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DATA SHEET
Philips Semiconductors
Product specication
TDA8571J
The TDA8571J is a integrated class-B output amplifier contained in a 23-lead Single-In-Line (SIL) plastic power package. It contains four amplifiers in a BTL configuration, each with a gain of 34 dB. The output power is 4 40 W (EIAJ) into a 4 load. APPLICATIONS Primarily developed for car radio applications.
UNIT V A mA A A k W dB dB dB V mV mV
ORDERING INFORMATION TYPE NUMBER TDA8571J 2002 Mar 05 PACKAGE NAME DBS23P DESCRIPTION plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm) 2 VERSION SOT411-1
Philips Semiconductors
Product specication
TDA8571J
MODE 15 10
VP1 1
VP2 8
VP3 16
VP4 23
IN1
+
30 k
OUT1+
+
Vref
OUT1
IN2
11
+
30 k
OUT2+
+
12
OUT2
SGND
TDA8571J
IN3 13
DIAGNOSTIC
VDIAG
+
30 k
17
OUT3+
+
Vref
19
OUT3
IN4
14
+
30 k
22
OUT4+
+
3 PGND1 6 PGND2 18 PGND3 21 PGND4
20
OUT4
MGM562
2002 Mar 05
Philips Semiconductors
Product specication
TDA8571J
handbook, halfpage
1 2 3 4 5 6 7 8 9
IN1 10 IN2 11 SGND 12 IN3 13 IN4 14 MODE 15 VP3 16 OUT3+ 17 PGND3 18 OUT3 19
TDA8571J
2002 Mar 05
Philips Semiconductors
Product specication
TDA8571J
When a short-circuit occurs at one or more outputs to ground or to the supply voltage, the output stages are switched off until the short-circuit is removed and the device is switched on again, with a delay of approximately 10 ms after removal of the short-circuit. During this short-circuit condition, pin VDIAG is continuously LOW. When a short-circuit occurs across the load of one or more channels, the output stages are switched off during approximately 10 ms. After that time it is checked during approximately 50 s to determine whether the short-circuit is still present. Due to this duty cycle of 50 s/10 ms the average current consumption during this short-circuit condition is very low. During this short-circuit condition, pin VDIAG is LOW for 10 ms and HIGH for 50 s (see Fig.5). The protection circuits of all channels are coupled. This means that if a short-circuit condition occurs in one of the channels, all channels are switched off. Consequently, the power dissipation in any short-circuit condition is very low. TEMPERATURE PRE-WARNING When the virtual junction temperature Tvj reaches 145 C, pin VDIAG goes LOW. OPEN-COLLECTOR OUTPUTS The diagnostic pin has an open-collector output, so more devices can be tied together. An external pull-up resistor is needed.
MGG155
+V
10 k MODE
47 F BZX79C/3.9V
MGD959
V9 VP 0
2002 Mar 05
Philips Semiconductors
Product specication
TDA8571J
circuit current
MGG156
t 50 s
2002 Mar 05
Philips Semiconductors
Product specication
TDA8571J
MAX. V V V V V A A W C C C
UNIT
THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-c PARAMETER thermal resistance from junction to ambient in free air thermal resistance from junction to case (see Fig.6) VALUE 40 1 UNIT K/W K/W
handbook, halfpage
OUT1
3.2 K/W
3.2 K/W
3.2 K/W
3.2 K/W
0.2 K/W
case
MGG157
2002 Mar 05
Philips Semiconductors
Product specication
TDA8571J
TYP.
MAX.
