AEM envisions to be among the world’s Top 3 companies supplying world-class assembly, packaging

equipment, materials and services for the global microelectronic industry through our innovative people.
Coupled with the diverse experience of the management team and the investments into our
manufacturing capacities and R&D innovations as well as the excellent collaborations with our strategic
customers and suppliers, we have now evolved into a one-stop total solution provider of a whole spectrum
of solutions ranging from advanced automated equipment, precision engineering products and materials
to manufacturing services. Over the years, we have successfully developed World Class Products to meet
the dynamic challenges of the microelectronics industry and is well positioned to become a World Class AEM Headquarter, Singapore

Company.

Our unique capabilities are integrated to offer an effective Chemicals

package of equipment, precision components, engineering
We develop processes and associated chemical formulations
materials, substrates manufacturing, chemicals and plating
for surface finishing including deflashing, solder dipping and
services to our customers in semiconductor assembly, testing
plating for IC packages, connectors, base coil.
and finishing.

Plating
Equipment Development & Manufacturing
We provide value-added manufacturing & plating services to
Specializing in automated equipments for the semiconductor
the IC Manufacturing/SMT/Connector industries. We perform
industry, providing needs for the assembly and end-of-line
re-packing and re-balling services in Tianjin - China.
operations. Key components are manufactured in our factory
With a well-equipped facility and huge capacity, we also
which incorporate the latest technologies which are developed
provide quality Plating services to the leadframes and
in-house or jointly with industry partners.
Precision Engineering connectors industries.

Offers a wide range of precision engineering parts that are

designed and manufactured in-house to support the assembly, Distribution

testing and finishing processes. These encompass: Test Offers a wide range of materials and products to the

Sockets, Device Change Kit, Stiffeners and Precision Spare semiconductor and general industries. Our key distribution

Parts. products involves supplying engineering plastic stock shapes

and raw resins that we carry under established brand names
from Dupont, Quadrant and Victrex.plc.

AEM Platronics (S) Pte Ltd AEM Platronics (M) Sdn. Bhd AEM Microtronics (M) Sdn. Bhd AEM (Suzhou) Co. Ltd AEM (Tianjin) Co. Ltd

Substrates Manufacturing
Microcircuit Technology (S) Pte Ltd, a wholly-owned subsidiary of AEM Holdings Ltd, is pioneer in
advanced interconnects substrate manufacturing in Singapore. We provide total semiconductor solution
from substrate design to fabrication for prototype and high volume production.
Microcircuit Technology (S) Pte Ltd
© Copyright 2007 AEM Singapore Pte Ltd
 " # $ ! %#$& '
!

AEM Singapore Pte Ltd specializes in providing total backend machine and solutions to the microelectronics
applications. In particular, the company has developed a wide range of application specifically machine
vision inspection systems, marking systems and lead conditioning system and many more.

We are the first supplier to develop an integrated system which combines four types of processes (Mark,
Lead inspection with conditioning and Tape & Reel) into a single machine.

Through material and process research our highly experienced engineers can adapt to all customer
specifications. With know-how and quality engineering, custom-made systems produced optimum
efficiency. The ultimate compact electromechanically design with its high throughput and small footprint
enhances an optimum cost of ownership.

Last but not least, the final analysis during the debugging stage guarantees customer satisfaction during
buy-off.
" # $ " %&

Wafer Sorter

Vision Inspection Systems

Laser Marking Systems

Lead Conditioning

Laser Deflash

Packaging

Wet process

Plating Systems

Deflash System (Wet process)

Backend Auto In-line System

(% (
52 Serangoon North Avenue 4, Singapore 555853
T 65 6483 1811 F 65 6483 1321
Email equipment_sales@aem-evertech.com
W http://www.aem-evertech.com
Co. Reg No 199200632M p. 2
*
ADS-1000
• High throughput up to 10,000UPH
• Dual head flipper
• OEM vision system
• 2D vision inspection for bump damage, edges chips/crack,
laser marks, surface defects and tape seal quality
• High placement accuracy
• For wafer size: 6” or 8”

) &
Optimus T-1100
• Fully automated of 3D vision inspection system
• High throughput up to 45,000 UPH
• In-pocket check
• 3D “On-The-Fly” lead ball/pad inspection
• Integrated with mark inspection module
• User-defined output: tray-to-tray or tray-to-tape Dual taper output
• Small footprint
• Solution for BGA, QFN, QFP packages (JEDEC thin trays)
DSR-400A
• Fully automated 3D vision inspection system
• Input/output in tube (stacked form)
• Integrated with mark, lead inspection and rework modules
• High throughput up to 5,000 UPH
• 3D lead inspection capability
- Pitch, lead, skew, span, spread, Co-line
• Capable of sorting devices into “Good”, “Mark reject”, “Lead
reject” & “Rework” modules
• Rework capabilities:
- Lead bent, Co-line, lead sweep, lead spread
• Small footprint
• Solution for PDIP packages
© Copyright 2007 AEM Singapore Pte Ltd
For the continuous improvement of the product, the design and specification given in this document are subject to changes without prior notice.
% +
LR-510
• Fully automated of laser marking system
• Laser mark types of SMD devices from tray
– eliminate lead bent defects
• High throughput up to 15,000 UPH
• Servo driven mechanism - for high speed & accuracy
• Programmable conversion for different types through
auto-hostlink & bar-coding
• 2 axes tilting mechanism - to ensure marking accuracy
• Specially designed tray referencing aligner
• Solution for all packages in JEDEC or EIAJ trays

