Philips Semiconductors Product specification

Thyristors BT151 series C

GENERAL DESCRIPTION QUICK REFERENCE DATA

Passivated thyristors in a plastic SYMBOL PARAMETER MAX. MAX. MAX. UNIT
envelope, intended for use in
applications requiring high BT151- 500C 650C 800C
bidirectional blocking voltage VDRM, Repetitive peak off-state 500 650 800 V
capability and high thermal cycling VRRM voltages
performance. Typical applications IT(AV) Average on-state current 7.5 7.5 7.5 A
include motor control, industrial IT(RMS) RMS on-state current 12 12 12 A
and domestic lighting, heating and ITSM Non-repetitive peak on-state 100 100 100 A
static switching. current

PINNING - TO220AB PIN CONFIGURATION SYMBOL

PIN DESCRIPTION
tab

1 cathode a k
2 anode

3 gate
tab anode 1 23 g

LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 60134).
SYMBO PARAMETER CONDITIONS MIN. MAX. UNIT
L
-500C -650C -800C
VDRM, Repetitive peak - 5001 6501 800 V
VRRM off-state voltages
IT(AV) Average on-state half sine wave; Tmb ≤ 109 ˚C - 7.5 A
current
IT(RMS) RMS on-state current all conduction angles - 12 A
ITSM Non-repetitive peak half sine wave; Tj = 25 ˚C
on-state current prior to surge
t = 10 ms - 100 A
t = 8.3 ms - 110 A
I2t I2t for fusing t = 10 ms - 50 A2s
dIT/dt Repetitive rate of rise of ITM = 20 A; IG = 50 mA; - 50 A/µs
on-state current after dIG/dt = 50 mA/µs
triggering
IGM Peak gate current - 2 A
VGM Peak gate voltage - 5 V
VRGM Peak reverse gate - 5 V
voltage
PGM Peak gate power - 5 W
PG(AV) Average gate power over any 20 ms period - 0.5 W
Tstg Storage temperature -40 150 ˚C
Tj Operating junction - 125 ˚C
temperature

1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor may
switch to the on-state. The rate of rise of current should not exceed 15 A/µs.

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Philips Semiconductors Product specification

Thyristors BT151 series C

THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Rth j-mb Thermal resistance - - 1.3 K/W
junction to mounting base
Rth j-a Thermal resistance in free air - 60 - K/W
junction to ambient

STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
IGT Gate trigger current VD = 12 V; IT = 0.1 A - 2 15 mA
IL Latching current VD = 12 V; IGT = 0.1 A - 10 40 mA
IH Holding current VD = 12 V; IGT = 0.1 A - 7 20 mA
VT On-state voltage IT = 23 A - 1.44 1.75 V
VGT Gate trigger voltage VD = 12 V; IT = 0.1 A - 0.6 1.5 V
VD = VDRM(max); IT = 0.1 A; Tj = 125 ˚C 0.25 0.4 - V
ID, IR Off-state leakage current VD = VDRM(max); VR = VRRM(max); Tj = 125 ˚C - 0.1 0.5 mA

DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
dVD/dt Critical rate of rise of VDM = 67% VDRM(max); Tj = 125 ˚C;
off-state voltage exponential waveform;
Gate open circuit 50 130 - V/µs
RGK = 100 Ω 200 1000 - V/µs
tgt Gate controlled turn-on ITM = 40 A; VD = VDRM(max); IG = 0.1 A; - 2 - µs
time dIG/dt = 5 A/µs
tq Circuit commutated VD = 67% VDRM(max); Tj = 125 ˚C; - 70 - µs
turn-off time ITM = 20 A; VR = 25 V; dITM/dt = 30 A/µs;
dVD/dt = 50 V/µs; RGK = 100 Ω

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Philips Semiconductors Product specification

Thyristors BT151 series C

Ptot / W Tmb(max) / C ITSM / A

15 105.5 120
conduction form ITSM
angle factor IT
degrees a a = 1.57
30 4
100
60 2.8 1.9 T time
90 2.2 2.2 Tj initial = 25 C max
10 120 1.9 112 80
180 1.57 2.8
4
60

5 118.5 40

20

0 125
0 1 2 3 4 5 6 7 8 0
1 10 100 1000
IT(AV) / A Number of half cycles at 50Hz

Fig.1. Maximum on-state dissipation, Ptot, versus Fig.4. Maximum permissible non-repetitive peak
average on-state current, IT(AV), where on-state current ITSM, versus number of cycles, for
a = form factor = IT(RMS)/ IT(AV). sinusoidal currents, f = 50 Hz.