UNIT
18 360
V mA
Operating condition mode select switch level mode select switch current output voltage Vp 80 6.4 80 80 V A V
Mute condition mode select switch level output voltage DC output offset voltage delta DC output offset voltage V V mV mV
0.6
2002 Mar 05
Philips Semiconductors
Product specication
TDA8571J
MAX. 35
UNIT W W W W W W % % Hz Hz kHz dB
THD = maximum; Vi = 2 V (p-p) 35 square wave THD = maximum; VP = 15.2 V; Vi = 2 V (p-p) square wave Po = 1 W VMODE = 0.6 V; note 1 THD = 0.5%; Po = 1 dB with respect to 16 W at 1 dB; note 2 at 1 dB 40 20 33
38 170 1 2
dB dB dB k V V V dB dB mV
2002 Mar 05
Philips Semiconductors
Product specication
TDA8571J
+14.4 V 2200 F
input 1
OUT1+ RL = 4
+
Vref
OUT1
input 2 470 nF
IN2
11
+
30 k
OUT2+ RL = 4
+
SGND 12
TDA8571J
DIAGNOSTIC 9 VDIAG
input 3 470 nF
IN3
13
+
30 k
17
OUT3+ RL = 4
+
Vref
19
OUT3
input 4 470 nF
IN4
14
+
30 k
22
OUT4+ RL = 4
+
3 PGND1 6 PGND2 18 PGND3 21
20
OUT4
PGND4
MGM564
Special care must be taken in the PCB-layout to separate pin VDIAG from the pins IN1, IN2, IN3 and IN4 to minimize the crosstalk between the clip output and the inputs. To avoid switch-on plops, it is advised to keep the amplifier in the mute mode during a period of 150 ms (charging the input capacitors at pins IN1, IN2, IN3 and IN4).
2002 Mar 05
10
Philips Semiconductors
Product specication
TDA8571J
Figures 8 to 13 have the following conditions: VP = 14.4 V; RL = 4 ; f = 1 kHz; 80 kHz filter used; unless otherwise specified.
handbook, halfpage
300
MGM566
handbook, halfpage
80
MGM567
IP (mA) 200
Po (W) 60
40
(1)
100 20
(2)
(3)
0 0 4 8 12 16 VP (V) 20
0 8 10 12 14 16 VP (V) 18
(1) EIAJ; 100 Hz. (2) THD + N = 10%. (3) THD + N = 0.5%.
handbook, halfpage
10
MGM568
handbook, halfpage
10
MGM569
THD + N (%) 1
THD + N (%) 1
(1) (1) (2)
101
(2) (3)
101
102 102
101
10
Po (W)
102
102 10
102
103
104
f (Hz)
105
(1) Po = 1 W. (2) Po = 10 W.
2002 Mar 05
11
Philips Semiconductors
Product specication
TDA8571J
handbook, halfpage
20
MGM570
handbook, halfpage
30
MGM565
SVRR (dB) 40
cs (dB)
50
(1)
(2)
60
70
80 10
102
103
104
f (Hz)
105
90 10
102
103
104
f (Hz)
105
(1) Between channels 1 and 2 or between channels 3 and 4. (2) Between channels 1 or 2 and channels 3 or 4.
2002 Mar 05
12
Philips Semiconductors
Product specication
TDA8571J
111.76
78.74
Pgnd
2200 F VP
100 nF
out 4
out1
+
470 nF 470 nF
+
out 3 10 k diag in sgnd in mode
out2
1 Dimensions in mm.
4
MGK079
2002 Mar 05
13
Philips Semiconductors
Product specication
TDA8571J
111.76
78.74
Pgnd
100nF
out 4
2200 F VP
out1
+
470 nF 470 nF
+
out2
out 3
mode
in
sgnd
in
diag
10 k
1
MGK080
Dimensions in mm.
2002 Mar 05
14
Philips Semiconductors
Product specication
TDA8571J
SOT411-1
non-concave x D Dh
Eh
A5 A4
B j
E2 E
E1
L2 L1 L3
L 1 Z e e1 w M 23
Q m
c e2
v M
bp
5 scale
10 mm
Z (1)
12.2 4.6 1.15 1.65 0.75 0.55 30.4 28.0 12 2.54 1.27 5.08 11.8 4.3 0.85 1.35 0.60 0.35 29.9 27.5
6 10.15 6.2 1.85 3.6 14.0 10.7 2.4 4.3 2.1 0.6 0.25 0.03 45 1.43 9.85 5.8 1.65 2.8 13.0 9.9 1.6 0.78 1.8
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT411-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
2002 Mar 05
15
Philips Semiconductors
Product specication
TDA8571J
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING DBS, DIP, HDIP, SDIP, SIL Note 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. suitable suitable(1) WAVE
2002 Mar 05
16
Philips Semiconductors
Product specication
TDA8571J
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specication in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specication without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notication (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualication
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2002 Mar 05
17
Philips Semiconductors
Product specication
TDA8571J
2002 Mar 05
18
Philips Semiconductors
Product specication
TDA8571J
2002 Mar 05
19
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
753503/02/pp20
Mar 05