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DB1
DB0
DB2
DB4
DB5
DB6
DB7
DB3
MSB
Single-Supply Operation: +5 V to +15 V GND CS CE LSB +VCC
–2– REV. A
AD558
ABSOLUTE MAXIMUM RATINGS*
(LSB) DB0 1 16 VOUT
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +18 V DB1 2 15 VOUT SENSE
Digital Inputs (Pins 1–10) . . . . . . . . . . . . . . . . . . 0 V to +7.0 V 14 VOUT SELECT
DB2 3
VOUT . . . . . . . . . . . . . . . . . . . . . . . Indefinite Short to Ground AD558
DB3 4 13 GND
Momentary Short to VCC TOP VIEW
DB4 5 12 GND
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW (Not to Scale)
DB5 6 11 +VCC
Storage Temperature Range
DB6 7 10 CS
N/P (Plastic) Packages . . . . . . . . . . . . . . . . –25°C to +100°C
(MSB) DB7 8 9 CE
D (Ceramic) Package . . . . . . . . . . . . . . . . . –55°C to +150°C
Lead Temperature (soldering, 10 sec) . . . . . . . . . . . . . +300°C Figure 1a. AD558 Pin Configuration (DIP)
Thermal Resistance
Junction to Ambient/Junction to Case
VOUT SENSE
DB0 (LSB)
D (Ceramic) Package . . . . . . . . . . . . . . 100°C/W/30°C/W
N/P (Plastic) Packages . . . . . . . . . . . . . 140°C/W/55°C/W
VOUT
DB1
NC
*Stresses greater than those listed under “Absolute Maximum Ratings” may cause
3 2 1 20 19
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute DB2 4 18 VOUT SELECT
maximum rating conditions for extended periods may affect device reliability. DB3 5 17 GND
AD558
NC 6 TOP VIEW 16 NC
AD558 METALIZATION PHOTOGRAPH DB4 7 (Not to Scale) 15 GND
Dimensions shown in inches and (mm). DB5 8 14 +VCC
9 10 11 12 13
CS
NC
(MSB) DB7
DB6
CE
NC = NO CONNECT
ORDERING GUIDE
REV. A –3–
AD558
CIRCUIT DESCRIPTION CHIP AVAILABILITY
The AD558 consists of four major functional blocks, fabricated The AD558 is available in laser-trimmed, passivated chip form.
on a single monolithic chip (see Figure 2). The main D-to-A AD558J and AD558T chips are available. Consult the factory
converter section uses eight equally-weighted laser-trimmed for details.
current sources switched into a silicon-chromium thin-film Input Logic Coding
R/2R resistor ladder network to give a direct but unbuffered 0
mV to 400 mV output range. The transistors that form the Digital Input Code Output Voltage
DAC switches are PNPs; this allows direct positive-voltage logic Binary Hexadecimal Decimal 2.56 V Range 10.000 V Range
interface and a zero-based output range.
0000 0000 00 0 0 0
DIGITAL INPUT DATA 0000 0001 01 1 0.010 V 0.039 V
CONTROL 0000 0010 02 2 0.020 V 0.078 V
INPUTS
LSB MSB 0000 1111 0F 15 0.150 V 0.586 V
0001 0000 10 16 0.160 V 0.625 V
DB1
DB0
DB2
DB4
DB7
DB6
DB3
DB5
–4– REV. A
Applications–AD558
OUTPUT
The only consideration in selecting a supply voltage is that, in
AMP order to be able to use the 0 V to 10 V output range, the power
16 VOUT
supply voltage must be between +11.4 V and +16.5 V. If, how-
604Ω
ever, the 0 V to 2.56 V range is to be used, power consumption
500Ω
15 will be minimized by utilizing the lowest available supply voltage
40kΩ (above +4.5 V).
14
14kΩ
2kΩ
TIMING AND CONTROL
13 GND
The AD558 has data input latches that simplify interface to 8-
and 16-bit data buses. These latches are controlled by Chip
Figure 4. 10.24 V Full-Scale Connection Enable (CE) and Chip Select (CS) inputs. CE and CS are inter-
nally “NORed” so that the latches transmit input data to the
NOTE: Decreasing the scale by putting a resistor in series with GND
will not work properly due to the code-dependent currents in GND. DAC section when both CE and CS are at Logic “0”. If the ap-
Adjusting offset by injecting dc at GND is not recommended for the plication does not involve a data bus, a “00” condition allows
same reason. for direct operation of the DAC. When either CE or CS go to
Logic “1”, the input data is latched into the registers and held
GROUNDING AND BYPASSING* until both CE and CS return to “0”. (Unused CE or CS inputs
All precision converter products require careful application of should be tied to ground.) The truth table is given in Table I.
good grounding practices to maintain full rated performance. The logic function is also shown in Figure 6.
