With Two Mirrored Drives)
A-7
A.5.4 Jumper Settings A-8
A.5.5 CD Handling and Use A-8
A.5.5.1 Inserting a CD into the CD-ROM Drive A-8
A.5.5.2 Ejecting a CD From the CD-ROM Drive A-9
viii Sun Ultra 10 Service Manual • February 2000

A.5.5.3 Cleaning the CD-ROM Drive A-9
A.5.5.4 Handling and Storing CDs A-9
B. Signal Descriptions B-1

B.1 Power Supply Connectors B-2
B.2 Keyboard/Mouse Connector B-4
B.3 Twisted-Pair Ethernet Connector B-5
B.3.1 TPE Cable-Type Connectivity B-6
B.3.2 External UTP-5 Cable Lengths B-6
B.4 Serial Port A Connector B-7
B.5 Serial Port B Connector B-9
B.6 Parallel Port Connector B-10
B.7 Audio Connectors B-12
B.8 Video Connector B-13
C. Functional Description C-1

C.1 System C-1
C.1.1 CPU Module C-3
C.1.2 UPA C-4
C.1.3 PCI-IDE Interface C-4
C.1.3.1 Primary PCI Bus C-5
C.1.3.2 Secondary PCI Buses C-5
C.1.3.3 APB ASIC C-5
C.1.3.4 PCIO ASIC C-5
C.1.3.5 10-/100-Mbit Ethernet C-5
C.1.3.6 EBus2 Interface C-6
C.1.3.7 EIDE Interface C-7
C.1.3.8 PCI-Based Graphics C-9
C.1.4 Memory Architecture C-10
C.1.4.1 DIMM Memory Configuration C-12
C.1.4.2 DIMM Characteristics C-12
C.1.4.3 Memory Address Assignment C-13
Contents ix
C.1.4.4 Transceivers C-14
C.1.5 PCI Riser Board C-14
C.1.5.1 Connector Definition C-15
C.1.5.2 PCI Riser Board Pin Assignment C-15
C.1.6 ASICs C-19
C.1.6.1 APB C-19
C.1.6.2 PCIO C-19
C.1.6.3 RISC C-20
C.1.7 EBus2 Devices C-21
C.1.7.1 SuperIO C-22
C.1.7.2 Serial Communications Controller C-23
C.1.7.3 Flash PROM C-23
C.1.7.4 NVRAM/TOD C-24
C.1.7.5 Audio C-24
C.1.8 Power and Standby Switching C-26
C.1.8.1 Power Switch C-26
C.1.8.2 Keyboard Standby or Power Key C-26
C.1.8.3 Front Panel Standby Switch C-26
C.2 Clocking C-27
C.2.1 CPU and UPA Clocking C-27
C.2.2 PCI Clock Generation C-27
C.3 Address Mapping C-29
C.3.1 Port Allocations C-29
C.3.2 UPA Graphics Address Assignments C-30
C.3.3 PCI Address Assignments C-31
C.3.3.1 PCI Bus A Address Assignments C-31
C.3.3.2 PCI Bus B Address Assignments C-31
C.4 Interrupts C-32
C.5 Power C-36
C.5.1 Onboard Voltage Regulator C-36
C.5.2 Power Supply Memory C-36
x Sun Ultra 10 Service Manual • February 2000

C.5.3 Power Management C-36
C.6 Motherboard C-37
C.7 Jumper Descriptions C-38
C.7.1 Serial Port Jumpers C-39
C.7.2 Flash PROM Jumpers C-39
C.8 Enclosure C-40
D. Software Notes D-1

D.1 PGX24 8- or 24-Bit Graphics D-1
D.1.1 What Does 8-Bit or 24-Bit Frame Buffer Refer To? D-1
D.1.2 The Difference Between 8-Bit Mode and 24-Bit Mode on Ultra 5
Onboard Graphics D-2
D.1.3 How to Install PGX24 Graphics Software on Solaris 2.5.1 HW:11/
97 D-2
D.1.4 How to Install PGX24 Graphics Software on Solaris 2.6 5/98 D-3
D.1.5 Which Mode is Running D-4
D.1.6 Changing From One Mode to the Other D-4
D.2 Solaris 2.5.1 and 2.6 Software Upgrades for Systems Faster Than 420 MHz
D-5
Glossary Glossary-1
Contents xi
xii Sun Ultra 10 Service Manual • February 2000
Figures
FIGURE 1-1 Ultra 10 Minitower System 1-2
FIGURE 1-2 Ultra 10 System Front View 1-5
FIGURE 1-3 Ultra 10 System Back View 1-5
FIGURE 3-1 Setting Up a TIP Connection 3-2
FIGURE 3-2 Sun Type-5 Keyboard 3-5
FIGURE 3-3 Sun I/O Type-6 Keyboard 3-6
FIGURE 4-1 Power Supply Connector J17 Pin Configuration 4-6
FIGURE 5-2 System Standby Switch 5-6
FIGURE 5-5 System Power Switch 5-7
FIGURE 5-6 Removing and Replacing the System Cover 5-9
FIGURE 5-7 Attaching the Wrist Strap to the Chassis 5-10
FIGURE 5-8 Removing a Plastic Filler Panel 5-12
FIGURE 5-9 Removing a Metal Filler Panel 5-13
FIGURE 6-1 Removing and Replacing the Power Supply 6-2
FIGURE 6-2 Removing and Replacing the Diskette Drive Cable Assembly 6-5
FIGURE 6-3 Removing and Replacing the Hard Drive Cable Assembly 6-7
FIGURE 6-4 Removing and Replacing the Serial/Parallel Cable Assembly 6-8
xiii
FIGURE 6-5 Removing and Replacing the Audio Cable 6-10
FIGURE 6-6 Removing and Replacing the Speaker Assembly 6-12
FIGURE 6-7 Removing and Replacing the CPU Fan Assembly 6-14
FIGURE 6-8 Removing and Replacing the Front Bezel 6-16
FIGURE 6-9 Removing and Replacing the Rear Hard Drive Bracket 6-18
FIGURE 7-1 Removing and Replacing the Diskette Drive 7-2
FIGURE 7-2 Removing and Replacing a Primary Hard Drive (Chassis Rear) 7-5
FIGURE 7-3 Removing and Replacing a Secondary Hard Drive (Chassis Front) 7-6
FIGURE 7-4 Hard Drive Mirroring Configuration 7-8
FIGURE 7-5 Removing and Replacing a CD-ROM Drive 7-14
FIGURE 8-1 Removing and Replacing the CPU Module 8-3
FIGURE 8-2 Removing and Replacing the NVRAM/TOD 8-5
FIGURE 8-3 Removing and Replacing a DIMM 8-7
FIGURE 8-4 Removing and Replacing the Graphics Card 8-10
FIGURE 8-5 Removing and Replacing the PCI Card 8-13
FIGURE 8-6 Removing and Replacing the PCI Riser Board 8-16
FIGURE 8-7 Removing and Replacing the Motherboard 8-19
FIGURE 8-8 Identifying Jumper Pins 8-20
FIGURE 9-1 Ultra 10 System Exploded View 9-3
FIGURE 10-1 Removing and Replacing the System Cover 10-2
FIGURE 10-2 System Power Switch 10-3
FIGURE 10-3 System Standby Switch 10-4
FIGURE A-1 CD-ROM Drive Cabling Configuration A-6
FIGURE A-2 Ultra 10 Hard Drive Cabling Configuration A-7
FIGURE A-3 Hard Drive Mirroring Configuration A-7
FIGURE B-1 Power Supply Connector J12 Pin Configuration B-2
xiv Sun Ultra 10 Service Manual • February 2000

FIGURE B-2 Keyboard/Mouse Connector Pin Configuration B-4
FIGURE B-3 TPE Connector Pin Configuration B-5
FIGURE B-4 Serial Port A Connector Pin Configuration B-7
FIGURE B-5 Serial Port B Connector Pin Configuration B-9
FIGURE B-6 Parallel Port Connector Pin Configuration B-10
FIGURE B-7 Audio Connector Configuration B-12
FIGURE B-8 Video Connector Pin Configuration B-13
FIGURE C-1 System Functional Block Diagram C-2
FIGURE C-2 UPA Graphics Functional Block Diagram C-4
FIGURE C-3 10-/100-Mbit Ethernet Functional Block Diagram C-6
FIGURE C-4 EIDE Interface Functional Block Diagram C-7
FIGURE C-5 EIDE Cable Labeling C-8
FIGURE C-6 Supported Ultra 10 Configuration C-8
FIGURE C-7 PCI-Based Graphics Functional Block Diagram (PGX) C-9
FIGURE C-8 PCI-Based Graphics Functional Block Diagram (PGX24) C-9
FIGURE C-9 Memory Interface Functional Block Diagram C-11
FIGURE C-10 System Reset Functional Block Diagram C-21
FIGURE C-11 Standard Serial Port Functional Block Diagram C-22
FIGURE C-12 Communications Controller Serial Ports Functional Block Diagram C-23
FIGURE C-13 NVRAM/TOD Functional Block Diagram C-24
FIGURE C-14 Audio Circuit Functional Block Diagram C-25
FIGURE C-15 Interrupt Scheme Block Diagram C-33
FIGURE C-16 Motherboard Block Diagram C-37
FIGURE C-17 Selected Jumper Settings C-38
FIGURE C-18 Identifying Jumper Pins C-38
FIGURE C-19 JP3/JP4 Jumper Settings for RS-423 Interface C-39
FIGURE C-20 JP1/JP2 Jumper Settings for the Flash PROM C-40
Figures xv
xvi Sun Ultra 10 Service Manual • February 2000
Tables
TABLE P-1 Document Organization xx
TABLE P-2 Typographic Conventions xxii
TABLE P-3 Shell Prompts xxii
TABLE P-4 Related Documents xxiii
TABLE 1-1 Supported I/O Devices 1-3
TABLE 1-2 Ultra 10 System Physical Dimensions 1-4
TABLE 1-3 Ultra 10 System Replaceable Components 1-6
TABLE 2-1 SunVTS Documentation 2-3
TABLE 3-1 Keyboard LED Error Indication Patterns 3-19
TABLE 4-1 Internal Drives Identification 4-4
TABLE 4-2 Power Supply Connector J17 Pin Assignments 4-6
TABLE 4-3 DIMM Physical Memory Address 4-7
TABLE 4-4 Selected OBP On-Board Diagnostic Tests 4-11
TABLE 8-1 DIMM Banks and Slot Pairs 8-6
TABLE 8-2 Serial Port Jumper Settings 8-20
TABLE 9-1 Ultra 10 System Replaceable Components 9-3
TABLE A-1 Ultra 10 Physical Specifications A-1
TABLE A-2 Ultra 10 SystemElectrical Specifications A-2
TABLE A-3 Ultra 10 System Environmental Requirements A-5
TABLE B-1 Power Supply Connector J12 Pin Assignments B-2
xvii
TABLE B-2 Keyboard/Mouse Connector Pin Assignments B-4
TABLE B-3 TPE Connector Pin Assignments B-5
TABLE B-4 TPE UTP-5 Cables B-6
TABLE B-5 Serial Port A Connector Pin Assignments B-7
TABLE B-6 Serial Port B Connector Pin Assignments B-9
TABLE B-7 Parallel Port Connector Pin Assignments B-10
TABLE B-8 Audio Connector Line Assignment B-12
TABLE B-9 Video Connector Pin Assignments B-13
TABLE C-1 Ultra 10 CPU Module Cache and SRAM C-3
TABLE C-2 Memory DIMM Configuration C-12
TABLE C-3 PA Map Into RASx_L Signals C-13
TABLE C-4 Memory Address Range Based on Installed DIMMs C-13
TABLE C-5 PCI Riser Board Pin Summary C-15
TABLE C-6 PCI Riser Board Pin Assignment C-15
TABLE C-7 Audio Input Electrical Specification C-25
TABLE C-8 Audio Output Electrical Specification C-25
TABLE C-9 PCI Clocks C-27
TABLE C-10 PCI Clock Generator Frequency Select (ICW48C60-422G) C-28
TABLE C-11 PCI Clock Generator Frequency Select (CY2254A-2) C-28
TABLE C-12 Port Allocations C-29
TABLE C-13 UPA Address Space C-30
TABLE C-14 CPU Module Internal CSR Space C-30
TABLE C-15 PCI Address Assignments C-31
TABLE C-16 Boot PROM/Flash PROM Address Assignments C-32
TABLE C-17 Interrupt Routing C-33
TABLE C-18 Serial Port Jumper Settings C-39
TABLE C-19 Flash PROM Jumper Settings C-40
xviii Sun Ultra 10 Service Manual • February 2000

Preface
The Sun Ultra 10 Service Manual provides detailed procedures that describe the
removal and replacement of replaceable parts in the Sun™ Ultra™ 10 systems. The
service manual also includes information about the use and maintenance of the
systems. This manual is written for technicians, system administrators, authorized
service providers (ASPs), and advanced computer system end users who have
experience in troubleshooting and replacing hardware.
About the Multimedia Links in This

Manual
Removal and replacement procedures for selected system components are also
illustrated with interactive multimedia audio and video instructions in the Sun
Ultra 10 ShowMe How2 multimedia documentation, which is linked to the online
version of this manual. These multimedia links can be accessed wherever you see
the following film-clip symbol:
Preface xix
How This Book Is Organized
This document is organized into chapters and appendixes as listed in the following
table. A glossary is also included.
TABLE P-1 Document Organization
Chapter Content Description
“Regulatory Compliance Statements and Provides regulatory compliance statements and the declaration
Declaration of Conformity,” page xxv of conformity for the product.
“Safety Agency Compliance Statements,” Provides safety agency compliance statements.
page xxix
Chapter 1, “Product Description” Describes the major components of the system.
Chapter 2, “SunVTS Overview” Describes the execution of individual tests for verifying
hardware configuration and functionality.
Chapter 3, “Power-On Self-Test” Describes the execution of POST and provides examples of POST
output patterns.
Chapter 4, “Troubleshooting Procedures” Provides troubleshooting advice and suggested corrective
actions for hardware problems.
Chapter 5, “Preparing For Component Explains how to work safely when replacing system
Replacement” components. Provides procedures for powering off the system,
removing the system cover, and attaching the wrist strap.
Chapter 6, “Major Subassemblies” Provides procedures for removing and replacing major
subassemblies.
Chapter 7, “Storage Devices” Provides procedures for removing and replacing storage devices.
Chapter 8, “Motherboard and Component Provides procedures for removing and replacing the
Replacement” motherboard and various components associated with
motherboard operation.
Chapter 9, “Illustrated Parts List” Lists replaceable parts for the system.
Chapter 10, “Finishing Component Provides procedures for replacing the system cover and
Replacement” powering on the system.
Appendix A, “Product Specifications” Provides specifications on power and environment, system
dimensions, weight, memory mapping, and peripheral
component interconnect (PCI) card slots.
xx Sun Ultra 10 Service Manual • February 2000

TABLE P-1 Document Organization (Continued)
Chapter Content Description
Appendix B, “Signal Descriptions” Provides signal descriptions, instructions for connecting the
system unit to a 10BASE-T/100BASE-T twisted-pair Ethernet
(TPE) local area network (LAN), and modem settings for systems
used in specific network telecommunication applications.
Appendix C, “Functional Description” Provides functional descriptions of the system.
Appendix D, “Software Notes” Identifies software issues.
Using UNIX Commands

For complete information on basic UNIX™ commands and procedures such as
shutting down the system, booting the system, and configuring devices, refer to the
following:
■ Solaris Handbook for Sun Peripherals
■ AnswerBook2™ online documentation for the Solaris ™software environment
■ Other software documentation that you received with your system
Preface xxi
Typographic Conventions
Typographic conventions used in this manual are listed in the following table.
TABLE P-2 Typographic Conventions
Typeface or
Symbol Meaning Examples
AaBbCc123 The names of commands, files, Edit your .login file.

and directories; on-screen Use ls -a to list all files.
computer output. % You have mail.
AaBbCc123 What you type, when % su
contrasted with on-screen Password:
computer output.
AaBbCc123 Book titles, new words or Read Chapter 6 in the User’s Guide.
terms, words to be emphasized. These are called class options.
Command-line variable; You must be root to do this.
replace with a real name or To delete a file, type rm filename.
value.
Shell Prompts
The following table lists the default system prompt and superuser prompt for the C
shell, Bourne shell, and Korn shell.
TABLE P-3 Shell Prompts
Shell Prompt
C shell machine_name%
C shell superuser machine_name#
Bourne shell and Korn shell $
Bourne shell and Korn shell #
superuser
xxii Sun Ultra 10 Service Manual • February 2000

Related Documents
Additional information for servicing the system are listed in the following table.
Some of these documents are also available online on the Solaris on Sun Hardware
AnswerBook2.
TABLE P-4 Related Documents
Application Title Part Number
Configuration Solaris Handbook for Sun Peripherals 805-4440
Configuration Solaris Handbook for Sun Frame Buffers 805-4441
Installation Sun Ultra 5/Ultra 10 CD-ROM Drive and 805-7115

Hard Drive Installation Guide
Software notes, Getting Started with the Sun Ultra 10 805-0162
preinstalled Hardware and Software
software
Specification 17-Inch Entry, 17-Inch Premium, and 802-6178
20-Inch Premium Color Monitors Specifications
Specification Diskette Drive Specification 802-6285
Preface xxiii
Ordering Sun Documents
The docs.sun.com web site enables you to access Sun technical documentation on
the web. You can browse the docs.sun.com archive or search for a specific book title
or subject at:
http://docs.sun.com
Sun Welcomes Your Comments

We are interested in improving our documentation and welcome your comments
and suggestions. You can email your comments to us at:
docfeedback@sun.com
Please include the part number of your document in the subject line of your email.
xxiv Sun Ultra 10 Service Manual • February 2000

Regulatory Compliance Statements and Declaration of
Conformity
Your Sun product is marked to indicate its compliance class:
• Federal Communications Commission (FCC) — USA
• Industry Canada Equipment Standard for Digital Equipment (ICES-003) - Canada
• Voluntary Control Council for Interference (VCCI) — Japan
• Bureau of Standards Metrology and Inspection (BSMI) - Taiwan
Please read the sections that correspond to the marking on your Sun product before attempting to install the product.
FCC Class A Notice

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired operation.
Note: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment
is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy, and if it is
not installed and used in accordance with the instruction manual, it may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference, in which case the user will be required
to correct the interference at his own expense.
Shielded Cables: Connections between the workstation and peripherals must be made using shielded cables to comply
with FCC radio frequency emission limits. Networking connections can be made using unshielded twisted-pair (UTP) cables.
Modifications: Any modifications made to this device that are not approved by Sun Microsystems, Inc. may void the
authority granted to the user by the FCC to operate this equipment.
FCC Class B Notice

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee
that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/television technician for help.
Shielded Cables: Connections between the workstation and peripherals must be made using shielded cables in order to
maintain compliance with FCC radio frequency emission limits. Networking connections can be made using unshielded
twisted pair (UTP) cables.
Modifications: Any modifications made to this device that are not approved by Sun Microsystems, Inc. may void the
authority granted to the user by the FCC to operate this equipment.
xxv
ICES-003 Class A Notice - Avis NMB-003, Classe A
This Class A digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe A est conforme à la norme NMB-003 du Canada.
ICES-003 Class B Notice - Avis NMB-003, Classe B

This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.
xxvi Sun Ultra 10 Service Manual • February 2000

BSMI Class A Notice
The following statement is applicable to products shipped to Taiwan and marked as Class A on the product compliance
label.
Agency Compliance
The system complies with international and domestic regulatory requirements for safety, ergonomics, and electromagnetic
compatibility. When installed and operated in accordance with this service manual, the EMC class marked on your system
label remains the same.
German Acoustic Compliance

ACHTUNG: Der arbeitsplatzbezogenr Schalldruckpegel nach DIN 45 635.
Teil 1000 beträgt 70 Db(A) order weniger.
Declaration of Conformity
The declaration of conformity for the Sun Ultra 10 product is on the following page.
xxvii
Declaration of Conformity
Compliance ID: 201
Product Name: Sun Ultra 10 Family
This product has been tested and complies with:
EMC
USA —FCC Class B
European Union—EC
This equipment complies with the following requirements of the EMC Directive 89/336/EEC
EN55022 / CISPR22 (1985) Class B
EN50082-1 IEC801-2 (1991) 4 kV (Direct), 8 kV (Air)
IEC801-3 (1984) 3 V/m
IEC801-4 (1988) 1.0 kV Power Lines, 0.5 kV Signal Lines
EN61000-3-2/IEC1000-3-2(1994) Pass
Safety
This equipment complies with the following requirements of the Low Voltage Directive 73/23/EEC:
EC Type Examination Certificates:
EN60950/IEC950 (1993)
EN60950 w/ Nordic Deviations
Supplementary Information
This product was tested and complies with all the requirements for the CE Mark.
/S/ /S/
Dennis P. Symanski DATE John Shades DATE
Manager, Product Compliance Quality Assurance Manager
Sun Microsystems, Inc. Sun Microsystems Scotland, Limited

901 San Antonio Road, M/S UMPK15-102 Springfield, Linlithgow
Palo Alto, CA 94303, USA West Lothian, EH49 7LR
Tel: 650-786-3255 Scotland, United Kingdom
Fax: 650-786-3723 Tel: 0506 670000
Fax: 0506 760011
xxviii Sun Ultra 10 Service Manual • February 2000

Depending on the type of power switch your device has,
Safety Agency Compliance one of the following symbols may be used:
Statements
Off - Removes AC power from the system.
Read this section before beginning any procedure. The

following text provides safety precautions to follow when Standby – The On/Standby switch is in the
installing a Sun Microsystems product. standby position.
Safety Precautions
For your protection, observe the following safety Modifications to Equipment
precautions when setting up your equipment:
Do not make mechanical or electrical modifications to the
■ Follow all cautions and instructions marked on the equipment. Sun Microsystems is not responsible for
equipment. regulatory compliance of a modified Sun product.
■ Ensure that the voltage and frequency of your power
source match the voltage and frequency inscribed on
the equipment’s electrical rating label. Placement of a Sun Product
■ Never push objects of any kind through openings in
the equipment. Dangerous voltages may be present. Caution – Do not block or cover the openings
Conductive foreign objects could produce a short of your Sun product. Never place a Sun
circuit that could cause fire, electric shock, or damage
product near a radiator or heat register.
to your equipment.
Failure to follow these guidelines can cause
overheating and affect the reliability of your
Symbols Sun product.
The following symbols may appear in this book:
Caution – There is risk of personal injury and Caution – The workplace-dependent noise
equipment damage. Follow the instructions. level defined in DIN 45 635 Part 1000 must be
70Db(A) or less.
SELV Compliance
Caution – Hot surface. Avoid contact. Surfaces
Safety status of I/O connections comply to SELV
are hot and may cause personal injury if
requirements.
touched.
Caution – Hazardous voltages are present. To

reduce the risk of electric shock and danger to
personal health, follow the instructions.
On – Applies AC power to the system.
xxix
Power Cord Connection Lithium Battery
Caution – Sun products are designed to work Caution – On Sun CPU boards, there is a
with single-phase power systems having a lithium battery molded into the real-time
grounded neutral conductor. To reduce the clock, SGS No. MK48T59Y, MK48TXXB-XX,
risk of electric shock, do not plug Sun MK48T18-XXXPCZ, M48T59W-XXXPCZ, or
products into any other type of power system. MK48T08. Batteries are not customer
Contact your facilities manager or a qualified replaceable parts. They may explode if
electrician if you are not sure what type of mishandled. Do not dispose of the battery in
power is supplied to your building. fire. Do not disassemble it or attempt to
recharge it.
Caution – Not all power cords have the same

Battery Pack
current ratings. Household extension cords do
not have overload protection and are not
meant for use with computer systems. Do not Caution – There is a sealed lead acid battery
use household extension cords with your Sun in Ultra 10 units. Portable Energy Products
product. No. TLC02V50. There is danger of explosion if
the battery pack is mishandled or incorrectly
replaced. Replace only with the same type of
Sun Microsystems battery pack. Do not
Caution – Your Sun product is shipped with a
disassemble it or attempt to recharge it
grounding type (three-wire) power cord. To
outside the system. Do not dispose of the
reduce the risk of electric shock, always plug
battery in fire. Dispose of the battery properly
the cord into a grounded power outlet.
in accordance with local regulations.
The following caution applies only to devices with a

Standby power switch: System Unit Cover
You must remove the cover of your Sun computer system
Caution – The power switch of this product unit to add cards, memory, or internal storage devices. Be
functions as a standby type device o sure to replace the top cover before powering on your
nly. The power cord serves as the primary computer system.
disconnect device for the system. Be sure to
plug the power cord into a grounded power
Caution – Do not operate Sun products
outlet that is nearby the system and is readily
without the top cover in place. Failure to take
accessible. Do not connect the power cord
this precaution may result in personal injury
when the power supply has been removed
and system damage.
from the system chassis.
Laser Compliance Notice

Sun products that use laser technology comply with Class 1
laser requirements.
xxx Sun Ultra 10 Service Manual • February 2000

Achtung – Gefahr von Verletzung und
Geräteschaden. Befolgen Sie die
Class 1 Laser Product Anweisungen.
Luokan 1 Laserlaite
Klasse 1 Laser Apparat
Laser KLasse 1
Achtung – Hohe Temperatur. Nicht berühren,
da Verletzungsgefahr durch heiße Oberfläche
besteht.
CD-ROM
Caution – Use of controls, adjustments, or the Achtung – Gefährliche Spannungen.

performance of procedures other than those Anweisungen befolgen, um Stromschläge und
specified herein may result in hazardous Verletzungen zu vermeiden.
radiation exposure.
Ein – Setzt das System unter Wechselstrom.

Einhaltung sicherheitsbehördlicher
Vorschriften
Auf dieser Seite werden Sicherheitsrichtlinien beschrieben,
Je nach Netzschaltertyp an Ihrem Gerät kann eines der
die bei der Installation von Sun-Produkten zu beachten
folgenden Symbole benutzt werden:
sind.
Sicherheitsvorkehrungen Aus – Unterbricht die Wechselstromzufuhr

zum Gerät.
Treffen Sie zu Ihrem eigenen Schutz die folgenden
Sicherheitsvorkehrungen, wenn Sie Ihr Gerät installieren:
■ Beachten Sie alle auf den Geräten angebrachten
Warnhinweise und Anweisungen.
Wartezustand (Stand-by-Position) - Der Ein-/
■ Vergewissern Sie sich, daß Spannung und Frequenz
Wartezustand-Schalter steht auf
Ihrer Stromquelle mit der Spannung und Frequenz
übereinstimmen, die auf dem Etikett mit den Wartezustand. Änderungen an Sun-Geräten.
elektrischen Nennwerten des Geräts angegeben sind.
■ Stecken Sie auf keinen Fall irgendwelche Gegenstände Nehmen Sie keine mechanischen oder elektrischen
in Öffnungen in den Geräten. Leitfähige Gegenstände Änderungen an den Geräten vor. Sun Microsystems,
könnten aufgrund der möglicherweise vorliegenden übernimmt bei einem Sun-Produkt, das geändert wurde,
gefährlichen Spannungen einen Kurzschluß keine Verantwortung für die Einhaltung behördlicher
verursachen, der einen Brand, Stromschlag oder Vorschriften
Geräteschaden herbeiführen kann.
Symbole
Die Symbole in diesem Handbuch haben folgende
Bedeutung:
xxxi
Aufstellung von Sun-Geräten Die folgende Warnung gilt nur für Geräte mit
Wartezustand-Netzschalter:
Achtung – Um den zuverlässigen Betrieb Ihres

Sun-Geräts zu gewährleisten und es vor Achtung – Der Ein/Aus-Schalter dieses Geräts
Überhitzung zu schützen, dürfen die schaltet nur auf Wartezustand (Stand-By-
Öffnungen im Gerät nicht blockiert oder Modus). Um die Stromzufuhr zum Gerät
verdeckt werden. Sun-Produkte sollten vollständig zu unterbrechen, müssen Sie das
niemals in der Nähe von Heizkörpern oder Netzkabel von der Steckdose abziehen.
Heizluftklappen aufgestellt werden. Schließen Sie den Stecker des Netzkabels an
eine in der Nähe befindliche, frei zugängliche,
geerdete Netzsteckdose an. Schließen Sie das
Netzkabel nicht an, wenn das Netzteil aus der
Achtung – Der arbeitsplatzbezogene
Systemeinheit entfernt wurde.
Schalldruckpegel nach DIN 45 635 Teil 1000
beträgt 70Db(A) oder weniger.
Lithiumbatterie
Einhaltung der SELV-Richtlinien
Die Sicherung der I/O-Verbindungen entspricht den Achtung – CPU-Karten von Sun verfügen
Anforderungen der SELV-Spezifikation. über eine Echtzeituhr mit integrierter
Lithiumbatterie (Teile-Nr. MK48T59Y,
MK48TXXB-XX, MK48T18-XXXPCZ,
Anschluß des Netzkabels M48T59W-XXXPCZ, oder MK48T08). Diese
Batterie darf nur von einem qualifizierten
Achtung – Sun-Produkte sind für den Betrieb Servicetechniker ausgewechselt werden, da sie
an Einphasen-Stromnetzen mit geerdetem bei falscher Handhabung explodieren kann.
Nulleiter vorgesehen. Um die Werfen Sie die Batterie nicht ins Feuer.
Stromschlaggefahr zu reduzieren, schließen Versuchen Sie auf keinen Fall, die Batterie
Sie Sun-Produkte nicht an andere auszubauen oder wiederaufzuladen.
Stromquellen an. Ihr Betriebsleiter oder ein
qualifizierter Elektriker kann Ihnen die Daten
zur Stromversorgung in Ihrem Gebäude Batterien
geben.
Achtung – Die Geräte Ultra 10 enthalten
auslaufsichere Bleiakkumulatoren. Produkt-
Achtung – Nicht alle Netzkabel haben die Nr. TLC02V50 für portable Stromversorgung.
gleichen Nennwerte. Herkömmliche, im Werden bei der Behandlung oder beim
Haushalt verwendete Verlängerungskabel Austausch der Batterie Fehler gemacht,
besitzen keinen Überlastungsschutz und sind besteht Explosionsgefahr. Batterie nur gegen
daher für Computersysteme nicht geeignet. Batterien gleichen Typs von Sun Microsystems
austauschen. Nicht demontieren und nicht
versuchen, die Batterie außerhalb des Geräts
zu laden. Batterie nicht ins Feuer werfen.
Achtung – Ihr Sun-Gerät wird mit einem Ordnungsgemäß entsprechend den vor Ort
dreiadrigen Netzkabel für geerdete geltenden Vorschriften entsorgen.
Netzsteckdosen geliefert. Um die Gefahr eines
Stromschlags zu reduzieren, schließen Sie das
Kabel nur an eine fachgerecht verlegte, Gehäuseabdeckung
geerdete Steckdose an. Sie müssen die obere Abdeckung Ihres Sun-Systems
entfernen, um interne Komponenten wie Karten,
xxxii Sun Ultra 10 Service Manual • February 2000

Speicherchips oder Massenspeicher hinzuzufügen. Bringen produire un court-circuit qui entraînerait des
Sie die obere Gehäuseabdeckung wieder an, bevor Sie Ihr flammes, des risques d’électrocution ou des dégâts
System einschalten. matériels.
Achtung – Bei Betrieb des Systems ohne obere

Symboles
Abdeckung besteht die Gefahr von Vous trouverez ci-dessous la signification des différents
Stromschlag und Systemschäden. symboles utilisés :
Attention: – risques de blessures corporelles et

Einhaltung der Richtlinien für Laser de dégâts matériels. Veuillez suivre les
Sun-Produkte, die mit Laser-Technologie arbeiten, instructions.
entsprechen den Anforderungen der Laser Klasse 1.
Attention: – surface à température élevée.

