SEMINAR REPORT 2010- FLIP

2011 CHIP

(MANAGED BY IHRD, AFFILIATED TO UNIVERSITY OF CALICUT)

OLLEGE OF APPLIED SCIENCE

VADAKKENCHERRY CERTIFICATE
This is to certify that the seminar Report entitled as

“flip chip technology”

Is Submitted to College of Applied Science, Vadakkencherry
for the award of the degree of
BACHELOR OF SCIENCE IN ELECTRONICS
is a record of seminar done by
JIJI.P.POULOSE
REG NO: 12208
during the period of her study under our supervision and guidance.

HEAD OF DEPARTMENT SEMINAR CO-ORDINATOR

MR.SUBI.T.S MR.MADHAVADAS.C
(H.O.D, Electronics dept.) (Lecturer in Electronics)

DEPARTMENT OF ELECTRONICS IHRD, CAS VDY

 SEMINAR REPORT 2010- FLIP
2011 CHIP

ACKNOWLEDGEMENT

It is a pleasant task to express my thanks to all the persons who

had helped in the successful completion of this seminar. First of all, I express my

sincere gratitude to Mr.Pradip Somasundaran, The principal of the college, for

providing me all the facilities with which I was able to do this seminar.

I express my profound thanks to our H.O.D, Mr.Subi.T.S

and seminar coordinator Mr.Madhavadas.C (Lecturer in electronics) for providing

me information on contemporary developments in the vast field of electronics and

helping to select this topic.

I would also like to thank all lecturers of electronics for clearing

my doubts and for providing me moral support. Further I would like to thank my

friends for their constant support and encouragement.

And above all I express my deep sense of gratitude to `God the

Almighty’ who gave me immense strength and showed me the path to make this

seminar victorious.

JIJI. P. POULOSE.

DEPARTMENT OF ELECTRONICS IHRD, CAS VDY

 SEMINAR REPORT 2010- FLIP
2011 CHIP

Abstract

The intense competition in the electronics industry generally serves to

drive down the size and cost of electronic products while improving their performance,

flexibility, and reliability. As a part of this effort, packaging methods are constantly being

improved and new, innovative methods are being developed. One area of focus is highly

integrated chip-level electronics assembly, using multiple unpackaged dies and electrical

components in a single package. One of the most popular methods is known as flip chip

assembly.

Advancements in the packaging of semiconductor devices traditionally

use wire bonds to provide the interconnection from device to substrate or to other active

devices. Flip chip offers advantages over traditional interconnect schemes. A smaller overall

footprint can be realized, better thermal heat transfer, and improved performance especially at

higher frequencies are all enabled through the use of flip chip technology.

The assembly process has proliferated in many applications, including

automotive electronics, smart cards, radio frequency identification (RFID) cards

etc………………………!

DEPARTMENT OF ELECTRONICS IHRD, CAS VDY

SEMINAR REPORT 2010- FLIP
2011 CHIP

CONTENTS

1. INTRODUCTION…………………………………………..……01.

2. FLIP CHIP…………………………………………............…..…02.

3. REASONS FOR USE OF FLIP CHIP……………………..……03.

4. HISTORY.................……………………………………..…….…04.

5. FLIPCHIP PROCESS………………………………….…...……13.

6. BUMPING……………………………………………………..….14.

7. FLIP CHIP ASSEMBY……………………………..……….……17.

8. FLIPCHIP JOINING..............................................................…...19.

9. VARIOUS FLIPCHIP ASSEMBLIES……………….…….……22.

10. COMPARISON OF MOUNTING TECHNOLOGIES………….26.

11. ADVANTAGES……………………………………………………

30.

12. DISADVANTAGES…………………...………………………….31.

13. CONCLUTION…………………………………………….….…31.

14. BIBLIOGRAPHY………………………………………………..32.

DEPARTMENT OF ELECTRONICS IHRD, CAS VDY