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Thermal
Instruction Manual
V 1.4.0
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3 Settings
General Option ..........................................................................17
11
Analysis Settings ………………………………............................19
• Convection ……………………………………………….......20
• Units …………………………………………......................... 22
4 Model Building
PC Board Modeling ……………………………............................24
Component Modeling ………………………………………...........29
Cold Plate Modeling ………………………………………….........35
Conduction Bar Modeling …………………………...…………...... 39
Boundary Conditions ……………………………….......................43
5 Results
Analysis ………………………………….......................................46
Jplot Results ..............................................................................49
Report Generation ………………………………….......................53
7 Appendix
Key Terms ……………………………..........................................67
1 2
3 4
5 6
A B
C
D
B. LuxCalc Tools
Includes LuxCalc calculator tools for ‘h’ and ‘Board k’
1 2 3 4
5 6 7 8 9 10 11
1. File
Manage LuxPCB sessions
• New Project: Starts new project
• Open Project: Opens saved project
• Save: Saves current project
• Save As...: Saves current project as
• Exit: Exits LuxPCB
2. Edit Image
Manage imported image files
• Add Image: Adds PCB image from file
• Clear Image: Clears PCB image
• Crop Image: Crops PCB image
3. Tools
Access material library, Jplot, FEA
input file, and general options
4. Help
Access User Guide and information
about LuxPCB
• Help: Opens help
• About...: Displays program version
information
5. Run
Initiate analysis
6. Model Check
Create and display 3D rendered
model of PCB in Jplot
7. Setting
Set analysis mode
8. Units
Set units of variables and constants
9. PCB Image
Import PCB image file
10. Library
Access and manage materials library for PCB model
11. Report
Manage the format and images to include in the automatically
generated Power Point report
B LuxCalc Tools
12 13
12. h Calc
Convection h calculator tool
13. Board K
Board k calculator tool
15
15. Create/Modify PC Board
Create or modify PC board
16
20
21 23
22
a. General
b. Model Options a. b.
Options
a. General
b. Model Options
1. Press Setting
• Convection
• Units
Convection
Natural Convection
2.
2. Select air flow orientation
Forced Convection
Note:
- Uniform heat flux: average Nusselt
number for uniform heat flux in flow
direction and uniform wall
temperature at any cross section
Units
7. Geometry/Heat Tab:
b. Geometry
Material Property
a. Library
c. Manual Input
d. Calculate K
Layer Detail:
1. Press Create/Modify
Component
3. Component is created
CMP_t_0
CMP_t_0
a.
Natural Forced b.
c.
Select to adjust the ‘h’ value of
the air flow
Geometry/Heat
a. Cold Plate
b. Detail
Material Property
a. Library
c. Manual Input
d. Calculate K
Board Interface:
Natural Forced
6. Geometry Tab:
Choose among a. b.
a. Library
b. Select Commonly c.
Used
c. Manual input
to define property
Material Property
a. Library
c. Manual Input
1. Press Create/Modify
Conduction Bar
6. Geometry Tab:
Choose among a. b.
a. Library
b. Select Commonly c.
Used
c. Manual input
to define property
Material Property
a. Library
c. Manual Input
1. Press Create/Modify
Conduction Bar
3. Boundary Condition is
created
3. Press Run
1 2 3 4 5
6 7 8 9 10 11 12 13 14 15 16 17
1. File
Manage sessions of Jplot
2. View
Manage result image
3. Contour
Select contour mode of the PCB
model
• Normal: Monochrome 3D rendered model
• Wireframe: Wireframe 3D rendered model
• Material: Color part distinguished 3D
rendered model
• Thermal: Color temperature distinguished
3D rendered model
4. Options
Access plot option
5. Help
Access LuxPCB User Guide and
information
• Help: Opens up help
• About...: Displays program information
9. Zoom In
Zoom in current result view
c.
a. b.
2. Set values for the following
areas:
Generate Report
Note:
- The titles of the previously saved
result images from Jplot will be
listed in the left window
b. Select Slides
c. Options
A. Convection Type
Select type of convection
B. Input Settings
Define convection input parameters
C. Results Summary
Displays the results
Natural Convection
Forced Convection
Note:
- Uniform heat flux: average Nusselt
number for uniform heat flux in flow
direction and uniform wall
temperature at any cross section
4. Press Calculate
A. Material Selection
Define material properties of the board
B. Input Settings
Define PCB stackup information
C. Results
Displays the results
a.
1. Material Property: b.
Choose among
a. Library
b. Select Commonly Used
Layer Detail:
3. Press Calculate
Component
A logical unit of structure that includes integrated circuit chip
and packing. The interfaces to the PCB and cold
plate(optional) is included in the model
1. Component Substrate
A logical unit that represents a combined unit of the die
of integrated circuit chip and a substrate
2. Component Encapsulant
A molding that is used to cover the die and the rest of
the substrate to provide protection to the die from the
environment.
3. Board Interface
Accounts for leads and thermal pad or air gap between
the component and PCB
4. PCB with Vias
The part of PCB underneath the component that
includes through-hole vias. The effect of vias are
reflected in the modified value of K in z-direction only.
The modified and orignal K value are smeared using
weighted area rule and the effective Kz value is used for
the area underneath each component.
Cold plate
A solid plate made of highly conductive material that is
connected to the component with the purpose of providing
additional heat flow paths.
Conduction bar
A solid block of highly conductive material that connects a
cold plate to a PCB.
Boundary Region
A region of model in which specified conditions are enforced
on the enclosed grid point.
h
Convective coefficient. An average convection heat transfer
coefficient over an area.
Thermal resistance
A property which indicates a material's ability to resist the flow
of heat k Thermal conductivity. The property of a material that
indicates its ability to conduct heat. A reciprocal of thermal
resistance.
Natural convection
A mechanism, or type of heat transport in which the motion of
the fluid is caused solely by differences in density resulting from
temperature gradients and is not aided by a pump or a fan.
Forced convection
A mechanism, or type of heat transport in which fluid motion is
generated by an external source (like a pump, fan, suction
device, etc)
Steady State
A state of a system, in which the recently observed behavior
of the system will continue into the future.
Transient
A state of a system, in which a process variable has been
changed and they system has not reached steady state.
2-D board
Representation of a board using two-dimensional shell model
3-D board
Representation of a board using three-dimensional solid model
Thermal Analysis
A type of analysis where the change of temperature in the
system is simulated, subject to given set of boundary
conditions
Stress Analysis
A type of analysis where the change of stress in the system is
simulated, subject to given set of boundary conditions
Ambient temperature
The temperature of the surrounding condition, usually defined
as room temperature. Ambient temperature is subtracted from
estimated surface temperature in order to determine
temperature gradient
CFM
Cubic feet per minute. A non-SI unit of measurement of flow of
gas or liquid in a given amount of time.
Heat input
Heat dissipation in the component
Nusselt equation
Dimensionless heat transfer coefficient. For forced convection,
different equations are used for different boundary conditions :
Re
Reynolds Number. A dimensionless parameter that
quantitatively relates the viscous and inertial forces and whose
value determines the transition from laminar to turbulent flow
≝ ρ U∞ x ⁄ μ = U∞ x ⁄ ν
Gr
Grashoff Number. Ratio of buoyant to viscous forces
≝ g β (Ts-T∞) L3⁄ ν2
Pr
Prandtl Number. Ratio of molecular momentum diffusivity to
thermal diffusivity
≝ Cp μ ⁄ k = ν ⁄ α
Ra
Raylengh Number. Product of Grashof and Prandtl numbers
≝ Gr*Pr