Académique Documents
Professionnel Documents
Culture Documents
UNIVERSITY of AUCKLAND
DEPARTMENT of ELECTRICAL AND ELECTRONIC
ENGINEERING
BY FRED NASSENSTEIN DEC 1992
UPDATED MAR 1995
UPDATED DEC 1996 BY SLAVEK PRZEPIORSKI
Libray List
3. ARTWORK PLOT------------------
4. MASK (NEGATIVE)
5. BOARD EXPOSURE----------------
- DEVELOPING----------------------
---CHEMICAL PROCESS
- ETCHING----------------------------
- PHOTORESITS REMOVAL-----
6. TINNING
7. DRILLING
8. BOARD ASSEMBLING
9. TESTING
Process 2 to 6 are briefly mentioned in this guideline . The work involved with process
4 to 6 is usually carried out by a technician in this department.
Contents:
1. - Introduction
2. - Chemical Process
4. - Using PROTEL-PCB
5. - Example
6. - Appendix
7. - Library Parts
INTRODUCTION
Having gone through the process and struggle to design an electronic circuit,
which should result in the form of a circuit diagram, you have reached the stage
of needing to create your circuit at a physical level. Printed circuit board design
could be difficult as well, since you may include mistakes from your circuit
diagram and possibly create some more with this procedure (unless you are very
careful). But relax creating a PCB could (hopefully) be a nice expression of your
technical capabilities as well as an expression of your artistic skills.
A PCB is the most common, practical, reliable and low cost (in particular for
larger quantities) solution to assemble a cluster of electronics components (see #1
other techniques). The aim of PCB design is to physically place and interconnect
(using conductive tracks acting as wires) electronic components on an insulating
material according to the plans in the circuit diagram (or schematic).
CHEMICAL PROCESS
In practice we do not actually print the physical circuit on a board, this is usually
achieved by means of a photographic and chemical process (see #2 for other
techniques).
The board is usually made of a glass fibre strengthened epoxy based material
(sheet) with good electrical and mechanical properties (ie.: good insulator and
high mechanical strength).
The epoxy board is covered with a very thin copper layer either on one (single
sided boards) or on both sides (double sided boards) which we have to configure
in such a way so that the copper can be used as individual conductors (see #3 for
multi layers). This is usually achieved with the aid of an additional UV light
sensitive photo resist (plastic film) attached to the surface of the copper layer (see
figure 1).
In the Electrical and Electronics Engineering Department there are several PCB
software packages available on the network able to produce the artwork for such
a mask. In this session however I will only outline the use of PROTEL-
WINDOWS since it is easy to use and performs very well for most designs.
2- USING A NETLIST
It is possible, for example after you have created a circuit diagram with
PROTEL-SCHEMATIC and the generation of a so called NETLIST, to “ load
your schematic (as a netlist)” directly in to PCB (see # 10). It is however
very important that all the pins of the components are assigned as well as all
the packages (ie.: dipl4, axial 0.3, etc.) and make sure that all physical
packages you are using exists in the PCB Library!
Advantages of using a Netlist are;
-mistakes are eliminated to a large extend
-automatic placement of all the components from the schematic diagram (you could
otherwise forget some components!)
-using the DRC option allows you to compare your PCB file with the actual schematic
diagram (and also check your spacings)
-all logical connections are visible with so called rubber bands allowing optimum
placements of components and tracks
3- STARTING PROTEL-PCB
Protel-PCB will ask you what file name it should load, however since you have
not yet created a name and directory yet (when you use PCB for the first
time), you should now press the ESC button, in case your pcb file already
exists type the name of your directory and your design file name.
6- Set the VISIBLE GRID to 1000 and the SNAP GRID to 100 mils !!
