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DESCRIPTION
The M27C512 is a 512 Kbit EPROM offered in the PLCC32 (C) TSOP28 (N)
two ranges UV (ultra violet erase) and OTP (one 8 x 13.4 mm
time programmable). It is ideally suited for applica-
tions where fast turn-around and pattern experi-
mentation are important requirements and is
Figure 1. Logic Diagram
organized as 65,536 by 8 bits.
The FDIP28W (window ceramic frit-seal package)
has transparent lid which allows the user to ex-
pose the chip to ultraviolet light to erase the bit pat-
tern. A new pattern can then be written to the
device by following the programming procedure. VCC
For applications where the content is programmed
only one time and erasure is not required, the
M27C512 is offered in PDIP28, PLCC32 and 16 8
TSOP28 (8 x 13.4 mm) packages. A0-A15 Q0-Q7
E M27C512
GVPP
VSS
AI00761B
VCC
A12
A15
A14
A13
A15 1 28 VCC
DU
A7
A12 2 27 A14
A7 3 26 A13 1 32
A6 4 25 A8 A6 A8
A5 5 24 A9 A5 A9
6 23 A11 A4 A11
A4
A3 7 22 GVPP A3 NC
M27C512 A2 9 M27C512 25 GVPP
A2 8 21 A10
9 20 E A1 A10
A1
A0 10 19 Q7 A0 E
Q0 11 18 Q6 NC Q7
Q1 12 17 Q5 Q0 Q6
17
Q2 13 16 Q4
Q1
Q2
VSS
DU
Q3
Q4
Q5
VSS 14 15 Q3
AI00762
AI00763
E Chip Enable
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M27C512
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M27C512
1.3V
High Speed
3V 1N914
1.5V
0V 3.3kΩ
DEVICE
Standard UNDER OUT
TEST
2.4V CL
2.0V
0.8V
0.4V
CL = 30pF for High Speed
AI01822
CL = 100pF for Standard
CL includes JIG capacitance AI01823B
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M27C512
Symbol Alt Parameter Test Condition -45 (3) -60 -70 -80 Unit
Address Transition to
tAXQX tOH E = VIL, G = VIL 0 0 0 0 ns
Output Transition
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Sampled only, not 100% tested.
3. Speed obtained with High Speed AC measurement conditions.
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M27C512
Symbol Alt Parameter Test Condition -90 -10 -12 -15/-20/-25 Unit
Address Transition to
tAXQX tOH E = VIL, G = VIL 0 0 0 0 ns
Output Transition
Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Sampled only, not 100% tested.
tAVQV tAXQX
tEHQZ
tGLQV
tELQV tGHQZ
Hi-Z
Q0-Q7
AI00735B
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M27C512
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M27C512
VCC
A8
A9
tA9HVPH tVPXA9X
GVPP
tVPHEL tEXVPX
tA10HEH tEXA10X
A10 Set
A10 Reset
tA10LEH
AI00736B
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M27C512
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M27C512
A0-A15 VALID
tAVEL tEHAX
VCC tELQV
tVCHEL tEHVPX
GVPP
tVPHEL tVPLEL
E
tELEH
PROGRAM VERIFY
AI00737
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M27C512
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M27C512
Device Type
M27
Supply Voltage
C = 5V
Device Function
512 = 512 Kbit (64Kb x8)
Speed
-45 (1) = 45 ns
-60 = 60 ns
-70 = 70 ns
-80 = 80 ns
-90 = 90 ns
-10 = 100 ns
-12 = 120 ns
-15 = 150 ns
-20 = 200 ns
-25 = 250 ns
VCC Tolerance
blank = ± 10%
X = ± 5%
Package
F = FDIP28W
B = PDIP28
C = PLCC32
N = TSOP28: 8 x 13.4 mm
Temperature Range
1 = 0 to 70 °C
3 = –40 to 125 °C
6 = –40 to 85 °C
Options
X = Additional Burn-in
TR = Tape & Reel Packing
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-
vice, please contact the STMicroelectronics Sales Office nearest to you.
