Semiconductor Products

Application Bulletin
HOW & WHY SOLDER BUMPS WRINKLE AFTER REFLOW ON A PBGA
It is commonly known that metals shrink when they solidify. Solder is no exception to this rule; as eutectic tin-lead solder (63Sn/37Pb) shrinks about 3% upon cooling from the liquid to solid state. The Encyclopedia of Physics, (2nd edition, Rita G. Lerner and George L. Trigg, editors, copyright 1991) states on page 1250: It has been found that most metals expand about 7 percent on heating from 0 K to their melting temperature. Therefore, a metal with a low melting point TM has a large coefficient of thermal expansion, and vice versa; see Table III. It follows that upon cooling, metals will shrink. Solder, being comprised of tin-lead, will exhibit a larger amount of shrinkage upon cooling than will most other metals. Table III from the Encyclopedia of Physics: Metal TM (K) Lead 601 Copper 1357 Platinum 2042 Tungsten 3653 @ 293 K (X 10-6 K-1) 86.1 50.1 26.7 13.5

One can equate the shrinkage of a solder bump to that of a molten metal poured into a casting mold. Paul G. Shewmon wrote in his book, Transformations in Metals, copyright 1969, pages 194 - 195, Most metals shrink when they solidify. This shrinkage cannot be avoided, but its location in the casting can be controlled. For instance, if heat is extracted from only the bottom of a mold, the advancing liquid-solid interface remains planar and the liquid surface drops to compensate for any shrinkage. On the other hand, if heat was extracted uniformly from all sides, the shrinkage volume would appear as a void inside the ingot. One can carry this information over to the reflow of solder bumps or the manufacture of solder spheres. When Cookson manufactures solder spheres, the fluid media used to melt and also freeze the spheres must have certain properties in order to allow for a slow cool of the molten metal. Invariably some shrinkage takes place and is seen in the form of subtle shrinkage lines or depressions in the solder sphere surface. This varies somewhat by the specific alloy micro-compositions (Pb rich versus Sn rich phase and thickness of the lamellar eutectic structure) at the surface of the solder at the time of cooling as well as the specific cooling capacity and turbulence of the media surrounding the sphere at the time of freezing. When melting (reflowing) spheres onto Plastic Ball Grid Array (PBGA) substrates and then freezing them in place onto a solderable pad, the solder bumps will shrink from the molten state. If one applies the information expressed by Shewmon above, one can affect the surface appearance to some extent. When the heat is uniformly extracted on all sides and the solder sphere freezes to form a bump, rather large depressions or pits can form in the top center area of the bump. This is very typical and can vary depending upon the substrate type and the heating profile used. One can modify the freezing of the solder bump to get a smoother surface by altering the reflow profile at the cooling stage. It has proven successful in nitrogen and air convection reflow furnaces to modify the cooling portion of the profile. After peak temperature is achieved, one can set the cooling profile to a higher temperature on the top side (the bump side) of the package, while setting a cooler temperature for the bottom side of the package. This allows, as noted above, a more planar solidification front from solid to liquid and allow the bump to freeze

Semiconductor Products
Application Bulletin
from the bottom to the top. To a lesser degree, shrinkage lines or very slight depressions are likely to form; however a profile allowing for the difference in temperature setting from top to bottom has proven successful. An example is shown below from the Electrovert furnace used in Cooksons Central Research Laboratory: Furnace Zone Settings to Simulate an Eight (8) Zone Furnace (Degrees C) TOP BOTTOM 125 125 170 180 180 200 180 180 215 215 230 230 180 150 180 150

It was noted that keeping the initial top heater temperature near the solidus-liquidus of the alloy aided in keeping a smooth surface on the solder bumps. Cooling from the bottom of the bumps allowed for a uniform cooling direction and reduced shrinkage effects similar to the metal poured into a casting with single direction cooling. FIGURE 1 SOLDER BUMP COOLED IN UNIFORM DIRECTION

SOLDER SPHERE OR OTHER PREFORMED SHAPE

UNIFORM COOLING RESULTS IN LARGER DEGREE OF SHRINKAGE

BEFORE REFLOW

AFTER REFLOW AND UNIFORM COOLING FROM ALL SIDES

FIGURE 2 SOLDER BUMP COOLED IN PLANAR COOLING PROFILE

SOLDER SPHERE OR OTHER PREFORMED SHAPE

NON-UNIFORM COOLING RESULTS IN LESSER DEGREE OF SURFACE SHRINKAGE EFFECTS

BEFORE REFLOW

AFTER REFLOW AND COOLING FROM BOTTOM OF PACKAGE

FIGURE 3 FURNACE SETTINGS AND HEATING PROFILE (SAMPLE)

250 TEMPERATURE SETTINGS (DegC) 200 150 100 50 0 1 2 3 4 ZONE
RESULTANT PROFILE

TOP SETPOINTS BOTTOM SETPOINTS

The information contained herein is based upon data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Rev. 3/00 DML

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