DIP8 - LM741
AXIAL0.4 - RESISTOR (.33 W)
CD0.2/1 - DECOUPLING CAPACITOR (lOOnF)
Example:
NAME=AXIAL 0.4 (for a standard resistor)
PCM5/2.5 (for a standard capacitor)
DIP 8 (for an OPAMP)
NOTE: After placing many components the text might disturb the visibility
when placing tracks, suggestion; turn the comments off (edit
component).
PLOTTING
As mentioned in the beginning (page 4) the actual plot for the final Artwork
should be created in Postcript Format (using the 1270DPI-Linotronix) and
processed by an outside company. Supply your Technician with your PCB
File when you reached this stage! However plotting or printing (to a standard
laser printer) your Artwork on paper could still be useful for the following;
BILL OF MATERIALS
You can create file contains list of components:
Select File/Reports/Bill of Material.
NOTE THAT:
#2 There are (Routing) Machines available on the market able to generate a PCB
(including drilling) directly from a plot file, thus eliminating the chemicals and
environmental hazardous chemical process, however not very satisfactory at
present (likely to be improved in the near future).
#3 For high density and some times high speed PCB’ s and the use of a special
manufacturing process the number of layers can be significantly increased (the
copper and epoxy layers are thinner), this is called a multilayer board (club
sandwich structure!)
#4 When creating a so called Gerber File (instead of normal HPGL Plot File)
it is possible create the artwork (positive) on a Photo Plotter (very accurate but
at high costs). Standard Postscript printers are not very accurate however there
are special Postcript printers such as the Linotronix able to produce negatives
directly with 1270 and 2540 DPI resolution and sufficient accuracy.
#5 Logic circuits (even CMOS) require much higher (switching) currents from
the power supply when they are CHANGING STATE therefore the average
current will increase proportionally with the frequency.
o
TRACK 35
100 C
75 oC
60 oC
WIDTH: 30 45 oC
30 oC
This graph can 25
20 oC
be used to deter- 20
CURRENT (AMPERS)
15
mine track width 12
10 oC
as a function of 10
9
8
current and 7
6
5
temperature rise 4
3.0
above 2.0
1.5
1.0
ambient. 0.5
0.25
0.125
0
Do not allow a 0
1
higher increase 5
CONDUCTOR WIDTH (MILS)
10
20
in 30
temperature than 50
70
20 degrees. 100
3-OZ COPPER
350
1-OZ COPPER
400
450
0 1 2 5 10 20 30 50 70 100 150 200 250 300 400 500 600 700
#7 TRACK SPACINGS
This table shows track spacings depending on voltage between tracks:
#8
For some applications such as very fast circuits (>50MHz) you might need
the second layer (usually the top layer) as a so called GROUND PLANE (all
connections to this type of layer will be of low impedance!).
#9
When using a double sided board use vertical tracks on one side and all
horizontal tracks on the other side (to avoid being blocked when placing
multiple tracks), try to keep most of the tracks on the solder(bottom) side
since soldering components on the top of the board is often a problem.
#10
To generate a Netlist File (your schem.S01) with Protel-Schematic, exit from
Schematic and Execute POST in the Schematic Directory, do not specify the
extension (S01) especially when you have multiple sheets of the same file
name (ie.: fileX.S01.. fileX.S02 etc., schematic will link the sheets).
#11
As mentioned in 2 it is very important that all the pins of the components
are assigned as well as all the packages (ie.: dipl4, axial 0.3, etc.) and make
sure that all physical packages you are using exists in the Library!
In case you have created your own parts library you probably have to merge
components from the Protel-PCB Library in to your library for all
the components you are using in your design!
This will move (spread out) all components to the appropriate grid as
defined in Autoplace Setup. In case you wish to move all components to a
different grid size, select Move all Components to Grid and specify the
desired grid size.
Components placed from netlist are connected with ratnets (rubberband). They
indicate which pin should be linked to which one.
Happy with the way ‘ Auto Placement’ placed your components??
I doubt it!
The Auto Placement in Protel-PCB does not work very satisfactory, you will do a
better and faster job by placing the components manually !
