SPECIMEN PREPARATIO

SPECIMEN PREPARATIO
CONTACT Model 682.40000
Semiconductor Application:

Slope Cutter Tool (SC-Tool)

Slope Cut at 45 degree with Gatan Inc.

SE
rocking; large cutting length Corporate Office
> 8mm; selective ion beam Western USA Sales
etching applied; sputter coat- 5933 Coronado Lane
ing 2nm Pt applied; high mag- Pleasanton, CA 94588
nification Tel. (925) 463 0200
Fax. (925) 463 0204
Contact: info@gatan.com

Eastern USA Sales

780 Commonwealth Drive
Warrendale, PA 15086
Tel. (724) 776 5260
Fax. (724) 776 3360
Contact: info@gatan.com

Gatan UK
25 Nuffield Way
Polymer Application: Carbon fibers/PTFE; perpendicular cut; 7.0keV, Abingdon

PECIMEN PREPARATION
250µA. Image courtesy of W. Hauffe, Dresden University of Technology Oxon, OX14 1RL ION BEAM SLOPE CUTTING
United Kingdom Ion beam slope cutting is a technique developed by W.
BENEFITS Tel. +44 (0)1235 540160
Cut, etch and coat cross sections from any material quickly and easily Fax. +44 (0)1235 540169 Hauffe, Dresden University of Technology. It allows the
Contact: ukinfo@gatan.com cross sectional cutting of homogeneous/heterogeneous
• Difficult to polish soft materials such as Copper, Aluminum, Gold, Lead or Lead free solder
Gatan GmbH materials while minimizing mechanical deformation or
• Difficult to cut hard materials such as Ceramic, Carbides or Composites of these materials.
Ingolstädterstr. 12 damage. It can reveal internal structures at precisely
• The cross sections prepared by the SC-Tool are suitable for EDS, WDS, Auger and EBSD (Electron D-80807 München selected locations on the sample. Ion beam slope cutting
Back Scatter Diffraction) analysis and for observation and measurement of multi-layered structures. Germany
Tel. +49 89 358084-0 has essential advantages over mechanical grinding/
Fax. +49 89 358084-77 polishing and focused ion beam (FIB) and can be applied
Contact: mfelsmann@gatan.com
Preservation of Internal Structures universally to most materials.
The SC-Tool preserves structures that conventional mechanical polishing can destroy, such as voids in a Gatan France
3bis, Chemin du Haut Breuil
bonded interface in solder bumps. Delamination between layers can be observed and analyzed accurately. 78113 GRANDCHAMP PRINCIPLE
FRANCE A cross sectional region of a sample is exposed by positioning
Tel: +33 1 34944407
Compared with FIB GSM: +33 6 80135139 a screen relative to the sample at a position of interest and
Fax: +33 1 34871668 bombarding the screen edge and exposed sample surface
The slope cutting technique is not meant to compete against FIB technology; however it does offer essential Ion Beam Slope Cutter developed by W. Hauffe, Dresden University of Technology. Contact: dmonville@gatan.com
advantages compared to FIB: with a parallel beam of ions (1). As the ion bombardment
Nippon Gatan proceeds, a cross sectional region (Cut Surface) is formed
• Higher throughput (productivity) Hibarigaokaminamikan 6F
3-27-11 Yato-cho, or developed. The exact location, orientation, angle and
• Versatility of multi-step processing ORDERING INFORMATION Nishi-Tokyo-shi depth of the cross section are user selectable.
• Variety of application fields Tokyo 188-0001 Japan
Model Number Description Tel: +81 424 387230
• Ease of use (less training) 682.40000 SC-Tool Fax: +81 424 387228 This technique works equally well for material combinations
• Lower cost of the complete technique Contact: miyamori@gatan.com
682.30200 Spare SC Sample Fixture having dramatic property variations and allows processing
• Longer cut lengths 8mm (8,000 times larger) 682.30340 Sample stub storage block Gatan Singapore samples without embedding or mechanical treatment.
10 Eunos Road 8
• Application of inert or reactive gases at relatively low energies. 682.30017 Polished screens x1
#12-06 Singapore Post Centre The cut area is free of deformations and smooth even in
• Galium damage is non-existent compared with FIB due to the use of an argon ion beam. 682.30550 90° Sample Stub (2M) (Use with samples 100um – 2mm) x1 Singapore 408600 very inhomogeneous materials concerning composition,
682.30500 90° Sample Stub (4M) (Use with samples 2mm – 4mm) x1 Tel: (65) 6293 3160 hardness, porosity etc. These types of materials can
Fax: (65) 6293 3307
682.30551 45° Sample Stub (2M) (Use with samples 100um – 2mm) x1 Contact: wchuang@gatan.com sometimes produce furrows or streaking on the cut
SC-Tool includes:
682.30501 45° Sample Stub (4M) (Use with samples 2mm – 4mm) x1 surface but these artifacts are easily eliminated by rocking
• Insertion Rod with SC Fixture (x1) and Stand x1 Gatan On-line
682.30552 30° Sample Stub (2M) (Use with samples 100um – 2mm) x1 the sample during the cutting process.
EM

EM
• 90° Sample Stub (2M) x1 http://www.gatan.com
682.30502 30° Sample Stub (M) (Use with samples 2mm – 4mm) x1 info@gatan.com
• 45° Sample Stub (2M) x1
• 30° Sample Stub (2M) x1
• Cutting Screens x3 (Two knife edges/screen)
• Sample Stub Storage Block x1
• Hex Adjusting Tool x1
• Pin Stub x1 PRECISION PERFORMANCE PRODUCTIVITY PRECISION PERFORMANCE PRODUCTIVITY
www.gatan.com www.gatan.com
 ION BEAM SLOPE CUTTING OPERATION
After No Rocking Rocking
Getting started is quick and easy, a sample is mounted to an SEM
SE