Evitez le contact. La température des surfaces
Class 1 Laser Product est élevée et leur contact peut provoquer des
Luokan 1 Laserlaite blessures corporelles.
Laser KLasse 1
Attention: – présence de tensions

dangereuses. Pour éviter les risques
CD-ROM d’électrocution et de danger pour la santé
physique, veuillez suivre les instructions.
Warnung – Die Verwendung von anderen

Steuerungen und Einstellungen oder die
Durchfhrung von Prozeduren, die von den MARCHE – Vot re système est sous tension
hier beschriebenen abweichen, knnen (courant alternatif).
gefhrliche Strahlungen zur Folge haben.
Un des symboles suivants sera peut-être utilisé en fonction

Conformité aux normes de sécurité du type d'interrupteur de votre système:
Ce texte traite des mesures de sécurité qu’il convient de

prendre pour l’installation d’un produit Sun Microsystems. ARRET - Votre système est hors tension
(courant alternatif).
Mesures de sécurité
Pour votre protection, veuillez prendre les précautions
suivantes pendant l’installation du matériel :
VEILLEUSE – L'interrupteur Marche/
■ Suivre tous les avertissements et toutes les Veilleuse est en position « Veilleuse ».
instructions inscrites sur le matériel.
■ Vérifier que la tension et la fréquence de la source
d’alimentation électrique correspondent à la tension et
à la fréquence indiquées sur l’étiquette de Modification du matériel
classification de l’appareil.
Ne pas apporter de modification mécanique ou électrique
■ Ne jamais introduire d’objets quels qu’ils soient dans
une des ouvertures de l’appareil. Vous pourriez vous au matériel. Sun Microsystems n’est pas responsable de la
trouver en présence de hautes tensions dangereuses. conformité réglementaire d’un produit Sun qui a été
Tout objet conducteur introduit de la sorte pourrait modifié.
xxxiii
Positionnement d’un produit Sun
Attention: – tous les cordons d’alimentation
n’ont pas forcément la même puissance
Attention: – pour assurer le bon
nominale en matière de courant. Les rallonges
fonctionnement de votre produit Sun et pour
d’usage domestique n’offrent pas de
l’empêcher de surchauffer, il convient de ne
protection contre les surcharges et ne sont pas
pas obstruer ni recouvrir les ouvertures
prévues pour les systèmes d’ordinateurs. Ne
prévues dans l’appareil. Un produit Sun ne
pas utiliser de rallonge d’usage domestique
doit jamais être placé à proximité d’un
avec votre produit Sun.
radiateur ou d’une source de chaleur.
Attention: – votre produit Sun a été livré

Attention: – Le niveau de pression acoustique
équipé d’un cordon d’alimentation à trois fils
au poste de travail s'élève selon la norme DIN
(avec prise de terre). Pour écarter tout risque
45 635 section 1000, à 70 dB (A) ou moins.
d’électrocution, branchez toujours ce cordon
dans une prise mise à la terre.
Conformité SELV
L'avertissement suivant s'applique uniquement aux
Sécurité : les raccordements E/S sont conformes aux
systèmes équipés d'un interrupteur VEILLEUSE:
normes SELV.
Connexion du cordon d’alimentation Attention: – le commutateur d’alimentation de

ce produit fonctionne comme un dispositif de
mise en veille uniquement. C’est la prise
Attention: – les produits Sun sont conçus pour d’alimentation qui sert à mettre le produit
fonctionner avec des alimentations hors tension. Veillez donc à installer le produit
monophasées munies d’un conducteur neutre à proximité d’une prise murale facilement
mis à la terre. Pour écarter les risques accessible. Ne connectez pas la prise
d’électrocution, ne pas brancher de produit d’alimentation lorsque le châssis du système
Sun dans un autre type d’alimentation secteur. n’est plus alimenté.
En cas de doute quant au type d’alimentation
électrique du local, veuillez vous adresser au
directeur de l’exploitation ou à un électricien Batterie au lithium
qualifié.
Attention: – sur les cartes CPU Sun, une

batterie au lithium (référence MK48T59Y,
MK48TXXB-XX, MK48T18-XXXPCZ,
M48T59W-XXXPCZ, ou MK48T08.) a été
moulée dans l’horloge temps réel SGS. Les
batteries ne sont pas des pièces remplaçables
par le client. Elles risquent d’exploser en cas
de mauvais traitement. Ne pas jeter la batterie
au feu. Ne pas la démonter ni tenter de la
recharger.
xxxiv Sun Ultra 10 Service Manual • February 2000

Bloc-batterie CD-ROM
Attention: – Les unités Ultra 10 contiennent Attention: – L’utilisation de contrôles, de

une batterie étanche au plomb (produits réglages ou de performances de procédures
énergétiques portatifs n˚TLC02V50). Il existe autre que celle spécifiée dans le présent
un risque d’explosion si ce bloc-batterie est document peut provoquer une exposition à
manipulé de façon erronée ou mal mis en des radiations dangereuses.
place. Ne remplacez ce bloc que par un bloc-
batterie Sun Microsystems du même type. Ne
le démontez pas et n’essayez pas de le Normativas de seguridad
recharger hors du système. Ne faites pas
brûler la batterie mais mettez-la au rebut El siguiente texto incluye las medidas de seguridad que se
conformément aux réglementations locales en deben seguir cuando se instale algún producto de Sun
vigueur. Microsystems.
Precauciones de seguridad
Couvercle Para su protección observe las siguientes medidas de
Pour ajouter des cartes, de la mémoire, ou des unités de seguridad cuando manipule su equipo:
stockage internes, vous devrez démonter le couvercle de
■ Siga todas los avisos e instrucciones marcados en el
l’unité système Sun. Ne pas oublier de remettre ce couvercle
equipo.
en place avant de mettre le système sous tension.
■ Asegúrese de que el voltaje y la frecuencia de la red
eléctrica concuerdan con las descritas en las etiquetas
Attention: – il est dangereux de faire de especificaciones eléctricas del equipo.
fonctionner un produit Sun sans le couvercle ■ No introduzca nunca objetos de ningún tipo a través
en place. Si l’on néglige cette précaution, on de los orificios del equipo. Pueden haber voltajes
encourt des risques de blessures corporelles et peligrosos. Los objetos extraños conductores de la
de dégâts matériels. electricidad pueden producir cortocircuitos que
provoquen un incendio, descargas eléctricas o daños
en el equipo.
Conformité aux certifications Laser
Les produits Sun qui font appel aux technologies lasers sont Símbolos
conformes aux normes de la classe 1 en la matière. En este libro aparecen los siguientes símbolos:
Precaución – Existe el riesgo de lesiones

personales y daños al equipo. Siga las
Class 1 Laser Product instrucciones.
Luokan 1 Laserlaite
Laser KLasse 1
Precaución – Superficie caliente. Evite el
contacto. Las superficies están calientes y
pueden causar daños personales si se tocan.
xxxv
Precaución – Voltaje peligroso presente. Para Cumplimiento de la normativa SELV
reducir el riesgo de descarga y daños para la El estado de la seguridad de las conexiones de entrada/
salud siga las instrucciones. salida cumple los requisitos de la normativa SELV.
Conexión del cable de alimentación eléctrica

Encendido – Aplica la alimentación de CA al
sistema.
Precaución – Los productos Sun están
diseñados para trabajar en una red eléctrica
monofásica con toma de tierra. Para reducir el
Según el tipo de interruptor de encendido que su equipo
riesgo de descarga eléctrica, no conecte los
tenga, es posible que se utilice uno de los siguientes
productos Sun a otro tipo de sistema de
símbolos:
alimentación eléctrica. Póngase en contacto
con el responsable de mantenimiento o con un
Apagado - Elimina la alimentación de CA del electricista cualificado si no está seguro del
sistema. sistema de alimentación eléctrica del que se
dispone en su edificio.
En espera – El interruptor de Encendido/En Precaución – No todos los cables de

espera se ha colocado en la posición de En alimentación eléctrica tienen la misma
espera. capacidad. Los cables de tipo doméstico no
están provistos de protecciones contra
sobrecargas y por tanto no son apropiados
para su uso con computadores. No utilice
Modificaciones en el equipo alargadores de tipo doméstico para conectar
sus productos Sun.
No realice modificaciones de tipo mecánico o eléctrico en el
equipo. Sun Microsystems no se hace responsable del
cumplimiento de las normativas de seguridad en los
equipos Sun modificados. Precaución – Con el producto Sun se
proporciona un cable de alimentación con
toma de tierra. Para reducir el riesgo de
Ubicación de un producto Sun
descargas eléctricas conéctelo siempre a un
enchufe con toma de tierra.
Precaución – Para asegurar la fiabilidad de
funcionamiento de su producto Sun y para
protegerlo de sobrecalentamien-tos no deben
obstruirse o taparse las rejillas del equipo. Los
productos Sun nunca deben situarse cerca de
radiadores o de fuentes de calor.
Precaución – De acuerdo con la norma DIN 45

635, Parte 1000, se admite un nivel de presión
acústica para puestos de trabajo máximo de
70Db(A).
xxxvi Sun Ultra 10 Service Manual • February 2000

La siguiente advertencia se aplica solamente a equipos con
un interruptor de encendido que tenga una posición "En Precaución – Es peligroso hacer funcionar los
espera": productos Sun sin la tapa superior colocada.
El hecho de no tener en cuenta esta precaución
Precaución – El interruptor de encendido de puede ocasionar daños personales o
este producto funciona exclusivamente como perjudicar el funcionamiento del equipo.
un dispositivo de puesta en espera. El enchufe
de la fuente de alimentación está diseñado
para ser el elemento primario de desconexión
Aviso de cumplimiento con requisitos de láser
del equipo. El equipo debe instalarse cerca del Los productos Sun que utilizan la tecnología de láser
enchufe de forma que este último pueda ser cumplen con los requisitos de láser de Clase 1.
fácil y rápidamente accesible. No conecte el
cable de alimentación cuando se ha retirado la
fuente de alimentación del chasis del sistema.
Class 1 Laser Product
Luokan 1 Laserlaite
Batería de litio Klasse 1 Laser Apparat
Laser KLasse 1
Precaución – En las placas de CPU Sun hay
una batería de litio insertada en el reloj de
tiempo real, tipo SGS Núm. MK48T59Y,
MK48TXXB-XX, MK48T18-XXXPCZ, CD-ROM
M48T59W-XXXPCZ, o MK48T08. Las baterías
no son elementos reemplazables por el propio
Precaución – El manejo de los controles, los
cliente. Pueden explotar si se manipulan de
ajustes o la ejecución de procedimientos
forma errónea. No arroje las baterías al fuego.
distintos a los aquí especificados pueden
No las abra o intente recargarlas.
exponer al usuario a radiaciones peligrosas.
Paquete de pilas
Precaución – Las unidades Ultra 10 contienen

una pila de plomo sellada, Productos de
energía portátil nº TLC02V50. Existe riesgo de
estallido si el paquete de pilas se maneja sin
cuidado o se sustituye de manera indebida.
Las pilas sólo deben sustituirse por el mismo
tipo de paquete de pilas de Sun Microsystems.
No las desmonte ni intente recargarlas fuera
del sistema. No arroje las pilas al fuego.
Deséchelas siguiendo el método indicado por
las disposiciones vigentes.
Tapa de la unidad del sistema

Debe quitar la tapa del sistema cuando sea necesario añadir
tarjetas, memoria o dispositivos de almacenamiento
internos. Asegúrese de cerrar la tapa superior antes de
volver a encender el equipo.
xxxvii
GOST-R Certification Mark
Nordic Lithium Battery Cautions

Norge
ADVARSEL – Litiumbatteri —
Eksplosjonsfare.Ved utskifting benyttes kun
batteri som anbefalt av apparatfabrikanten.
Brukt batteri returneres apparatleverandøren.
Sverige
VARNING – Explosionsfara vid felaktigt

batteribyte. Använd samma batterityp eller
en ekvivalent typ som rekommenderas av
apparattillverkaren. Kassera använt batteri
enligt fabrikantens instruktion.
Danmark
ADVARSEL! – Litiumbatteri —
Eksplosionsfare ved fejlagtig håndtering.
Udskiftning må kun ske med batteri af samme
fabrikat og type. Levér det brugte batteri
tilbage til leverandøren.
Suomi
VAROITUS – Paristo voi räjähtää, jos se on

virheellisesti asennettu. Vaihda paristo
ainoastaan laitevalmistajan suosittelemaan
tyyppiin. Hävitä käytetty paristo valmistajan
ohjeiden mukaisesti.
xxxviii Sun Ultra 10 Service Manual • February 2000

CHAPTER 1
Product Description
The Ultra 10 systems are uniprocessor devices that use the family of UltraSPARC™
processors. They support high-performance CPU module (UltraSPARC-IIi)
processing and high-performance graphics. FIGURE 1-1 illustrates the Ultra 10
minitower-style system.
This chapter contains the following topics:

■ Section 1.1 “Feature Overview” on page 1-2
■ Section 1.2 “I/O Devices” on page 1-3
■ Section 1.3 “System Description” on page 1-4
■ Section 1.4 “Replaceable Components” on page 1-6
1-1
Keyboard
Monitor
Mouse
System
FIGURE 1-1 Ultra 10 Minitower System
1.1 Feature Overview

The Ultra 10 system provides the following features:
■ Minitower-style enclosure
■ 250-watt power supply
■ UltraSPARC-IIi processor module (CPU module)/advanced PCI bridge (APB)
application-specific integrated circuit (ASIC)
■ 480-MHz, 440-MHz, 360-MHz, 333-MHz, or 300-MHz CPU module
■ 1-gigabyte (Gbyte) memory (maximum)
■ Four PCI slots (PCI riser board expansion with four long PCI cards)
■ 33-megahertz (MHz), 32-bit peripheral component interconnect (PCI)
■ One dedicated front-access 5.25-inch bay
■ One optional front-access 5.25-inch bay
■ Up to two enhanced integrated drive electronic (IDE) hard drives
■ Front access Personal Computer Memory Card International Association
(PCMCIA) bay (two Type II or one Type III slot(s))
■ CD-ROM drive
■ CD quality audio
1-2 Sun Ultra 10 Service Manual • February 2000

■ 1.44-megabyte (Mbyte) manual-eject diskette drive
■ PGX on-board graphics or PGX24 PCI on-board graphics
Note – Systems with PGX24 graphics haveeither "PGX24" or “Series 3” printed on

the serial number label that is affixed to the front bezel.
■ One UltraSPARC port architecture (UPA) graphics slot

■ Two serial ports
■ One parallel port
■ 10-/100-megabit per second Ethernet
Note – This manual covers all versions of the Ultra 10. You can determine which
version you have from the information printed on the serial number label that is
affixed to the front bezel. If the label contains:
* Serial number only - Ultra 10 system,
* Serial number and PGX24 - Ultra 10 Model 333 or Model 360,
* Serial number and Series 3 - Ultra 10 Model 440 or Model 480
1.2 I/O Devices

The Ultra 10 workstations use the I/O devices listed in TABLE 1-1.
TABLE 1-1 Supported I/O Devices
I/O Device Description
17-inch (43-cm) 1280 x 1024 resolution, 76- or 66-Hz refresh rate, 110 dots per inch
color monitor (dpi)
20-inch (51-cm) 1152 x 900 resolution, 76- or 66-Hz refresh rate, 84 dpi
color monitor
1280 x 1024 resolution, 76- or 66-Hz refresh rate, 93 dpi
960 x 680 resolution, 112-Hz refresh rate, 70 dpi

24-inch (61-cm) 1920 x 1200 resolution, 70-Hz refresh rate, 103 dpi
color monitor
1600 x 1000 resolution, 76- or 66-Hz refresh rate, 86 dpi
Chapter 1 Product Description 1-3

TABLE 1-1 Supported I/O Devices
I/O Device Description
Microphone SunMicrophone™ II (optional)

Keyboard Sun Type-5: AT 101 or UNIX layout available;
Sun Type 6: AT 101 layout
Mouse Sun Type-5; 3-button optomechanical mouse
Sun Type-6; 3-button crossbow mouse
1.3 System Description

System components are housed in a minitower-style enclosure. Overall chassis
dimensions for the Ultra 10 system are listed in the following table.
TABLE 1-2 Ultra 10 System Physical Dimensions
Unit Width Height Depth
Ultra 10 6.93 inches (17.60 cm) 15.75 inches (40.00 cm) 16.54 inches (42.00 cm)
Minitower enclosure
System electronics are contained on a single printed circuit board (motherboard).

The motherboard contains the CPU module, memory modules, system control
ASICs, and I/O ASICs.
The following figures illustrate the Ultra 10 system front and back views.

CD-ROM drive
5.25-inch
bay (spare)
3.5-inch bay (spare)
Diskette drive Standby switch
FIGURE 1-2 Ultra 10 System Front View
Power inlet Power switch
Power supply fan
Audio
Voltage select
Keyboard/mouse
UPA graphics
Serial port B
Serial port A (not illustrated)
PCI connector, 33-MHz (4)
Video connector
TPE connector Parallel port connector

(not illustrated)
FIGURE 1-3 Ultra 10 System Back View

1.4 Replaceable Components
The following table lists the Ultra 10 system replaceable components. A brief
description of each listed component is also provided.
Note – Consult your authorized Sun sales representative or service provider prior to
ordering a replacement part.
TABLE 1-3 Ultra 10 System Replaceable Components
Component Description
Manual eject floppy Diskette drive
Speaker assembly Speaker assembly
Fan assembly CPU fan, 92-mm
CD-ROM drive CD-ROM drive
16-Mbyte DIMM 60-ns, 16-Mbyte DIMM
CPU module 300-MHz, 512-Kbyte external cache
CPU module 333-MHz, 2-Mbyte external cache

TABLE 1-3 Ultra 10 System Replaceable Components (Continued)
Component Description
CPU module 440-MHz, 2-MKbyte external cache
Motherboard System board
NVRAM/TOD Time of day, 48T59, with carrier
PCI card Generic
PCI riser board 4-slot PCI riser board
Hard drive Disk drive, 9.1-Gbyte, 7200 RPM
Hard drive bracket 9.1-Gbyte rear hard drive bracket
Power supply Power supply, 250 watts
Graphics card Vertical, double buffer plus Z (DBZ) UPA graphics
Graphics card Vertical, single-buffer UPA graphics card
Graphics card Vertical, double-buffer UPA graphics card
Graphics card Elite3D m3 UPA graphics card
Graphics card Elite3D m6 UPA graphics card
Front bezel System front bezel
Audio cable assembly Cable assembly.
Service kit Includes diskette drive cable assembly, hard drive cable
assembly, serial/parallel cable assembly, and CD-ROM drive
cable assembly
Note – The Ultra 10 diskette drive cable assembly, hard drive cable assembly, serial/
parallel cable assembly, and CD-ROM drive cable assembly are part of service kit
370-3266 and cannot be ordered separately.

CHAPTER 2
SunVTS Overview
This chapter contains an overview of the SunVTS™ diagnostic tool.

■ Section 2.1 “SunVTS Description” on page 2-1
■ Section 2.1.1 “SunVTS Requirements” on page 2-2
■ Section 2.1.2 “SunVTS References” on page 2-2
2.1 SunVTS Description

SunVTS is Sun’s online Validation Test Suite. SunVTS is a comprehensive software
diagnostic package that tests and validates hardware by verifying the connectivity
and functionality of most hardware controllers, devices, and platforms.
SunVTS can be tailored to run on various types of systems ranging from desktops to
servers with many customizable features to meet the varying requirements of many
diagnostic situations.
Use SunVTS to validate a system during development, production, receiving

inspection, troubleshooting, periodic maintenance, and system or subsystem
stressing.
2-1
SunVTS executes multiple diagnostic tests from one graphical user interface (GUI)
that provides test configuration and status monitoring. The user interface can run in
the CDE or OPEN LOOK environments or through a TTY-mode interface for
situations when running a GUI is not possible.
The SunVTS interface can run on one system to display the SunVTS test session of
another system on the network.
SunVTS is distributed with each SPARC™ Solaris™ operating environment release.

It is located on the Sun Computer Systems Supplement CD.
2.1.1 SunVTS Requirements

Your system must meet the following requirements to run SunVTS:
■ The SunVTS packages must be installed. The main package is SUNWvts. There
are additional supporting packages that differ based on the version of the Solaris
operating environment that is installed. For specific details, refer to the
corresponding SunVTS documentation (described below).
■ The system must be booted to the multiuser level (level 3).
■ To run SunVTS with a GUI, that GUI must be installed. Otherwise, run SunVTS
with the TTY-mode interface.
2.1.2 SunVTS References

For more information about using SunVTS, refer to the SunVTS documentation that
corresponds to the Solaris software version that you are running.
The SunVTS documents are part of the Solaris on Sun Hardware AnswerBook
collection. This AnswerBook collection is preinstalled on the hard disk of new
systems. It is also distributed on the Software Supplement CD that is part of each
Solaris Media Kit release and is also accessible at http://docs.sun.com.
The following list describes the content of each SunVTS document:

■ SunVTS User’s Guide – describes how to install, configure, and run the SunVTS
diagnostic software.
■ SunVTS Quick Reference Card – provides an overview of how to use the SunVTS
CDE interface.
■ SunVTS Test Reference Manual – provides details about each individual SunVTS
test.

CHAPTER 3
Power-On Self-Test
This chapter describes how to initiate power-on self-test (POST) diagnostics.

■ Section 3.1 “POST Overview” on page 3-1
■ Section 3.2 “Pre-POST Preparation” on page 3-2
■ Section 3.3 “Initializing POST” on page 3-5
■ Section 3.4 “Maximum and Minimum POST Levels” on page 3-7
■ Section 3.5 “Bypassing POST” on page 3-22
■ Section 3.6 “Resetting Variables to Default Settings” on page 3-22
■ Section 3.7 “Initializing Motherboard POST” on page 3-23
3.1 POST Overview

POST is useful in determining if a portion of the system has failed and should be
replaced. POST detects approximately 95 percent of system faults and is located in
the motherboard OpenBoot™ PROM (OBP). The setting of two NVRAM variables,
diag-switch? and diag-level, determines whether POST is executed and to
what level (see Section 3.3 “Initializing POST” on page 3-5).
3-1
3.2 Pre-POST Preparation
Pre-POST preparation includes:
■ Setting up a TIP connection to another workstation or terminal to view POST
progress and error messages. See Section 3.2.1 “Setting Up a TIP Connection” on
page 3-2.
■ Verifying baud rates between a workstation and a monitor or terminal. See
Section 3.2.2 “Verifying the Baud Rate” on page 3-4.
If a terminal or a monitor is not connected to serial port A (default port) of a

workstation to be tested, the keyboard light-emitting diodes (LEDs) are used to
determine error conditions. See Section 3.4.3 “POST Progress and Error Reporting”
on page 3-19.
3.2.1 Setting Up a TIP Connection

A TIP connection enables a remote shell window to be used as a terminal to display
test data from a tested system. Serial port A or serial port B of a tested system is
connected to another Sun workstation monitor or TTY-type terminal.
To set up a TIP connection, proceed as follows:
1. Connect serial port A of the tested system to serial port B of a second Sun
workstation using a serial null modem cable (connect cable pins 2-3, 3-2, 7-20, and
20-7). See FIGURE 3-1.
2 2
3 3
7
7
20 20
FIGURE 3-1 Setting Up a TIP Connection

2. At the second Sun workstation, check the /etc/remote file by changing to the
/etc directory and editing the remote file. The following sample remote file
text shows connection to serial port B:
hardwire: /dv=/dev/term/b:br#9600:el=^C^S^Q^U^D:ie=%$:oe=^D:
3. To use serial port A:
a. Copy and paste the remote file text that shows connection to serial port B.
b. Modify the pasted text as follows to change the connection to serial port A:
hardwire: /dv=/dev/term/a:br#9600:el=^C^S^Q^U^D:ie=%$:oe=^D:
4. In a shell window on the second Sun workstation, type tip hardwire.
% tip hardwire
connected
The shell window becomes a TIP window directed to serial port A of the tested
system. When power is applied to the tested system, POST messages are displayed
in this shell window.
5. When POST is completed, disconnect the TIP connection as follows:
a. Open another shell window at the second workstation.
b. Type ps -a to view the active TIP line and process ID (PID) number.
c. Type the following to disconnect the TIP hardwire process.
% kill -9 PID#
Chapter 3 Power-On Self-Test 3-3

3.2.2 Verifying the Baud Rate
To verify the baud rate between the tested system and a terminal or another Sun
workstation monitor:
1. Open a shell window.
2. Type eeprom.
3. Verify the following serial port default settings:
ttyb-mode = 9600,8,n,1
ttya-mode = 9600,8,n,1
Note – Ensure that the settings are consistent with TTY-type terminal or
workstation monitor settings.

3.3 Initializing POST
POST can be initialized in two ways:
■ By setting the diag-switch? to true and the diag-level to max or min,
followed by power-cycling the system
■ By simultaneously pressing the keyboard Stop and D keys while power is applied
to the system
To set the diag-switch? to true and power-cycle the system:
1. At the system prompt, type:
ok% setenv diag-switch? true
2. At the keyboard (Sun Type-5 or Sun I/O Type-6), power-cycle the system by
simultaneously pressing the Shift key and the Standby (Power) key. After a few
seconds, press the Standby (Power) key again (see FIGURE 3-2 or FIGURE 3-3).
Stop Scroll Lock

key key indicator Standby key
Caps Lock Shift key D key Compose Num Lock

key indicator key indicator key indicator
FIGURE 3-2 Sun Type-5 Keyboard

Caps Scroll
lock lock
Stop key Num

Shift key Lock Compose Power key
Num Lock Caps Lock Scroll Lock Compose
Help Esc F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 Print Scroll Pause

Screen Lock
SysRq Break
Stop Again ~ ! @ # $ % ^ & * ( ) _ + Back Space Insert Home Page Num / * -

Up Lock
` 1 2 3 4 5 6 7 8 9 0 - =
Props Undo Tab Q W E R T Y U I O P { } | Del End Page 7 8 9 +

Down
[ ] \ Home PgUp
Front Copy A S D F G H J K L : " Enter 4 5 6

Caps Lock ; '
Z X C V B N M < > ? Shift 1 2 3 Enter

Open Paste Shift , . /
End PgDn
Find Cut Control Alt 0 .

Com- Alt
pose Graph Ins Del
FIGURE 3-3 Sun I/O Type-6 Keyboard
3. Verify the following:

■ The display prompt is no longer displayed.
■ The monitor power-on indicator flashes on and off.
■ The keyboard Caps Lock key indicator flashes on and off.
4. When the POST is complete, type the following at the system prompt:
ok% setenv diag-switch? false

3.4 Maximum and Minimum POST Levels
Two levels of POST are available: maximum (max) level and minimum (min) level.
The system initiates the selected level of POST based upon the setting of
diag-level, an NVRAM variable. The default setting for diag-level is max.
To set the diag-level variable to min before power-cycling the system, type:
ok% setenv diag-level min
To return to the default setting:
ok% setenv diag-level max
An example of a max-level POST output on serial port A is provided in Section 3.4.1

“diag-level Variable Set to max” on page 3-7. An example of a min-level POST
output on serial port A is provided in Section 3.4.2 “diag-level Variable Set to min”
on page 3-15.
3.4.1 diag-level Variable Set to max

When you set the diag-level variable to max, POST enables an extended set of
diagnostic-level tests. This mode requires approximately two minutes to complete
(with 128 Mbytes of DIMM installed). CODE EXAMPLE 3-1 shows a typical serial port
A POST output with diag-level set to max.
Note – Video output is disabled while POST is initialized.
CODE EXAMPLE 3-1 diag-level Variable Set to max

Power On Selftest Completed
Software Power ON0.0000.0000.0000 ffff.ffff.f00b.4100
0002.3333.0200.001b
@(#) Sun Ultra 5/10 UPA/PCI 3.9 P2.1 Version 9 created 1997/08/
05 16:24
Clearing E$ Tags Done
Clearing I/D TLBs Done
Probing Memory Done

CODE EXAMPLE 3-1 diag-level Variable Set to max (Continued)
MEM BASE = 0000.0000.0000.0000
MEM SIZE = 0000.0000.1000.0000
11-Column Mode Enabled
MMUs ON
Copy Done
PC = 0000.01ff.f000.20ec
PC = 0000.0000.0000.2130
Decompressing into Memory Done
Size = 0000.0000.0007.5300
ttya initialized
Reset Control: BXIR:0 BPOR:0 SXIR:0 SPOR:1 POR:0
UltraSPARC-IIi 2-2 module
Probing Memory Bank #0 128 + 128 : 256 Megabytes
Probing Floppy: drive detected on ID0
Probing EBUS SUNW,CS4231
Probing UPA Slot at 1e,0 SUNW,ffb
Probing /pci@1f,0/pci@1,1 at Device 2 SUNW,m64B
Probing /pci@1f,0/pci@1,1 at Device 3 ide disk cdrom
Probing /pci@1f,0/pci@1 at Device 1 Nothing there
Sun Ultra 5/10 UPA/PCI (UltraSPARC-IIi 300MHz), No Keyboard

OpenBoot 3.9 P2.1 , 256 MB memory installed, Serial #9337477.
Ethernet address 8:0:20:8e:7a:85, Host ID: 808e7a85.
ok Hardware Power ON
05 16:24

Probing keyboard Done
%o0 = 0000.0000.0000.4001
Executing Power On SelfTest
@(#) Sun Ultra 5/10 (Darwin) POST 2.1.1 (Build No. 293) 08/21/97:
15:59
CPU: UltraSPARC-LC (MHz: 301 Ecache Size: 512KB)
Init POST BSS

Init System BSS
NVRAM
NVRAM Battery Detect Test
NVRAM Scratch Addr Test
NVRAM Scratch Data Test
DMMU TLB Tags
DMMU TLB Tag Access Test
DMMU TLB RAM
DMMU TLB RAM Access Test
Probe Ecache
Probe Ecache
Ecache Tests
Ecache RAM Addr Test
Ecache Tag Addr Test
Ecache RAM Test
Ecache Tag Test
All CPU Basic Tests
V9 Instruction Test
CPU Tick and Tick Compare Reg Test
CPU Soft Trap Test
CPU Softint Reg and Int Test
All Basic MMU Tests
DMMU Primary Context Reg Test
DMMU Secondary Context Reg Test
DMMU TSB Reg Test
DMMU Tag Access Reg Test
DMMU VA Watchpoint Reg Test
DMMU PA Watchpoint Reg Test
IMMU TSB Reg Test
IMMU Tag Access Reg Test
All Basic Cache Tests
Dcache RAM Test
Dcache Tag Test
Icache RAM Test

Icache Tag Test
Icache Next Test
Icache Predecode Test
Sabre MCU Control & Status Regs Init and Tests
Init Sabre MCU Control & Status Regs
Initializing SC registers in SabreIO
Memory Probe and Init
Probe Memory
INFO: 256MB Bank 0
bank 2: 0MB
frequency = 301, refvalue = 146, no_of_banks = 1
INFO: MC0 = 0x00000000.80001192, MC1 = 0x00000000.0c4aab14
Malloc Post Memory
Memory Addr w/ Ecache
Load Post In Memory
Run POST from MEM
.........
loaded POST in memory
Map PROM/STACK/NVRAM in DMMU
Update Master Stack/Frame Pointers
All FPU Basic Tests
FPU Regs Test
FPU Move Regs Test
FPU State Reg Test
FPU Functional Test
FPU Trap Test
UPA Data Bus Line Test
Memory Tests
Init Memory
INFO: 256MB at bank 0 stack 0 (2 dimms per bank)
................................................................
................................................................
INFO: 0MB at bank 0 stack 1
Memory Addr w/ Ecache Test
ECC Memory Addr Test
Block Memory Addr Test

Block Memory Test
Write 0x33333333.33333333
................................................................
................................................................
Read
................................................................
................................................................
Write 0x55555555.55555555
................................................................
................................................................
Read
................................................................
................................................................
Write 0xcccccccc.cccccccc
................................................................
................................................................
Read
................................................................
................................................................
Write 0xaaaaaaaa.aaaaaaaa
................................................................
................................................................
Read
................................................................
................................................................

ECC Blk Memory Test
Write 0xa5a5a5a5.a5a5a5a5
................................................................
................................................................
Read
................................................................
................................................................
Write 0x96969696.96969696
................................................................
................................................................