The best way to continue from here is to manually place all the components
to a better location. In case you are using many components it is best to define a
block (covering all components, not the Keep Out Layer) and move the block out
side the keep out area (then hide block).
With the Schematic Diagram as a guide for component allocations, move the
components one by one to a suitable position on the board area and similar as the
locations in the diagram, start with IC’ s and connectors first.
During this process you will probably find that some ratnets bands are
crossing one other, avoid these crossings by rotating the components. In some
cases (such as connector pins, IC pins etc.) you might like to swap pins.
#12
Since the copper layer is glued to the epoxy board it could easily happen
that the pads (when too small) will come off when soldering (heat will soften the
adhesive). This could also happen when drilling the holes in the PCB !
Literature:
LIBRARY PARTS
The following attached list shows the physical dimensions of components available in the
listed Libraries below. Use this list also to define package outlines in Protel Schematic.
E1.LIB:
RESISTORS, CAPACITORS, SEMICONDUCTORS, TRIMMERS
E2.LIB:
CONNECTORS, TRANSFORMERS, HEATSINKS, MISC.DEVICES
SMD1.LIB:
SURFACE MOUNT DEVICES
If you want to make some changes make a copy of library file to your directory first!!!
In case you are unable tom find a suitable part you must create your own part(s) and store this
part(s) in yours.lib!
In the above directory standard pcb card formats are available such as:
Eurocards 100x160 mm (ie.:euro-a.pcb) and IBM-PC cards (ie.:atboard.pcb)
NOTES:
• To reduce the number of parts and depending on what technology is required (ie. CMOS,
LINEAR etc) Protel Schematic is using many different libraries which can be loaded
individually by the program.
• The Schematic Libraries contains symbols of components whereas the PCB Libraries
contains the physical layout of components.
• The DEVICE.LIB from Schematic only supports basic symbols of certain components.
13.03.95 F.Nassenstein
13.12.96 S.Przepiorski
Example for some stndard components:
;
TYPE LIBRARY FILE COMPONENT NAME PACKAGE
Library Last
Click below. Description Count
Name Updated
CONNECTORS
13 Mar
CON_1.LIB Various Connectors 1. 45
1998
18 May
CON_2.LIB Various Connectors 2. 6
1998
Connectors 3 (Double 17 Aug
CON_3.LIB NEW! 80
Row, Plain Grid) 1998
CON_STO.LIB Single Row Connectors. 34 2 Jan 1998
12 Sept
CON_EDG.LIB Edge Connectors. 42
1997
CON_SAM.LIB Samtec Connectors. 155 5 Sept 1997
Box Headers and Pin 20 Aug
CON_HDR.LIB 149
Headers. 1997
13 Aug
CON_DB.LIB Various DB Connectors. 88
1997
GENERAL IC's
DC-DC Converter
DCDC.LIB 13 21 Jan 1998
Footprints.
16 Apr
IC_GEN.LIB General IC Footprints. 136
1998
Pin Grid Array (PGA)
IC_PGA.LIB 42 8 Dec 1997
Footprints.
IC_TAPE.LIB TAPEPAK Footprints. 26 8 Dec 1997
28 Nov
TRA.LIB Transistor Footprints. 28
1997
IPC-SM-782 STANDARD ( Revision A - August 1993 )
19 Sept
IPC8.LIB Discrete Components. 41
1997
Next Page
Components with
19 Sept
IPC9.LIB Gullwing Leads on Two 67
1997
Sides.
Components with J 24 Sept
IPC10.LIB 31
Leads on Two Sides. 1997
Components with
10 Oct
IPC11.LIB Gullwing Leads on Four 267
1997
Sides.
Components with J 24 Sept
IPC12.LIB 24
Leads on Four Sides. 1997
Modified Dual-In-Line
IPC13.LIB 13 2 Oct 1997
Pin (DIP) Components.
OTHER FOOTPRINTS
Top