ITSM / A IT(RMS) / A
1000 25

20

dI T /dt limit 15
100

10
IT I TSM

T time 5
Tj initial = 25 C max

10 0
10us 100us 1ms 10ms 0.01 0.1 1 10
T/s surge duration / s

Fig.2. Maximum permissible non-repetitive peak Fig.5. Maximum permissible repetitive rms on-state
on-state current ITSM, versus pulse width tp, for current IT(RMS), versus surge duration, for sinusoidal
sinusoidal currents, tp ≤ 10ms. currents, f = 50 Hz; Tmb ≤ 109˚C.

IT(RMS) / A BT151 VGT(Tj)

15 VGT(25 C)
1.6
109 C
1.4

10
1.2

5 0.8

0.6

0 0.4
-50 0 50 100 150 -50 0 50 100 150
Tmb / C Tj / C
Fig.3. Maximum permissible rms current IT(RMS) , Fig.6. Normalised gate trigger voltage
versus mounting base temperature Tmb. VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.

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Philips Semiconductors Product specification

Thyristors BT151 series C

IGT(Tj) 30
IGT(25 C) Tj = 125 °C
3
IT Tj = 25 °C
(A)
2.5 typ
20
2

1.5 max

1 10

0.5 Vo = 1.06 V
Rs = 0.0304 ohms
0 0
-50 0 50 100 150 0 0.5 1 1.5 2
Tj / C VT (V)

Fig.7. Normalised gate trigger current Fig.10. Typical and maximum on-state characteristic.
IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.

IL(Tj) Zth j-mb (K/W)

10
IL(25 C) BT145
3

2.5 1

0.1
1.5

P tp
1 D

0.01

0.5 t

0 0.001
-50 0 50 100 150 10us 0.1ms 1ms 10ms 0.1s 1s 10s
Tj / C tp / s

Fig.8. Normalised latching current IL(Tj)/ IL(25˚C), Fig.11. Transient thermal impedance Zth j-mb, versus
versus junction temperature Tj. pulse width tp.

IH(Tj) dVD/dt (V/us)

10000
IH(25 C)
3

2.5
1000
2
RGK = 100 Ohms
1.5

1 100 gate open circuit

0.5

0 10
-50 0 50 100 150 0 50 100 150
Tj / C Tj / C

Fig.9. Normalised holding current IH(Tj)/ IH(25˚C), Fig.12. Typical, critical rate of rise of off-state voltage,
versus junction temperature Tj. dVD/dt versus junction temperature Tj.

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Philips Semiconductors Product specification

Thyristors BT151 series C

MECHANICAL DATA

Dimensions in mm
4,5
Net Mass: 2 g max
10,3
max
1,3
3,7

2,8 5,9
min

15,8
max

3,0 max
3,0
not tinned
13,5
min
1,3
max 1 2 3
(2x) 0,9 max (3x)
0,6
2,54 2,54 2,4

Fig.13. SOT78 (TO220AB). pin 2 connected to mounting base.

Notes
1. Refer to mounting instructions for SOT78 (TO220) envelopes.
2. Epoxy meets UL94 V0 at 1/8".

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Philips Semiconductors Product specification

Thyristors BT151 series C

DEFINITIONS
DATA SHEET STATUS
DATA SHEET PRODUCT DEFINITIONS
STATUS2 STATUS3
Objective data Development This data sheet contains data from the objective specification for
product development. Philips Semiconductors reserves the right to
change the specification in any manner without notice

Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product
Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in
order to improve the design, manufacturing and supply. Changes will
be communicated according to the Customer Product/Process
Change Notification (CPCN) procedure SNW-SQ-650A
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 2004
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The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.

2 Please consult the most recently issued datasheet before initiating or completing a design.
3 The product status of the device(s) described in this datasheet may have changed since this datasheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

April 2004 6 Rev 1.000

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