Read
................................................................
................................................................
Write 0xbbbbbbbb.bbbbbbbb
................................................................
................................................................
Read
................................................................
................................................................
Write 0xdddddddd.dddddddd
................................................................
................................................................
Read
................................................................
................................................................

All Basic Sabre MMU Tests
Init Sabre
PIO Decoder and BCT Test
PCI Byte Enable Test
Interrupt Map (short) Reg Test
Interrupt Set/Clr Reg Test
Sabre IOMMU Regs Test
Sabre IOMMU RAM Address Test
Sabre IOMMU CAM Address Test
IOMMU TLB Compare Test
IOMMU TLB Flush Test
PBMA PCI Config Space Regs Test
PBMA Control/Status Reg Test
PBMA Diag Reg Test
Sabre IO Regs Test
All Advanced CPU Tests
DMMU Hit/Miss Test
IMMU Hit/Miss Test
DMMU Little Endian Test
IU ASI Access Test
FPU ASI Access Test
Ecache Thrash Test
All CPU Error Reporting Tests
CPU Data Access Trap Test
CPU Addr Align Trap Test
DMMU Access Priv Page Test

DMMU Write Protected Page Test
All Advanced Sabre IOMMU Tests
Init Sabre
Consist DMA Rd, IOMMU miss Ebus Test
Consist DMA Rd, IOMMU hit Ebus Test
Consist DMA Wr, IOMMU miss Ebus Test
Consist DMA Wr, IOMMU hit Ebus Test
Pass-Thru DMA Rd, Ebus device Test
Pass-Thru DMA Wr, Ebus device Test
Consist DMA Rd, IOMMU LRU Lock Ebus Test
Consist DMA Wr, IOMMU LRU Locked Ebus Test
All Basic Cheerio Tests
Cheerio Ebus PCI Config Space Test
Cheerio Ethernet PCI Config Space Test
Cheerio Init
All Sabre IOMMU Error Reporting Tests
Init Sabre
PIO Read, Master Abort Test
PIO Read, Target Abort Test
Status of this POST run:PASS

manfacturing mode=OFF
Time Stamp [hour:min:sec] 00:02:01 [month/date year] 08/22 1997

0002.3333.0200.001b
05 16:24
Probing Memory Done
MEM BASE = 0000.0000.0000.0000
MEM SIZE = 0000.0000.1000.0000
MMUs ON
Copy Done
PC = 0000.01ff.f000.20ec
PC = 0000.0000.0000.2130
Size = 0000.0000.0007.5300

ttya initialized

ok

3.4.2 diag-level Variable Set to min
When you set the diag-level variable to min, POST enables an abbreviated set of
diagnostic-level tests. This mode requires approximately one minute to complete
(with 128 Mbytes of DIMM installed). CODE EXAMPLE 3-2 shows a serial port A POST
output with diag-level set to min.
Note – Video output is disabled while POST is initialized.
CODE EXAMPLE 3-2 diag-level Variable Set to min

05 16:24
%o0 = 0000.0000.0000.2001
15:59
Init POST BSS

Init System BSS
NVRAM
DMMU TLB Tags
DMMU TLB RAM
Probe Ecache
Probe Ecache
Ecache Tests
All CPU Basic Tests
V9 Instruction Test
CPU Soft Trap Test
All Basic MMU Tests

CODE EXAMPLE 3-2 diag-level Variable Set to min (Continued)
05 16:24
DMMU TSB Reg Test
IMMU TSB Reg Test
Dcache RAM Test
Icache RAM Test
Probe Memory
INFO: 256MB Bank 0
bank 2: 0MB
INFO: MC0 = 0x00000000.80001192, MC1 = 0x00000000.0c4aab14
Malloc Post Memory
Load Post In Memory
Run POST from MEM
.........
All FPU Basic Tests
FPU Regs Test
FPU Move Regs Test
Memory Tests
Init Memory
................................................................
................................................................
................................................................
........................................................
All Basic Sabre MMU Tests
Init Sabre

05 16:24
Interrupt Map (short) Reg Test
Interrupt Set/Clr Reg Test
Sabre IOMMU Regs Test
Sabre IOMMU RAM Address Test
Sabre IOMMU CAM Address Test
PBMA PCI Config Space Regs Test
PBMA Control/Status Reg Test
PBMA Diag Reg Test
Sabre IO Regs Test
All Advanced CPU Tests
IU ASI Access Test
FPU ASI Access Test
All CPU Error Reporting Tests
CPU Data Access Trap Test
CPU Addr Align Trap Test
DMMU Access Priv Page Test
DMMU Write Protected Page Test
All Advanced Sabre IOMMU Tests
Init Sabre
Consist DMA Rd, IOMMU miss Ebus Test
All Basic Cheerio Tests
Cheerio Ebus PCI Config Space Test
Cheerio Ethernet PCI Config Space Test
Cheerio Init
All Sabre IOMMU Error Reporting Tests
Init Sabre
PIO Read, Master Abort Test
PIO Read, Target Abort Test
Status of this POST run:PASS

manfacturing mode=OFF
Time Stamp [hour:min:sec] 00:10:33 [month/date year] 08/22 1997

0002.3333.0200.001b
05 16:24

05 16:24
Probing Memory Done
MEM BASE = 0000.0000.0000.0000
MEM SIZE = 0000.0000.1000.0000
MMUs ON
Copy Done
PC = 0000.01ff.f000.20ec
PC = 0000.0000.0000.2130
Size = 0000.0000.0007.5300
ttya initialized

ok

3.4.3 POST Progress and Error Reporting
When POST is initialized, the Caps Lock key on the Sun Type-5 or Type-6 keyboard
flashes on and off to indicate that POST is active (see FIGURE 3-2 or FIGURE 3-3).
Additional POST progress indications are also visible when a TTY-type terminal or a
TIP line is connected between serial port A (default port) of the tested system and a
second Sun workstation.
If an error occurs during POST execution, the keyboard Caps Lock key indicator
stops flashing and an error code pattern is indicated using the Caps Lock, Compose,
Scroll Lock, and Num Lock key indicators (see FIGURE 3-2 or FIGURE 3-3). The error
code pattern indicates a particular system hardware failure. If a keyboard error code
pattern is displayed, determine the meaning of the pattern by using TABLE 3-1.
Note – An error code might be visible for only a few seconds. Observe the Caps
Lock, Compose, Scroll Lock, and Num Lock key indicators closely while POST is
active.
TABLE 3-1 Keyboard LED Error Indication Patterns
Caps Lock Compose Scroll Lock Num Lock Bit Value Meaning of Pattern
Blink Off Off Off x000(2) POST in progress
Off Off Off Off 0000(2) POST successfully completed
On Off Off On 1001(2) System board failed
On Off On Off 1010(2) No memory found
On Off On On 1011(2) Reserved
On On Off Off 1100(2) Reserved
On On Off On 1101(2) Reserved
On On On Off 1110(2) Bad CPU
On On On On 1111(2) Reserved
In most cases, POST also attempts to send a failure message to the POST monitoring
system. CODE EXAMPLE 3-3 shows the typical appearance of an error message.

Note – The system does not automatically boot if a POST error occurs; it halts at the
ok prompt to indicate a failure.
CODE EXAMPLE 3-3 Typical Error Code Failure Message

05 16:24
%o0 = 0000.0000.0000.2001
15:59
Init POST BSS

Init System BSS
NVRAM
DMMU TLB Tags
DMMU TLB RAM
Probe Ecache
Probe Ecache
Ecache Tests
All CPU Basic Tests
V9 Instruction Test
CPU Soft Trap Test
All Basic MMU Tests
DMMU TSB Reg Test
IMMU TSB Reg Test
Dcache RAM Test

CODE EXAMPLE 3-3 Typical Error Code Failure Message (Continued)
05 16:24
Icache RAM Test
Probe Memory
INFO: All the memory banks in 10 bit column mode
INFO: 32MB Bank 0
INFO: MC0 = 0x00000000.80000549, MC1 = 0x00000000.0c4aab14
Malloc Post Memory
Load Post In Memory
Run POST from MEM
.........
All FPU Basic Tests
FPU Regs Test
FPU Move Regs Test
Memory Tests
Init Memory
........................
ERROR: DIMM Undetected on some sockets on the board!

3.5 Bypassing POST
To bypass POST:
1. Prior to powering on the system, press and hold the Stop key on the keyboard
(FIGURE 3-2 or FIGURE 3-3).
2. With the Stop key held down, turn on the system by pressing the Standby (Power)
key.
Note – Press and hold the Stop key for approximately 5 seconds.
3.6 Resetting Variables to Default Settings

To set the system NVRAM parameters to the original default settings:
1. Press and hold the Stop and N keys while powering on the system (FIGURE 3-2 or
FIGURE 3-3).
2. Continue to hold the Stop and N keys until the system banner displays on the
monitor.

3.7 Initializing Motherboard POST
To initialize the motherboard POST:
1. Power off the system.
2. Simultaneously press and hold the Stop and D keys, then press the Standby
(Power) key (FIGURE 3-2 or FIGURE 3-3).
Note – Video output is disabled while motherboard POST is initialized.
Note – To view the POST output results, you must set up a TIP connection. See
Section 3.2.1 “Setting Up a TIP Connection” on page 3-2.
3. Verify the keyboard Caps Lock key LED flashes on and off to indicate the system
has enabled POST.
4. If a failure occurs during POST, a keyboard key LED other than the Caps Lock
key LED might light, indicating a failed system component.
See Section 3.4.3 “POST Progress and Error Reporting” on page 3-19.
Note – The most probable cause of this type of failure is the motherboard. However,
optional system components could also cause POST to fail.
5. Before replacing the motherboard, remove any optional components, such as PCI
cards, then repeat the POST.
Note – Non-optional components such as DIMMs, the motherboard, the power

supply, and the keyboard must be installed for POST to execute properly. Removing
the optional system components and retesting the system isolates the possibility that
those components are the cause of the failure.

CHAPTER 4
Troubleshooting Procedures
This chapter describes how to troubleshoot possible hardware problems and

includes suggested corrective actions.

■ Section 4.1 “Power-On Failure” on page 4-2
■ Section 4.2 “Video Output Failure” on page 4-3
■ Section 4.3 “Hard Drive or CD-ROM Drive Failure” on page 4-4
■ Section 4.4 “Power Supply Test” on page 4-5
■ Section 4.5 “DIMM Failure” on page 4-7
■ Section 4.6 “OpenBoot PROM On-Board Diagnostics” on page 4-8
■ Section 4.7 “OpenBoot Diagnostics” on page 4-13
4-1
4.1 Power-On Failure
This section provides examples of power-on failure symptoms and suggested
actions. Perform the suggested actions until you isolate the problem.
Symptom 1
The system does not power on when you press the keyboard Standby (Power).
Actions
1. Check the keyboard connection to ensure that the keyboard is properly connected
to the system.
2. Check the power cord to ensure that it is properly connected to the system and to
the wall receptacle.
3. Verify that the system power switch is set to on.
4. Verify that the wall receptacle is supplying power to the system.
5. Check the voltage-line select switch to ensure that it is set correctly.
6. Press the front panel standby switch. If the system powers on, the keyboard might
be defective or the system might be unable to accept the keyboard power-on
signal.
7. Power off the system (if necessary) and press the keyboard Standby (Power) key
again. If the system powers on, no further action is required. If the system does
not power on, the CPU module might not be correctly seated.
8. Inspect the CPU module to ensure correct seating.
9. Press the keyboard Standby (Power) key again. If the system powers on, no
further action is required. If the system does not power on, the keyboard might be
defective.
10. Connect a spare Sun Type-5 or Sun I/O Type-6 keyboard to the system and press
the Standby (Power) key.
11. If the system still does not power up, the system power supply might be
defective. See Section 4.4 “Power Supply Test” on page 4-5.

Symptom 2
The system attempts to power on but does not boot or initialize the monitor.
Actions
1. Press the keyboard Standby (Power) key and watch the keyboard. The keyboard
LEDs should light briefly and you should hear a tone from the keyboard.
2. If you do not hear a keyboard tone or if the keyboard LEDs do not light briefly,
the system power supply may be defective. See Section 4.4 “Power Supply Test”
on page 4-5.
3. If a you hear a keyboard tone and the keyboard LEDs light briefly but the system
still fails to initialize, see Section 3.7 “Initializing Motherboard POST” on
page 3-23.
4.2 Video Output Failure

This section provides video output failure symptoms and suggested actions. Perform
the suggested actions until you isolate the problem.
Symptom
The video does not display at the system monitor.
Actions
1. Check the monitor power cord to ensure that the cord is connected to the monitor
and to the wall receptacle.
2. Verify that the wall receptacle is supplying power to the monitor.
3. Check the video cable connection between the monitor and the motherboard
video output connector.
4. Check that the CPU module is properly seated.
5. If video still does not display on the monitor, the monitor, graphics card, or
motherboard video chip may be defective.
Chapter 4 Troubleshooting Procedures 4-3

4.3 Hard Drive or CD-ROM Drive Failure
This section provides hard drive and CD-ROM drive failure symptoms and
suggested actions. Perform the suggested actions until you isolate the problem.
Symptoms
■ A hard drive read, write, or parity error is reported by the operating system or a
customer application.
■ A CD-ROM drive read error or parity error is reported by the operating system or
a customer application.
Action
● Replace the drive indicated by the failure message. The operating system
identifies the internal drives as shown in TABLE 4-1.
TABLE 4-1 Internal Drives Identification
Operating Environment Address Drive Physical Location and Target
c0t0d0s# Master (primary) hard drive, target 0
c0t1d0s# Slave (secondary) hard drive, target 1 (optional)
c0t6d0s# CD-ROM drive, target 6 (optional)
Note – The # symbol in the operating system address examples may be a numeral
between 0 and 7 that describes the slice or partition on the drive.
Symptom
Hard drive or CD-ROM drive fails to respond to commands.
Action
Test the drive response to the probe-ide command as follows:
1. To bypass POST, type setenv diag-switch? false at the ok prompt.
2. At the system ok prompt, type:
ok% reset-all
ok% probe-ide

■ If the hard drive responds correctly to probe-ide command, the message shown
in CODE EXAMPLE 4-4 on page 4-10 is displayed, which means that the system
EIDE controller has successfully probed the device. This is an indication that the
motherboard is operating correctly.
■ If an optional hard drive is installed and one drive does not respond to the EIDE
controller probe but the other does, replace the unresponsive drive.
■ If the probe-ide test fails to show the device in the message, replace the drive
(see Section 7.2.2 “Replacing a Hard Drive” on page 7-6). If replacing the hard
drive does not correct the problem, replace the motherboard.
4.4 Power Supply Test

The section describes how to test the power supply. FIGURE 4-1 and TABLE 4-2 describe
power supply connector J17.
1. Power off the system, remove the system cover, and attach an antistatic wrist strap
as described in Chapter 5.
2. Remove the PCI card from riser board connector 2 (adjacent to the power supply),
if necessary for clearance. Disconnect the ribbon cables from the motherboard to
expose connectors J17.
3. Power on the system.

See Section 10.2 “Powering On the System” on page 10-3.
Caution – With the system cover removed and the system powered on, there is
unprotected access to voltage and energy levels that are potentially hazardous to
equipment and personnel. If you are unsure how to safely proceed, please seek the
assistance of qualified service personnel.
4. Using a digital voltage meter (DVM), check the power supply output voltages as
follows:
Note – Power supply connector J17 must remain connected to the motherboard.
a. With the negative probe of the DVM placed on a connector ground (Gnd) pin,
position the positive probe on each power pin.
b. Verify voltage and signal availability as listed in TABLE 4-2.
5. If any power pin signal is not present with the power supply active and properly
connected to the motherboard, replace the power supply.

10 1
20 11
FIGURE 4-1 Power Supply Connector J17 Pin Configuration
TABLE 4-2 Power Supply Connector J17 Pin Assignments
Pin Signal Description
1 +3.3V +3.3 VDC
2 +3.3V +3.3 VDC
3 Gnd Chassis ground
4 +5V +5 VDC
6 +5V +5 VDC
8 PWR_OK Power okay
9 5VSB
10 +12V +12 VDC
11 +3.3V +3.3 VDC
12 -12V -12 VDC
14 PS_ON Power supply on

TABLE 4-2 Power Supply Connector J17 Pin Assignments (Continued)
18 -5V -5 VDC
19 +5V +5 VDC
20 +5V +5 VDC
6. After you finish testing the power supply, remove the wrist strap, replace the
system cover, and power on the system as described in Chapter 10.
4.5 DIMM Failure

At times, the operating environment, diagnostic program, or POST might not
display a DIMM location (U number) as part of a memory error message. In this
situation, the only available information is a physical memory address and failing
byte (or bit). The following table lists physical memory addresses that can be used to
locate a defective DIMM.
TABLE 4-3 DIMM Physical Memory Address
DIMM Pair
DIMM Slot (non-interleave)
DIMM0 00000000 - 0fffffff

DIMM1
DIMM2 10000000 - 1fffffff
DIMM3

4.6 OpenBoot PROM On-Board Diagnostics
The following sections describe the OpenBoot PROM (OBP) on-board diagnostics. To
execute the OBP on-board diagnostics, the system must be at the ok prompt. The
OBP on-board diagnostics are described as follows:
■ Section 4.6.1 “Watch-Clock Diagnostic” on page 4-8
■ Section 4.6.2 “Watch-Net and Watch-Net-All Diagnostics” on page 4-8
■ Section 4.6.3 “Probe-IDE Diagnostic” on page 4-10
■ Section 4.6.4 “Test device alias, device path, -All Diagnostic” on page 4-10
■ Section 4.6.5 “UPA Graphics Card” on page 4-12
4.6.1 Watch-Clock Diagnostic

The watch-clock diagnostic reads a register in the NVRAM/TOD chip and displays
the result as a seconds counter. During normal operation, the seconds counter
repeatedly increments from 0 to 59 until interrupted by pressing any key on the Sun
keyboard. The watch-clock diagnostic is initialized by typing the
watch-clock command at the ok prompt. The following code example identifies
the watch-clock diagnostic output message.
CODE EXAMPLE 4-1 Watch-Clock Diagnostic Output Message

ok watch-clock
Watching the 'seconds' register of the real time clock chip.
It should be 'ticking' once a second.
Type any key to stop.
49
ok
4.6.2 Watch-Net and Watch-Net-All Diagnostics

The watch-net and watch-net-all diagnostics monitor Ethernet packets on the
Ethernet interfaces connected to the system. Good packets received by the system
are indicated by a period (.). Errors such as the framing error and the cyclic
redundancy check (CRC) error are indicated with an “X” and an associated error
description. The watch-net diagnostic is initialized by typing the watch-net
command at the ok prompt and the watch-net-all diagnostic is initialized by typing

the watch-net-all command at the ok prompt. The following code example
identifies the watch-net diagnostic output message. CODE EXAMPLE 4-3 identifies the
watch-net-all diagnostic output message.
CODE EXAMPLE 4-2 Watch-Net Diagnostic Output Message

ok watch-net
Hme register test --- succeeded.
Internal loopback test -- succeeded.
Transceiver check -- Using Onboard Transceiver - Link Up.
passed
Using Onboard Transceiver - Link Up.
Looking for Ethernet Packets.
'.' is a Good Packet. 'X' is a Bad Packet.
..................................................
................................................................
................................................................
........................................................
ok
CODE EXAMPLE 4-3 Watch-Net-All Diagnostic Output Message

ok watch-net-all
/pci@1f,0/pci@1,1/network@1,1
Hme register test --- succeeded.
Internal loopback test -- succeeded.
Transceiver check -- Using Onboard Transceiver - Link Up.
passed
Looking for Ethernet Packets.
'.' is a Good Packet. 'X' is a Bad Packet.
........
................................................................
................................................................
................................................................
....................................
ok

4.6.3 Probe-IDE Diagnostic
The probe-ide diagnostic transmits an inquiry command to internal and external IDE
devices connected to the system’s on-board IDE interface. If the IDE device is
connected and active, the target address, unit number, device type, and
manufacturer name are displayed. Initialize the probe-ide diagnostic by typing the
probe-ide command at the ok prompt. The following code example identifies the
probe-ide diagnostic output message.
CODE EXAMPLE 4-4 Probe-IDE Diagnostic Output Message

ok probe-ide
Device 0 ( Primary Master )
ATA Model: ST34342A
Device 1 ( Primary Slave )

ATA Model: ST34342A
Device 2 ( Secondary Master )

Removable ATAPI Model: CRD-8160B
Device 3 ( Secondary Slave )

Removable ATAPI Model:
ok
4.6.4 Test device alias, device path, -All Diagnostic

The test diagnostic, when combined with a device alias or device path, enables a
device self-test diagnostic program. If a device has no self-test program, the message
No selftest method for device name is displayed. To enable the self-test
program for a device, type the test command followed by the device alias or device
path name.
The following code example identifies the test diagnostic output message. Test
diagnostics are initialized by typing the test device alias or device path command at
the ok prompt. TABLE 4-4 lists the types of tests that can be used, a brief description
of each test, and preparation.

Note – The diskette drive (floppy) is selected as the test alias name example.
CODE EXAMPLE 4-5 Test Diagnostic Output Message

ok test floppy
Testing floppy disk system. A formatted disk should be in the

drive.
Test succeeded.
ok
TABLE 4-4 Selected OBP On-Board Diagnostic Tests
Type of Test Description Preparation
test screen Tests the system video graphics hardware Diag-switch? NVRAM parameter must
and the monitor. be true for the test to execute.
test floppy Tests the diskette drive response to A formatted diskette must be inserted into
commands. the diskette drive.
test net Performs an internal/external loopback test An Ethernet cable must be attached to the
of the system auto-selected Ethernet system and to an Ethernet tap or hub.
interface.
test ttya Outputs an alphanumeric test pattern on A terminal must be connected to the port
test ttyb the system serial ports: ttya, serial port A; being tested to observe the output.
ttyb, serial port B
test Executes the keyboard selftest. Four keyboard LEDs should flash once and
keyboard a message should be displayed:
Keyboard Present.
test -all Sequentially tests system-configured Tests are sequentially executed in device-
devices containing selftest. tree order (viewed with the show-devs
command).

4.6.5 UPA Graphics Card
The UPA graphics card contains a built-in diagnostic test that is enabled through the
OBP. The UPA graphics card built-in diagnostic test verifies basic graphics
functionality without rebooting the operating system software.
To execute the built-in diagnostic test, the system must be at the ok prompt.
To initilize the UPA graphics card diagnostic:
1. At the ok prompt, type:

diag-switch? = true
ok% test screen

Verifying Console Mode for Frame Buffer Board
This will take a few minutes
Verifying Frame Buffer Memory used for console mode
This will take about two minutes
FFB Frame Buffer functional test passed
ok%
3. When the UPA graphics card on-board diagnostics are completed, type:

diag-switch? = false

4.7 OpenBoot Diagnostics
The OpenBoot diagnostic (OBDiag) is a menu-driven diagnostic tool that verifies:
■ Internal I/O system
■ Ethernet
■ Keyboard
■ Mouse
■ Diskette drive (floppy)
■ Parallel port
■ Serial ports
■ NVRAM
■ Audio
■ EIDE
■ Video
OBDiag performs root-cause failure analysis on the referenced devices by testing

internal registers, confirming subsystem integrity, and verifying device functionality.
Note – The OBDiag test result data captured in the following code examples
represent the test result data that is output when the system being tested is
connected to a remote shell window through a tip connection. When the system
being tested is tested in a stand-alone configuration, the test result data may differ.
4.7.1 Starting the OBDiag Menu

ok% setenv mfg-mode on

mfg-mode = on

diag-switch? = true

ok% setenv auto-boot? false

auto-boot? = false
ok% reset-all
5. Verify that the platform resets, as shown in CODE EXAMPLE 4-6.
CODE EXAMPLE 4-6 Reset Verification
ok setenv mfg-mode on
mfg-mode = on
ok setenv diag-switch? true
diag-switch? = true
ok setenv auto-boot? false
auto-boot? = false
ok reset-all
Resetting...
Software Power ON
@(#) Sun Ultra 5/10 UPA/PCI 3.11 Version 9 created 1998/03/06

10:31
Probing Memory Done
MEM BASE = 0000.0000.2000.0000
MEM SIZE = 0000.0000.1000.0000
MMUs ON
Copy Done
PC = 0000.01ff.f000.1ffc
PC = 0000.0000.0000.2040
Size = 0000.0000.0006.e160
ttya initialized
Probing Memory Bank #0 256 + 256: 512 Megabytes

CODE EXAMPLE 4-6 Reset Verification (Continued)
Probing /pci@1f,0/pci@1,1 at Device 1 pci108e,1000 network

Probing /pci@1f,0/pci@1 at Device 1 pci
Probing /pci@1f,0/pci@1/pci@1 at Device 0 pci108e,1000 SUNW,hme
Probing /pci@1f,0/pci@1/pci@1 at Device 1 Nothing there
Probing /pci@1f,0/pci@1/pci@1 at Device 4 SUNW,isptwo sd st

Probing /pci@1f,0/pci@1/pci@1 at Device a Nothing there
Probing /pci@1f,0/pci@1/pci@1 at Device b Nothing there
Probing /pci@1f,0/pci@1/pci@1 at Device c Nothing there
Probing /pci@1f,0/pci@1/pci@1 at Device d Nothing there
Probing /pci@1f,0/pci@1/pci@1 at Device e Nothing there
Probing /pci@1f,0/pci@1/pci@1 at Device f Nothing there

Probing /pci@1f,0/pci@1,1 at Device 1 pci108e,1000 network
Probing /pci@1f,0/pci@1 at Device 1 pci
Probing /pci@1f,0/pci@1/pci@1 at Device 0 pci108e,1000 SUNW,hme
Probing /pci@1f,0/pci@1/pci@1 at Device 4 SUNW,isptwo sd st
Probing /pci@1f,0/pci@1/pci@1 at Device a Nothing there
Probing /pci@1f,0/pci@1/pci@1 at Device b Nothing there

CODE EXAMPLE 4-6 Reset Verification (Continued)
Probing /pci@1f,0/pci@1/pci@1 at Device c Nothing there

Probing /pci@1f,0/pci@1/pci@1 at Device d Nothing there
Probing /pci@1f,0/pci@1/pci@1 at Device e Nothing there
Probing /pci@1f,0/pci@1/pci@1 at Device f Nothing there


OpenBoot 3.11, 512 MB memory installed, Serial #9337777.
Ethernet address 8:0:20:8e:7b:b1, Host ID: 808e7bb1.
ok
6. At the ok prompt, type obdiag. Verify that the OBDiag menu is displayed, as
shown in CODE EXAMPLE 4-7.
7. At the OBDiag menu prompt, type 16 to enable script-debug messages.
8. At the OBDiag menu prompt, type 18 to disable external loopback tests.
CODE EXAMPLE 4-7 OBDiag Menu
ok obdiag
stdin: fffe2008
stdout: fffe2010
loading code into: /pci@1f,0/pci@1,1/ebus@1
loading code into: /pci@1f,0/pci@1,1/ebus@1/eeprom@14,0
loading code into: /pci@1f,0/pci@1,1/ebus@1/ecpp@14,3043bc
loading code into: /pci@1f,0/pci@1,1/ebus@1/su@14,3062f8
loading code into: /pci@1f,0/pci@1,1/ebus@1/se@14,400000
loading code into: /pci@1f,0/pci@1,1/network@1,1
loading code into: /pci@1f,0/pci@1,1/ebus@1/fdthree@14,3023f0
loading code into: /pci@1f,0/pci@1,1/ebus@1/
SUNW,CS4231@14,200000
loading code into: /pci@1f,0/pci@1,1/ide@3
loading code into: /pci@1f,0/pci@1,1/ide@3/disk
loading code into: /pci@1f,0/pci@1,1/ide@3/cdrom
loading code into: /pci@1f,0/pci@1,1/SUNW,m64B@2
Debugging enabled
OBDiag Menu

CODE EXAMPLE 4-7 OBDiag Menu (Continued)
0..... PCI/Cheerio
1..... EBUS DMA/TCR Registers
2..... Ethernet
3..... Keyboard
4..... Mouse
5..... Floppy
6..... Parallel Port
7..... Serial Port A
8..... Serial Port B
9..... NVRAM
10..... Audio
11..... EIDE
12..... Video
13..... All Above
14..... Quit
15..... Display this Menu
16..... Toggle script-debug
17..... Enable External Loopback Tests
18..... Disable External Loopback Tests
Enter (0-13 tests, 14 -Quit, 15 -Menu) ===>
4.7.2 OB Diagnostics
The OBDiags are described in the following sections:
■ Section 4.7.2.1 “PCI/PCIO Diagnostic” on page 4-18
■ Section 4.7.2.2 “EBus DMA/TCR Registers Diagnostic” on page 4-19
■ Section 4.7.2.3 “Ethernet Diagnostic” on page 4-19
■ Section 4.7.2.4 “Keyboard Diagnostic” on page 4-20
■ Section 4.7.2.5 “Mouse Diagnostic” on page 4-21
■ Section 4.7.2.6 “Diskette Drive (Floppy) Diagnostic” on page 4-21
■ Section 4.7.2.7 “Parallel Port Diagnostic” on page 4-22
■ Section 4.7.2.8 “Serial Port A Diagnostic” on page 4-22
■ Section 4.7.2.9 “Serial Port B Diagnostic” on page 4-24
■ Section 4.7.2.10 “NVRAM Diagnostic” on page 4-25
■ Section 4.7.2.11 “Audio Diagnostic” on page 4-25
■ Section 4.7.2.12 “EIDE Diagnostic” on page 4-26
■ Section 4.7.2.13 “Video Diagnostic” on page 4-26
■ Section 4.7.2.14 “All Above Diagnostic” on page 4-27

4.7.2.1 PCI/PCIO Diagnostic
To start the PCI/PCIO diagnostic, type 0 at the OBDiag menu prompt. The PCI/
PCIO diagnostic performs the following:
1. vendor_ID_test – Verifies the PCIO ASIC vender ID is 108e.
2. device_ID_test – Verifies the PCIO ASIC device ID is 1000.
3. mixmode_read – Verifies the PCI configuration space is accessible as

half-word bytes by reading the EBus2 vender ID address.
4. e2_class_test – Verifies the address class code. Address class codes include
bridge device (0 x B, 0 x 6), other bridge device (0 x A and 0 x 80), and
programmable interface (0 x 9 and 0 x 0).
5. status_reg_walk1 – Performs a walk-one test on the status register with mask

0 x 280 (PCIO ASIC is accepting fast back-to-back transactions, DEVSEL timing is
0 x 1).
6. line_size_walk1 – Performs tests 1 through 5.
7. latency_walk1 – Performs a walk-one test on the latency timer.
8. line_walk1 – Performs a walk-one test on the interrupt line.
9. pin_test – Verifies the interrupt pin is logic-level high (1) after reset.
The following code example shows the PCI/PCIO output message.
CODE EXAMPLE 4-8 PCI/PCIO Output Message

Enter (0-12 tests, 13 -Quit, 14 -Menu) ===> 0
TEST='all_pci/PCIO_test'
SUBTEST='vendor_id_test'
SUBTEST='device_id_test'
SUBTEST='mixmode_read'
SUBTEST='e2_class_test'
SUBTEST='status_reg_walk1'
SUBTEST='line_size_walk1'
SUBTEST='latency_walk1'
SUBTEST='line_walk1'
SUBTEST='pin_test'

4.7.2.2 EBus DMA/TCR Registers Diagnostic
To start the DMA/TCR registers diagnostic, type 1 at the OBDiag menu prompt. The
EBus DMA/TCR registers diagnostic performs the following:
1. dma_reg_test – Performs a walking-ones bit test for the control status register,
address register, and byte-count register of each channel. Verifies the control
status register is set properly.
2. dma_func-test – Validates the DMA capabilities and FIFOs. The test is executed
in a DMA diagnostic loopback mode. Initializes the data of transmitting memory
with its address, performs a DMA read and write, and verifies that the data
received is correct. Repeats for four channels.
The following code example shows the EBus DMA/TCR registers output message.
CODE EXAMPLE 4-9 EBus DMA/TCR Registers Output Message
TEST='all_dma/ebus_test'
SUBTEST='dma_reg_test'
SUBTEST='dma_func_test'
4.7.2.3 Ethernet Diagnostic

To start the Ethernet diagnostic, type 2 at the OBDiag menu prompt. The Ethernet
diagnostic performs the following:
1. my_channel_reset – Resets the Ethernet channel.
2. hme_reg_test – Performs a walk-one test on the following registers set: global

register 1, global register 2, bmac xif register, bmac tx register, and mif register.
3. MAC_internal_loopback_test – Performs an Ethernet channel engine internal

loopback test.
4. 10_mb_xcvr_loopback_test – Enables the 10Base-T data present at the

transmit MII data inputs, to be routed back to the receive MII data outputs.
5. 100_mb_phy_loopback_test – Enables MII transmit data to be routed to the

MII receive data path.
6. 100_mb_twister_loopback_test – Forces the twisted-pair transceiver into

loopback mode.

