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Agenda
The new Silicon Labs low power capacitive sensing Low power systems Silicon Labs capacitive sensing methodology New capacitive sensing features System level implementation of low power capacitive sensing
25 MIPS core & Flash memory g eso u o b C, o age e e e ce, comparator, e a High resolution 12-bit ADC, voltage reference, co pa a o , internal oscillators, temperature sensor, and 6-bit current DAC
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Customer Benefit
Enables significant battery life savings Highly responsive and reliable cap-touch buttons, buttons sliders, and wheels Reliable even in noisy environments Saves BOM cost and enables a complete system solution for both cap-touch and MCU applications in a small form factor QuickSense Studio provides a rapid and p p trustworthy path to development success Single environment for all human interface functions reduces time to market
Calibration tools
Performance analysis tool
Quickly and easily set thresholds
Quick builder
8 kB
F99x 13 ch CDC, 12b ADC F98x 12b ADC F98x 12b ADC
4 kB
2 kB
20p QFN 3 mm x3 mm
24p QFN 4 mm x 4 mm
24p QSOP
42p QFN 5 mm x 7 mm
Standard
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Cap touch
DC-DC
Wireless
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Operating Modes (1 of 2)
Active mode
Perform calculations, decision making, I/O operations, etc. g CPU executing instructions from flash All peripherals and clocks active
IDLE
Can be used as a low power technique while peripherals are active
Example: place CPU into the idle mode while UART is transmitting
CPU d does not execute i t ti t t instructions All peripherals and clocks active
Operating Modes (2 of 2)
Suspend
Can be used as a low power technique while peripherals are active
Example: place CPU into the suspend mode while CS0 module is measuring the pad capacitance
CPU does not execute instructions All internal oscillators disabled y gated System clock g
Sleep
Lowest power mode MCU uses for the inactive period CPU does not execute instructions Peripherals and clocks turned off RTC either on or off Brownout detector on or off
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Wake-up Time
Time interval between an event used to start the CPU and the first instruction executed T i ll i l d regulator stabilization time when integrated Typically includes l t t bili ti ti h i t t d Analog wake up time must be considered for some applications
VREF voltage stabilization varies greatly between devices
Only 1.5 us for C8051F990 devices
Wake up is dependent on many factors. Read the manual to determine wake up requirements. For example some competing MCUs require requirements example, complete reset to come out of low power modes.
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Wake-up Events
Several different methods are available to wake the MCU from the low power modes
Wake-Up p Source
None
Power Savings
Excellent MIPS/mW Good No Code Execution Very Good No Code Execution All Internal Oscillators Disabled System Clock Gated Excellent Power Supply Gated All Oscillators except SmaRTClock Disabled
Wake-Up p Time
N/A
Idle
Any Interrupt , CS0, SmaRTClock, Port Match, Comparator0, RST pin SmaRTClock port match Comparator0
23 SYSCLKs
Suspend
400 ns
Sleep
2 us
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Frequency Sensitivity
Measure of the dynamic current of the MCU
PFS CV 2 F
Determines the active mode current
CPU at highest frequency for code dependent execution q y CPU at a reduced frequency for fixed time
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Temperature
Peripheral operation may be affected by temperature variation
Example: oscillator tolerance
General specmanship
Be aware of what the specification p p provided actually represents y p
Example: consider all parameters required for waking up (reset required)
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In many cases operating from a faster clock results in a lower cases, power consumption
Active mode
Ti Time Sleep mode Wake event: Analog only Digital only Analog and digital High sleep current Slow wake up time High active mode current Low sleep current Fast wake up time Low active mode current
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Capacitive Sensing
Measuring Capacitance
Capacitance
If two metal plates are placed with a gap between them and a voltage is applied to one of the plates, an electric field will exist between the plates Any two conductive objects can be used for the plates of the capacitor When using capacitive sensing for touch applications the capacitor is typically formed by a PCB element and the conductive object in proximity
Capacitor parameters
Areacapacitance is directly proportional to the area of the plates Dielectriccapacitance is directly proportional to the relative permittivity of the material between the plates (air, glass, plastic etc ) (air glass plastic, etc.) Distancecapacitance is indirectly proportional to the distance between the two plates
where: 0 is the permittivity of free space r is the relative permittivity of the dielectric material A is the area of the plates D is the distance between the plates
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Measuring SelfCapacitance
The are various techniques to detect the change
Relaxation oscillator
Builds an oscillator which uses the sensor capacitor as a timing element
Charge transfer
Charging a sensor capacitor and then transferring that charge into an integrating capacitor over several cycles
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IREF CREF
SAR
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I SENSOR C SENSOR
