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Abstract: Test power has become a serious problem with scan-based and the testing process such as, (a) this may give rise to severe
testing. It can lead to prohibitive test power in the process of test hazards to the circuit reliability and lead to long or short-term
application. During the process of scan shifting, the states of the flip- malfunction, (b) it can cause chip destruction due to excessive
flops are changing continually, which causes excessive switching heat in absence of proper heat dissipation mechanism, (c) it
activities. Test vector reordering for reducing scan in scan out power
is one of the general goal of low power testing. In this paper we have
can increase the packaging and cooling costs, (d) it can cause
proposed an AI-based approach to order the test vectors in an optimal the chip to falsely fail the test due to noise problems such as,
manner to minimize switching activity during testing. IR and Ldi/ dt drops, which may be a source of yield loss and
increase in production cost, (e) it may make it difficult to
Index Terms—Scan matrix, Low Power Testing, BIST, ATE, obtain a carefully tested bare die to be used in multichip
modules (MCM) or what is called the Known Good Die
I. INTRODUCTION problem (KGD) and (f) it can dramatically shorten the battery
Advancements in semiconductor fabrication technology has life when on-line testing is considered. For all these reasons,
helped the design engineers to accommodate more number of various techniques have been proposed to reduce the impact of
transistors in a VLSI chip. With the proliferation of mobile high power consumption during test application. Low power
battery-powered devices, reduction of power in the embedded dissipation during test application is becoming an equally
VLSI chips has become an active area of research. During the important figure of merit in today’s VLSI circuits design with
last decade, power reduction techniques have been proposed at BIST and is expected to become one of the major objectives in
all levels of the design hierarchy - from system to device the near future.
levels. For the development of complex, high performance, In this paper we have proposed an AI-based approach to
low power devices implemented in deep submicron reorder the test vectors such that the switching activity and
technology, power management is a critical parameter and it hence the power dissipation during testing is reduced. The
cannot be ignored even during testing. With the increase in the paper is organized as follows: preliminaries and prior works
density of the chips, the problem of testing has also increased for low power testing techniques and test vector reordering is
manifold. covered in Section 2. In Section 3, we describe the motivation
A related problem is to achieve power reduction during the of the work and the problem formulation. Section 4 explains
actual testing of a chip [10]. Power consumption in test mode the AI-based approach of test vector reordering in detail.
is considerably higher than the normal functional mode of a Empirical results and performance comparison is presented in
chip. The reason is that test patterns cause as many nodes Section 2 followed by concluding remarks in Section 6.
switching as possible, while a power saving system mode only
activates a few modules at a time. Thus, during testing II. PRELIMINARIES AND PRIOR WORK
switching activity in all the internal lines of a chip is often A. Power dissipation in cmos technology
several times higher than during normal operation. Sometimes
parallel testing is used in SoCs to reduce test application time, The Power dissipation in CMOS technology [14,15] can be
which results in excessive power dissipation. Again, classified into static and dynamic. Static dissipation is due to
successive functional input vectors applied to a given circuit leakage current that has small magnitude in digital CMOS
during system mode have a significant correlation, while the circuits. Hence, for such circuits, the dynamic dissipation is
correlation between consecutive test patterns can be very low. the dominant term. Dynamic dissipation occurs at a node
Usually, there is no definite correlation between the successive when it switches from one logic level to another logic level.
test patterns generated by an ATPG (for external testing) or by Dynamic dissipation is divided into two components caused
an LFSR (for BIST) for testing of a circuit. This can cause by short circuit current and charge/discharge current. The
significantly larger switching activity in the circuit during former is caused by a current pulse that flows from power
testing than that during its normal operation. Abnormal power supply to ground when both n- and p- transistors are
consumption during testing leads to adverse effects on the chip simultaneously ON during small interval of switching period
and is negligible in high speed circuits where n- and p- adjacent vectors to reduce the dynamic power dissipation
transistors are simultaneously ON for very short periods. The during testing. In [3], reduction of power dissipation during
later is caused by switching activity of transistors during 0 1 or test application has been studied both for scan designs and for
from 1 0 transitions. The charge/discharge current is the combinational circuits tested using built-in self-test (BIST).
current that charges and discharges the capacitive load on the They have shown that heuristics with good performance
output of a gate during 0 1 or from 1 0 transitions and in bounds can be derived for combinational circuits tested using
general, dominates dynamic power dissipation [15,16]. The BIST and a post- ATPG phase has been proposed for reducing
dynamic power dissipation (PD) in the circuit is given by (1) power dissipation during test application in full-scan circuits
PD= 1/2 Σjn CL(j) s(j)Vdd2 _________ (1) and for pure combinational circuits. They have shown that
where CL(j)is the load capacitance at line j of the Circuit scan-latch ordering along with test-vector reordering can give
Under Test (CUT), s(j) is the frequency of switching of the considerable improvement in power dissipation and
line j, and Vdd is the power Supply voltage. Other quantities considerable savings can be obtained by repeating some of the
being constant for a given circuit, test vector set generated to test vectors. In [8], an evaluation of different heuristic
minimize the frequency of switching at circuit lines during test approaches has been done in terms of execution time and
application will minimize the heat dissipation during testing. quality. Here, it has been shown that the Multi-Fragment
heuristic performs better than Christofides and Lin-Kernighan
B. Prior work
heuristics in terms of time. It also outperforms the Christofides
A survey on low power testing of VLSI circuits has been heuristic in terms of quality and achieves performance very
given in [5]. There are several techniques for low power close to Lin-Kernighan. They recommended reordering
testing of VLSI circuits such as, test vector reordering, scan algorithms to use the Multi-Fragment heuristic for near
chain ordering, power-constrained test scheduling, use of minimal ordered sets of vectors that result in both reduced
multiple scan chains, low power test pattern generation, vector power consumption and enhanced data compression ratio.
