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IRF540, RF1S540SM
Features
28A, 100V rDS(ON) = 0.077 Single Pulse Avalanche Energy Rated Nanosecond Switching Speeds Linear Transfer Characteristics High Input Impedance Related Literature - TB334 Guidelines for Soldering Surface Mount Components to PC Boards
Symbol
D
Ordering Information
PART NUMBER IRF540 RF1S540SM PACKAGE TO-220AB TO-263AB BRAND IRF540
G
RF1S540SM
S
NOTE: When ordering, use the entire part number. Add the suffix 9A to obtain the TO-263AB variant in the tape and reel, i.e., RF1S540SM9A.
Packaging
JEDEC TO-220AB
SOURCE DRAIN GATE DRAIN (FLANGE)
JEDEC TO-263AB
GATE SOURCE
DRAIN (FLANGE)
IRF540, RF1S540SM
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified IRF540, RF1S540SM 100 100 28 20 110 20 120 0.8 230 -55 to 175 300 260 UNITS V V A A A V W W/oC mJ oC
oC oC
Drain to Source Breakdown Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDS Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID TC = 100oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Dissipation Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Single Pulse Avalanche Energy Rating (Note 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T pkg
CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Specifications
PARAMETER Drain to Source Breakdown Voltage Gate to Threshold Voltage Zero Gate Voltage Drain Current
TC = 25oC, Unless Otherwise Specified SYMBOL BVDSS VGS(TH) IDSS ID(ON) IGSS rDS(ON) gfs td(ON) tr td(OFF) tf Qg(TOT) Qgs Qgd CISS COSS CRSS LD Measured From the Contact Screw on Tab To Center of Die Measured From the Drain Lead, 6mm (0.25in) from Package to Center of Die Modified MOSFET Symbol Showing the Internal Devices Inductances
D LD G LS S
TEST CONDITIONS ID = 250A, VGS = 0V (Figure 10) VGS = VDS, ID = 250A VDS = 95V, VGS = 0V VDS = 0.8 x Rated BV DSS, VGS = 0V, TJ = 150oC VDS > ID(ON) x rDS(ON) MAX, VGS = 10V (Figure 7) VGS = 20V ID = 17A, VGS = 10V (Figures 8, 9) VDS 50V, ID = 17A (Figure 12) VDD = 50V, ID 28A, RG 9.1, RL = 1.7 MOSFET Switching Times are Essentially Independent of Operating Temperature VGS = 10V, ID = 28A, VDS = 0.8 x Rated BV DSS , Ig(REF) = 1.5mA (Figure 14) Gate Charge is Essentially Independent of Operating Temperature
UNITS V V A A A nA S ns ns ns ns nC nC nC pF pF pF nH
On-State Drain Current (Note 2) Gate to Source Leakage Current Drain to Source On Resistance (Note 2) Forward Transconductance (Note 2) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge (Gate to Source + Gate to Drain) Gate to Source Charge Gate to Drain Miller Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Internal Drain Inductance
4.5
nH
LS
Measured From the Source Lead, 6mm (0.25in) From Header to Source Bonding Pad
7.5
nH
RJC RJA RJA Free Air Operation RF1S540SM Mounted on FR-4 Board with Minimum Mounting Pad
1.25 80 62
IRF540, RF1S540SM
Source to Drain Diode Specifications
PARAMETER Continuous Source to Drain Current Pulse Source to Drain Current (Note 3) SYMBOL ISD ISDM TEST CONDITIONS Modified MOSFET Symbol Showing the Integral Reverse P-N Junction Diode
G D
MIN -
TYP -
MAX 28 110
UNITS A A
Source to Drain Diode Voltage (Note 2) Reverse Recovery Time Reverse Recovery Charge NOTES:
TJ TJ TJ
= 25oC, ISD = 27A, VGS = 0V (Figure 13) = 25oC, ISD = 28A, dISD/dt = 100A/s = 25oC, ISD = 28A, dISD/dt = 100A/s
70 0.2
150 1.0
V ns C
2. Pulse test: pulse width 300s, duty cycle 2%. 3. Repetitive rating: pulse width limited by maximum junction temperature. See Transient Thermal Impedance curve (Figure 3). 4. VDD = 25V, starting TJ = 25oC, L = 440H, RG = 25, peak IAS = 28A.
30
24
18
12
0 125 50 75 100 TC , CASE TEMPERATURE (oC) 150 175 25 50 75 100 125 150 175 TC, CASE TEMPERATURE (oC)
1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 10-5 SINGLE PULSE 10-4 10-3 10-2 10-1 t1 t2 PDM
NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJC + TC 1 10 t1, RECTANGULAR PULSE DURATION (s)
100
40 30 20
100s 10
VGS = 6V
1ms 10ms
VGS = 5V 10 VGS = 4V 0
60
50
VGS = 8V VGS = 7V VGS = 10V 30 VGS = 6V ID(ON), ON-STATE DRAIN CURRENT (A) PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX ID, DRAIN CURRENT (A) 40
100
VDS 50V
10
175oC 1
25oC
0.8 ON RESISTANCE ()
3.0
2.4
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VGS = 10V, ID = 28A
0.6
1.8
0.4
1.2
0.2
0.6
20
40
60
3000 VGS = 0V, f = 1MHz CISS = CGS + CGD CRSS = CGD COSS CDS + CGD CISS
2400
1.05
1800
0.95
0.85
20
40
60
100
20
16
25oC 12 175oC 8
100
175oC 25oC 10
1 0 0.6 1.2 1.8 2.4 VSD, SOURCE TO DRAIN VOLTAGE (V) 3.0
0V
IAS 0.01
0 tAV
RG DUT
VDD
10% 90%
10%
50%
CURRENT REGULATOR
12V BATTERY
0.2F
50k 0.3F
D G DUT
VDS 0
IG(REF) 0
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