Because the AD558 is intended for application in microcom-
puter systems where digital noise is prevalent, special care must Table I. AD558 Control Logic Truth Table
be taken to assure that its inherent precision is realized. Latch
The AD558 has two ground (common) pins; this minimizes Input Data CE CS DAC Data Condition
ground drops and noise in the analog signal path. Figure 5
shows how the ground connections should be made. 0 0 0 0 “Transparent”
1 0 0 1 “Transparent”
0 g 0 0 Latching
OUTPUT
AMP
1 g 0 1 Latching
VOUT 0 0 g 0 Latching
16
1 0 g 1 Latching
VOUT SENSE
15
X 1 X Previous Data Latched
VOUT SELECT (SEE NEXT X X 1 Previous Data Latched
14 PAGE) RL
NOTES
GND X = Does not matter.
13
g = Logic Threshold at Positive-Going Transition.
TO SYSTEM GND
12 TO SYSTEM GND
GND 0.1µF (SEE TEXT)
11 TO SYSTEM VCC
+VCC
REV. A –5–
AD558
tDH
VOUT
DATA 2.0V 16
INPUTS tDS AD558
0.8V VOUT SENSE RL
15
CS OR CE 2.0V
RP-D = 2x VEE
0.8V NEGATIVE
SUPPLY VEE (in kΩ)
tW
Figure 9. Improved Settling Time
DAC
1/2 LSB available, bipolar output ranges may be achieved by suitable
V OUTPUT output offsetting and scaling. Figure 10 shows how a ± 1.28 volt
output range may be achieved when a –5 volt power supply is
tSETTLING available. The offset is provided by the AD589 precision 1.2 volt
tW = STORAGE PULSE WIDTH = 200ns MIN reference which will operate from a +5 volt supply. The AD544
tDH = DATA HOLD TIME = 10ns MIN output amplifier can provide the necessary ± 1.28 volt output
tDS = DATA SETUP TIME = 200ns MIN
tSETTLING = DAC OUTPUT SETTLING TIME TO ±1/2 LSB
swing from ± 5 volt supplies. Coding is complementary offset
binary.
Figure 7. AD558 Timing 5kΩ
VOUT = 0V TO +2.56V
+5V
USE OF VOUT SENSE
0.01µF
Separate access to the feedback resistor of the output amplifier 16
allows additional application versatility. Figure 8a shows how AD558 15
5kΩ
DB0–DB7
b. 0 V to 10 V Output Range 8
8
Figure 11. Offset Connection Diagrams
DATA BUS
The AD558 is configured to act like a “write only” location in b. 8080A/AD558 Interface
memory that may be made to coincide with a read only memory
location or with a RAM location. The latter case allows data 8
previously written into the DAC to be read back later via the ADDRESS BUS
RAM. Address decoding is partially complete for either ROM
or RAM. Figure 12 shows interfaces for three popular micropro- MA 0 – 7 8
cessor systems. ADDRESS CS
TPA
LATCH
& VOUT
ADDRESS BUS 1802
DECODE
AD558
MWR CE
16
16 DB0–DB7
ADDRESS
6800 DECODER 8
8
VMA
CS VOUT DATA BUS
AD558
φ2 CDP 1802: MWR → CE
DECODED ADDRESS SELECT PULSE → CS
CE
R/W
DB0–DB7
c. 1802/AD558 Interface
8 Figure 12. Interfacing the AD558 to Microprocessors
8
DATA BUS
R/W → CE
GATED DECODED ADDRESS → CS
a. 6800/AD558 Interface
LSB
1.75
1.50
1.25 LSB
ALL AD558 ALL AD558
1.00 AD558S, T 1/2 AD558S, T
0.75 ZERO
ERROR
0.50 1/4
0.25
FULL
0 0
SCALE
–0.25 oC
ERROR –55 –25 0 +25 +50 +75 +100 +125
–0.50 –1/4
–0.75
–1.00 –1/2 1LSB = 0.39% OF FULL SCALE
oC
–55 –25 0 +25 +50 +75 +100 +125
1LSB = 0.39% OF FULL SCALE
Figure 13. Full-Scale Accuracy vs. Temperature Figure 14. Zero Drift vs. Temperature Performance
Performance of AD558 of AD558
REV. A –7–
AD558
mA OUTLINE DIMENSIONS
16 Dimensions shown in inches and (mm).
14
ICC
N (Plastic) Package
12
C558f–21–8/87
10
4 6 8 10 12 14 16 18 VOLTS
VCC
D (Ceramic) Package
P (PLCC) Package
–8– REV. A
This datasheet has been download from:
www.datasheetcatalog.com