compaction, etc. Test vector reordering is a very well-known Recently, some works have formulated test vector reordering
technique to reduce dynamic power dissipation during problem as TSP and Genetic Algorithm (GA) has been used to
combinational circuit testing through switching activity generate low power test patterns.
minimization in the circuit. Test vector reordering is an Chattapadhyay and Choudhary have shown proposed a GA-
essential task in testing VLSI systems because it affects from based formulation to solve the problem of generating a test
two perspectives: power consumption and correlation among pattern set such that it has high fault coverage and low power
data used for test data compression. The problem of test vector consumption has been proposed in [2]. They have shown a
reordering can be mapped into finding Hamiltonian cycle in a method of selecting a subset of test vectors generated by an
complete weighted graph, which is known to be NP-hard. So, ATPG tool to reduce power dissipation by sacrificing a small
there is no polynomial time solvable algorithm for the amount of fault coverage. In [13], authors have studied two
problem. Therefore, it is essential to find a good heuristic- well known search methods (2-opt heuristic and a GA-based
based solution for the problem. Existing approaches have used approach) with reduction in fault coverage. They have also
several heuristics for solving this problem. In [11], the combined those two methods for power reduction.
problem of test vector reordering has been mapped into Sudip Roy et.al has proposed a test vector reordering
finding the Hamiltonian path in a fully connected weighted technique with Artificial Intelligence approach. They have
graph which is similar to the traveling salesman problem shown the method only for combinational circuits C17 and
(TSP). As there exists no polynomial time algorithm for TSP, they achieved almost around 22% reduction in switching
approximation methods of solution have been used. Solutions activity.[17]
for three cases have been given: (i) reordering for maximal or
minimal activity, (ii) reordering of test vectors with a desired III. MOTIVATION OF THE WORK AND PROBLEM
circuit activity across the VLSI chip while achieving a high
coverage for stuck-at faults, and (iii) reordering for localized FORMULATION
switching activities to maximize it in one part and minimize at A. Motivation of the work
other part of the circuit. In another work [6], proposed greedy
Most popular techniques for test power minimization orders
algorithm has guaranteed decrease in power consumption
the deterministic test patterns and several approaches have
without modifying the initial fault coverage. A second
been followed for test vector reordering such as, finding
technique based on Simulated Annealing (SA) has been
minimum cost Hamiltonian path after mapping the problem
proposed in which the greedy solution is used as initial
into TSP instance, finding optimal solution by applying GA or
solution and it shows a considerable average power reduction
SA. Although the dynamic power minimization problem by
during test application Here, only Hamming distance between
test vector reordering during VLSI testing is an old problem,
test vectors has been used to avoid simulation of the circuit
here new approach is proposed for solving it using Artificial
and providing a solution (an Hamiltonian path of minimum
Intelligence (AI). This problem can again be viewed as finding
cost in the Hamming distance graph) in a short computation
optimal path from start to goal node in a search space by
time. It has been shown that there is a correlation between the
applying informed search methods of AI, where start node is
Hamming distance and the transition activity. But, if signal
the node when no test vector is selected and the goal node is
transitions in the internal line be considered, then obviously
the node when only one test vector is remaining for selection.
optimal solution can be found. Another work [4] has also
A* search algorithm is a very well-known informed search
considered the Hamming distance minimization between
method used in AI. It takes advantages of both efficiency of The CLOSED list stores the tracks leading to nodes that have
greedy search and optimality of uniform-cost search by simply already been explored.
summing the two evaluation functions. Thus, it is optimally
B. Cost function g(n)
efficient algorithm for finding optimal solution in an informed
search space. This has motivated us to apply A* search A complete weighted graph X(T,O,E,W) is constructed
technique for test vector reordering problem for dynamic where T is the test set, O is the output response, E is the set of
power reduction during testing. edges
Also Previous work of Sudip Roy et al. motivated us to
implement Artificial Intelligence algorithm for test vector
reordering to sequential circuits in order to reduce scan in scan
out power.[17]
B. Problem formulation
Consider a test set for a combinational circuit is given by T
= {t1,t2, ..tk} and its output response is given by
O={o1,o2,….ok} with a predefined fault coverage, where |T| =
k. Each test vector is formed by a fixed ordered set of bits bj Figure 1. a.) Test vector b.) Output Response
i.e., ti =< b1,b2, ...bl >, where l =length of the test vectors or
the number of primary inputs (PIs) of the circuit. Assume Π be Weighted Transition Matrix(WTM) is used here to reorder the
the initial ordering of test vectors T. test patterns. Here different test patterns passed through the
The problem of scan in scan out power minimization by test output response and hence the switching will occur and from
vector reordering is to compute an optimal vector ordering Π_ that WTM is made as shown in figure 1 c. The corresponding
of T such that total scan in scan out power dissipation in the equation is also shown below.
circuit during testing is minimized. The problem of reducing
the peak power dissipation is not considered here. Only the
average power reduction has been considered. Since, the
power dissipation is directly proportional to switching activity,
the problem can be restated as to find out an optimal path or
optimal ordering of vertices Π_ from the search space of
having all possible orderings of vectors V such that total
switching activity in the circuit is minimized.
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