The following code example shows the Ethernet output message.
CODE EXAMPLE 4-10 Ethernet Output Message
TEST=’ethernet_test’
SUBTEST=’my_channel_reset’
SUBTEST=’hme_reg_test’
SUBTEST=’global_reg1_test’
SUBTEST=’bmac_xif_reg_test’
SUBTEST=’bmac_tx_reg_test’
SUBTEST=’mif_reg_test’
SUBTEST=’mac_internal_loopback_test’
SUBTEST=’10mb_xcvr_loopback_test’
SUBTEST=’100mb_phy_loopback_test’
SUBTEST=’100mb_twister_loopback_test’
4.7.2.4 Keyboard Diagnostic

To start the keyboard diagnostic, type 3 at the OBDiag menu prompt. The keyboard
diagnostic consists of an external and internal loopback test. The external loopback
requires a passive loopback connector. The internal loopback verifies the keyboard
port by transmitting and receiving 128 characters.
The following code example shows the keyboard output message.
CODE EXAMPLE 4-11 Keyboard Output Message
setenv Enter (0-13 tests, 14 -Quit, 15 -Menu) ===> 3
TEST=’keyboard_test’
SUBTEST=’internal_loopback’

4.7.2.5 Mouse Diagnostic
To start the mouse diagnostic, type 4 at the OBDiag menu prompt. The mouse
diagnostic performs a keyboard-to-mouse loopback test.
The following code example shows the mouse output message.
CODE EXAMPLE 4-12 Mouse Output Message
TEST=’mouse_test’
SUBTEST=’mouse_loopback’
###OBDIAG_MFG_START###
STATUS=’FAILED’
ERRORS=’1 ‘
TTF=’1656 ‘
SPEED=’295.99 MHz’
PASSES=’1 ‘
MESSAGE=’Error: Timeout receiving a character’
4.7.2.6 Diskette Drive (Floppy) Diagnostic

To start the diskette drive (floppy) diagnostic, type 5 at the OBDiag menu prompt.
The floppy diagnostic verifies the diskette drive controller initialization. It also
validates the status of a selected disk drive and reads the diskette drive header.
The following code example shows the floppy test output message.
CODE EXAMPLE 4-13 Floppy Output Message
TEST='floppy_test'
SUBTEST='floppy_id0_read_test'

4.7.2.7 Parallel Port Diagnostic
To start the parallel port diagnostic, type 6 at the OBDiag menu prompt. The parallel
port diagnostic performs the following:
1. sio-passive-lb – Sets up the SuperIO configuration register to enable

extended/compatible parallel port select, then does a write 0, walk-one, write 0 x
ff to the data register. It verifies the results by reading the status register.
2. dma_read – Enables ECP mode, ECP DMA configuration, and FIFO test mode.
Transfers 16 bytes of data from memory to the parallel port device and then
verifies the data is in TFIFO.
The following code example shows the parallel port output message.
CODE EXAMPLE 4-14 Parallel Port Output Message
TEST='parallel_port_test'
SUBTEST='dma_read'
4.7.2.8 Serial Port A Diagnostic

To start the serial port A diagnostic, type 7 at the OBDiag menu prompt. The serial
port A diagnostic invokes the uart_loopback test. This test transmits and receives
128 characters and checks serial port A transaction validity.
The following code example shows the serial port A output message.
CODE EXAMPLE 4-15 Serial Port A Output Message
TEST='uarta_test'
BAUDRATE='1200'
SUBTEST='internal_loopback'
BAUDRATE='1800'
BAUDRATE='2400'
BAUDRATE='4800'

CODE EXAMPLE 4-15 Serial Port A Output Message (Continued)
BAUDRATE='9600'
BAUDRATE='19200'
BAUDRATE='38400'
BAUDRATE='57600'
BAUDRATE='76800'
BAUDRATE='115200'
BAUDRATE='153600'
BAUDRATE='230400'
BAUDRATE='307200'
BAUDRATE='460800'
Note – The serial port A diagnostic will stall if the TIP line is installed on serial
port A. The following code example shows the serial port A output message when
the TIP line is installed on serial port A.
CODE EXAMPLE 4-16 Serial Port A Output Message With TIP Line Installed
TEST='uarta_test'
'UART A in use as console - Test not run.'

4.7.2.9 Serial Port B Diagnostic
To start the serial port B diagnostic, type 8 at the OBDiag menu prompt. The serial
port B diagnostic is identical to the serial port A diagnostic.
The following code example shows the serial port B output message.
Note – The serial port B diagnostic will stall if the TIP line is installed on serial
port B.
CODE EXAMPLE 4-17 Serial Port B Output Message
TEST='uartb_test'
BAUDRATE='1200'
BAUDRATE='1800'
BAUDRATE='2400'
BAUDRATE='4800'
BAUDRATE='9600'
BAUDRATE='19200'
BAUDRATE='38400'
BAUDRATE='57600'
BAUDRATE='76800'
BAUDRATE='115200'
BAUDRATE='153600'
BAUDRATE='230400'
BAUDRATE='307200'
BAUDRATE='460800'

4.7.2.10 NVRAM Diagnostic
To start the NVRAM diagnostic, type 9 at the OBDiag menu prompt. The NVRAM
diagnostic verifies the NVRAM operation by performing a write and read to the
NVRAM.
The following code example shows the NVRAM output message.
CODE EXAMPLE 4-18 NVRAM Output Message
TEST='nvram_test'
SUBTEST='write/read_patterns'
SUBTEST='write/read_inverted_patterns'
4.7.2.11 Audio Diagnostic

To start the audio diagnostic, type 10 at the OBDiag menu prompt. The audio
diagnostic performs the following:
1. cs4231_test – Verifies the cs4231 internal registers.
2. Line-in to line-out external loopback test.
3. Microphone to headphone external loopback test.
The following code example shows the audio output message.
CODE EXAMPLE 4-19 Audio Output Message
TEST=’audio_test’
SUBTEST=’cs4231_test’
Codec_ID=’8a’
Version_ID=’a0’
SUBTEST=’external_lpbk’
STATUS=’FAILED’
ERRORS=’1 ‘

CODE EXAMPLE 4-19 Audio Output Message (Continued)
TTF=’505 ‘
PASSES=’1 ‘
MESSAGE=’Error: External Audio Test not run: Please set the mfg-
mode to sys-ext.’
4.7.2.12 EIDE Diagnostic

To start the EIDE diagnostic, type 11 at the OBDiag menu prompt. The EIDE
diagnostic validates both the EIDE chip and the IDE bus subsystem.
The following code example shows the EIDE output message.
CODE EXAMPLE 4-20 EIDE Output Message
TEST=’ide_test’
SUBTEST=’probe-cmd-device’
SUBTEST=’hd-and-cd-check’
4.7.2.13 Video Diagnostic

To start the video diagnostic, type 12 at the OBDiag menu prompt. The video
diagnostic validates the graphics.
The following code example shows the video output message.
CODE EXAMPLE 4-21 Video Output Message
TEST=’video_test’
Please connect the monitor and use ttya/ttyb when running this test
if you are using the screen it may be become unreadable
SUBTEST=’mach64-chip-id-vendor-id-check’
SUBTEST=’video-frame-buffer-test’

CODE EXAMPLE 4-21 Video Output Message (Continued)

SUBTEST=’mach64-walk-one-test’
SUBTEST=’mach64-walk-zero-test’
4.7.2.14 All Above Diagnostic

To start the all above diagnostic, type 13 at the OBDiag menu prompt. The all above
diagnostic validates the entire system.
The following code example shows the all above output message.
Note – The all above diagnostic will stall if the TIP line is installed on serial port A
or serial port B.
CODE EXAMPLE 4-22 All Above Output Message
TEST=’all_pci/cheerio_test’
SUBTEST=’vendor_id_test’
SUBTEST=’device_id_test’
SUBTEST=’mixmode_read’
SUBTEST=’e2_class_test’
SUBTEST=’status_reg_walk1’
SUBTEST=’line_size_walk1’
SUBTEST=’latency_walk1’
SUBTEST=’line_walk1’
SUBTEST=’pin_test’
TEST=’all_dma/ebus_test’
SUBTEST=’dma_reg_test’
SUBTEST=’dma_func_test’
TEST=’ethernet_test’
SUBTEST=’my_channel_reset’
SUBTEST=’hme_reg_test’
SUBTEST=’bmac_xif_reg_test’

CODE EXAMPLE 4-22 All Above Output Message (Continued)
SUBTEST=’bmac_tx_reg_test’
SUBTEST=’mif_reg_test’
SUBTEST=’mac_internal_loopback_test’
SUBTEST=’10mb_xcvr_loopback_test’
SUBTEST=’100mb_phy_loopback_test’
SUBTEST=’100mb_twister_loopback_test’
TEST=’keyboard_test’
STATUS=’FAILED’
ERRORS=’1 ‘
TTF=’1011 ‘
PASSES=’1 ‘
MESSAGE=’Error: Timeout receiving a character’
TEST=’floppy_test’
SUBTEST=’floppy_id0_read_test’
TEST=’parallel_port_test’
SUBTEST=’dma_read’
TEST=’uarta_test’
‘UART A in use as console - Test not run.’
TEST=’uartb_test’
BAUDRATE=’1200’
BAUDRATE=’1800’
BAUDRATE=’2400’
BAUDRATE=’4800’
BAUDRATE=’9600’
BAUDRATE=’19200’

TEST=’nvram_test’
SUBTEST=’write/read_patterns’
SUBTEST=’write/read_inverted_patterns’
SUBTEST=’cs4231_test’
Codec_ID=’8a’
Version_ID=’a0’
STATUS=’FAILED’
ERRORS=’1 ‘
TTF=’1030 ‘
PASSES=’1 ‘
MESSAGE=’Error: External Audio Test not run: Please set the mfg-
mode to sys-ext.’
TEST=’ide_test’
SUBTEST=’probe-cmd-device’
SUBTEST=’hd-and-cd-check’
TEST=’video_test’
Please connect the monitor and use ttya/ttyb when running this test
if you are using the screen it may be become unreadable
SUBTEST=’mach64-chip-id-vendor-id-check’
SUBTEST=’video-frame-buffer-test’

SUBTEST=’mach64-walk-one-test’
SUBTEST=’mach64-walk-zero-test’
4.7.3 Exiting the OBDiag Menu

ok% setenv mfg-mode off

mfg-mode = off

diag-switch? = false
ok% setenv auto-boot? true

auto-boot? = true
ok% reset-all

CHAPTER 5
Preparing for Component

Replacement
This chapter describes the activities you must do to prepare for removal and
replacement of internal system components.
Note – It is very important that you review the safety requirements, safety symbols,
and safety precautions in this chapter before you begin to remove or replace system
components.

■ Section 5.8 “Safety Requirements” on page 5-2
■ Section 5.9 “Safety Symbols” on page 5-2
■ Section 5.10 “Safety Precautions” on page 5-3
■ Section 5.11 “Tools Required” on page 5-5
■ Section 5.12 “Powering Off the System” on page 5-5
■ Section 5.13 “Removing the System Cover” on page 5-8
■ Section 5.14 “Attaching the Wrist Strap” on page 5-10
■ Section 5.15 “Removing a Filler Panel” on page 5-11
5-1
5.8 Safety Requirements
For protection, observe the following safety precautions when setting up the
equipment:
■ Follow all cautions, warnings, and instructions marked on the equipment.
■ Ensure that the voltages and frequency rating of the power receptacle match the
electrical rating label on the equipment.
■ Never push objects of any kind through openings in the equipment. They may
touch dangerous voltage points or short components, resulting in fire or electric
shock.
■ Refer servicing of equipment to qualified personnel.
5.9 Safety Symbols

The following symbols mean:
Caution – Risk of personal injury and equipment damage. Follow the instructions.
Caution – Hazardous voltages are present. To reduce the risk of electric shock and
danger to personal health, follow the instructions.
Caution – Hot surfaces. Avoid contact. Surfaces are hot and may cause personal
injury if touched.

5.10 Safety Precautions
Follow all safety precautions.
5.10.1 Modification to Equipment
Caution – Do not make mechanical or electrical modifications to the equipment.

Sun Microsystems is not responsible for regulatory compliance of a modified Sun
product.
5.10.2 Placement of a Sun Product
Caution – To ensure reliable operation of the Sun product and to protect it from
overheating, ensure equipment openings are not blocked or covered. Never place a
Sun product near a radiator or hot air register.
5.10.3 Power Cord Connection
Caution – Not all power cords have the same current ratings. Household extension
cords do not have overload protection. Do not use household extension cords with a
Sun product.
Caution – The power switch on this product functions as a standby type device
only. The power cord serves as the primary disconnect device for the system. Be sure
to connect the power cord into a grounded electrical receptacle that is nearby the
system and is readily accessible. Do not connect the power cord when the power
supply has been removed from the system chassis.
Chapter 5 Preparing for Component Replacement 5-3

Caution – The power supply of this product is not an autoranging power supply.
You must set the power supply voltage setting to either 115V or 230V on the voltage
select switch. Failure to correctly set this switch may result in damage to the
equipment.
5.10.4 Electrostatic Discharge
Caution – The boards and hard drives contain electronic components that are
extremely sensitive to static electricity. Ordinary amounts of static electricity from
clothing or the work environment can destroy components. Do not touch the
components themselves or any metal parts. Wear an antistatic wrist strap when
handling the drive assemblies, boards, or cards.
Caution – Wear an antistatic wrist strap and use an ESD-protected mat when
handling components. When servicing or removing system components, attach an
ESD strap to your wrist, then to a metal area on the chassis. Then disconnect the
power cord from the system and the wall receptacle. Following this caution
equalizes all electrical potentials with the system.
5.10.5 Lithium Battery
Caution – On Sun motherboards, a lithium battery is molded into the real-time

clock, SDS No. M48T59Y, MK48TXXB-XX, M48T18-XXXPCZ, or M48T59W-XXXPCZ.
Batteries are not customer-replaceable parts. They may explode if mistreated. Do not
dispose of a battery in fire. Do not disassemble a battery or attempt to recharge it.

5.11 Tools Required
The following tools are required to service the Ultra 10 system.
■ No. 2 Phillips screwdriver (magnetized tip suggested)
■ Needle-nose pliers
■ Grounding wrist strap
■ Digital voltage meter (DVM)
■ Antistatic mat
Place ESD-sensitive components such as the motherboard, circuit cards, hard drives,
and NVRAM/TOD on an antistatic mat. The following items can be used as an
antistatic mat:
■ Bag used to wrap a Sun replacement part
■ Shipping container used to package a Sun replacement part
■ Inner side (metal part) of the system cover
■ Sun ESD mat, part number 250-1088 (available through your Sun sales
representative)
■ Disposable ESD mat; shipped with replacement parts or optional system features
5.12 Powering Off the System

To power off the system:
1. Back up system files as necessary.

See Solaris Handbook for SMCC Peripherals, part number 802-7675.
Caution – Exit from the operating system before turning off system power. Failure
to do so may result in data loss.
2. Press the system standby switch (FIGURE 5-2) or press the Sun Type-5 keyboard
Standby key (FIGURE 5-3) or the Sun I/O Type-6 keyboard Power key (FIGURE 5-4).
Note – For the system to gracefully shut down by the standby switch or the Sun
Type-5/6 keyboard Standby/Power key, UNIX must be operating. If the system is in
POST, the standby switch and the Standby key are inoperative.

Caution – Pressing the standby switch or pressing the Sun Type-5/6 keyboard
Standby/Power key does not remove all power from the system; a trickle voltage
remains in the power supply. To remove all power from the system, set the power
switch to the off position.
Standby switch
FIGURE 5-2 System Standby Switch
Standby key

Power key

Screen Lock
SysRq Break

Up Lock
` 1 2 3 4 5 6 7 8 9 0 - =

Down
[ ] \ Home PgUp

Caps Lock ; '

End PgDn

Com- Alt
pose Graph Ins Del
3. Set the system power switch to the off position (FIGURE 5-5).
Note – For a typical system shutdown or restart, it is not necessary to set the
power switch to the off position.
Voltage selector switch
Power switch
FIGURE 5-5 System Power Switch

a. The front panel power indicator LED is off.
b. The system fans are not spinning.
Caution – Disconnect the AC power cord prior to servicing system components.
5. Turn off the power to the monitor and any peripheral equipment.
6. Disconnect cables to any peripheral equipment.
5.13 Removing the System Cover

Remove the system cover as follows (FIGURE 5-6):
1. Position the system upside-down on its top.
2. Using a No. 2 Phillips screwdriver, remove the four screws securing the system
cover to the chassis.
3. Disengage the system cover from the cover tabs.
4. Lift the system cover straight up. Set it aside in a safe place.

System cover
Screw (4)
Cover tab
FIGURE 5-6 Removing and Replacing the System Cover

5.14 Attaching the Wrist Strap
Caution – Wear an antistatic wrist strap and use an ESD-protected mat when
handling components. When servicing or removing system components, attach an
ESD strap to your wrist, then to a metal area on the chassis. Then disconnect the
power cord from the system and the wall receptacle. Following this caution
equalizes all electrical potentials with the system.
1. Unwrap the first two folds of the wrist strap; wrap the adhesive side firmly
against your wrist.
2. Peel the liner from the copper foil at the opposite end of the wrist strap.
3. Attach the copper end of the wrist strap to the chassis (FIGURE 5-7).
4. Disconnect the AC power cord from the system.
Copper end
FIGURE 5-7 Attaching the Wrist Strap to the Chassis

5.15 Removing a Filler Panel
1. Remove the system cover.
See Section 5.13 “Removing the System Cover” on page 5-8.
2. Remove the CD-ROM drive.

See Section 7.3.1 “Removing a CD-ROM Drive” on page 7-13.
3. Remove a filler panel as follows (FIGURE 5-8 and FIGURE 5-9):
a. Using a No. 2 Phillips screwdriver, remove the two screws (located at the
system base) securing the lower bezel to the chassis.
b. Remove the lower bezel from the system.
c. Locate the two tabs securing the upper bezel to the chassis. Remove the upper
bezel from the chassis by pressing the tabs outward while lifting the bottom of
the bezel upward and out.
d. Remove the plastic filler panel from the upper bezel.
e. Using a screwdriver, break the metal filler panel from the chassis.

Screw (2)
Lower bezel
Upper bezel
Plastic bezel
filler panel
Tab (2)
FIGURE 5-8 Removing a Plastic Filler Panel

Metal
filler
panel
FIGURE 5-9 Removing a Metal Filler Panel
4. Replace the CD-ROM drive.

See Section 7.3.2 “Replacing a CD-ROM Drive” on page 7-14.
5. Replace the system cover.

See Section 10.1 “Replacing the System Cover” on page 10-1.

CHAPTER 6
Major Subassemblies
This chapter describes how to remove and replace the major subassemblies.

■ Section 6.1 “Power Supply” on page 6-1
■ Section 6.2 “Cable Assemblies” on page 6-4
■ Section 6.3 “Speaker Assembly” on page 6-11
■ Section 6.4 “CPU Fan Assembly” on page 6-13
■ Section 6.5 “Front Bezel” on page 6-15
■ Section 6.6 “Rear Hard Drive Bracket” on page 6-17
6.1 Power Supply

To remove and replace the power supply, proceed as follows.
6.1.1 Removing the Power Supply

Caution – Use proper ESD grounding techniques when handling components. Wear
an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.
6-1
2. Remove the power supply as follows (FIGURE 6-1):
a. Disconnect the power cable connectors from the following (not illustrated):
■ CD-ROM drive
■ Diskette drive
■ Hard drive(s)
■ Motherboard (J12 and J13)
b. Set the system on its side.
c. Using a No. 2 Phillips screwdriver, remove the four screws securing the power
supply to the chassis.
d. Push the power supply forward to disengage the mounting hooks and lift it
from the chassis.
Power
Power supply cables
Screw (4)
FIGURE 6-1 Removing and Replacing the Power Supply

6.1.2 Replacing the Power Supply
1. Replace the power supply as follows (FIGURE 6-1):
Caution – Verify the voltage selector switch is set to the correct setting: 115V or
230V. Plugging a 115V power cord into a 230V connector will severely damage the
system.
a. Position the power supply into the chassis.
b. Push the power supply toward the chassis rear, ensuring that the power supply
mounting hooks engage into the chassis mounting slots.
c. Using a No. 2 Phillips screwdriver, replace the four screws securing the power
supply to the chassis.
d. Connect the power cable connectors to the following (not illustrated):

■ CD-ROM drive
■ Diskette drive
■ Hard drive(s)
■ Motherboard (J12 and J13)
Note – Verify that the cable connectors are oriented properly by aligning the
connector keys.
2. Detach the wrist strap, replace the system cover, and power on the system as
decribed in Chapter 10.
Chapter 6 Major Subassemblies 6-3

6.2 Cable Assemblies
To remove and replace the diskette drive cable assembly, the hard drive cable
assembly, the serial/parallel cable assembly, and the audio cable assembly, proceed
as follows.
Note – The Ultra 10 diskette drive cable assembly, hard drive cable assembly, serial/
parallel cable assembly, and CD-ROM drive cable assembly are part of service kit
370-3266 and cannot be ordered separately.
6.2.1 Removing the Diskette Drive Cable Assembly

2. Remove the diskette drive cable assembly connectors from the following
(FIGURE 6-2):
■ Diskette drive
■ Motherboard (J16) (not illustrated)
3. Remove the diskette drive cable assembly from the chassis.

Diskette drive cable assembly
FIGURE 6-2 Removing and Replacing the Diskette Drive Cable Assembly

6.2.2 Replacing the Diskette Drive Cable Assembly
Caution – The diskette drive cable assembly connector labeled “A” connects to the
diskette drive only.
1. Replace the diskette drive cable assembly as follows (FIGURE 6-2):
a. Position the diskette drive cable assembly into the chassis.
b. Connect the diskette drive cable assembly connectors to the following:

■ Motherboard (J16)
■ Diskette drive
connector keys.
6.2.3 Removing the Hard Drive Cable Assembly

2. Disconnect the hard drive cable assembly connectors from the following
(FIGURE 6-3):
■ Hard drive(s)
■ Motherboard (J15, not illustrated)
3. Remove the hard drive cable assembly from the chassis.

Hard drive cable assembly
FIGURE 6-3 Removing and Replacing the Hard Drive Cable Assembly
6.2.4 Replacing the Hard Drive Cable Assembly

1. Replace the hard drive cable assembly as follows (FIGURE 6-3):
a. Position the hard drive cable assembly into the chassis.
b. Connect the hard drive cable assembly connectors to the following:

■ Hard drive(s)
connector keys.

6.2.5 Removing the Serial/Parallel Cable Assembly
2. Remove the serial/parallel cable assembly as follows (FIGURE 6-4):
a. Disconnect the serial/parallel cable assembly connector from the motherboard

(J7/J8).
b. Using a No. 2 Phillips screwdriver, remove the screw securing the serial/
parallel cable connector-assembly to the chassis. Remove the connector
assembly from the chassis opening.
c. Remove the serial/parallel cable assembly from the chassis.
Parallel connector
Serial connector
FIGURE 6-4 Removing and Replacing the Serial/Parallel Cable Assembly

6.2.6 Replacing the Serial/Parallel Cable Assembly
1. Replace the serial/parallel cable assembly as follows (FIGURE 6-4):
a. Position the serial/parallel cable assembly into the chassis.
b. Position the serial/parallel cable connector-assembly into the chassis opening.

Using a No. 2 Phillips screwdriver, replace the screw securing the connector
assembly to the chassis.
c. Connect the serial/parallel cable assembly connector to the motherboard (J7/J8).
connector keys.
6.2.7 Removing the Audio Cable Assembly

2. Remove the audio cable assembly as follows:
a. Remove the audio cable assembly connectors from the following ( FIGURE 6-5):
■ CD-ROM drive
b. Remove the audio cable assembly from the chassis.

Audio cable
(CD-ROM drive connector)
Audio cable
(Motherboard connector J5)
FIGURE 6-5 Removing and Replacing the Audio Cable
6.2.8 Replacing the Audio Cable Assembly

1. Replace the audio cable assembly as follows (FIGURE 6-5):
a. Position the audio cable assembly into the chassis.
b. Connect the audio cable assembly connectors to the following:

■ CD-ROM drive
connector keys.

6.3 Speaker Assembly
To remove and replace the speaker assembly, proceed as follows.
6.3.1 Removing the Speaker Assembly

2. Remove the speaker assembly as follows (FIGURE 6-6):
a. Disconnect the speaker cable from the motherboard (J18).
b. Grasp the speaker magnet and pull the speaker away from the chassis while
moving it downward.
c. Remove the speaker assembly.

Speaker rim
Tab (3)
Speaker assembly
FIGURE 6-6 Removing and Replacing the Speaker Assembly
6.3.2 Replacing the Speaker Assembly

1. Replace the speaker assembly as follows (FIGURE 6-6):
a. Position the speaker assembly.
b. Grasp the speaker magnet and slide the speaker upwards under the three metal
chassis speaker tabs until the lower tab engages the outer rim of the speaker.
c. Connect the speaker cable to the motherboard (J18).

6.4 CPU Fan Assembly
To remove and replace the CPU fan assembly, proceed as follows.
6.4.1 Removing the CPU Fan Assembly

2. Remove the CPU fan assembly as follows (FIGURE 6-7):
a. Remove all PCI cards.

See Section 8.5.1 “Removing a PCI Card” on page 8-12.
b. Remove the graphics card.

See Section 8.4.1 “Removing a Graphics Card” on page 8-9.
c. Disconnect the CPU fan assembly power-cable connector from the motherboard
(J19).
d. Press the fan retaining clip and remove the CPU fan assembly from the chassis.

CPU fan assembly
Retaining
clip
FIGURE 6-7 Removing and Replacing the CPU Fan Assembly
6.4.2 Replacing the CPU Fan Assembly

1. Replace the CPU fan assembly as follows (FIGURE 6-7):
a. Position the CPU fan assembly, ensuring that the fan retaining clip is aligned
with the chassis retaining-clip hole.
b. Secure the fan retaining clip to the chassis.
c. Connect the CPU fan assembly power-cable connector to the motherboard (J19).
d. Replace the graphics card.

See Section 8.4.2 “Replacing a Graphics Card” on page 8-10.
e. Replace all PCI cards.

See Section 8.5.2 “Replacing a PCI Card” on page 8-13.

6.5 Front Bezel
To remove and replace the front bezel, proceed as follows.
6.5.1 Removing the Front Bezel

2. Remove the CD-ROM drive.

See Section 7.3.1 “Removing a CD-ROM Drive” on page 7-13.
3. Remove the front bezel as follows (FIGURE 6-8):
a. Disconnect the standby switch connector from the motherboard.
b. Remove the lower front bezel and detach the upper front bezel from the chassis
as described in Section 5.15 “Removing a Filler Panel” on page 5-11.

Lower bezel Standby switch
connector
Upper bezel
FIGURE 6-8 Removing and Replacing the Front Bezel
6.5.2 Replacing the Front Bezel

1. Replace the front bezel as follows (FIGURE 6-8):
a. Position the lower front bezel and upper front bezel to the chassis.
b. Thread the standby switch connector and wires through the chassis access hole
and connect the standby switch connector to the motherboard.
c. Using a No. 2 Phillips screwdriver, replace the two screws (located at the unit
base) securing the lower front bezel to the chassis.
d. Attach the upper front bezel to the chassis by pressing in the upper bezel tabs
while lifting the bottom of the bezel down and in.
2. Replace the CD-ROM drive.

See Section 7.3.2 “Replacing a CD-ROM Drive” on page 7-14.

6.6 Rear Hard Drive Bracket
To remove and replace the rear hard drive bracket, proceed as follows.
6.6.1 Removing the Read Hard Drive Bracket

2. Remove the rear hard drive.

See Section 7.2.1 “Removing a Hard Drive” on page 7-4.
3. Using a No. 2 Phillips screwdriver, remove the trapezoidal support bracket.
4. Remove the rear hard drive bracket as follows (FIGURE 6-9):
a. Using a No. 2 Phillips screwdriver, remove the two screws securing the rear
hard drive bracket to the chassis.
b. While placing your hand under the rear hard drive bracket for support, use a
No. 2 Phillips screwdriver to remove the screw securing the rear hard drive
bracket to the chassis bracket support.
c. Remove the rear hard drive bracket.

Trapezoidal
support bracket
Screw
Screw (2)
Drive bracket
Part number location
FIGURE 6-9 Removing and Replacing the Rear Hard Drive Bracket

6.6.2 Replacing the Rear Hard Drive Bracket
Note – If you are installing a 9.1-GByte or larger capacity replacement or upgrade

hard drive in the rear position, a special bracket is required to ensure cooling. This
bracket is already installed in new Ultra 10 systems and can be identified by the
manufacturing part number, F370-3721, stamped on the side of the bracket.
1. Replace the rear hard drive bracket as follows (FIGURE 6-9):
a. Position the rear hard drive bracket.
b. While placing your hand under the rear hard drive bracket for support, use a
No. 2 Phillips screwdriver to replace the screw securing the rear hard drive
bracket to the chassis bracket support.
c. Using a No. 2 Phillips screwdriver, replace the two screws securing the rear
hard drive bracket to the chassis.

CHAPTER 7
Storage Devices
This chapter describes how to remove and replace the Ultra 10 storage devices.

■ Section 7.1 “Diskette Drive” on page 7-1
■ Section 7.2 “Hard Drives” on page 7-4
■ Section 7.3 “CD-ROM Drive” on page 7-13
7.1 Diskette Drive

To remove and replace the diskette drive, proceed as follows.
7.1.1 Removing the Diskette Drive

2. Remove the diskette drive as follows (FIGURE 7-1):
a. Disconnect the following:

■ Diskette drive cable assembly from the diskette drive
■ Power cable from the diskette drive
7-1
b. Using a No. 2 Phillips screwdriver, remove the screw securing the diskette
drive to the diskette drive bracket.
c. Remove the diskette drive through the chassis rear.
Diskette drive
Screw
FIGURE 7-1 Removing and Replacing the Diskette Drive
7.1.2 Replacing the Diskette Drive
Note – Read the diskette drive product guide for information about jumpers, switch
settings, or other installation tasks.
1. Replace the diskette drive as follows (FIGURE 7-1):
a. Position the diskette drive into the diskette drive bracket.
b. Using your fingers, push the diskette drive toward the chassis front.

c. Using a No. 2 Phillips screwdriver, replace the screw securing the diskette drive
to the diskette drive bracket.
d. Connect the following:

■ Diskette drive cable assembly to the diskette drive.
■ Power cable to the diskette drive.
connector keys.
Chapter 7 Storage Devices 7-3

7.2 Hard Drives
To remove and replace a hard drive, proceed as follows.
7.2.1 Removing a Hard Drive

2. Remove the hard drive.

■ Chassis rear (primary)—go to Step 3
■ Chassis front (secondary)—go to Step 4
3. Remove the primary hard drive from the chassis rear to provide clearance as
follows (FIGURE 7-2):
a. Disconnect the power cable connector and the hard drive cable connector from
the hard drive. Move the power and hard drive cables out of the way.
b. Using a No. 2 Phillips screwdriver, remove the two screws securing the hard
drive bracket to the chassis.
c. Using a No. 2 Phillips screwdriver, remove the four screws securing the hard
drive to the hard drive bracket.
d. Remove the hard drive from the hard drive bracket.
e. Place the hard drive on an antistatic mat.

