3M Thermosyphon Technology for

Passive 2-Phase Cooling of Electronics

March 2007

Phil E. Tuma
Advanced Application Development Specialist
3M Electronic Markets Materials Division
651-737-9895
petuma@mmm.com

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 Introduction
• 3M has manufactured fluorinated heat
transfer fluids since the 1950s

• Historically, these fluids were used in high

value military or specialty applications

• For the past few years, 3M has been

researching passive 2-phase or
“Thermosyphon” technology for use in
mainstream electronics

– 3M has published papers and builds

thermosyphon prototypes to showcase that
technology and prove feasibility
– 3M hopes to sell working fluids and boiling
surfaces for thermosyphon manufacturers
– 3M works with electronics OEMs to help pull
through the technology

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 Air Cooled Thermosyphon

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 • Terminology

– Thermosyphon performance characterized by the sink-to-

ambient thermal resistance, Rsa=Rsf+Rfa

– The Evaporator performance is characterized by the sink-to-

fluid thermal resistance,

Rsf=(Ts-Tf)/Q

– The Condenser performance is characterized by the fluid-to-

ambient thermal resistance,

Rfa=(Tf-Ta)/Q

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• Product/Technology Offerings
– 3M Will Supply Materials and technologies to spur the adoption of
thermosyphon technology.

Working Fluid

Boiling Materials/Technology

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 • 3M Novec™ Hydrofluoroether Working Fluids
– Clear, colorless, nearly odorless
– Excellent toxicological properties
– Non-conductive Dielectrics
– Environmentally favorable properties
• This is not true of HFC refrigerants which are discouraged by
global environmental regulations

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 Working Fluid

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 Working Fluid

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 Performance of 3M Boiling Enhancement Coating under conditions
of uniform heat flux

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Prior Art, Fluorinert ~1atm
Prior Art, Water 4kPa
Prior Art, Fluorinert ~1 atm
10 Smooth Flat Surface, Novec ~1 atm
3M Coating, Flat Surface, Novec ~1atm
3M Coating, Fins, Novec~1atm

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H [W/cm -K]
2

0 Q” = Q / Area
0 20 40 60 80 100 H = Q” / (Tw-Tsat)
2
Q" [W/cm ]

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 Typical Rsf Values for 3M boilers applied to various heat source sizes

Typical Modern
Microprocessor
Values

Taken from: Tuma, P.E. , “Evaporator/Boiler Design for

Thermosyphons Utilizing Segregated Hydrofluoroether Working
Fluids,” Proc. Semitherm 2006

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 Specifications (cont)
Condenser Design #7 in Figure Below

Note: 1m3/min=35CFM

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 Example – Air Cooled Thermosyphon

Specifications
Condenser Dimensions 115x120x19mm
Mass 380g
Capacity 200W
Design Orientations 2 (90°apart)

Horizontal Mother Board Vertical Mother Board

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 Specifications (cont)
Condenser Design #7 in Figure Below

Taken from: Tuma, P.E., et al , “Condenser Design for Thermosyphons

Utilizing Segregated Hydrofluoroether Working Fluids,” Proc. Semitherm 13
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 • This thermosyphon was tested on a 25x25mm
copper heater from 50-200W
– “Chip” temperature, Tc, was measured 1mm from the
heater surface
– “Ambient” temperature, Ta, was measured at fan inlet
– Fan was Panasonic FBL12G12H

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 1x1mm Thermocouple “Sink” Groove, Ts

Thermocouple Well, Tsat

120mm Thermosyphon 66x112mm Mounting Plate

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 Conclusion/Summary

• 3M has built and tested a 120mm thermosyphon that will

produce Rsa<0.08 C/W at over 200W with <2 m3/min airflow
at ΔP~2mm H2O

• Rsa<0.068 C/W is possible with a deeper 120mm

condenser like #8 and has been demonstrated

• Remote form factors are possible

• Clear evaporators can be employed for gaming applications

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 3M Thermosyphon in ATX Chassis

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 Clear glass evaporator with immersion-cooled high intensity LED to
illuminate boiling process
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 Evaporator Close up

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 3M Thermosyphon in Dell E520

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 Install
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 Evaporator Close up
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 3M Thermosyphon in Xbox 360

ΔTja
CPU GPU
Stock Heat Sinks 43.4 31.2
Thermosyphon 23.9 19.2

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 3M Thermosyphon, 690g XP90C
320g 4 heat pipe heat sink
Brass Copper Const. All Copper
92x92mm face area 95x95mm face area

Case-to-ambient
thermal resistance on
25mm heat source with
same 92mm fan

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