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M27C512
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M27C512
Table 14. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Mechanical Data
millimeters inches
Symbol
Typ Min Max Typ Min Max
A 5.72 0.225
A1 0.51 1.40 0.020 0.055
A2 3.91 4.57 0.154 0.180
A3 3.89 4.50 0.153 0.177
B 0.41 0.56 0.016 0.022
B1 1.45 – – 0.057 – –
C 0.23 0.30 0.009 0.012
D 36.50 37.34 1.437 1.470
D2 33.02 – – 1.300 – –
E 15.24 – – 0.600 – –
E1 13.06 13.36 0.514 0.526
e 2.54 – – 0.100 – –
eA 14.99 – – 0.590 – –
eB 16.18 18.03 0.637 0.710
L 3.18 4.10 0.125 0.161
S 1.52 2.49 0.060 0.098
∅ 7.11 – – 0.280 – –
α 4° 11° 4° 11°
N 28 28
Figure 9. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Outline
A2 A3 A
A1 L α
B1 B e C
eA
D2
eB
D
S
N
∅ E1 E
1
FDIPW-a
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M27C512
Table 15. PDIP28 - 28 pin Plastic DIP, 600 mils width, Package Mechanical Data
millimeters inches
Symbol
Typ Min Max Typ Min Max
A 4.445 0.1750
A1 0.630 0.0248
A2 3.810 3.050 4.570 0.1500 0.1201 0.1799
B 0.450 0.0177
B1 1.270 0.0500
C 0.230 0.310 0.0091 0.0122
D 36.830 36.580 37.080 1.4500 1.4402 1.4598
D2 33.020 – – 1.3000 – –
E 15.240 0.6000
E1 13.720 12.700 14.480 0.5402 0.5000 0.5701
e1 2.540 – – 0.1000 – –
eA 15.000 14.800 15.200 0.5906 0.5827 0.5984
eB 15.200 16.680 0.5984 0.6567
L 3.300 0.1299
S 1.78 2.08 0.070 0.082
α 0° 10° 0° 10°
N 28 28
Figure 10. PDIP28 - 28 pin Plastic DIP, 600 mils width, Package Outline
A2 A
A1 L α
B1 B e1 C
eA
D2 eB
D
S
N
E1 E
1
PDIP
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M27C512
Table 16. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Mechanical Data
millimeters inches
Symbol
Typ Min Max Typ Min Max
A 3.18 3.56 0.125 0.140
A1 1.53 2.41 0.060 0.095
A2 0.38 – 0.015 –
B 0.33 0.53 0.013 0.021
B1 0.66 0.81 0.026 0.032
CP 0.10 0.004
D 12.32 12.57 0.485 0.495
D1 11.35 11.51 0.447 0.453
D2 4.78 5.66 0.188 0.223
D3 7.62 – – 0.300 – –
E 14.86 15.11 0.585 0.595
E1 13.89 14.05 0.547 0.553
E2 6.05 6.93 0.238 0.273
E3 10.16 – – 0.400 – –
e 1.27 – – 0.050 – –
F 0.00 0.13 0.000 0.005
R 0.89 – – 0.035 – –
N 32 32
Figure 11. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline
D A1
D1 A2
1 N
B1
E2
e
E3 E1 E F
B
0.51 (.020) E2
1.14 (.045)
D3 A
R CP
D2 D2
PLCC-A
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M27C512
Table 17. TSOP28 - 28 lead Plastic Thin Small Outline, 8 x 13.4 mm, Package Mechanical Data
millimeters inches
Symbol Typ Min Max Typ Min Max
A 1.250 0.0492
A1 0.200 0.0079
A2 0.950 1.150 0.0374 0.0453
B 0.170 0.270 0.0067 0.0106
C 0.100 0.210 0.0039 0.0083
CP 0.100 0.0039
D 13.200 13.600 0.5197 0.5354
D1 11.700 11.900 0.4606 0.4685
e 0.550 – – 0.0217 – –
E 7.900 8.100 0.3110 0.3189
L 0.500 0.700 0.0197 0.0276
α 0° 5° 0° 5°
N 28 28
Figure 12. TSOP28 - 28 lead Plastic Thin Small Outline, 8 x 13.4 mm, Package Outline
A2
1 N
e
B
N/2
D1 A
D CP
DIE
TSOP-a A1 α L
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M27C512
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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