Hard drive Screw (4)
FIGURE 7-2 Removing and Replacing a Primary Hard Drive (Chassis Rear)
4. Remove the secondary hard drive from the chassis front as follows ( FIGURE 7-3):
a. Disconnect the power cable connector and the hard drive cable connector from
the hard drive. Move the power and hard drive cables out of the way.
b. Using a No. 2 Phillips screwdriver, remove the two screws securing the hard
c. Slide the hard drive and the hard drive bracket toward the chassis rear until it
clears the chassis.
d. Remove the hard drive and hard drive bracket.
e. Using a No. 2 Phillips screwdriver, remove the four screws securing the hard
f. Remove the hard drive from the hard drive bracket.
g. Place the hard drive on an antistatic mat.

Screw (2)
Hard drive
Hard drive bracket
Screw (4)
Hard drive Power cable

cable assembly
FIGURE 7-3 Removing and Replacing a Secondary Hard Drive (Chassis Front)
7.2.2 Replacing a Hard Drive
Note – Read the hard drive product guide for information about jumpers, switch
settings, or other installation tasks.
Note – Prior to replacing a hard drive, verify that the back panel mode-select
jumper is set to CS.
1. Replace the hard drive.

■ Chassis rear (primary)—go to Step 2
■ Chassis front (secondary)—go to Step 3

2. Replace the primary hard drive into the chassis rear as follows ( FIGURE 7-2):
Note – If the existing rear hard drive is being replaced with a 9.1-Gbyte or larger
capacity hard drive, ensure that the existing rear drive bracket is removed and the
replacement drive bracket (part number 370-3721) is installed. See Section 6.6 “Rear
Hard Drive Bracket” on page 6-17.
a. Position the hard drive into the hard drive bracket.
Note – Ensure the correct hard drive orientation.
b. Using a No. 2 Phillips screwdriver, replace the four screws securing the hard
c. Position the power cable and the hard drive cable.
d. Connect the power cable connector and the hard drive cable connector to the
hard drive. Dress cables.
connector keys.
3. Replace the secondary hard drive into the chassis front as follows ( FIGURE 7-3):
a. Position the hard drive into the hard drive bracket.
b. Using a No. 2 Phillips screwdriver, replace the four screws securing the hard
c. Position the hard drive and hard drive bracket into the chassis.
d. Slide the hard drive and hard drive bracket toward the chassis front.
e. Using a No. 2 Phillips screwdriver, replace the two screws securing the hard
f. Connect the power and hard drive cable connectors to the hard drive. Dress
cables.
connector keys.

7.2.3 Hard Drive Mirroring
This section describes the requirements and constraints of a hard drive mirroring
solution that utilizes Solstice DiskSuite™ software.
7.2.3.1 Hard Drive Mirroring Configuration

The IDE subsystem of the Ultra 10 system has two independent channels designated
“primary” and “secondary”. On the Ultra 10 motherboard there are two separate
connectors for each channel, allowing each channel to support two devices. One
device may be jumpered as “master” (device 0) and the other as “slave” (device 1).
When mirroring hard drives in an Ultra 10 system, use this hardware configuration:
■ Primary channel—One hard drive jumpered as master
■ Secondary channel—One hard drive jumpered as master
Two IDE cables are required for this configuration. Each cable is connected to the
motherboard at one end and to a hard drive (jumpered as master) at the “MASTER”
connector. FIGURE 7-4 shows this hardware configuration (with an optional CD-ROM
drive jumpered as a slave device on the secondary channel).
Primary IDE channel
Primary hard drive Motherboard J15

(master-device 0) (primary channel)
Secondary IDE channel
Optional CD-ROM Primary hard drive Motherboard J14

(slave-device 1) (master-device 0) (secondary channel)
FIGURE 7-4 Hard Drive Mirroring Configuration
7.2.3.2 Hardware Considerations

This section describes special considerations and requirements for hardware when
mirroring hard drives in an Ultra 10 system.
Note – The two hard drives that are mirrored cannot be on the same channel. Both
hard drives must be jumpered as the master device on two separate channels.

Note – If a CD-ROM drive is included in an Ultra 10 system with this hard drive
mirroring configuration, the CD-ROM drive must be jumpered as a slave device on
either the primary or the secondary channel.
Note – If a mirrored Ultra 10 system includes a CD-ROM drive, the alias for the CD-
ROM drive must be altered at the OBP level before a user can boot using the boot
cdrom command. The procedure for altering the alias immediately follows this
note.
Changing a CD-ROM Drive Alias
If a mirrored Ultra 10 system includes a CD-ROM drive, the alias for the CD-ROM
drive must be altered at the OBP level before a user can boot using the boot cdrom
command. This is because the alias for the CD-ROM drive is hardcoded with the
assumption that the CD-ROM drive is connected as the master device on the
secondary channel (/pci@1f,0/pci@1,1/ide@3/cdrom@2,0:f). In a mirrored
configuration, this is not true because the CD-ROM is jumpered as the slave device
on the primary or secondary channel. Therefore, the alias is incorrect and must be
altered. Use the nvalias command to alter a CD-ROM drive alias as follows:
■ To change the alias for a CD-ROM drive on the primary channel, type:
nvalias cdrom /pci@1f,0/pci@1,1/ide@3/cdrom@1,0:f
■ To change the alias for a CD-ROM drive on the secondary channel, type:
nvalias cdrom /pci@1f,0/pci@1,1/ide@3/cdrom@3,0:f
7.2.3.3 Required Software and Patches

The supported software version number is Solstice DiskSuite 4.1.
The IDE drivers have been modified and made more robust for mirroring support on
the Ultra 10 system. The appropriate driver patch must be installed on the system
before using the mirroring features of Solstice DiskSuite software. These required
patch numbers are:
■ For Solaris 7—Patch number 107121
■ For Solaris 2.6—Patch number 106407
■ For Solaris 2.5.1—Patch number 106197
The latest versions of these patches are available for download from SunSolve
Online at: http://sunsolve.Corp.Sun.COM

7.2.3.4 Software Constraints
When using Solstice DiskSuite 4.1 software, it is recommended that you have a
minimum of three metadevice databases to maintain a “quorum.” It is further
recommended that the databases be maintained on different disks, which would
require three IDE hard drives in the system. Because the Ultra 10 system can support
only two hard drives, only two metadevice databases are possible. This limitation
has a known impact.
Solstice DiskSuite software will function with only two disks and two database
replicas. However, if one disk fails, there is not a quorum. No problem with the
system will be seen until after the system is powered down. After the system is
powered down, it will not power on and boot in multiuser mode without system
administration intervention.
For example, if the quorum is not seen during boot due to a hard drive failure, the
system boots in single-user mode. The problem is reported by the system when the
machine is rebooted. The output is similar to the following example:
ok boot
Hostname: demo
metainit: demo: stale databases
Use metadb to delete databases which are broken.
Ignore any "Read-only file system" error messages.
Reboot the system when finished to reload the metadevice

database. After reboot, repair any broken database replicas
which were deleted.
Type Ctrl-d to proceed with normal startup,(or give root

password for system maintenance):
If you see the message shown above, use the recovery procedure in the next section
to replace broken database replicas.

7.2.3.5 Recovery Procedure for Broken Database Replicas
The high-level recovery steps are as follows:
■ Delete the broken database replica and reboot.
■ Repair or replace the problem hard drive.
■ Add back the database replica.
Detailed instructions for the broken database recovery are as follows:
1. After you see the error messages described in the previous section, type your root
password to enter system maintenance mode at the following prompt:
Type Ctrl-d to proceed with normal startup,

(or give root password for system maintenance): <root password>
The following message then displays:

Entering System Maintenance Mode
2. Type the metadb command as follows to look at the databases to determine which
database replica is broken.
# usr/opt/SUNWmd/metadb -i
flags first blk block count
a p l 1050 1034 /dev/dsk/c0t3d0s3
M p unknown unknown /dev/dsk/c1t2d0s3
In the example shown above, the system can no longer detect the state database
replica on slice /dev/dsk/c1t2d0s3, which is part of the failed disk. The metadb
command flags the replicas on this slice as having a problem with the master blocks.
3. Delete the database replica on the bad disk using the -d option of the metadb
command as follows. Using the example, you would type:
# usr/opt/SUNWmd/metadb -d -f /dev/dsk/c1t2d0s3
metadb: demo:/etc/opt/SUNWmd/mddb.cf.new: Read-only file system
At this point, the root (/) file system is read-only. You can ignore any mddb.cf error
messages that are displayed.

4. Verify that the replica was deleted using the metadb command again:
# usr/opt/SUNWmd/metadb -i
a m p lu 1050 1034 /dev/dsk/c0t3d0s3
5. Reboot the system.
6. Halt the system and replace the failed hard drive (refer to Section 7.2 “Hard
Drives” on page 7-4).
# halt
7. After replacing the failed hard drive, power on and reboot the system.
ok boot
8. Use the format or the fmthard command to partition the hard drive as it was
before the failure. Using the example, you would type:
# format /dev/rdsk/c1t2d0s0
9. Use the metadb command to add back the state database replicas and to
determine that the state database replicas are correct. Using the example, you
would type:
# usr/opt/SUNWmd/metadb -a /dev/dsk/c1t2d0s3
a m p luo 16 1034 /dev/dsk/c0t3d0s3
a u 16 1034 /dev/dsk/c1t2d0s3

7.3 CD-ROM Drive
To remove and replace a CD-ROM drive, proceed as follows.
7.3.1 Removing a CD-ROM Drive

2. Remove the CD-ROM drive as follows (FIGURE 7-5):
a. Remove the following from the rear of the CD-ROM drive:

■ CD-ROM drive cable connector
■ Power cable connector
■ Audio cable connector
b. Using a No. 2 Phillips screwdriver, remove the four screws securing the CD-
ROM drive to the CD-ROM drive bracket.
c. Place your fingers on the rear of the CD-ROM drive. Push the CD-ROM drive
toward the chassis front and remove.
d. Place the CD-ROM drive on an antistatic mat.

CD-ROM drive Screw (4)
Audio cable
CD-ROM drive cable

Power cable
FIGURE 7-5 Removing and Replacing a CD-ROM Drive
7.3.2 Replacing a CD-ROM Drive
Note – Prior to replacing the CD-ROM drive, verify that the CD-ROM drive back
panel mode-select jumper is set to MA.
1. Replace the CD-ROM drive as follows (FIGURE 7-5):
a. Position the CD-ROM drive into the CD-ROM drive bracket. Push the
CD-ROM drive toward the chassis rear.
b. Using a No. 2 Phillips screwdriver, replace the four screws securing the CD-
ROM drive to the bracket.

c. Connect the following to the rear of the CD-ROM drive:
■ CD-ROM drive cable connector
■ Power cable connector
■ Audio cable connector
connector keys.

CHAPTER 8
Motherboard and Component

Replacement
This chapter describes how to remove and replace the Ultra 10 motherboard and
motherboard components.

■ Section 8.1 “CPU Module” on page 8-1
■ Section 8.2 “NVRAM/TOD” on page 8-4
■ Section 8.3 “DIMM” on page 8-6
■ Section 8.4 “Graphics Card” on page 8-9
■ Section 8.5 “PCI Card” on page 8-12
■ Section 8.6 “PCI Riser Board” on page 8-15
■ Section 8.7 “Motherboard” on page 8-17
8.1 CPU Module

To remove and replace the CPU module, proceed as follows.
8.1.1 Removing the CPU Module

8-1
Caution – The static random access memory (SRAM) heatsinks are extremely
fragile. Do not touch the SRAM heatsinks.
2. If necessary, remove any PCI cards installed to provide clearance.

3. Remove the CPU module as follows (FIGURE 8-1):
a. Using a No. 2 Phillips screwdriver, remove the screw securing the hold-down
brace to the riser. Remove the hold-down brace.
b. Using a No. 2 Phillips screwdriver, remove the screw securing the CPU module
hold-down clip to the motherboard. Remove the CPU module hold-down clip.
c. Using your fingers, gently and evenly lift the edges of the CPU module to
loosen it from the motherboard CPU connectors MJ1 and MJ2.
d. Lift the CPU module upward from the motherboard CPU connectors until it
clears the system chassis.
e. Place the CPU module on an antistatic mat.

Hold-down brace Screw
CPU module
Front edges
Motherboard CPU connector (2)
Riser
FIGURE 8-1 Removing and Replacing the CPU Module
8.1.2 Replacing the CPU Module

1. Replace the CPU module as follows (FIGURE 8-1):
a. Position the CPU module onto the motherboard CPU connectors MJ1 and MJ2.
b. Grasping the CPU module, gently and evenly press on the CPU module edges
until the CPU module begins to seat.
c. Using both hands, press the CPU module downward evenly until it is properly
seated in the motherboard CPU connectors.
d. Push the hold-down clip forward over the edge of the CPU module.
Chapter 8 Motherboard and Component Replacement 8-3

e. Replace the hold-down clip. Using a No. 2 Phillips screwdriver, replace the
screw securing the CPU module hold-down clip to the motherboard.
f. Replace the hold-down brace. Using a No. 2 Phillips screwdriver, replace the
screw securing the hold-down brace to the riser.
2. Replace any PCI card(s) removed.

Note – If you upgrade with a replacement CPU module that is faster than 420 MHz,
and the system is using either the Solaris 2.5.1 or 2.6 operating environments,
software patches are required for those Solaris releases to run at the faster CPU
speed. You can order the software patch CDs using part number 704-6657 (for
Solaris 2.5.1) or 704-6658 (for Solaris 2.6). Refer to the instructions included with the
CD in the Solaris 2.5.1 and 2.6 for 420+ MHz Systems Installation Guide.
8.2 NVRAM/TOD
To remove and replace the NVRAM/TOD, proceed as follows.
8.2.1 Removing the NVRAM/TOD

2. Remove the NVRAM/TOD as follows (FIGURE 8-2):
a. Remove any PCI cards installed.

b. Locate the NVRAM/TOD and carrier on the motherboard.
c. Grasp the NVRAM/TOD carrier at each end and pull it straight up, gently
wiggling it as necessary.

3. Place the NVRAM/TOD and carrier on an antistatic mat.
NVRAM/TOD
Carrier
Motherboard socket
FIGURE 8-2 Removing and Replacing the NVRAM/TOD
8.2.2 Replacing the NVRAM/TOD

1. Replace the NVRAM/TOD as follows (FIGURE 8-2):
a. Position the NVRAM/TOD carrier on the motherboard.
b. Carefully insert the NVRAM/TOD carrier into the motherboard socket.
Note – The carrier is keyed so the NVRAM/TOD can be installed only one way.
c. Push the NVRAM/TOD into the carrier until it is properly seated.
2. Replace any PCI card(s) removed.


8.3 DIMM
To remove and replace a DIMM, proceed as follows.
Caution – DIMMs consist of electronic components that are extremely sensitive to

static electricity. Ordinary amounts of static electricity from clothing or work
environment can destroy the DIMM.
Caution – When removing a DIMM, an identical replacement is required. The

replacement DIMM must be inserted into the same socket as the removed DIMM.
Caution – Each DIMM bank must contain 2 DIMMs of equal density (for example,
two 32-Mbyte DIMMs) to function properly. Do not mix DIMM capacities in any
bank. For best system performance, install 4 identical DIMMs in the 2 banks.
The following table identifies DIMM banks and slot pairs.
TABLE 8-1 DIMM Banks and Slot Pairs
Bank Slot Pairs
0 DIMM1 and DIMM2
1 DIMM3 and DIMM4
8.3.1 Removing a DIMM
Caution – Handle DIMMs only by the edges. Do not touch the DIMM components
or metal parts. Always wear a grounding strap when handling a DIMM.

2. Locate the DIMM to be removed.
3. Push the ejection levers away from the DIMM (FIGURE 8-3).
DIMM
Ejection lever (2)
FIGURE 8-3 Removing and Replacing a DIMM
4. Remove the DIMM from the motherboard connector.
5. Place the DIMM on an antistatic mat.

8.3.2 Replacing a DIMM
Caution – Do not remove any DIMM from the antistatic container until you are
ready to install it on the motherboard. Handle DIMMs only by their edges. Do not
touch DIMM components or metal parts. Always wear a grounding strap when
handling DIMMs.
1. Remove the DIMM from the antistatic container.
2. Install the DIMM as follows: (FIGURE 8-3)
Caution – The system must have two identical DIMMs installed in a bank. For best
system performance, install four identical DIMMs in the two banks. TABLE 8-1
identifies DIMM banks and slot pairs.
a. Position the DIMM in the connector, ensuring that the notches on the bottom
of the DIMM are aligned with the connector alignment bumps.
Note – Bottom DIMM notches and connector alignment bumps are keyed to ensure
proper DIMM orientation.
Caution – If the DIMM is not seated into its slot evenly, it can cause shorts that will
damage the system. Ensure that all contacts engage at the same time by pressing
evenly on the top corners of the DIMM--do not rock the DIMM into place.
A clicking sound is heard when the DIMM is properly seated.
b. Press firmly on the DIMM top until the DIMM is properly seated.
3. Verify the ejection levers are closed toward the DIMM.

8.4 Graphics Card
To remove and replace a graphics card, and to install graphics card patch software,
proceed as follows.
8.4.1 Removing a Graphics Card

2. Remove a graphics card as follows (FIGURE 8-4):
a. Using a No. 2 Phillips screwdriver, remove the screw securing the graphics card
bracket tab to the system chassis.
Caution – To avoid damaging the card’s connectors, apply equal force to both ends
of the card.
b. At the two nearest corners of the graphics card, pull the card straight away from
the motherboard connector (UPA1).
3. Place the graphics card on an antistatic mat.

UPA graphics card
Screw
Bracket tab
FIGURE 8-4 Removing and Replacing the Graphics Card
8.4.2 Replacing a Graphics Card
Note – If you are using the Solaris 2.5.1 Hardware: 11/97 or the Solaris 2.6 5/98
operating environments, and you are installing an Elite3D UPA graphics card, see
Section 8.4.3 “Elite3D m3 and Elite3D m6 UPA Graphics Card Patch Information” on
page 8-11.
1. Replace the graphics card as follows (FIGURE 8-4):
a. Position the graphics card into the chassis.
b. Guide the graphics card bracket tab into the chassis back panel opening.

c. Position the graphics card connector so that it touches its associated graphics
card connector on the motherboard.
Caution – To avoid damaging the card’s connectors, apply equal force to both ends
of the card.
Note – The graphics card connector is a double-row connector that requires two
levels of insertion. When installing the graphics card, ensure that the connector is
fully seated into the slot.
d. At the two nearest corners of the card, push the card straight into the connector
until the card is fully seated.
e. Using a No. 2 Phillips screwdriver, replace the screw securing the card bracket
tab to the system chassis.
2. Connect the video cable to the graphics card video connector.
8.4.3 Elite3D m3 and Elite3D m6 UPA Graphics Card

Patch Information
If you are installing or using the Solaris 2.5.1 Hardware: 11/97 or the Solaris 2.6 5/98
operating environments, and you are also installing an Elite3D UPA graphics card,
you must install the following software patch(es):
■ Solaris 2.5.1 Hardware: 11/97 - Patch 105789-01 is automatically installed when
the Elite3D UPA graphics card software is installed. It is recommend that software
patch 105791-05 (or a more current version of the patch, if available) also be
installed.
■ Solaris 2.6 5/98 - After installing the Elite 3D UPA graphics card, software patch
105363-06 (or a more current version of the patch, if available) should be installed.
These latest versions of these patches are available through the SunSolve Online
website at http://www.sun.com/service/online/index.html, or by
contacting Sun Enterprise Services.

8.5 PCI Card
To remove and replace a PCI card, proceed as follows.
8.5.1 Removing a PCI Card

2. Remove the PCI card as follows (FIGURE 8-5):
a. Using a No. 2 Phillips screwdriver, remove the screw securing the PCI card
Caution – To avoid damaging the card’s connector do not apply force to only one
end or one side of the card.
b. Grasp the two corners of the PCI card and pull the card straight out from the
PCI riser board connector.
c. Place the PCI card on an antistatic mat.

PCI card
Screw
Bracket tab
FIGURE 8-5 Removing and Replacing the PCI Card
8.5.2 Replacing a PCI Card
Note – Read the PCI card product guide for information about jumper or switch
settings, slot requirements, and required tools.
1. Replace the PCI card as follows (FIGURE 8-5):
a. Position the PCI card into the chassis.
b. Insert the PCI card connector so that it touches the associated PCI riser board
connector.

Caution – Support the PCI riser board with the fingers of one hand to insure full
insertion of the PCI card into the board.
c. Guide the PCI card bracket tab into the chassis back panel slot.
d. At the two corners of the card, push the card into the PCI riser board connector
until the card is fully seated.
e. Using a No. 2 Phillips screwdriver, replace the screw securing the PCI card
2. Connect all external cables to the PCI card.

8.6 PCI Riser Board
To remove and replace a PCI riser board, proceed as follows.
8.6.1 Removing the PCI Riser Board

2. Remove the PCI card(s) from the PCI riser board.

3. Remove the PCI riser board as follows (FIGURE 8-6):
a. Using a No. 2 Phillips screwdriver, remove the two screws securing the PCI
riser board to the system chassis.
Caution – To avoid damaging the board’s connectors, apply equal force to both
ends of the board.
b. At the two upper corners of the PCI riser board, pull the board straight upward
from the connector.
c. Remove the PCI riser board from the chassis.

Screw (2)
PCI riser board
FIGURE 8-6 Removing and Replacing the PCI Riser Board
8.6.2 Replacing the PCI Riser Board

1. Replace the PCI riser board as follows (FIGURE 8-6):
a. Position the PCI riser board into the chassis.
b. Position the PCI riser board connector so that it touches its associated connector
on the motherboard.
c. At the two upper corners of the board, push the board straight downward into
the connector until the card is fully seated.

d. Using a No. 2 Phillips screwdriver, replace the two screws securing the PCI
riser board to the system chassis.
2. Replace the PCI card(s) to the PCI riser board.

8.7 Motherboard
To remove and replace a motherboard, proceed as follows.
Caution – Use an antistatic mat when working with the motherboard. An antistatic
mat contains the cushioning needed to protect the underside components, to prevent
motherboard flexing, and to provide antistatic protection.
8.7.1 Removing the Motherboard

2. Remove the motherboard as follows (FIGURE 8-7):
a. Place the system on its side.
b. Disconnect the following from the motherboard:

■ Speaker cable connector (J18)
■ CPU fan cable connector (J19)
■ Power-on LED/software power on cable connector (J17)
■ Diskette drive cable assembly (J16)
■ CD-ROM drive cable connector (J14)
■ Hard drive cable connector (J15)
■ Audio cable assembly (J9)
■ Serial/parallel cable assembly (J7/J8)

c. Remove the following:
i. CPU module
See Section 8.1.1 “Removing the CPU Module” on page 8-1.
ii. CPU fan assembly

See Section 6.4.1 “Removing the CPU Fan Assembly” on page 6-13.
iii. PCI card(s)

iv. PCI riser board

See Section 8.6.1 “Removing the PCI Riser Board” on page 8-15.
v. UPA graphics card(s)

See Section 8.4.1 “Removing a Graphics Card” on page 8-9.
vi. NVRAM/TOD with carrier

See Section 8.2.1 “Removing the NVRAM/TOD” on page 8-4.
Note – The NVRAM/TOD contains the system host identification (ID) and Ethernet
address. If the same ID and Ethernet address are to be used on the replacement
motherboard, remove the NVRAM/TOD from the motherboard and install it to the
new motherboard after motherboard installation.
vii. DIMMs
See Section 8.3.1 “Removing a DIMM” on page 8-6.
d. Remove the motherboard as follows:
i. Disconnect the external cables.
ii. Using a No. 2 Phillips screwdriver, remove the eight screws securing the
motherboard to the chassis standoffs.
Caution – Handle the motherboard by the back panel or by the edges only.
iii. Lift the motherboard from the chassis.
Note – It may be necessary to slide the motherboard toward the chassis front before
lifting from chassis.
iv. Place the motherboard on an antistatic mat.

Screw (8)
FIGURE 8-7 Removing and Replacing the Motherboard
8.7.2 Replacing the Motherboard
Note – Jumpers JP3 and JP4 can be set to either RS-423 or RS-232 serial interface.
The jumpers are preset for RS-423. RS-232 is required for digital telecommunication
within the European Community.

1. Using long-nose pliers, set the motherboard serial port jumpers JP3 and JP4 (refer
to the following table).
TABLE 8-2 Serial Port Jumper Settings
Default Shunt
Jumper Pins 1 + 2 Select Pins 2 + 3 Select on Pins
JP3 RS-232 RS-423 2-3
JP4 RS-232 RS-423 2-3
Note – Motherboard jumpers are identified as JP. Jumper pins are located
immediately adjacent to the part number. Ensure that the serial port jumpers are set
correctly.
Closed Open
1 1
1-2 2-3
FIGURE 8-8 Identifying Jumper Pins
2. Replace the motherboard as follows (FIGURE 8-7):
a. Replace the motherboard as follows:
Caution – Handle the motherboard by the back panel or by the edges only.
i. Position the motherboard into the chassis.
ii. Using a No. 2 Phillips screwdriver, replace the eight screws securing the
motherboard to the chassis.
iii. Connect the external cables.
b. Replace the following:

i. DIMMs
See Section 8.3.2 “Replacing a DIMM” on page 8-8.
ii. NVRAM/TOD with carrier

See Section 8.2.2 “Replacing the NVRAM/TOD” on page 8-5.
iii. UPA graphics card(s)

See Section 8.4.2 “Replacing a Graphics Card” on page 8-10.
iv. PCI riser board

See Section 8.6.2 “Replacing the PCI Riser Board” on page 8-16.
v. PCI card(s)
vi. CPU fan assembly

See Section 6.4.2 “Replacing the CPU Fan Assembly” on page 6-14.
vii. CPU module

See Section 8.1.2 “Replacing the CPU Module” on page 8-3.
c. Connect the following to the motherboard:

■ Speaker cable connector (J18)
■ CPU fan cable connector (J19)
■ Power-on LED/software power on cable connector (J17)
■ Diskette drive cable assembly (J16)
■ CD-ROM drive cable connector (J14)
■ Hard drive cable connector (J15)
■ Audio cable assembly (J9)
■ Serial/parallel cable assembly (J7/J8)
connector keys.
4. Reset the #power-cycles NVRAM variable to zero as follows:
a. Press the keyboard Stop and A keys after the system banner appears on the
monitor.
b. At the ok prompt, type:
ok% setenv #power-cycles 0

c. Verify that the #power-cycles NVRAM variable increments each time the
system is power cycled.
Note – The Solaris operating environment Power Management software uses the
#power-cycles NVRAM variable to control the frequency of automatic system
shutdown (if automatic shutdown is enabled).

CHAPTER 9
Illustrated Parts List
This chapter lists the authorized replaceable parts for the Ultra 10 system. FIGURE 9-1
illustrates an exploded view of the system and TABLE 9-1 lists the replaceable
components. Numerical references illustrated in FIGURE 9-1 correlate to the
numerical references listed in TABLE 9-1.
Consult your authorized Sun sales representative or service provider to confirm a

part number before ordering a replacement part.
9-1
1
18
2 3
17
4 5
6
16
9
15
14
13
12
10
11

FIGURE 9-1 Ultra 10 System Exploded View
TABLE 9-1 Ultra 10 System Replaceable Components
Numerical
Reference Component Description
1 Manual eject floppy Manual eject diskette drive

2 Audio cable assembly Audio subsystem cables
3 Diskette drive cable assembly Diskette drive cable. Part of
service kit 370-3267
4 Hard drive cable assembly Hard drive cable. Part of service
kit 370-3267
5 CD-ROM drive cable assembly CD-ROM drive cable. Part of
6 Fan assembly CPU fan, 92-mm
7 Speaker assembly System speaker
8 16-Mbyte DIMM 60-ns, 16-Mbyte DIMM
8 64-Mbyte DIMM 60-ns, 64-Mbyte DSIMM
9 CPU module 300-MHz, 512-Kbyte external
cache
9 CPU module 333-MHz, 2-Mbyte external cache
10 Motherboard System main logic board
11 NVRAM/TOD Time of day, 48T59, with carrier
12 Serial/parallel cable assembly Serial/parallel cable. Part of
13 PCI card Generic
Chapter 9 Illustrated Parts List 9-3

TABLE 9-1 Ultra 10 System Replaceable Components (Continued)
Numerical
Reference Component Description
14 PCI riser board Four-slot riser board

15 Graphics card Vertical, double buffer plus Z
(DBZ) UPA graphics card
15 Graphics card Vertical, single buffer UPA
graphics card
15 Graphics card Elite3D m3 UPA graphics card
15 Graphics card Elite3D m6 UPA graphics card
16 Hard drive Disk drive, 9.1-Gbyte, 7200 RPM
17 Power supply Power supply, 250 watts
18 CD-ROM drive CD-ROM drive
Not shown Front bezel System front bezel
Not shown Drive bracket 9.1-Gbyte rear drive bracket (rear
position only)

CHAPTER 10
Finishing Replacement Procedures
This chapter describes the activities you must do after you finish removing and
replacing internal system components. This chapter also explains how to externally
control standby operation.

■ Section 10.1 “Replacing the System Cover” on page 10-1
■ Section 10.2 “Powering On the System” on page 10-3
10.1 Replacing the System Cover

1. Remove the wrist strap from the system chassis and from your wrist.
2. Replace the system cover as follows: (FIGURE 10-1):
a. Position the system upside-down on its top.
b. Position the system cover onto the system chassis. Press the system cover onto
the chassis until the cover tabs lock.
c. Using a No. 2 Phillips screwdriver, replace the four screws securing the system
cover to the chassis.
d. Position the system upright.
10-1
System cover
Screw (4)
Cover tab
FIGURE 10-1 Removing and Replacing the System Cover

10.2 Powering On the System
To power on the system:
Caution – Plugging a 115V power cord into a 230V connector will severely damage
the system.
1. Verify the voltage selector switch is set to the correct setting: 115V or 230V.
2. Connect the system power cord to the system and to an AC power outlet.
3. Reconnect and turn on power to any peripherals (so that the system can recognize
the peripherals when it is powered on).
4. Set the power switch to the on position (FIGURE 10-2).
Voltage selector switch
Power switch
FIGURE 10-2 System Power Switch
5. Press the standby switch (FIGURE 10-3), or press the Sun Type-5 keyboard
Standby key (FIGURE 10-4) or the Sun I/O Type-6 keyboard Power key (FIGURE 10-5).
Chapter 10 Finishing Replacement Procedures 10-3

Standby switch
FIGURE 10-3 System Standby Switch
Standby key

Power key

Screen Lock
SysRq Break

Up Lock
` 1 2 3 4 5 6 7 8 9 0 - =

Down
[ ] \ Home PgUp

Caps Lock ; '

End PgDn

Com- Alt
pose Graph Ins Del
a. The front panel power-indicator LED is on.
b. The system fans are spinning.
Chapter 10 Finishing Replacement Procedures 10-5

APPENDIX A
Product Specifications and

Reference Information
This appendix provides product specifications for the Ultra 10 system.