SE
SE
APPLICATIONS stub that mounts to the SC-Fixture and attaches to the insertion rod
The Gatan Precision Etching Coating System (PECS) is a versatile for loading into the airlock of the PECS. This insertion rod replaces
tool offering features for various TEM and SEM applications the standard PECS holder and is programmed to either remain
depending on the operating conditions and parameters. Some fixed during cutting or to rock. Rocking avoids ion beam induced
of these features are ion beam cleaning, smoothing, thinning, furrows/streaking caused by differential milling (metallization layers
selective etching, sputter coating and slope cutting. Slope cutting in Semiconductors). Once inside the vacuum chamber, the ion beam
alone may not produce the high quality images required for today’s parameters are set and the slope cutting procedure processed. 10µm
SEM applications; but when integrated into the PECS, the unique A two step process after cutting, ion beam polishing and selective
PECS Lead-Free Solder Application: 750X
cutting, etching and coating features result in samples with a etching at nearly normal incidence onto the cut area removes ion
magnification; Cu grain apparent
superior level of image clarity and detail. beam damage and re-dep to greatly improve internal grain contrast Semiconductor Application: Perpendicular Semiconductor Application: Same sample cut
variation. cut without sample rocking; striations appear with rocking; striations reduced/eliminated
(shadowing)
After
Slope cutting reveals not only the internal microstructure of the cut surface, but also the initial top surface

SPECIMEN PREPARATION
PECIMEN PREPARATION
PECIMEN PREPARATION
NO SPECIAL SKILL REQUIRED Lead free
(the third dimension). Special microscopic technologies are necessary to characterize the sample in all three Solder
dimensions. Various surface analyzing methods and microscopic imaging techniques can be applied on the Mechanical polishing of cross sections, particularly for soft materials FEATURES
Ni
processed samples. The cut surface can be investigated by SEM and microanalysis in direct correlation to the (Lead or Lead-free solder) require considerable training and skill The Gatan Precision Etching Coating System (PECS) features:
initial surface and both surfaces can also be etched simultaneously. levels. The SC-Tool allows quick and easy cutting of perfect cross • Ion beam polishing for smoothing and removal of re-deposited sputtered material.
Cu
sections after minimal training. Three simple steps: • Selective ion beam etching to enhance internal grain and phase structure.
Ni/Sn
Typical mechanical cross-sectioning followed by conventional metallographic preparation is not always sufficient • Ion beam sputter coating of conductive layers to eliminate charging for high resolution SEM imaging.
for revealing artifact-free microstructures for optical or EM observation. Ion beam processing not only permits 1. Cut and Trim the Specimen to size • Integrates features of slope cutting
10µm
deformation-free preparation but also removes damaged layers produced during mechanical treatment. After The maximum specimen size for the SC-Tool is 12mm (W) x 8mm (D)
making the cut, short selective ion beam etching (2) at a fixed incidence direction reveals the internal structure x 4mm (H). A diamond cutoff saw can easily cut specimens to size. PECS Lead-Free Solder Application: 2000X SC-tool provides multi-angle cross sectioning
combining material contrast with topographical contrast (e.g. at grain and phase boundaries). Target area can be within 1.5mm from the edge of the specimen. magnification; distinct grain boundaries for all
materials • 90° Cross sections
Any mechanical polisher can be used to remove excess material in
• 45° Cross sections
Before front of the target site.
SEM APPLICATIONS • 30° Cross sections
• Precision ion beam cutting to reveal internal
microstructure 2. Specimen Mounting and Alignment PECS plus SC-Tool offers:
• Ion beam polishing • The specimen is secured under the metal clamp attached to the • Ion beam slope cutting
• Selective ion beam etching stub or carbon tape can be used.
• Ion beam etching for the removal of re-deposited sputtered material
• Ion Beam sputter coating • The sample stub inserts into a simple collet arrangement in the SC
• Selective ion beam etching of internal grain and phase structure
• 3-D sample characterization fixture.
• Ion beam sputter coating of conductive layers for high resolution SEM imaging
• Sample investigation without embedding or • The target site is precisely aligned relative to the knife edge using
the ‘X’ and ‘Y’ drives. • Inert or reactive gas (Iodine) processing
mechanical treatment. Position 1: Permits
Perpendicular Cut: No sample rocking; no • The SC fixture is mounted to the insertion rod. slope cutting while • Ion beam energy range 2.0keV – 10keV
selective etching rocking to reduce
• The rod is inserted into the PECS airlock for cutting. striations • Cutting length over 8 millimeters
MATERIAL APPLICATIONS
• Typical semiconductor cutting rate 5um/hr at 7kev
• Semiconductors After
• Ceramics 3. Set Cutting Parameters
• Metals • The PECS sample rocking (standard feature) can be used to eliminate 30º Sample
• Organic materials formation of striations in heterogeneous materials. Stub-Thick

• Polymers • The ion beam cutting voltage, current and time are set.
• As the ion bombardment proceeds, a cross sectional cut surface
develops.
Position 2: Permits
cutting without rock- 45º Sample
ing, or selective ion 90º Sample Stub-Thin
beam etching or sput- Stub-Thin
Same Sample after selective Ion Beam ter coating
Etching