dV dt d
or
dV
I SENSOR dt CSENSOR
This additional capacitance reduces the voltage potential of the sensor capacitor at a given current
Inactive Switch Active Switch
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Charge Time
Successive Approximation
Decision tree based on binary weighted voltages
Start the first comparison at the mid-scale voltage IREF/2 ( (for 16 bit conversion IREF=0x8000) ) Determine MSB value based on the timing of the capacitors S t the next comparison voltage to the next comparison Set th t i lt t th t i value Continue process through all 16 bits
IREF Charge Time Current value for ISENSOR = 0x8000 Current value for ISENSOR = 0x4000
VSENSOR > VREF then MSB = 0 VSENSOR < VREF then MSB = 1
IREF ISENSOR
Bit 15 = 0 Bit 14 = 1 Bit 13 = 0 Bit 0 = 0
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Auto-scan logic reduces overhead Pin monitoring for noise rejection Hardware accumulator to reduce Overhead Wake on suspend
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Connect these CS0 channels internally and scan the single input reduce sampling overhead
Curr rent
IAVG IAVG
27 1 2 3 4 5 6 7 8 9 0 # *
Pad #
Curre ent
0-*
Pad #
Port Pin P0.0 P0 0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P0 7 P1.0 P1.1 P1.2 P1.3
CS0SCAN1 P1.5
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P1.0
P1.4 P1.5
Example: The SMBus in a system is heavily loaded with multiple slaves and a long PCB route g Example: Timer2 controls an LED on Port 1, pin 3 to provide variable dimming A SPI port is a typical example where pin monitoring is not needed due to light loads
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CS0 FeaturesGain
CS0 circuit adjusted in integer increments
1x to 8x (8x is the default)
High gain gives the best sensitivity and resolution for small capacitors
Touch sensitive PCB switches
Most capacitive sensors do not require any modification from the default timer settings
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CS0 provides the capability to change the source current and thus the ramp time
Changes charge timing ISENSOR
dV
I SENSOR dt CSENSOR
VR
CSENSOR
Charge Time
Charge Time
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Single P d Si l Pad
Each l E h element i th t in the slider can also be interpreted as a single pad
Slider
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Capacitive GesturesSlider
Sliders
Single finger gesture
Finger motion is across multiple pads (CS0 channels)
Position indication determined using adjacent pad signal levels Each pad element connects to a single CS0 channel Wake events
Can do single touch to initiate wake events Can use channel bonding to have any point on the slider wake the MCU
Reduces power
CS1
CS2
CS3
CS4
CS5
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Capacitive GesturesPinch
Pinch
Two finger gesture
Each finger movement is unidirectional and in opposite directions
Position indication of multi-touch determined using adjacent pad signal levels of two points Each pad element connect to single CS0 channel Wake events
Can do single touch to initiate wake events Can use channel bonding to have any point on the slider wake the MCU
Reduces power
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Wake On Slider
Slider uses the run time channel bonding to create three pads out of the six connected to the MCU
Sample the first set of dynamically bonded channels for slider start Use combined channels to detect slider movement
CS0 multiple channel enable (CS0MCEN) using the CS0SCAN0/1 bit settings
S Sample th l t set of b d d channels t d t l the last t f bonded h l to determine slider end position i lid d iti
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Touch Detected D t t d ?
Y
Set RTC Alarm to 10 ms Set th S t the CS0 t b d th next t to bond the t two pads as one d Set CS0 channel index to the pad pair
10 ms m
Next pad?
Y
Finger off?
Channel Bonded
10 ms
Confirmed C fi d Touch
RTC alarm remains at 10 ms Set the CS0 to bond the next two pads as one Set CS0 channel index to the pad pair N
Run Application
Next pad?
Finger off?
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Go to sleep
Active Mode
CP Active PU
CP Active PU
Sleep Mode
Sleep Mode
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CS0 Convert
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F340
Kit contents
F990Slider-EB demo board F990Slider quick start guide
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MAX LED
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Slider Mode
The LEDs act as a ball in motion and will continue rotating until it is stopped
The LEDs may be stopped by pressing one (slow stop) or two fingers (fast stop) on the slider Continuing slider motions cause the enabled LED to rotate faster Th rotating LED slow d The t ti LEDs l down until it comes to a complete stop with no til t l t t ith gestures
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Changing Modes
The user may cycle through the modes by performing a pinch gesture
The slider may be pinched by placing one finger on the A button and another finger on the B button then simultaneously sliding both fingers towards the middle of the slider
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Development Kits
ToolStick990DC
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FrontPanel1EB
FrontPanel2EK
$39.99
KeymatEK
$79.99
C8051F700DK C8051F800DK
$99.00
AN366: Capacitive Sensing APIA Guide to the API firmware library AN367: Understanding Capacitive Sensing SNR and Setting Reliable Thresholds AN418: Baselining in the Capacitive Sensing Firmware API
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www.silabs.com/QuickSense