■ Section A.1 “Physical Specifications” on page A-1
■ Section A.2 “Electrical Specifications” on page A-2
■ Section A.3 “Modem Setup Specifications” on page A-2
■ Section A.4 “Environmental Requirements” on page A-5
■ Section A.5 “Reference Information” on page A-6
A.1 Physical Specifications

The following table lists the Ultra 10 physical specifications.
TABLE A-1 Ultra 10 Physical Specifications
Specification U.S.A. Metric
Height 15.75 in. 40.00 cm
Width 6.93 in. 16.60 cm
Depth 16.54 in. 42.00 cm
Weight (approximate) 44.00 lb. 20.00 kg
A-1
A.2 Electrical Specifications
The following table lists the electrical specifications for the Ultra 10 system.
TABLE A-2 Ultra 10 SystemElectrical Specifications
Parameter Value
AC input 47 to 63 Hz, 90 to 132 VAC or 180 to

264 VAC, switch selectable
DC output 250W (maximum)
Output 1 +3.3 VDC, 21A
Output 2 +5.0 VDC, 22A
Output 3 +12.0 VDC, 5.0A
Output 4 -12.0 VDC, 0.3A
Output 5 -12.0 VDC, 0.3A
Output 6 +5.0 VDC, 0.2A

(Standby)
A.3 Modem Setup Specifications

■ Section A.3.1 “Setting Up the Modem” on page A-2
■ Section A.3.2 “Serial Port Speed Change” on page A-3
■ Section A.3.3 “Modem Recommendations” on page A-4
A.3.1 Setting Up the Modem

Any modem that is compatible with CCITT V.24 can be connected to the system
serial port. Modems can be set up to function in one of three ways:
■ Dial out only
■ Dial in only
■ Bidirectional
A-2 Sun Ultra 10 Service Manual • February 2000

To set up a modem:
1. Become superuser and type admintool.
% su
Password:#
admintool
2. In the Admintool window, select Serial Port Manager.
3. Select Port a or Port b for your modem connection.
4. Select Edit.
The Serial Port Manager: Modify Service window is displayed.
5. Choose the Expert level of detail.
6. From the Use Template menu, choose one of the following:

■ Modem - Dial-out only
■ Modem - Dial-in only
■ Modem - Bidirectional
7. Select Apply.
8. Set your modem auto-answer switch to one of the following:

■ Off – Dial-out only
■ On – dial-in only
■ On – Bidirectional
A.3.2 Serial Port Speed Change

To change the speed of a serial port, edit the /etc/remote file as follows:
1. Become superuser, and type cd /etc.
% su
Password:#
cd /etc
2. Type vi remote.
Appendix A Product Specifications and Reference Information A-3

3. Type tip speed device-name.
Typical speeds are 9600, 19200 to 38400 bps.
The device name is the serial port name—for example,
/dev/tty[a,b] or /dev/term/[a,b].
4. Press Esc and type wq to save your file change(s) and to exit from the vi text
editor.
A.3.3 Modem Recommendations
A.3.3.1 Cable
For a modem-to-host (system) connection, use an RS-423/RS-232
straight-through cable with DB-25 male connectors at both ends.
A.3.3.2 Modem Switch Settings (AT Commands)

■ Enable transmit flow control (AT&H1) [suggested setting]
(Required for sending binary/8-bit data.)
■ Set link rate to fixed
(Will not track modem data rate, AT&Bn; n = menu choice in modem manual.)
■ Set display result codes (ATQ0)
■ Set verbal result codes (ATV1)
■ Set result code subset (ATXn; n = option choice)
■ Save settings in NVRAM (AT&W)
Note – The above settings are meant as helpful guidelines only. These guidelines
may change depending on site requirements and the chosen modem.
For additional information about modem switch settings, see the manual that came
with the modem.

A.4 Environmental Requirements
The following table lists environmental requirements for the Ultra 10 systems.
TABLE A-3 Ultra 10 System Environmental Requirements
Environmental Operating Non-operating
Temperature 40 to 95 degrees F -4 to 140 degrees F

(5 to 35 degrees C) (-20 to 60 degrees C)
Humidity 80% (max) noncondensing 95% noncondensing
at 95 degrees F (35 degrees C) at 140 degrees F (60 degrees C)
Altitude 10,000 ft (3 km) 40,000 ft (12 km)

A.5 Reference Information
This section contains the following reference information:
■ Section A.5.1 “CD-ROM Drive Cabling Configuration” on page A-6
■ Section A.5.2 “Ultra 10 Hard Drive Cabling Configuration” on page A-7
■ Section A.5.4 “Jumper Settings” on page A-8
■ Section A.5.5 “CD Handling and Use” on page A-8
A.5.1 CD-ROM Drive Cabling Configuration

The following block diagram shows the cabling for the CD-ROM drive.
■ CD-ROM data cable: connects to motherboard connector J14
■ CD-ROM audio cable: connects to motherboard connector J9
Ultra 10 CD-ROM drive data cable
CD-ROM drive Motherboard J14

(device 2) (secondary channel)
Ultra 10 CD-ROM drive audio cable
CD-ROM drive Motherboard J9
FIGURE A-1 CD-ROM Drive Cabling Configuration

A.5.2 Ultra 10 Hard Drive Cabling Configuration
The Ultra 10 hard drive cabling differs, depending on whether there are one or two
hard hard drives configured:
■ Hard drive cable: connects to motherboard connector J15
■ If two hard drives are installed, the cable assembly connection is as shown in the
following block diagram
Ultra 10 Hard Drive cable
Front hard drive Rear hard drive Motherboard J15

(slave-device 1) (master-device 0) (primary channel)
FIGURE A-2 Ultra 10 Hard Drive Cabling Configuration
A.5.3 Hard Drive Cabling Configuration (With Two

Mirrored Drives)
The following diagram shows the drive cabling configuration when the system
contains two mirrored hard drives:
■ Primary channel—One hard drive jumpered as master
■ Secondary channel—One hard drive jumpered as master
Primary IDE channel
Primary hard drive Motherboard J15

(master-device 0) (primary channel)
Secondary IDE channel
Optional CD-ROM Primary hard drive Motherboard J14

(slave-device 1) (master-device 0) (secondary channel)
FIGURE A-3 Hard Drive Mirroring Configuration
Note – The two hard drives that are mirrored cannot be on the same channel. Both
hard drives must be jumpered as the master device on two separate channels.

Note – If a CD-ROM drive is included in an Ultra 10 system with this hard drive
mirroring configuration, the CD-ROM drive must be jumpered as a slave device on
either the primary or the secondary channel.
For more information on hard driive mirroring, see Section 7.2.3 “Hard Drive
Mirroring” on page 7-8.
A.5.4 Jumper Settings

Prior to installing a CD-ROM or hard disk drive in an Ultra 10 system, verify that
the drive’s back panel mode-select jumper is set as follows:
■ Set the CD-ROM drive jumper to MA
■ Set a hard drive jumper to CS
A.5.5 CD Handling and Use

The following topics are discussed in this section.
■ Inserting a CD into the CD-Rom drive
■ Ejecting a CD from the CD-ROM drive
■ Cleaning the CD-ROM drive
■ Handling and storing CDs
A.5.5.1 Inserting a CD into the CD-ROM Drive

1. After the system is powered on, push the eject button to open the drive tray.
It may be necessary to unmount the CD before manually ejecting it. The CD can also
be ejected by using software commands. Refer to the peripherals handbook that
corresponds with your operating environment.
2. Place the CD (label side up) into the tray.

Ensure that the CD is properly set into the recessed area of the tray.
3. If the drive is being installed in a vertical position, slide the two bottom tabs on
the tray toward each other to hold the CD.

A.5.5.2 Ejecting a CD From the CD-ROM Drive
To eject a CD, press the eject button on the front of the CD-ROM drive.
If the motorized eject mechanism does not operate, insert a thin, stiff wire (such as a
paper clip) into the hole next to the eject button to eject the CD.
A.5.5.3 Cleaning the CD-ROM Drive

If the CD-ROM drive cannot read a CD, the cause may be a dirty CD. Follow these
guidelines to clean a CD:
Caution – Do not user solvents such as benzine, paint thinner, antistatic aerosol
spray, or abrasive cleaners to clean CDs.
■ Use a soft, clean, lint-free, dry cloth.

■ Clean the non-labeled side of the CD.
■ Wipe the CD radially from the center to the outside.
■ Use professional cleaning kits.
A.5.5.4 Handling and Storing CDs

Follow these guidelines when handling and storing CDs:
■ Handle CDs only by their edges; avoid touching CD surfaces.
■ Do not write on CDs with permanent marking pens.
■ Do not use CDs in high-dust environments.
■ Keep CDs out of direct sunlight, extreme sources of heat or cold, and away from
dust and moisture.
■ Make sure CDs are at room temperature before using them.
■ Store CDs in storage boxes so that they remain clean and free of dust.

APPENDIX B
Signal Descriptions
This appendix describes the Ultra 10 motherboard connector signals and pin
assignments.
■ Section B.1 “Power Supply Connectors” on page B-2
■ Section B.2 “Keyboard/Mouse Connector” on page B-4
■ Section B.3 “Twisted-Pair Ethernet Connector” on page B-5
■ Section B.4 “Serial Port A Connector” on page B-7
■ Section B.5 “Serial Port B Connector” on page B-9
■ Section B.6 “Parallel Port Connector” on page B-10
■ Section B.7 “Audio Connectors” on page B-12
■ Section B.8 “Video Connector” on page B-13
B-1
B.1 Power Supply Connectors
There are two power supply connectors on the motherboard. The Ultra 10
motherboard uses a standard ATX style connector (J12).
FIGURE B-1 illustrates the J12 connector configuration and TABLE B-1 lists the pin
assignments.
10 1
20 11
FIGURE B-1 Power Supply Connector J12 Pin Configuration
TABLE B-1 Power Supply Connector J12 Pin Assignments
1 +3.3V +3.3 VDC

2 +3.3V +3.3 VDC
4 +5V +5 VDC
6 +5V +5 VDC
8 PWR_OK Power okay
9 5VSB
10 +12V +12 VDC
11 +3.3V +3.3 VDC
12 -12V -12 VDC
14 PS_ON Power supply on
B-2 Sun Ultra 10 Service Manual • February 2000

TABLE B-1 Power Supply Connector J12 Pin Assignments (Continued)

18 -5V -5 VDC
19 +5V +5 VDC
20 +5V +5 VDC
Appendix B Signal Descriptions B-3

B.2 Keyboard/Mouse Connector
The keyboard/mouse connector is a DIN-8 type connector located on the
motherboard back panel. The following figure illustrates the keyboard/mouse
connector configuration and the following table lists the pin assignments.
8 7 6
5 4 3
2 1
FIGURE B-2 Keyboard/Mouse Connector Pin Configuration
TABLE B-2 Keyboard/Mouse Connector Pin Assignments
3 +5V +5 VDC
4 Mse-rxd Mouse receive data
5 Kbd-txd Keyboard out
6 Kbd-rxd Keyboard in
7 Kbd-pwk Keyboard power on
8 +5V +5 VDC

B.3 Twisted-Pair Ethernet Connector
The twisted-pair Ethernet (TPE) connector is an RJ-45 type connector located on the
motherboard back panel. The following figure illustrates the TPE connector
configuration and the following table lists the pin assignments.
Caution – Connect only TPE-type cable into the TPE connector.
8 1
FIGURE B-3 TPE Connector Pin Configuration
TABLE B-3 TPE Connector Pin Assignments
1 tpe0 Transmit data +
2 tpe1 Transmit data -
3 tpe2 Receive data +
4 Common mode termination Termination
6 tpe3 Receive data -

B.3.1 TPE Cable-Type Connectivity
The following types of TPE cables can be connected to the TPE connector.
■ For 10BASE-T applications, unshielded twisted-pair (UTP) cable:
■ Category 3 (UTP-3, “voice grade”)
■ Category 4 (UTP-4)
■ Category 5 (UTP-5, “data grade”)
■ For 100BASE-T applications, UTP cable, UTP-5, “data grade”
B.3.2 External UTP-5 Cable Lengths

The following table lists TPE UTP-5 types, application, and maximum lengths.
TABLE B-4 TPE UTP-5 Cables
Maximum Length
Cable Type Application(s) (Metric) Maximum Length (US)
UTP-5, “data grade” 10BASE-T or 100 meters 109 yards

100BASE-T

B.4 Serial Port A Connector
The serial port A connector is a DB-25 type connector located on the motherboard
back panel. The serial port A connector provides both synchronous and
asynchronous serial communications. The following figure illustrates the serial port
A connector configuration and the following table lists the pin assignments.
13 1
25 14 A
FIGURE B-4 Serial Port A Connector Pin Configuration
TABLE B-5 Serial Port A Connector Pin Assignments
1 NC Not connected
2 TXD_A Transmit data A
3 RXD_A Receive data A
4 RTS_A Read to send A
5 CTS_A Clear to send A
6 DSR_A Data set ready A
7 Gnd Signal ground
8 DCD_A Data carrier detect A
9 NC Not connected
10 NC Not connected
11 NC Not connected
12 NC Not connected
13 NC Not connected
14 NC Not connected

TABLE B-5 Serial Port A Connector Pin Assignments (Continued)
15 RTXC_A Transmit clock A
16 NC Not connected
17 RXC_A Receive clock A
18 NC Not connected
19 NC Not connected
20 DTR_A Data terminal ready A
21 NC Not connected
22 NC Not connected
23 NC Not connected
24 TXCA Data terminal ready A
25 NC Not connected

B.5 Serial Port B Connector
The serial port B connector is a DB-9 type connector located on the serial/parallel
connector back panel. The serial port B connector provides asynchronous serial
communications. The following figure illustrates the serial port B connector
configuration and the following table lists the pin assignments.
1 5
6 9 B
FIGURE B-5 Serial Port B Connector Pin Configuration
TABLE B-6 Serial Port B Connector Pin Assignments
1 CD Carrier detect
2 RD Receive data
3 TD Transmit data
4 DTR Data terminal ready
5 GND Ground
6 DSR Data set ready
7 RTS Request to send
8 CTS Clear to send
9 RI Ring indicator

B.6 Parallel Port Connector
The parallel port connector is a DB-25 type connector located on the serial/parallel
connector back panel. The following figure illustrates the parallel port connector
configuration and the following table lists the connector pin assignments.
13 1
25 14
FIGURE B-6 Parallel Port Connector Pin Configuration
TABLE B-7 Parallel Port Connector Pin Assignments
1 Data_Strobe_L Set low during forward channel

transfers to latch data into peripheral
device. Set high during reverse channel
transfers.
2 to 9 Data[0..7] The main data bus for the parallel port.
Data0 is the least significant bit (LSB).
Are not used during reverse channel
transfers.
10 ACK_L Driven low by the peripheral device to
acknowledge data byte transfer from
host during forward channel transfer.
Qualifies data being transferred to host
in reverse channel transfer.
11 BUSY Driven high to indicate the peripheral
device is not ready to receive data
during forward channel transfer. Used
to send Data3 and Data7 during
reverse channel transfer.
12 PERROR Driven high by peripheral device to
indicate an error in the paper path
during forward channel transfer. Used
to send Data2 and Data6 during

TABLE B-7 Parallel Port Connector Pin Assignments (Continued)
13 SELECT_L Indicates the peripheral device is on-

line during forward channel transfer.
Used to send Data1 and Data5 during
14 AFXN_L Set low by the host to drive the
peripheral into auto-line feed mode
during forward channel transfer.
During reverse channel transfer, set
low to indicate host can receive
peripheral device data and then set
high to acknowledge receipt of
peripheral data.
15 ERROR_L Set low by the peripheral device to
indicate an error during forward
channel transfer. In reverse channel
transfer, set low to indicate peripheral
device has data ready to send to the
host. Used to send Data0 and Data4.
16 INIT_L Driven low by the host to reset
peripheral.
17 PAR_IN_L Set low by the host to select peripheral
device for forward channel transfer. Set
high to indicate bus direction is from
peripheral to host.
18 Signal ground Signal ground

B.7 Audio Connectors
The audio connectors are located on the motherboard backpanel. These connectors
use EIA standard 0.125-inch (3.5-mm) jacks. The following figure illustrates each
audio connector configuration and the following table lists each connector line
assignment.
Headphones Line-out Line-in Microphone
FIGURE B-7 Audio Connector Configuration
TABLE B-8 Audio Connector Line Assignment
Component Headphones Line-Out Line-In Microphone
Tip Left channel Left channel Left channel Left channel
Ring (center) Right channel Right channel Right channel Right channel
Shield Ground Ground Ground Ground

B.8 Video Connector
The video connector is a 15-pin mini D-sub connector located on the motherboard
backpanel. The following figure illustrates the video connector configuration and the
following table lists the video connector pin assignment.
5 1
10 6
15 11
FIGURE B-8 Video Connector Pin Configuration
TABLE B-9 Video Connector Pin Assignments
1 Red Red video signal
2 Green Green video signal
3 Blue Blue video signal
4 Gnd Ground
5 NC Not connected
6 Gnd Ground for red video signal
7 Gnd Ground for green video signal
8 Gnd Ground for green video signal
9 NC Not connected
10 Gnd Ground
11 Gnd Ground
12 SDA Bidirectional data

TABLE B-9 Video Connector Pin Assignments (Continued)
13 Horizontal sync Horizontal synchronizing signal
14 Vertical sync V. clock
15 SCL Data clock

APPENDIX C
Functional Description
This appendix provides a functional description of the Ultra 10 system.

■ Section C.1 “System” on page C-1
■ Section C.2 “Clocking” on page C-27
■ Section C.3 “Address Mapping” on page C-29
■ Section C.4 “Interrupts” on page C-32
■ Section C.5 “Power” on page C-36
■ Section C.6 “Motherboard” on page C-37
■ Section C.7 “Jumper Descriptions” on page C-38
■ Section C.8 “Enclosure” on page C-40
C.1 System
The Ultra 10 system is an UltraSPARC port architecture (UPA)-based uniprocessor
machine that uses peripheral component interconnect (PCI) as the I/O bus. The CPU
module, APB ASIC (advanced PCI bridge), and UPA graphics communicate with
each other using the UPA64S and PCI protocols. The graphics card is a UPA slave-
only device. The RISC ASIC routes interrupts to the CPU module.
This section discusses the following topics:

■ Section C.1.1 “CPU Module” on page C-3
■ Section C.1.2 “UPA” on page C-4
■ Section C.1.3 “PCI-IDE Interface” on page C-4
■ Section C.1.4 “Memory Architecture” on page C-10
■ Section C.1.5 “PCI Riser Board” on page C-14
■ Section C.1.6 “ASICs” on page C-19
■ Section C.1.7 “EBus2 Devices” on page C-21
■ Section C.1.8 “Power and Standby Switching” on page C-26
The following figure shows a functional block diagram of the system.
C-1
Memory control 33-MHz PCI Clk
Buffer
XCVR control
72-bit data int_num[5:0]
CPU module Reg RISC
ASIC
Memory control
64-bit U
UPA data P
32-bit, 66-MHz
Primary PCI bus
A Interrupts
g
r
Transceivers (6) a Control PCI
p slots
h 64-bit UPA data
i
c
s PCI-A bus
PCI-B bus 32-bit, 33-MHz
x72 DIMM 32-bit, 33-MHz APB
ASIC
x72 DIMM
PHY MAG RJ45

PCI-IDE PCIO
interface ASIC
EBus (2)
IDE channel 2 Audio Serial

CODEC communications 1-Mbyte
IDE channel 1 controller Flash
PROM
Graphics
controller
SuperIO Audio Async
(DB9)
Sync/Async
DB25
DB15 SGRAM
Keyboard/mouse/parallel/diskette NVRAM/TOD
FIGURE C-1 System Functional Block Diagram
C-2 Sun Ultra 10 Service Manual • February 2000

C.1.1 CPU Module
The system CPU module is the UltraSPARC-IIi processor. The CPU module is a high-
performance, highly-integrated superscalar processor implementing the SPARC-V9
64-bit RISC architecture. The CPU module is capable of sustaining the execution of
up to four instructions per cycle, even in the presence of conditional branches and
cache misses. This sustained performance is supported by a decoupled prefetch and
dispatch unit with instruction buffer. The CPU module supports both 2D and 3D
graphics, as well as image processing, video compression and decompression, and
video effects via the sophisticated visual instruction set (VIS). VIS provides high
levels of multimedia performance, including real-time video compression/
decompression and two streams of MPEG-2 decompression at full broadcast quality
with no additional hardware support. The CPU module characteristics and
associated features include:
■ SPARC-V9 architecture compliant
■ Binary compatible with all SPARC application code
■ Snooping or directory-based protocol support
■ Four-way superscalar design with nine execution units
■ Four integer execution units
■ Three floating-point execution units
■ Two graphics execution units
■ Selectable little-endian or big-endian byte ordering

■ 64-bit address pointers
■ 16-Kbyte non-blocking data cache
■ 16-Kbyte instruction cache with single cycle branch following
■ Power management
■ Software prefetch instruction support
■ Multiple outstanding requests
The Ultra 10 system may contain either a 300-MHz, 333-MHz, 360-MHz, 440-MHz,
or a 480-MHz CPU module. The following table identifies the cache and SRAM for
each module.
TABLE C-1 Ultra 10 CPU Module Cache and SRAM
Module Second-Level Cache Data SRAMs TAG SRAMs
300-Mhz 500-Kbyte 4 - 64K x 18 1 - 64K x 18

333-Mhz 2-Mbyte 4 - 256K x 18 1 - 64K x 18
360-Mhz 2-Mbyte 4 - 256K x 18 1 - 64K x 18
440-Mhz 2-Mbyte 2 - 256K x 36 1 - 256K x 18
480-Mhz 2-Mbyte 2 - 256K x 36 1 - 256K x 18
Appendix C Functional Description C-3

C.1.2 UPA
The system unit supports one slave-only UPA slot for a UPA-based graphics device.
The UPA 64-bit data bus provides the connection between the CPU module and the
UPA graphics. The 64-bit UPA data shares the data bus with memory through six
transceiver chips.
The UPA graphics slot receives a differential signal (UPA_CLK +/-) from the CPU
module, which is in synchronization with the CPU module clock. UPA_CLK +/-
clocks at one-third the frequency of the CPU module frequency. All transfers to and
from the graphics connector are fully synchronous. The CPU module transfers UPA
data to the graphics connector on leading clock edges that correspond to the UPA
clock edges. The maximum interface rate is 120 MHz.
The following figure is a functional block diagram of the UPA graphics.
UPA_CLK +/-
SYSADR[28:0]/Control Graphics
CPU module
connector
UPA data
64-bit
Memory data
Transceivers
72-bit (6)
144-bit Memory data

Memory
FIGURE C-2 UPA Graphics Functional Block Diagram
C.1.3 PCI-IDE Interface

The 32-bit, 66-MHz PCI bus is interfaced through a connector to the motherboard.
This interface operates at 66 MHz and interfaces to the APB ASIC. There are three
PCI buses: primary PCI bus, secondary PCI bus A, and secondary PCI bus B.
■ Section C.1.3.1 “Primary PCI Bus” on page C-5
■ Section C.1.3.2 “Secondary PCI Buses” on page C-5
■ Section C.1.3.3 “APB ASIC” on page C-5
■ Section C.1.3.4 “PCIO ASIC” on page C-5
■ Section C.1.3.5 “10-/100-Mbit Ethernet” on page C-5
■ Section C.1.3.6 “EBus2 Interface” on page C-6
■ Section C.1.3.7 “EIDE Interface” on page C-7
■ Section C.1.3.8 “PCI-Based Graphics” on page C-9

C.1.3.1 Primary PCI Bus
The CPU module interfaces to the APB ASIC through the primary PCI bus. The
primary PCI bus is a 32-bit, 66-MHz bus. The primary PCI bus is 3.3-VDC bus only,
and there cannot be a 5-VDC device residing on this bus. In the Ultra 10 systems, the
primary PCI bus is a point-to-point bus between the CPU module and the APB
ASIC. There are no other devices or slots on the primary PCI bus.
C.1.3.2 Secondary PCI Buses

The secondary PCI buses are designated as PCI bus A and PCI bus B.
Bus A is a 33-MHz, 32-bit bus that interfaces between the APB ASIC and the PCI
slots, with no motherboard device communications. PCI bus A is a 5-VDC-only bus
and the only supported boards are 5-VDC type.
PCI bus B is also a 33-MHz, 32-bit bus. Unlike PCI bus A, PCI bus B does not
interface to any PCI slots; however, it does communicate with motherboard devices.
The motherboard devices residing on PCI bus B include:
■ APB ASIC
■ PCIO ASIC
■ PCI-based graphics controller
■ PCI-IDE interface
C.1.3.3 APB ASIC

Refer to Section C.1.6.1 “APB” on page C-19.
C.1.3.4 PCIO ASIC

Refer to Section C.1.6.2 “PCIO” on page C-19.
C.1.3.5 10-/100-Mbit Ethernet

The Ethernet channel engine within the PCIO ASIC provides a buffered full-duplex
DMA engine and a media access controller (MAC) function. The descriptor-based
DMA engine contains independent transmit and receive channels, each with 2
Kbytes of on-chip buffering. The MAC provides a 10-Mbps or a 100-Mbps
CSMA/CD protocol based upon a network interface conforming to IEEE 802.3,
proposed IEEE 802.30, and Ethernet specifications. The following figure shows a
functional block diagram of the 10-/100-Mbit Ethernet.

Rcv MII 10BASE T Rcv
10BASE T Xmit
Serial MII 100BASE T

PCIO
ASIC PHY Xmit
Twister
100BASE T
Xmit MII
Rcv
100BASE T
100BASE T
50 MHz
Xmit
Rcv
PCI
Twisted RJ45 Common

pair Magnetics
FIGURE C-3 10-/100-Mbit Ethernet Functional Block Diagram
C.1.3.6 EBus2 Interface

The PCIO ASIC provides the EBus2 interface to connect as many as eight 8-bit
devices. The following devices reside on the EBus2:
■ Audio CODEC
■ SuperIO
■ Serial communications controller
■ NVRAM/TOD
■ Flash PROM
Up to eight single- or multi-function Intel-style 8-bit devices can be accommodated.

Four internal DMA engines can be attached to any of the 8-bit devices, buffering
data streams in 128-byte FIFOs for each channel.
The EBus2 channel engine provides access to several general purpose AUXIO
(auxiliary IO) lines, which are used to control miscellaneous system functions.

C.1.3.7 EIDE Interface
The enhanced integrated drive electronics (EIDE) interface is a hard drive interface
that is also called an ATA bus interface. With the advent of faster hard drives, the
definition of the EIDE interface has been expanded to include new operating PIO
and DMA modes. The five PIO modes, numbered zero through four, offer
increasingly faster interface speeds, with the higher-numbered mode being the
faster. PIO modes 0, 1, and 2 correspond to the EIDE interface as originally defined.
PIO mode 3 defines a maximum transfer rate of 11.1 Mbytes per second and PIO
mode 4 defines a maximum transfer rate of 16.67 Mbytes per second. Additional
DMA modes have also been defined with Multiword DMA wired 0 corresponding to
the original DMA interface and DMA modes 1 and 2 being faster transfer rates.
Multiword DMA mode 2 is the same speed as the new PIO mode 4.
The following figure shows the EIDE interface functional block diagram.
CH2_CS1, 3#
CH2_INTQ
CH2_DMARQ, DMACK 40-pin IDE
connector connector
DIRQ#/DIOW#, DRST# (channel 2)
DA[2:0]
PCI PCI-EIDE
interface
CH1_CS1,3#
IDE
CH1_INTRQ 40-pin connector
connector (channel 1)
CH1_DMARQ, DMACK
DD[15:0]
FIGURE C-4 EIDE Interface Functional Block Diagram
Cable Electrical Requirements

To allow automatic cable selection of a master and a slave hard drive without the
need to change drive jumpers, an ATA cable is used to interface the host with the
hard drives. Device 0 must be installed on the connector nearest on the cable to the
host and device 1 must be installed on the connector farthest from the host.

Cable Labeling
The ATA cable and/or connectors on the cable are clearly marked to indicate which
connector should be connected to the slave device, master device, and motherboard
(following figure).
SLAVE
MASTER
MOTHERBOARD
FIGURE C-5 EIDE Cable Labeling
Configuration Support
FIGURE C-6 shows the Ultra 10 ATA cable configurations.
Primary Master Slave

connector (primary) (secondary)
Rear hard drive Front hard drive
Secondary Device 2
connector CD-ROM drive
FIGURE C-6 Supported Ultra 10 Configuration

C.1.3.8 PCI-Based Graphics
The system has an on-board PCI-based graphics controller. The graphics controller
uses either 2-Mbytes SGRAM or 4-Mbytes SGRAM as the graphics memory. The on-
board graphics connector is a standard DB15 VGA connector. The PGX graphics
controller provides 8-bit graphics with 2-Mbytes SGRAM. The PGX24 graphic
controller provides 24-bit graphics with 4-Mbytes SGRAM.
The following two figures show a functional block diagram of the PGX and the
PGX24 PCI-based graphics.
PCI-B Bus
PGX graphics
controller
(ATI Rage II+DVD)
2-Mbyte EMI
SGRAM filters DB15
FIGURE C-7 PCI-Based Graphics Functional Block Diagram (PGX)

PCI-B Bus
PGX24 graphics
controller
(ATI 3D Rage Pro)
4-Mbyte EMI
SGRAM filters DB15
FIGURE C-8 PCI-Based Graphics Functional Block Diagram (PGX24)

C.1.4 Memory Architecture
The memory architecture uses the 168-pin JEDEC standard extended data out (EDO)
3.3-VDC buffered DIMMs. The memory controller unit (MCU) is embedded within
the CPU module. All memory addressing and control are driven from the CPU
module to the motherboard and then buffered before being gated to the DIMM
DRAMs (assuming buffered DIMMs). The data path on the DRAM side is 144 bits
(2-bit x 72-bit) wide, and data is multiplexed to 72 bits wide on the processor side by
using the transceiver switches.
The interface between the CPU module MCU and the system memory subsystem
consists of the following:
■ A 12-bit multiplexed row-column address
■ Two column address select (CAS) lines
■ Eight row address select (RAS) lines
■ One write enable (WE) line
■ Support for 60-ns EDO DRAMs
Up to four DIMMs can be installed. Having only four DIMM connectors requires a
stacked and dual-bank DIMM architecture to achieve the 1-Gbyte capacity.
All memory transfers have error checking code (ECC). The MCU performs ECC
generation and checking. The following figure is a functional block diagram of the
memory interface.

MCU Bank 0
P/O Mem_Add[12:0] DIMM1 DIMM2
RAST2_L[3:0]
LVT16244
RAST0_L[0]
RAS0_L
RAST0_L[1]
RAST0_L[2] RAS1_L
RAST_L[2,0] 2
RAST0_L[3] RAS0_L
RAS1_L
CAS0_L[3:0] CAS_L
RAST_L[3,1] [0,1,4,5] CAS_L
WE_[1:0] [0,1,4,5]
WE[0,2] WE[0,2]
RASB0_L[0]
RAS2_L
RASB0_L[1]
RAS3_L
RASB_L[2,0] 2 RASB0_L[2] RAS2_L
RASB0_L[3] RAS3_L UPA64S
RASB_L[3,1]
RASB2_L[3:0] Data Data
SSC48
XCVR Interface
72 bit 72 bit 64-bit
CAS0_L[3:0]
1 LVT16244
CAS0_L 1 WE0_L[1:0]
72 bit 72-bit
1 72 bit
CAS1_L CPU
Data Data
4 CAS0_L[3:0]
CAS_L
[0,1,4,5]
RAST2_L[0]
RAS0_L
1 RAST2_L[1]
MEM_WE_L RAS0_L RAS0_L
RAST2_L[2]
RAS1_L
RAST2_L[3] CAS_L
2 WE1_L[1:0] [0,1,4,5]
SSC48 WE[0,2] WE[0,2]
RASB2_L[0]
RAS2_L
RASB2_L[1]
RAS3_L
RASB2_L[2] RAS2_L
RASB2_L[3] RAS3_L
P/O Mem_Add[12:0]
DIMM3 DIMM4
Bank 1
FIGURE C-9 Memory Interface Functional Block Diagram

C.1.4.1 DIMM Memory Configuration
Caution – If the system memory is configured with 16-Mbyte DIMMs, and the
system memory is being upgraded with anything other than 16-Mbyte DIMMs, you
must remove all 16-Mbyte DIMMs and replace them with the memory upgrade.
An additional mode in the MCU supports 11-bit column addressing. Since the total
available address bits in the MCU is constant (1-Gbyte maximum addressable), the
maximum number of DIMM pairs in this mode is halved in 11-bit column address
mode (4 DIMMs). The MCU can only be programmed in 11-bit column address or
10-bit column address mode (16-Mbyte DIMM memory size), therefore the two types
of DIMMs cannot be mixed. If 16-Mbyte DIMMS (10-bit column address) are
installed and you wish to upgrade with 11-bit column address DIMMs, then the
10-bit DIMMs must be removed and replaced with 11-bit column address DIMMs.
The following table lists memory DIMM configurations.
TABLE C-2 Memory DIMM Configuration
Number of Fully Loaded

Sun Part DIMM DRAMs DIMM Memory Bank Memory (2 banks, 4 Column
Number Configuration on Module Size Size (2 DIMMs) DIMMs) Address Bits
370-3211 2-Mbyte x 72 9 16-Mbyte* 32-Mbyte 64-Mbyte 10*

370-3198 4-Mbyte x 72 18 32-Mbyte 64-Mbyte 128-Mbyte 11
370-3201 32-Mbyte x 72 36 256-Mbyte 512-Mbyte 1 Gbyte 11
*. Do not mix with other DIMM memory size. Do not mix DIMMs that have 10 column address bits with DIMMs that have 11 column
address bits.
C.1.4.2 DIMM Characteristics

The DIMMs used in the system have the following characteristics:
■ JEDEC standard in 168-pin DIMM
■ Support ECC (x72)
■ Single 3.3-VDC +/- 0.3-VDC power supply
■ LVTTL-compatible input and outputs
■ All inputs are buffered with exception of RAS_L
■ CAS_L before RAS_L refresh capability

C.1.4.3 Memory Address Assignment
The system memory spans a 1-Gbyte region, starting at physical address
0x000.0000.0000. The system has four DIMM sockets that accept 16-Mbyte to 256-
Mbyte DIMMs. DIMMs must be installed in pairs. If the same size pair of DIMMs
are not installed, software configures them to the lower size DIMM. Address
mapped to memory must be cacheable. Transfers between any port and memory is
done in 64-byte cache line size. Non-cacheable accesses to memory are not
supported and are treated as an error. Parameters that effect the address assignment
of each DIMM module are DIMM size and in which bank (bank 0 or bank 1) the
DIMM is installed.
PA[28:27] are used as the DIMM-pair select. PA[29] is used as an upper stack or
a lower stack select; 0 is bottom stack and 1 is the upper stack. DIMMs that contain
a single bottom stack must have PA[29] set to 0 (lo) to be accessed. The way that
PA[29:27] maps into RASx_L is listed in the following table. TABLE C-4 lists the
memory address range based on installed DIMMs.
TABLE C-3 PA Map Into RASx_L Signals
PA[29:27] RASx_L Asserted PA[29:27] RASx_L Asserted
000 RASB_L[0] 100 RAST_L[0]
010 RASB)L[2] 110 RAST_L[2]
TABLE C-4 Memory Address Range Based on Installed DIMMs
DIMM Bank
Number DIMM Size DIMM Pair Size Address Range Notes
0 16 Mbyte 32 Mbyte 0x0000.0000 -

0x01FF.FFFF
0 32 Mbyte 64 Mbyte 0x0000.0000 -
0x03FF.FFFF
0 64 Mbyte 128 Mbyte 0x0000.0000 -
0x07FF.FFFF
0 128 Mbyte 256 Mbyte 0x0000.0000
0x0FFF.FFFF
0 256 Mbyte 512 Mbyte 0x2000.0000 - Stacked or dual
0x2FFF.FFFF banks
1 16 Mbyte 32 Mbyte 0x1000.0000 -
0x11FF.FFFF
1 32 Mbyte 64 Mbyte 0x1000.0000 -
0x13FF.FFFF

TABLE C-4 Memory Address Range Based on Installed DIMMs (Continued)
DIMM Bank
Number DIMM Size DIMM Pair Size Address Range Notes
1 64 Mbyte 128 Mbyte 0x1000.0000 -

0x17FF.FFFF
1 128 Mbyte 256 Mbyte 0x1000.0000 -
0x1FFF.FFFF
1 256 Mbyte 512 Mbyte 0x3000.0000 - Stacked or Dual
0x3FFF.FFFF banks
Note – If the system memory is configured with 16-Mbyte DIMMs, and the system
memory is being upgraded with anything other than 16-Mbyte DIMMs, you must
remove all 16-Mbyte DIMMs and replace them with the memory upgrade.
C.1.4.4 Transceivers
The system motherboard transceivers are a hub of all data transfers among memory,
CPU module, and the UPA graphics. The transceivers are bit-sliced so that six parts
are required to implement the memory subsystem.
C.1.5 PCI Riser Board

Because of the space limitations to the system enclosures, a PCI riser board is present
in the systems. The PCI riser board supports a maximum of four PCI cards.

C.1.5.1 Connector Definition
The PCI riser board uses the PCI 64-bit standard connector with revised pinout for
additional power needed to support four PCI cards. The following table lists the PCI
riser board pin summary.
TABLE C-5 PCI Riser Board Pin Summary
Pin Type Number of Pins Current Rating
Gnd 38 N/A
+5V 18 + 4 + 3= 25 26 amp (max)
+12V 1+2=3 2 amp (max)
-12V 1 1 amp (max)
■ Current rating is 1 ampere at 30˚C for each pin.

■ Pinout follows the 64-bit 5-VDC PCI specification (with modifications for
additional power).
■ The IDSEL pin for each PCI slot is reserved.
C.1.5.2 PCI Riser Board Pin Assignment

The following table lists the PCI riser board pin assignments.
TABLE C-6 PCI Riser Board Pin Assignment
Pin Number Signal Pin Number Signal
A1 TRST_L A9 Reserved
A2 +12V A10 +5V

A3 TMS A11 Reserved
A4 TDI A12 Gnd
A5 +5V A13 Gnd

A6 INTA1_L A14 Reserved
A7 INTC1_L A15 RST_L

A8 +5V A16 +5V
A17 GNT1_L A43 PAR

TABLE C-6 PCI Riser Board Pin Assignment (Continued)
A18 Gnd A44 AD15
A19 Reserved A45 Not connected

A20 AD30 A46 AD13
A21 Not connected A47 AD11

A22 AD28 A48 Gnd
A23 AD26 A49 AD9

A24 Gnd A50 Key
A25 AD24 A51 Key

A26 IDSEL1 A52 C/BE0_L
A27 Not connected A53 Not connected

A28 Gnd A54 AD6
A29 AD20 A55 AD4
A30 Gnd A56 Gnd
A31 AD18 A57 AD2

A32 AD16 A58 AD0
A33 Not connected A59 +5V

A34 FRAME_L A60 REQ64_L
A35 Gnd A61 +5V

A36 TRDY_L A62 +5V
A37 Gnd A63 Gnd

A38 STOP_L A64 +5V
A39 Not connected A65 +12V

A40 SDONE A66 +5V
A41 SBO_L A67 +12V

A42 Gnd A68 Not connected
A69 Gnd B2 TCK

A70 INTA2_L B3 Gnd
A71 REQ2_L B4 TDO

A72 Gnd B5 +5V
A73 REQ3_L B6 +5V

A74 INTA3_L B7 INTB1_L
A75 +5V B8 INTD1_L

A76 INTA4_L B9 PRSNT1_L
A77 REQ4_L B10 Reserved

A78 Gnd B11 PRSNT2_L
A79 Not connected B12 Gnd

A80 INTC2_L B13 Gnd
A81 Gnd B14 Reserved

A82 INTC3_L B15 Gnd
A83 GNT2_L B16 CLK1

A84 +5V B17 Gnd
A85 GNT3_L B18 REQ1_L

A86 INTC4_L B19 +5V
A87 Gnd B20 AD31

A88 +5V B21 AD29
A89 GNT4_L B22 Gnd
A90 Gnd B23 AD27
A91 +5V B24 AD25
A92 Reserved B25 Not connected
A93 Gnd B26 C/BE3_L
A94 Reserved B27 AD23
B1 -12V B28 Gnd
B29 AD21 B52 AD8

B30 AD19 B53 AD7
B31 Not connected B54 Not connected

B32 AD17 B55 AD5
B33 C/BE2_L B56 AD3
B34 Gnd B57 Gnd
B35 IRDY_L B58 AD1
B36 Not connected B59 +5V
B37 DEVSEL_L B60 ACK64_L
B38 Gnd B61 +5V
B39 LOCK_L B62 +5V
B40 PERR_L B63 Reserved
B41 Not connected B64 Gnd
B42 SERR_L B65 IDSEL4
B43 Not connected B66 IDSEL2
B44 C/BE1_L B67 Gnd
B45 AD14 B68 IDSEL3
B46 Gnd B69 +5V
B47 AD12 B70 +5V
B48 AD10 B71 INTD2_L
B49 Gnd B72 Not connected
B50 Key B73 INTD3_L
B51 Key B74 Gnd
B75 INTD4_L B85 Gnd

B76 CLK2 B86 Gnd
B77 INTB2_L B87 +5V
B78 Gnd B88 +5V
B79 +5V B89 +5V
B80 CLK3 B90 +5V
B81 INTB3_L B91 Gnd
B82 Gnd B92 Reserved
B83 INTB4_L B93 Reserved
B84 CLK4 B94 Gnd
C.1.6 ASICs
System ASICs include APB, PCIO, and RISC.
C.1.6.1 APB
The advanced PCI bridge (APB) ASIC provides a connection path between the
primary PCI bus and the two secondary PCI buses. APB features include:
■ 32-bit memory addressing for PIO, 64-bit memory addressing (DACs) for DMA
■ 16-bit I/O addressing
■ Full concurrences for primary and secondary PCI interfaces
■ 72-byte FIFO data buffering on each of the DMA and PIO paths
■ Arbitration/prioritization
■ PIO reads and writes are in non-cacheable memory space
C.1.6.2 PCIO
The PCI-to-EBus/Ethernet controller (PCIO) ASIC interfaces to the PCI bus and
implements three major functions:
■ 10-/100-Mbit Ethernet media access controller (MAC)
■ Asynchronous 8-bit EBus2 interface

■ Four dedicated DMA channels:
■ Parallel port
■ Audio capture/record
■ Audio playback
■ Diskette
A PCIO ASIC interrupt router directs the channel engine interrupts to the
appropriate device. EBus2 interrupts (only those associated with a DMA channel)
are assigned to INTA# and Ethernet interrupts are assigned to INTB#. In PC card
mode, this is in add-in mode. The PCIO ASIC has separate interrupt lines for each
internal device. INTA# becomes ent_irq_1, INTB# is unused, INTC# becomes
pport_irq_1, and INTD# becomes fpy_irq_1. Interrupts from the audio capture
are routed to audio_cap_irq_1 while interrupts from audio playback are routed to
audio_pb_irq_1.
In the motherboard mode, interrupts from external EBus2 devices not associated
with DMA channels (for example, keyboard and mouse) are connected directly to
the system interrupt controller (RISC) ASIC.
C.1.6.3 RISC
The reset, interrupt, scan, and clock (RISC) ASIC combine the five reset conditions
into three signals to the CPU module. Based on these signals, the CPU module sets
the proper control register bit to enable the software to identify the source of the
reset. The following figure shows the system reset functional block diagram. The five
reset conditions include:
■ POWER_GOOD from power supply
■ Scan control
■ Button POR
■ Button XIR
■ Scan XIR

Power Power_GOOD SYS_RESET_L
supply
P_RESET_L CPU
module
Scan SCAN control X_RESET_L
interface
RISC
ASIC
RST_L
BUTTON_POR
Push- UPA
button BUTTON_XIR graphics
PCI_RESET_A APB
ASIC
PCI slots PCI_RESET_B

Enet
PCI_RESET_B
EIDE
PCI_RESET_B
GFX
EBus2 PCI_RESET_B
devices
FIGURE C-10 System Reset Functional Block Diagram
C.1.7 EBus2 Devices

The devices described in the sections below interface to the EBus2 within PCIO
ASIC. The EBus2 is a slave interface that provides slave cycles on the EBus2. The
EBus2 slave interface provides eight chip selects. The slave cycle timing(s) on the
EBus2 is programmable. Timing control is provided for 7 address ranges that
correspond to the EB_CS1 through EB_CS7 address ranges. This section discusses
the following topics.
■ Section C.1.7.1 “SuperIO” on page C-22
■ Section C.1.7.2 “Serial Communications Controller” on page C-23
■ Section C.1.7.3 “Flash PROM” on page C-23
■ Section C.1.7.4 “NVRAM/TOD” on page C-24
■ Section C.1.7.5 “Audio” on page C-24

C.1.7.1 SuperIO
The SuperIO is a chip device that provides the following functions:
■ On-chip diskette controller
■ Two standard 16550 UARTs used for the serial mouse and keyboard
■ Parallel port
■ Mixed voltage support
■ 100-pin PQFP
Serial Ports/Keyboard and Mouse

The on-chip serial ports are used as the mouse and keyboard devices because the
system does not have fast and synchronous serial ports. The following figure is a
functional block diagram of the serial port.
KBD_IN KBD_IN
SIN0
RC (EMI) NETWORK
SP0 KBD_OUT KBD_OUT
SOUT0
SuperIO Keyboard/
mouse connector
MOUSE_IN MOUSE_IN
SIN1
SP1 POWERON_L
SOUT1
POWERON_L
To power supply
FIGURE C-11 Standard Serial Port Functional Block Diagram
Parallel Port
■ IEEE 1284-compatible parallel port
All five modes supported:

■ Compatible mode
■ Nibble mode
■ Byte mode
■ ECP
■ EPP
One legacy DMA channel supported

C.1.7.2 Serial Communications Controller
The Siemens serial communications controller enables a two-channel increased
throughput because of 32-byte first-in-first-out (FIFO) architecture. Serial port A
(DB25 connector) is fully synchronous/asynchronous, while serial port B
(DB9 connector) is asynchronous only. The serial communications controller has
64-byte buffering on both input and output. Therefore, the serial ports take less CPU
bandwidth. Interrupts are driven when the buffer is half full. The controller has a
dedicated crystal that enables using integer dividers to achieve exact baud rates in
most cases. The serial communications controller supports rates up to 921.6 Kbaud.
The limitation is the line drivers, which support up to 460.8 Kbaud.
The serial communications controller operates up to 430 Kbaud in asynchronous

mode. Synchronous mode operation is up to 460 Kbaud with external clocks.
The line drivers used are compatible with RS232 and RS423 protocols and are set
with a jumper on the motherboard. The slew rate of the line drivers is
programmable. The system slew rates are set at 10 VDC per microsecond for baud
rates greater than 100 Kbaud, and at 5 VDC per microsecond for baud rates less than
100 Kbaud. The following figure is a functional block diagram of the
communications controller serial ports.
UC5170
DB25
Serial B
EBus2
XTAL
Network
communications
controller A
B
RC
DB9
UC5180
FIGURE C-12 Communications Controller Serial Ports Functional Block Diagram
C.1.7.3 Flash PROM

The flash PROM is an 8-Mbit, 5.0 VDC, 1-Mbyte by 8-bit flash memory. The 1 Mbyte
of data is divided into 16 sectors of 64 Kbytes of flexible erase capability. This device
is designed to be programmed in-system with the standard system 5.0 VDC VCC
supply. 12.0 VDC Vpp is not required for program or erase operations. The flash
PROM is also programmed in a standard EPROM programmer. The flash PROM has
an access time of approximately 120 nanoseconds.

The flash PROM is divided into two halves, the open boot PROM (OBP) half, and
the power-on self-test (POST)/open boot diagnostic (OBDiag) half. There are two
physical jumpers on the motherboard. One jumper is used to enable either ROMBO
or the on-board flash. The second jumper protects the flash prom from accidental
writes to the flash PROM.
C.1.7.4 NVRAM/TOD
The non-volatile RAM/time of day (NVRAM/TOD), is an 8K x 8 nonvolatile static
RAM and real-time clock. The programmable alarm output is used for turning the
system on when Energy Star is enabled and the system has turned itself off. The
following figure shows the NVRAM/TOD functional block diagram.
A[12:0]
ED[7:0]
NVRAM/TOD
To POWERON_L
power supply IRQ TOD_WE_L
W
TOD_CS_L
E
FIGURE C-13 NVRAM/TOD Functional Block Diagram
C.1.7.5 Audio
The system audio consists of a single-chip CODEC, integrated amplifier, and
supporting analog circuitry.
The CODEC is a single-chip stereo, analog-to-digital and digital-to-analog converter

based on delta-sigma conversion technique. The microphone input specifications are
designed for the SunMicrophone II or equivalent. The following figure shows a
functional block diagram of the system audio circuit. TABLE C-7 lists the audio input
electrical specifications and TABLE C-8 lists the audio output electrical specifications.

EBus2
Line LIN_L
level Mono
input A Internal
LIN_R _Out
(stereo) D mono
speaker
Microphone MIN_L
level Line
input B CODEC E level
MIN_R
(stereo) output
(stereo)
AUX1_L Headphone
CD F output
input C AUX1_R (stereo)
FIGURE C-14 Audio Circuit Functional Block Diagram
TABLE C-7 Audio Input Electrical Specification
Parameter (Rec=50, Mon, Play=100) Min Nom Max Unit
Input voltage at microphone jack input that results in 66.9 70.4 77.4 mV (p-p)
full scale digital output
Input voltage at line-in jack that results in full scale 6.00 6.54 6.99 V (p-p)
digital output
Microphone input impedance 1.5 2.21 2.5 Kohm
Microphone input capacitance 200 220 240 pF
Line-in input impedance 8.7 9.16 9.62 Kohm
Line-in input capacitance 200 220 240 pF
TABLE C-8 Audio Output Electrical Specification
Parameter OLB= 1 (Rec=50, Mon, Play=100) Min Nom Max Unit
Output voltage at line out that results from a full 2.60 2.8 3.20 V (p-p)
scale digital signal (ATTN= 0dB)

TABLE C-8 Audio Output Electrical Specification (Continued)
Parameter OLB= 1 (Rec=50, Mon, Play=100) Min Nom Max Unit
Output voltage at headphone out that results from a 1.55 1.67 1.91 V (p-p)
full scale digital signal (ATTN= 10.5 dB)
Headphone output impedance 15 16 1.0K ohm
Line-out output impedance 207 220 233 ohm
C.1.8 Power and Standby Switching

The system has one power switch and two standby switches. These switches include
the power switch, the Sun Type-5 keyboard Standby key (or the Sun I/O Type-6
Power key), and the front panel standby switch.
C.1.8.1 Power Switch

The power switch is located on the system back, on the power supply. When set to
off, the system is completely off with no power.
C.1.8.2 Keyboard Standby or Power Key

The Sun Type-5 keyboard Standby key (or the Sun I/O Type-6 Power key) turns on
the system if the power switch is set to on and the system has been previously
placed in the standby mode.
The keyboard Standby/Power key can also be used to suspend the operating system
and place the system in the standby mode if the Energy Star power management
software (dtpower) has been installed.
C.1.8.3 Front Panel Standby Switch

The front panel standby switch turns on the system if the power switch is set to on
and the system has been previously placed in the standby mode.
The front panel standby switch can also be used to halt the operating system and
place the system in standby mode.

C.2 Clocking
There are five system clock domains: CPU, second level cache SRAMs, UPA, PCI,
and miscellaneous clocks for the various IO devices.
C.2.1 CPU and UPA Clocking

The CPU and UPA clocks are generated using a frequency synthesizer on the CPU
module. The synthesizer output frequency is divided by four, before being driven to
the CPU and SRAMs. In addition, one synthesizer output frequency is divided by six
and is gated to the CPU module and to the UPA graphics slot as the UPA clock.
C.2.2 PCI Clock Generation

All PCI clocks are generated on the motherboard. Additionally, two 66-MHz PCI
clocks are gated to the CPU module through the module connector. TABLE C-9 lists
the generated PCI clocks.
The motherboard supports two different PCI clock generators; the ICW48C60-422G
clock generator or the CY2254A-2 clock generator. TABLE C-10 and TABLE C-11 list the
PCI clock generator frequency select bits for the ICW48C60-422G and the
CY2254A-2 PCI clock generators, respectively.
TABLE C-9 PCI Clocks
Component 66 MHz 33 MHz
CPU module 2
APB 1 1
PCI expansion slots 2
RISC 1
PCIO 1

TABLE C-9 PCI Clocks (Continued)
Component 66 MHz 33 MHz
IDE 1
ATI PCI based VGA 1
Total number of PCI clocks 3 7
TABLE C-10 PCI Clock Generator Frequency Select (ICW48C60-422G)
CPUx
SEL0 SEL1 SEL2 R%EF1:2 (60/66 MHz) PCIx (30/33)
0 0 0 14.318 MHz 50 MHz 25 MHz
0 1 0 14.318 MHz 60 MHz 30 MHz
1 0 0 14.318 MHz 66 MHz 33 MHz
1 1 0 14.318 MHz 66 MHz 33 MHz
TABLE C-11 PCI Clock Generator Frequency Select (CY2254A-2)
CPUx
SEL0 SEL1 OE R%EF1:2 (60/66 MHz) PCIx (30/33)
0 0 1 14.318 MHz 50 MHz 25 MHz
0 1 1 14.318 MHz 60 MHz 30 MHz
1 0 1 14.318 MHz 66 MHz 33 MHz
1 1 1 14.318 MHz 55 MHz 27.5 MHz

C.3 Address Mapping
This section provides the overview of address partitioning and software-visible
registers and their respective functionality. The physical address associated with
each of these registers is listed, along with a brief description of the register. For
further details on the description of the registers and chips functionality refer to the
respective chip specification.
■ Section C.3.1 “Port Allocations” on page C-29
■ Section C.3.2 “UPA Graphics Address Assignments” on page C-30
■ Section C.3.3 “PCI Address Assignments” on page C-31
C.3.1 Port Allocations

The following table lists the system port allocations. The CPU module divides the
physical address space among:
■ Main memory (DRAM)
■ UPA graphics
■ PCI (which is further subdivided into the primary PCI bus (PCI-A) and the
secondary PCI bus (PCI-B bus) when the APB ASIC is used)
TABLE C-12 Port Allocations
Address Range in
PA<40:0> Size Port Access Access Type
0x000.0000.0000 - 1 Gbyte Main memory Cacheable

0x000.3FFF.FFFF
0x000.4000.0000 - Do not use Undefined Cacheable
0x1FF.FFFF.FFFF
0x1FC.0000.0000 - 8 Gbytes UPA graphics Non-cacheable
0x1FD.FFFF.FFFF
0x1FE.0000.0000 - 8 Gbytes CPU IO Non-cacheable
0x1FF.FFFF.FFFF

C.3.2 UPA Graphics Address Assignments
The following table lists the UPA graphics address assignments. TABLE C-14 lists
additional CPU module internal CSR space (non-cacheable).
TABLE C-13 UPA Address Space
UPA Address
Space PA[40:0] Size CPU Commands Supported PCI Commands Generated
PCI Config. 0x1FE.0100.0000 - 16 Mbytes NC read (max 4 bytes) Configuration read,

Space 0x1FE.01FF.FFFF NC write (max 4 bytes) configuration write (may
also be Special cycle)
PCI bus IO 0x1FE.0200.0000 - 16 Mbytes NC Read (any), NC IO read
space 0x1FE.02FF.FFFF Write (any) IO write
Don’t use 0x1FE.0300.0000 - May wrap to
0x1FE.FFFF.FFFF configuration or IO
Space behavior
PCI bus 0x1FF.0000.0000 - 4 Gbytes NC read (4 byte) Memory read
memory 0x1FF.FFFF.FFFF NC read (8 byte) Memory read multiple
space NC block read Memory read line
NC write Memory write
NC block write Memory write memory
NC Instruction fetch Read
TABLE C-14 CPU Module Internal CSR Space
PA[40:0] Owner
0x1FE.0000.0000 - 0x1FE.0000.01FF MCU
0x1FE.0000.0200 - 0x1FE.0000.03FF IOM
0x1FE.0000.0400 - 0x1FE.0000.1FFF PIE
0x1FE.0000.2000 - 0x1FE.0000.5FFF PBM
0x1FE.0000.6000 - 0x1FE.0000.9FFF PIE
0x1FE.0000.A000 - 0x1FE.0000.A7FF IOM
0x1FE.0000.A800 - 0x1FE.0000.EFFF PIE
0x1FE.0000.F000 - 0x1FE.00FF.FFFF MCU

C.3.3 PCI Address Assignments
The following table lists the PCI address assignments.
TABLE C-15 PCI Address Assignments
Address Range in PCI Address Size PCI Space Addressed Notes
0x8000.0000 - 0xBFFF.FFFF 1 Gbyte Primary PCI DVMA space CPU module DVMA register
(equals 0x30)
0x4000.0000 - 0x7FFF.FFFF 1 Gbyte PCI bus A memory space PCI slots APB ASIC register
(equals 0xc)
0x40.0000 - 0x7f.ffff 4 Mbytes PCI bus A I/O space PCI slots
0x0000.0000 - 0x3FFF.FFFF 2 Gbytes PCI bus B memory space Onboard PCI bus
0xC000.0000 - 0xFFFF.FFFF APB ASIC B register
(equals 0xc3)
0x00.0000 - 0x3f.FFFF 8 Mbytes PCI bus B I/O space

0xC0.0000 - 0xFF.FFF
C.3.3.1 PCI Bus A Address Assignments

PCI bus A has all the PCI slots and the address is programmable by the OpenBoot
Prom (OBP).
C.3.3.2 PCI Bus B Address Assignments

The PCI bus B address assignments are as follows:
■ PCIO ASIC registers
■ Boot PROM
PCIO ASIC Registers

The PCIO ASIC is a PCI client and the address can be reprogrammed by software
during boot only. Therefore, instead of providing absolute addresses for each of the
registers, only offset addresses, relative to a base address, are given.
The PCIO ASIC is a multifunction PCI device and its configuration space has three
base address pointers:
■ Boot PROM
■ EBus2 (function 0)
■ Ethernet (function 1)

Boot PROM
The PCIO ASIC is strapped so that the red mode trap address is:
■ UPA: 0x1FF.F000.0000
■ PCI: 0xF000.0000
■ EBus2: 0x00.0000
The following table lists the boot and flash PROM address assignments.
TABLE C-16 Boot PROM/Flash PROM Address Assignments
Offset Register Description Type Size
0x00.0000 - 0xFF.FFFF Flash Prom/EPROM R 1 or 4 bytes
C.4 Interrupts
Interrupts utilize a UPA-provided interrupt vector mechanism. All interrupts are
delivered to the CPU module through a packet-write scheme that provides 24 bytes
of data to the CPU module. Level sensitive software-acknowledge interrupts, which
would typically be communicated through dedicated interrupt lines, are converted
into interrupt packets and delivered to the CPU module.
The output of INT_NUM is registered externally and synchronized to the PCI clock
before being transferred to the CPU module. The following figure shows the
interrupt scheme block diagram and the following table summarizes the interrupt
routing.

INT_NUM[5:0]
374
UPA_Int
PCI A Int
PCI B Int RISC
ASIC CLK
EBus2 Int
CLK Reg_INT_NUM[5:0] CPU
module
PCI_CLK
(33-MHz)
FIGURE C-15 Interrupt Scheme Block Diagram
TABLE C-17 Interrupt Routing
INT_NUM
RISC Pin Interrupt Int/Ext Source (from RISC) Type Offset Priority
SB0_INTREQ7 Not used Ext PCI 0x07 Level 0x00 7
SB1_INTREQ7 Not used Ext PCI 0x0F Level 0x04 7
SB1_INTREQ5 Not used Ext PCI 0x0D Level 0x05 5
SB3_INTREQ5 Not used Ext PCI 0x1D Level 0x06 5
SB1_INTREQ2 Not used Ext PCI 0x0A Level 0x07 2
NO RISC PIN Not used Ext PCI 0x38 Level 0x09 5
NO RISC PIN Not used Ext PCI 0x10 Level 0x0A 2
SB1_INTREQ2 Not used Ext PCI 0x12 Level 0x0B 1
NO RISC PIN Not used Ext PCI 0x18 Level 0x0C 6
NO RISC PIN Not used Ext PCI 0x39 Level 0x0D 5

TABLE C-17 Interrupt Routing (Continued)
INT_NUM
NO RISC PIN Not used Ext PCI 0x00 Level 0x0E 2
SB3_INTREQ2 On Board PCI GFX Ext PCI 0x1A Level 0x0F 1
SB0_INTREQ6 PCI A slot 0, INTA# Ext PCI 0x06 Level 0x10 6
SB0_INTREQ4 PCI A slot 0, INTB# Ext PCI 0x04 Level 0x11 4
SB0_INTREQ3 PCI A slot 0, INTC# Ext PCI 0x03 Level 0x12 3
SB0_INTREQ1 PCI A slot 0, INTD# Ext PCI 0x01 Level 0x13 1
SB1_INTREQ6 PCI A Slot 1, INTA# Ext PCI 0x0E Level 0x14 6
SB1_INTREQ4 PCI A slot 1, INTB# Ext PCI 0x0C Level 0x15 4
SB1_INTREQ3 PCI A slot 1, INTC# Ext PCI 0x0B Level 0x16 3
SB1_INTREQ1 PCI A slot 1, INTD# Ext PCI 0x09 Level 0x17 1
SB2_INTREQ6 PCI A Slot 2, INTA# Ext PCI 0x16 Level 0x18 6
SB2_INTREQ4 PCI A slot 2, INTB# Ext PCI 0x14 Level 0x19 4
SB2_INTREQ3 PCI A slot 2, INTC# Ext PCI 0x13 Level 0x1A 3
SB2_INTREQ1 PCI A slot 2, INTD# Ext PCI 0x11 Level 0x1B 1
SB3_INTREQ6 PCI A Slot 3, INTA# Ext PCI 0x1E Level 0x1C 6
SB3_INTREQ4 PCI A slot 3, INTB# Ext PCI 0x1C Level 0x1D 4
SB3_INTREQ3 PCI A slot 3, INTC# Ext PCI 0x1B Level 0x1E 3
SB3_INTREQ1 PCI A slot 3, INTD# Ext PCI 0x19 Level 0x1F 1
SCSI_INT IDE Ext OBIO 0x20 Level 0x20 3
ETHERNET_INT Ethernet Ext OBIO 0x21 Level 0x21 3
PARALLEL_INT Parallel Port Ext OBIO 0x22 Level 0x22 2
AUDIO_INT Audio Capture/Rec Ext OBIO 0x24 Level 0x23 8
SB3_INTREQ7 Audio Playback Ext OBIO 0x1F Level 0x24 7

TABLE C-17 Interrupt Routing (Continued)
INT_NUM
Power_FAIL_I NT Power Fail Ext OBIO 0x25 Level 0x25 8
KEYBOARD_INT IDE Channel 2 Ext OBIO 0x28 Level 0x26 7

(Not used)
FLOPPY_INT Diskette Ext OBIO 0x29 Level 0x27 8
SPARE_INT Spare hardware Ext OBIO 0x2A Level 0x28 2
SKEY_INT Keyboard Ext OBIO 0x2B Level 0x29 4
SMOU_INT Mouse Ext OBIO 0x2C Level 0x2A 4
SSER_INT Serial Ports Ext OBIO 0x2D Level 0x2B 7
Reserved 0x2C -
0x2D
Uncorrectable ECC Int ECC Level 0x2E 8
Correctable ECC Int ECC Level 0x2F 8
PCI Bus Error Int PBM Level 0x30 8
Reserved Int 0x31 -

0x32
Graphics1_INT Graphics Ext UPA64 0x23 Pulse FROM 5
INR
Graphics1_INT Graphics (Not used) Ext UPA64 0x26 Pulse FROM 5
INR
No Interrupt Ext NONE 0x3F N/A N/A N/A

C.5 Power
This section discusses the following topics.
■ Section C.5.1 “Onboard Voltage Regulator” on page C-36
■ Section C.5.2 “Power Supply Memory” on page C-36
C.5.1 Onboard Voltage Regulator

The onboard voltage regulator meets VRM8.1 specifications. The output of the
voltage regulator is programmed by the module. The module drives VID[3:0], which
asks the regulator to generate the correct core voltage for the CPU module core
voltage and SRAM IO.
C.5.2 Power Supply Memory

The system remembers the state that it was in before a power failure or accidental
power cord removal. This circuit is implemented on the motherboard. A latching
relay circuit on the motherboard performs this function.
C.5.3 Power Management

To meet EPA Energy Star requirements, the system power consumption is lower than
30 watts.
In-system software monitors system activity, and based on the system control
settings, system software saves the machine state (including the memory) onto the
hard drive and halts the operating system. The system software then turns off the
power supply.
Based on the setting of the NVRAM/TOD, which has an alarm clock, the system is
turned on automatically if the alarm is set. This is done by having the interrupt out
of the NVRAM/TOD directly connected to the power supply. The power supply
requires a power_off signal for the system software to be able to write to a bit
within a register and have the power supply shut down.

C.6 Motherboard
The following figure illustrates a block diagram of the system motherboard.
System Top
Audio GP0 DIMM1

J5 J9 Pwr J12 Pwr J13 DIMM2
GP1 DIMM3
Audio J14
J6 DIMM4
J15
J16
Keyboard/
Mouse JP2
J1
UPA graphics connector UPA1
JP1
JP3
JP4
J10
A1 A94
J19
Rear
Riser board connector J11
B1 B94 J18
J17
U13
NVRAM/ JP8 JP9
TOD
J7
Serial Serial port B

port A CPU module connector MJ1
J3
Parallel port
J8
Video
J4
TPE
J2 CPU module connector MJ2
System Bottom
FIGURE C-16 Motherboard Block Diagram

C.7 Jumper Descriptions
Jumper configurations can be changed by setting jumper switches on the
motherboard. The motherboard’s jumpers are preset at the factory.
A jumper switch is closed (sometimes referred to as shorted) with the plastic cap
inserted over two pins of the jumper. A jumper is open with the plastic cap inserted
over one or no pin(s) of the jumper. The following figure shows the different jumper
settings that are used on the motherboard.
Closed Open
1 1
1-2 2-3
FIGURE C-17 Selected Jumper Settings
Jumper descriptions include brief overviews of serial port jumpers, flash PROM
jumpers, and additional system board jumper and connector blocks.
Jumpers are identified on the system board by J designations. Jumper pins are
located immediately adjacent to the J designator. Ensure that the serial port jumpers
are set correctly.
J PX X Part number
Pins
FIGURE C-18 Identifying Jumper Pins

C.7.1 Serial Port Jumpers
Serial port jumpers JP3 and JP4 can be set to either RS-423 or RS-232 serial interface.
The jumpers are preset for RS-423. RS-232 is required for digital telecommunication
within the European Community. The following table identifies serial port jumper
settings. If the system is being connected to a public X.25 network, the serial-port-
mode jumper setting may need to change from RS-423 to RS-232 mode. The
following figure illustrates the JP3/JP4 jumper settings for RS-423 (default) interface.
1 1
2 2
3 3
JP3 JP4
FIGURE C-19 JP3/JP4 Jumper Settings for RS-423 Interface
TABLE C-18 Serial Port Jumper Settings
Pins 1-2 Pins 2-3

Jumper Select Select Default Jumper on Pins
JP3 RS-232 RS-423 2-3

JP4 RS-232 RS-423 2-3
To change the serial port jumper setting from RS-423 (default) to RS-232, refer to
Section 8.7.2, “Replacing the Motherboard."
C.7.2 Flash PROM Jumpers

Flash PROM jumpers JP1 and JP2 are used for reprogramming specific code blocks
and remote programming of the flash PROM. The following figure illustrates the
JP1/JP2 jumper settings (default) for the flash PROM and the following table
identifies the flash PROM jumper settings. The default shunt settings of jumpers JP1
and JP2 are 1-2. Placing the shunt on pins 2 and 3 enables reprogramming of the
flash PROM.

1 1
2 2
3 3
JP1 JP2
FIGURE C-20 JP1/JP2 Jumper Settings for the Flash PROM
TABLE C-19 Flash PROM Jumper Settings
Jumper Pins 1-2 Select Pins 2-3 Select Default Jumper on Pins
JP1 To onboard PROM To ROMBO 1-2

JP2 Disable (default) Enable 1-2
C.8 Enclosure
The system uses an enclosure that reflects style, ergonomics, serviceability,
functionality, versatility, and quality. Physical orientation allows for a rack-mount,
desktop, or under-desk installation. The enclosure design complies with all
necessary environmental and regulatory specifications.
The Ultra 10 enclosure houses:

■ One 3.5-inch (8.89-cm) diskette drive
■ One 1.6-inch (4.064-cm) CD-ROM drive
■ One 3.5-inch (8.89-cm) hard drive bay
■ One plug-in UltraSPARC module
■ Four DIMMs
■ Four PCI slots
■ One UPA64S module

APPENDIX D
Software Notes
Note – Systems with PGX24 graphics have "PGX24" or “Series 3” printed on the
serial number label that is affixed to the system front bezel.
D.1 PGX24 8- or 24-Bit Graphics

The PGX24 offers PCI-based onboard 8-bit or 24-bit graphics. Selected features of the
PCI-based onboard 8-bit or 24-bit graphics are described in the following
paragraphs. (Also included is an m64 driver installation procedure that is required
for systems running either the Solaris 2.5.1 Hardware: 11/97 or Solaris 2.6 5/98
operating environments.) Software support for PGX24 is included with Solaris 7.
Software support for version 2.5.1 Hardware: 11/97 or version 2.6 5/98 requires an
update, which is included on the Sun Ultra 10 Software Supplement CD (704-6624). For
patch installation instructions, refer to this appendix or the instructions in the CD-
insert document included with that CD.
D.1.1 What Does 8-Bit or 24-Bit Frame Buffer Refer To?

The 8-bit or 24-bit graphics describes the number of graphics bits available to store
the information for each pixel on the screen. The Ultra 5 onboard PGX24 graphics
supports 8-bit or 24-bit colormapping. In contrast, the earlier Ultra 5 onboard PGX
graphics only support 8-bit colormapping.
D-1
D.1.2 The Difference Between 8-Bit Mode and 24-Bit
Mode on Ultra 5 Onboard Graphics
When in 8-bit mode, an 8-bit colormap is available. A main drawback of the 8-bit
mode is colormap flashing. Because of the low number of colors, each application
typically uses all the colors in the map. If two applications assigned different colors
to the map, when one application is pulled into the foreground, the color map is
changed and the colors of all the other open application windows change (i.e., flash)
to use those in the map of the application just pulled into the foreground. The visual
classes available for the 8-bit mode are: PseudoColor, StaticGray, StaticColor,
GrayScale, TrueColor, and DirectColor. The 8-bit mode provides 256-different-colors
availability at one time. All of the applications that run on previous Ultra 5 on-board
frame buffers (PGX) are available.
When in 24-bit mode, a 24-bit colormap is available. The visual class available is
TrueColor. The 24-bit mode provides up to 16.7 million different colors available at
one time. The large number of colors available eliminate the colormap flashing.
However, some of the applications that assume an 8-bit colormap do not initialize in
24-bit mode.
D.1.3 How to Install PGX24 Graphics Software on

Solaris 2.5.1 HW:11/97
To load the Solaris 2.5.1 HW:11/97 PGX24 graphics software patch, patch 103792-15,
proceed as follows:
1. Become super-user on the system.
2. Go to the directory that contains the patch by typing
# ./cdrom/sun_ultra_5_10_series_hw_ab/Patches/103792-15
3. Install the patch by typing
# ./installpatch .
D-2 Sun Ultra 10 Service Manual • February 2000

6. Set the PGX24.graphics mode to 24-bit by typing
# m64config -depth 24 -res 1152x900x66
7. Either log out or exit the windowing system, then restart the windowing system.
When the windowing system starts up, the display the display will be in 24-bit
mode.
Note – Software patches may be updated after the release of this product. You may
contact Sun Enterprise Services, or go to the Sun Online Support Tools webpage,
http://www.sun.com/service/online/, to obtain the latest software patch.
D.1.4 How to Install PGX24 Graphics Software on

Solaris 2.6 5/98
To load the Solaris 2.6 5/98 PGX24 graphics software patch, patch 105362-13,
proceed as follows:
2. Go to the directory that contains the patch by typing
# ./cdrom/sun_ultra_5_10_series_hw_ab/Patches/105362-13
3. Install the patch by typing
# ./installpatch .
6. Set the PGX24.graphics mode to 24-bit by typing
# m64config -depth 24 -res 1152x900x66
Appendix D Software Notes D-3

7. Either log out or exit the windowing system, then restart the windowing system.
When the windowing system starts up, the display the display will be in 24-bit
mode.
Note – Software patches may be updated after the release of this product. You may
contact Sun Enterprise Services, or go to the Sun Online Support Tools webpage,
http://www.sun.com/service/online/, to obtain the latest software patch.
D.1.5 Which Mode is Running

The output of the command:
% /usr/sbin/m64config -propt
tells you this information. depth 8 means that 8-bit mode is initialized. Likewise,
depth 24 means that the 24-bit mode is active. The default setting is 8-bit mode.
D.1.6 Changing From One Mode to the Other

1. Exit the window system.
2. Enter the command:
% /usr/sbin/m64config -res <current resolution> -depth <8/24>
3. Check the current resolution by entering:
% /usr/sbin/m64config -prconf
4. Example 1 - To change from 8-bit to 24-bit mode:
% /usr/sbin/m64config -res 1152x900x66 -depth 24

5. Example 2 - To change from 24-bit to 8-bit mode:
% /usr/sbin/m64config -res 1152x900x66 -depth 8
Note – The -res option needs to be specified although the resolution is not
changing.
Note – The maximum resolution supported by the 24-bit mode is 1152x900x76.
6. Restart the window system or reboot the machine.
D.2 Solaris 2.5.1 and 2.6 Software Upgrades

for Systems Faster Than 420 MHz
If your system CPU speed is faster than 420 MHz, or if you upgrade with a
replacement CPU module that is faster than 420 MHz, and your system is using
either the Solaris 2.5.1 or 2.6 operating environments, software patches are required
for those Solaris releases to run at the faster CPU speeds.
Systems with CPU speed faster than 420 MHz have the patch CDs shipped with
them from the factory.
If you upgrade to a CPU faster than 420 MHz, you can order the software patch CDs
using part number 704-6657 (for Solaris 2.5.1) or 704-6658 (for Solaris 2.6).
Refer to the installation instructions included with the CDs in the Solaris 2.5.1 and 2.6
for 420+ MHz Systems Installation Guide.
Appendix D Software Notes D-5

Glossary
address A unique location within computer or peripheral memory. Reference made to

an address is usually for retrieving or storing data.
APB Advanced PCI bridge. A PCI-to-PCI bridge ASIC that features a connection
path between a 32-bit bus operating at speeds up to 66 MHz on the primary
interface and two 32-bit, 5 Vdc or 3.3 Vdc, PCI buses (each operating at 33
MHz), on the secondary interface.
ASIC Application-specific integrated circuit.
ASP Authorized service provider.
AUXIO Auxiliary IO. General purpose lines used to control miscellaneous system
functions.
boot A term used to identify the process of reading initial software into the
computer.
boot PROM In Sun workstations, contains the PROM monitor program, a command
interpreter used for booting, resetting, low-level configuration, and simple test
procedures.
CAS Column address select.
CDE Common Desktop Environment.
CD-ROM Compact disc read-only memory.
DBZ Double buffer with Z.
DCE Data communication equipment. An external modem.
default A preset value that is assumed to be correct unless changed by the user.
DIMM Dual in-line memory module. A small printed circuit card that contains
dynamic random access memory chips.
DMA Direct memory address.
Glossary-1
DOC Department of communications.
dpi Dots per inch.
DRAM Dynamic random-access memory. A read/write dynamic memory in which the

data can be read or written in approximately the same amount of time for any
memory location.
DTAG Dual tag or data tag.
DTE Data terminal equipment.
EBus Extension bus.
ECC Error checking code.
EDO Extended data out.
EIDE Enhanced IDE.
EMI Electrostatic magnetic interference. Electrical phenomena that directly or

indirectly contributes to a degradation in performance of an electronic system.
Ethernet A type of network hardware that provides communication between systems

connected directly together by transceiver taps, transceiver cables, and various
cable types such as coaxial, twisted-pair, and fiber-optic.
FBC Frame buffer controller. An ASIC responsible for the interface between the
UPA and the 3DRAM. Also controls graphic draw acceleration.
FCC Federal communications commission.
FIFO First-in-first-out.
flash PROM Flash programmable read-only memory.
Gbyte Gigabyte.
GUI Graphical user interface.
IDC Insulation displacement connector.
IDE Intergrated drive electronics.
I/O Input/output.
JTAG IEEE standard 1149.1.
Kbyte Kilobyte.
LAN Local area network.
LED Light-emitting diode.
MAC Media access controller.
Glossary-2 Sun Ultra 10 Service Manual • February 2000

Mbyte Megabyte.
MBps Megabyte per second.
Mbps Megabit per second.
MCU Memory controller unit.
MHz Megahertz.
MII Media independent interface.
ns Nanosecond.
NVRAM Non-volatile random access memory. Stores system variables used by the boot
PROM. Contains the system hostID number and Ethernet address.
OBP OpenBoot PROM. A routine that tests the network controller, diskette drive
system, memory, cache, system clock, network monitoring, and control
registers.
PCI Peripheral component interconnect. A high-performance 32- or 64-bit-wide bus

with multiplexed address and data lines.
PCIO PCI-to-EBus/Ethernet controller. An ASIC that bridges the PCI bus to the
EBus, enabling communication between the PCI bus and all miscellaneous I/O
functions, as well as the connection to slower on-board functions.
PCMCIA Personal Computer Memory Card International Association.
PID Process ID.
POR Power-on reset.
POST Power-on self-test. A series of tests that verify motherboard components are
operating properly. Initialized at system power-on or when the system is
rebooted.
RAMDAC RAM digital-to-analog converter. An ASIC responsible for direct interface to

3DRAM. Also provides onboard phase-lock loop (PLL) and clock generator
circuitry for the pixel clock.
RAS Row address select.
RC Resistive-capacitive.
RISC Reset, interrupt, scan, and clock. An ASIC responsible for reset, interrupt, scan,
and clock.
SB Single buffer.
SDRAM Synchronous DRAM.
SGRAM Synchronous graphics RAM.
Glossary-3
SRAM Static random access memory.
Standby switch Controls the standby state of the system.
STP Shielded twisted-pair.
SunVTS A diagnostic application designed to test hardware.
TIP connection A connection that enables a remote shell window to be used as a terminal to
display test data from a system.
TPE Twisted-pair Ethernet.
TOD Time of day. A timekeeping intergrated circuit.
TTL Transistor-transistor logic.
UPA UltraSPARC port architecture. Provides processor-to-memory interconnection.
UTP Unshielded twisted-pair.
VCCI Voluntary control council for interference.
VIS Visual instruction set.
Vrms Volts root-mean-square.
Glossary-4 Sun Ultra 10 Service Manual • February 2000

Index
NUMERICS B
10-/100-Mbit Ethernet, C-5 baud rate, verifying, 3-4
functional block diagram, C-6 block diagram
motherboard, C-37
bypassing POST, 3-22
A
all above output message, 4-27
APB ASIC, C-5, C-19 C
ASIC cabling configuration
APB, C-5, C-19 CD-ROM drive, A-6
PCIO, C-5, C-19 cabling configuration, Ultra 10 hard drive, A-7
CD-ROM drive
RISC, C-20
attaching wrist strap failure, 4-4
to chassis (Ultra 10), 5-10 removing, 7-13
audio, 4-25, C-24 replacing, 7-14
cable assembly CD-ROM drive cabling configuration, A-6
removing, 6-9 commands, keyboard control, 3-22
replacing, 6-10
common features, 1-2
circuit functional block diagram, C-25 communications controller serial ports functional
connector
block diagram, C-23
line assignments, B-12
compliance
pin configuration, B-12
German acoustic, xxvii
input electrical specification, C-25
output electrical specification, C-25 components, system unit, 1-6
cover, top
audio output message, 4-25 removing, 5-8
replacing, 10-1
CPU
fan assembly
Index-1
removing, 6-13 interface, C-6
replacing, 6-14 EIDE
module, C-3 cable
removing, 8-1 configuration support, C-8
replacing, 8-3 electrical requirements, C-7
labeling, C-8
interface, C-7
functional block diagram, C-7
D
electrical specification
description
audio input, C-25
functional, C-1
audio output, C-25
product, 1-1
electrical specifications, A-2
signal, B-1
Ultra 10, A-2
SunVTS, 2-1
diag-level electrostatic discharge, 5-4
variable Elite3D m3 Lite
set to max, 3-7 patch information, 8-11
set to min, 3-15 enclosure, C-40
diagnostics, OBP on-board, 4-8 environmental
DIMM requirements, A-5
bank location, 8-6 error reporting, POST, 3-19
characteristics, C-12 Ethernet, 4-19
failure, 4-7 output message, 4-20
physical memory address, 4-7 external UTP-5 cable lengths, B-6
removing, 8-6
replacing, 8-8
slot pair location, 8-6 F
diskette drive failure
cable assembly
removing, 6-4
CD-ROM drive, 4-4
replacing, 6-6 DIMM, 4-7
removing, 7-1 hard drive,4-4
replacing, 7-2 power-on, 4-2
drive bracket video output, 4-3
removing, 6-17 features
common, 1-2
flash PROM, C-23
E jumper settings, C-40
EBus jumpers, C-39
DMA registers, 4-19 floppy, 4-21
TCR registers, 4-19 output message, 4-21
EBus2 front
devices, C-21 panel on/off switch, C-26
Index-2 Sun Ultra 10 Service Manual • February 2000

view initializing POST, 3-5
Ultra 10 system unit, 1-5
internal drives identification, 4-4
functional block diagram
10-/100-Mbit Ethernet, C-6
audio circuit, C-25
communications controller serial ports, C-23 J
J12 connector
EIDE interface,C-7 pin assignments, B-2
memory interface, C-11
NVRAN/TOD, C-24 J17 connector
PCI-based graphics (PGX), C-9 pin assignments, 4-6
PCI-based graphics (PGX24), C-9 pin configuration, 4-6
standard serial port, C-22 jumper
system reset, C-21 descriptions, C-38
system unit, C-2 pins
identifying, C-38
UPA graphics, C-4
settings
functional description, C-1 flash PROM, C-40
RS-423 interface, C-39
serial port, 8-20, C-39
jumpers
G
flash PROM, C-39
German acoustic compliance, xxvii
serial port, C-39
H
hard drive
K
cable assembly keyboard, 4-20
removing, 6-6 LED patterns,3-19
replacing, 6-7 output message,4-20
failure, 4-4
Sun Type-5, 5-6, 10-4
removing, 7-4 keyboard standby key, C-26
replacing, 7-6 keyboard/mouse
hard drive mirroring, 7-8 connector
how this book is organized, xx pin assignments, B-4
I
L
I/O devices, 1-3
LEDs, 3-5, 3-6, 5-7, 10-5
ide output message, 4-26
patterns, keyboard, 3-19
identifying jumper pins, 8-20, C-38
line assignments, audio connector, B-12
illustrated parts list, 9-1
lithium battery, 5-4
information, reference, A-6
Index-3
M audio, 4-25
6-1
major subassemblies, EBus
maximum level of POST, 3-7 DMA registers, 4-19
TCR registers, 4-19
memory
Ethernet, 4-19
address assignments, C-13
architecture, C-10 floppy, 4-21
IDE, 4-26
DIMM configuration, C-12
interface keyboard, 4-20
functional block diagram, C-11 mouse, 4-21
minimum level of POST, 3-7 NVRAM, 4-25
minitower workstation, Ultra 10, 1-2 parallel port, 4-22
mirroring hard drives, 7-8 PCI/PCIO, 4-18
modem serial port A, 4-22
setting up, A-2 serial port B, 4-24
setup specifications, A-2 OBP on-board diagnostics, 4-8
modification to equipment, 5-3 probe-ide, 4-10
motherboard
selected tests, 4-11
block diagram, C-37
watch-clock, 4-8
component replacement, 8-1
watch-net, 4-8
3-23
initializing POST,
watch-net-all, 4-8
removing,8-17 on/off switch
replacement, 8-1 front panel, C-26
replacing, 8-19 power supply, C-26
mouse, 4-21 on-board voltage regulator, C-36
output message, 4-21 OpenBoot diagnostics, 4-13
operation
SunVTS, 2-2
N output message
NVRAM, 4-25 all above, 4-27
output message, 4-25 audio, 4-25
NVRAM/TOD, C-24 Ethernet, 4-20
functional block diagram, C-24 floppy, 4-21
removing, 8-4 ide, 4-26
replacing, 8-5 keyboard, 4-20
mouse, 4-21
NVRAM, 4-25
O parallel port, 4-22
OBDiags, 4-13 PCI/PCIO, 4-18
4-27
all above, probe-ide, 4-10
serial port A, 4-22

serial port A with TIP line, 4-23 connector J12, B-2
serial port B, 4-24 J17 connector, 4-6
test, 4-11 keyboard/mouse connector, B-4
watch-clock, 4-8 parallel port connector, B-10
watch-net, 4-9 riser board, C-15
watch-net-all, 4-9 serial port B connector, B-9
overview TPE connector, B-5
POST, 3-1 video connector, B-13
SunVTS, 2-1 pin configuration
audio connector, B-12
connector J12, B-2
P J17 connector, 4-6
parallel port, 4-22, C-22 keyboard/mouse connector, B-4
connector parallel port connector, B-10
pin assignments, B-10
serial port A connector, B-7
serial port B connector, B-9
output message, 4-22
TPE connector, B-5
parts list, illustrated, 9-1
video connector, B-13
patch information, Elite3D m3 Lite, 8-11
PCI placement of Sun product, 5-3
bus POST
primary, C-5 bypassing, 3-22
secondary, C-5 error reporting, 3-19
card
initializing, 3-5
removing, 8-12
replacing, 8-13 maximum level, 3-7
PCI/PCIO, 4-18 minimum level, 3-7
PCI/PCIO output message, 4-18 motherboard, initializing, 3-23
PCI-based graphics, C-9 overview, 3-1
PCI-based graphics (PGX) progress reporting, 3-19
functional block diagram, C-9 power, C-36
PCI-based graphics (PGX24) cord connection, 5-3
functional block diagram, C-9 management, C-36
PCI-IDE
interface, C-4
on/off switch, system unit, 5-7, 10-3
supply on/off switch, C-26
PCIO ASIC, C-5, C-19
physical dimensions supply, test, 4-5
Ultra 10, 1-4 switching, C-26
power supply
Ultra 5, 1-4
removing, 6-1
physical specifications, A-1
replacing, 6-3, 6-19
Ultra 10, A-1
power supply (Ultra 10)
pin assignments
Index-5
removing and replacing, 6-2 riser board, 8-15
powering serial/parallel cable assembly, 6-8
off the system unit, 5-5 speaker assembly, 6-11
on the system unit, 10-3 top cover, 5-8
power-on
UPA graphics card, 8-9
failure, 4-2 removing and replacing
self-test,3-1 audio cable (Ultra 10), 6-10
preface, xix CD-ROM drive (Ultra 10), 7-14
pre-POST preparation, 3-2 CPU fan assembly (Ultra 10), 6-14
primary PCI bus, C-5 CPU module (Ultra 10), 8-3
probe-ide diagnostic output message, 4-10 DIMM (Ultra 10), 8-7
procedures, troubleshooting, 4-1 diskette drive (Ultra 10), 7-2
product
diskette drive cable (Ultra 10), 6-5
description, 1-1
hard drive (Ultra 10 chassis front), 7-6
specifications, A-1 hard drive (Ultra 10 chassis rear), 7-5
progress reporting, POST, 3-19 6-7
hard drive cable (Ultra 10),
motherboard (Ultra 10), 8-19
NVRAM/TOD (Ultra 10), 8-5
R
PCI card (Ultra 10), 8-13
rear view
power
Ultra 10 system unit,1-5 supply (Ultra 10), 6-2
reference information, A-6 riser board (Ultra 10), 8-16
related documents, xxiii 6-8
serial/parallel cable (Ultra 10),
removing
speaker assembly (Ultra 10), 6-12
audio cable assembly, 6-9 UPA graphics card (Ultra 10), 8-10
CD-ROM drive, 7-13 upper and lower bezels (Ultra 10), 5-12
CPU fan assembly, 6-13 replaceable components
CPU module, 8-1 Ultra 10, 1-6
DIMM, 8-6 Ultra 5, 1-6
diskette drive, 7-1 replacing
cable assembly, 6-4 audio cable assembly, 6-10
drive bracket, 6-17 CD-ROM drive, 7-14
front bezel (Ultra 10), 6-16 CPU fan assembly, 6-14
hard drive, 7-4 CPU module, 8-3
cable assembly, 6-6
DIMM, 8-8
motherboard, 8-17
diskette drive, 7-2
NVRAM/TOD, 8-4 cable assembly, 6-6
PCI card,8-12 front bezel (Ultra 10), 6-16
power supply, 6-1 hard drive, 7-6
rear drive bracket (Ultra 10), 6-18 cable assembly, 6-7

motherboard, 8-19 pin configuration, B-7
NVRAM/TOD, 8-5 output message, 4-22
output message with TIP line, 4-23
PCI card, 8-13
port B, 4-24
power supply, 6-3, 6-19
connector
rear drive bracket (Ultra 10), 6-18 pin assignments, B-9
riser board, 8-16 pin configuration, B-9
serial/parallel cable assembly, 6-9 output message, 4-24
speaker assembly, 6-12 serial ports/keyboard and mouse, C-22
top cover, 10-1 serial/parallel
UPA graphics card, 8-10 cable assembly
removing, 6-8
requirements, environmental, A-5 replacing, 6-9
RISC ASIC, C-20 setting up
riser board modem, A-2
C-15
connector definition, tip connection, 3-2
pin assignment, C-15 shell prompts, xxii
pin summary, C-15 signal descriptions, B-1
removing, 8-15 speaker assembly
replacing, 8-16 removing, 6-11
replacing, 6-12
specifications
S electrical, A-2
safety physical, A-1
precautions product, A-1
electrostatic discharge, 5-4
lithium battery, 5-4
standard serial port functional block diagram, C-
modification to equipment, 5-3 22
placement of Sun product, 5-3 standby
power cord connection, 5-3 5-6, 10-4
switch, system unit,
requirements, 5-2 standby switching, C-26
secondary PCI bus, C-5 storage devices, 7-1
selected jumper settings, C-38 Sun
serial Type-5 keyboard, 5-6, 10-4
communications controller, C-23 type-5 keyboard, 3-5
port type-5 keyboard LEDs, 3-5
A connector, B-7
B connector, B-9 Type-6 keyboard, 3-6, 5-7, 10-5
jumper settings, 8-20, C-39 Type-6 keyboard LEDs, 3-6, 5-7, 10-5
jumpers, C-39 SunVTS
speed change, A-3 description, 2-1
port A, 4-22 operation, 2-2
connector
overview, 2-1
pin assignments, B-7
Index-7
SuperIO, C-22 rear view, 1-5
supported Ultra 10 hard drive cabling configuration, A-7
Ultra 10 configuration, C-8 Ultra 5
symbols, 5-2 physical dimensions, 1-4
system replaceable components, 1-6
reset functional block diagram, C-21 UPA, C-4
unit, C-1 graphics card
components, 1-6 removing, 8-9
features, 1-4 replacing, 8-10
functional block diagram, C-2 graphics card (Ultra 10 only), 4-12
power on/off switch, 5-7, 10-3 graphics card (Ultra 10), 8-9
standby switch, 5-6, 10-4 UPA graphics
system unit
functional block diagram, C-4
replaceable components, 9-3
V
T
verifying baud rate, 3-4
test
video connector
power supply, 4-5 pin assignments, B-13
test diagnostic output message, 4-11 pin configuration,B-13
tip connection, setting up, 3-2 video output failure, 4-3
tools required, 5-5
TPE
cable-type connectivity, B-6
connector W
pin assignments, B-5 watch-clock diagnostic, 4-8
pin configuration, B-5 watch-clock diagnostic output message, 4-8
transceivers, C-14 watch-net diagnostic, 4-8
troubleshooting procedures, 4-1 watch-net diagnostic output message, 4-9
typical error code failure message, 3-20 watch-net-all diagnostic, 4-8
typographic conventions, xxii watch-net-all diagnostic output message, 4-9
wrist strap, attaching
to chassis (Ultra 10), 5-10
U
Ultra 10
electrical specifications,A-2
minitower workstation, 1-2
physical dimensions, 1-4
physical specifications, A-1
replaceable components, 1-6
system unit
front view, 1-5

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Sun Ultra 10 Service Manual

Sun Microsystems, Inc.

Part No.: 805-7764-12

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How This Book Is Organized xx

Using UNIX Commands xxi

Typographic Conventions xxii

Shell Prompts xxii

Related Documents xxiii

Ordering Sun Documents xxiv

Sun Welcomes Your Comments xxiv

1. Product Description 1-1

2. SunVTS Overview 2-1

4. Troubleshooting Procedures 4-1

iv Sun Ultra 10 Service Manual • February 2000

5. Preparing for Component Replacement 5-1

7. Storage Devices 7-1

vi Sun Ultra 10 Service Manual • February 2000

8. Motherboard and Component Replacement 8-1

9. Illustrated Parts List 9-1

10. Finishing Replacement Procedures 10-1

A. Product Specifications and Reference Information A-1

viii Sun Ultra 10 Service Manual • February 2000

B. Signal Descriptions B-1

C. Functional Description C-1

x Sun Ultra 10 Service Manual • February 2000

D. Software Notes D-1

FIGURE 1-1 Ultra 10 Minitower System 1-2

FIGURE 1-2 Ultra 10 System Front View 1-5

FIGURE 1-3 Ultra 10 System Back View 1-5

FIGURE 3-1 Setting Up a TIP Connection 3-2

FIGURE 3-2 Sun Type-5 Keyboard 3-5

FIGURE 3-3 Sun I/O Type-6 Keyboard 3-6

FIGURE 4-1 Power Supply Connector J17 Pin Configuration 4-6

FIGURE 5-2 System Standby Switch 5-6

FIGURE 5-3 Sun Type-5 Keyboard 5-6

FIGURE 5-4 Sun I/O Type-6 Keyboard 5-7

FIGURE 5-5 System Power Switch 5-7

FIGURE 5-6 Removing and Replacing the System Cover 5-9

FIGURE 5-7 Attaching the Wrist Strap to the Chassis 5-10

FIGURE 5-8 Removing a Plastic Filler Panel 5-12

FIGURE 5-9 Removing a Metal Filler Panel 5-13

FIGURE 6-1 Removing and Replacing the Power Supply 6-2

FIGURE 6-6 Removing and Replacing the Speaker Assembly 6-12

FIGURE 6-8 Removing and Replacing the Front Bezel 6-16

FIGURE 7-1 Removing and Replacing the Diskette Drive 7-2

FIGURE 7-4 Hard Drive Mirroring Configuration 7-8

FIGURE 7-5 Removing and Replacing a CD-ROM Drive 7-14

FIGURE 8-1 Removing and Replacing the CPU Module 8-3

FIGURE 8-2 Removing and Replacing the NVRAM/TOD 8-5

FIGURE 8-3 Removing and Replacing a DIMM 8-7

FIGURE 8-4 Removing and Replacing the Graphics Card 8-10

FIGURE 8-5 Removing and Replacing the PCI Card 8-13

FIGURE 8-7 Removing and Replacing the Motherboard 8-19

FIGURE 8-8 Identifying Jumper Pins 8-20

FIGURE 9-1 Ultra 10 System Exploded View 9-3

FIGURE 10-1 Removing and Replacing the System Cover 10-2

FIGURE 10-2 System Power Switch 10-3

FIGURE 10-3 System Standby Switch 10-4

FIGURE 10-4 Sun Type-5 Keyboard 10-4