LSR-680DE
• Fully automated laser marking system
• Integrated with 2D vision inspection
• Pre-vision module - for lead/ball/orientation inspection
• Tray flipper module - for flipping the tray (ball device only)
• Post-vision module - ensure mark quality
• Pick & place sorting arm module
- process good & reject device into tray respectively
• Solution for packages in JEDEC trays

LS-338
• Fully automated strip-to-strip leadframe laser marking system
• Single track strip handler with double galvo head laser marker
• Strip positioned by servo system - for high speed & accuracy
• Programmable conversion capability, through auto-hostlink &
bar-coding
• Pre-vision module - for strip orientation
• “On The Fly” Post-vision module - ensure mark quality
• Capable of process good & reject device into stack magazine
and reject bin respectively
• Solution for all packages in strip form
© Copyright 2007 AEM Singapore Pte Ltd
For the continuous improvement of the product, the design and specification given in this document are subject to changes without prior notice.
%
FP-550
• Fully automated standalone rework station
• User-defined input/output tray-to-tray or tube-to-tube
• High throughput up to 550 UPH
• Use of servo motor controller for rework
– minimize conversion time
• Rotary arm module – to maximize production time
• Dynamic Precisor module
– ensure no stoppage and achieve error free productivity
• Lead conditioning capabilities
- Lead bent, pitch, sweep, skew, copplanarity, package standoff,
terminal dimension
• Solution for QFP, TQFP, PQFP,TSOP packages (stacked in JEDEC
or EIAJ trays)
PGR-380
• Fully automated standalone rework station
• High throughput of 800 UPH
• Lead conditioning capabilities
- Lead bent, standoff, coplanarity, sweep, pitch, skew,
terminal dimension
• Dynamic Precisor module
- ensure no stoppage and achieve error free productivity
• Mechanical Incoming Jig Lead Inspection
– ensure rework capabilities
• Solution for PGA & µPGA packages (in JEDEC trays)
SI-2700

• Fully automated standalone rework station

• High throughput up to 1,200 UPH
• Flipper module
• Singulator module
• Input orientation module
• Lead conditioning capabilities
- Lead bent, pitch, sweep, skew, copplanarity, package
standoff, terminal dimension
• Solution for TSSOP, SSOP & SOIC packages (stacked tube)
© Copyright 2007 AEM Singapore Pte Ltd
For the continuous improvement of the product, the design and specification given in this document are subject to changes without prior notice.
%
SP-300
• Semi-automated lead conditioning single tube input machine
• Manual dual tube output station
• High throughput of 1,200 UPH
• Lead conditioning capabilities
- lead bent, standoff, coplanarity, sweep, pitch, terminal
dimension
• Solution for TSSOP, SOIC packages (in tube form)

%
LD-310
• Fully automated laser deflashing system
• Servo system mechanism – ensure accurate positioning
• Programmable conversion for different types through auto-
hostlink & bar-coding
• Uses mask for deflashing
• For all strip subrates leadframe (slotted magazine)

LD-100
• Fully automated single track laser deflashing system
• No media & chemical contact to package
• Quick & simple conversion
• Pre-vision to check on position before cutting

© Copyright 2007 AEM Singapore Pte Ltd

For the continuous improvement of the product, the design and specification given in this document are subject to changes without prior notice.
 +
TTT-300

• Fully automatic transfer machine

• User-defined input/output tray-to-tube or tube-to-tray
• High throughput up to 4,500 UPH
• ID Matrix Decoder – to determine “good” or “bad” devices
• Shutter station - to flipped devices & shuttered into two different
buffer tracks position
• Pick & place module with orientation module
• Incline tracks with air assist module (for tray-to-tube operation)
• Solution for TSSOP, SSOP, SOIC packages

TTR-280VD

• Fully automatic transfer machine

• Input tray-to-tape & reel
• High throughput up to 7,000 UPH
• 2D In-pocket Mark Inspection
• Implied/Gross Lead Inspection
• Single or Dual tape & reel module
• New sealing module
• SPC reporting
• Dual pick & place arm
• Auto reject replacement
• Optional module: De-taping module & Barcode reader
• Solution for BGA, QFN, QFP in JEDEC trays

© Copyright 2007 AEM Singapore Pte Ltd

For the continuous improvement of the product, the design and specification given in this document are subject to changes without prior notice.
*
Wet Bench

AEM specializes in the design and manufacture of wet process

stations to meet the varied needs and demand from the
following industries : Semiconductor, Disk Media,
Pharmaceutical, Aviation industries as well as institutions of
research & development.
Modular designs are custom-built to suit our customers’ process
needs. It is available in automated, semi-automated and manual
benches. It also comes in stainless steel, PVDF, Polypropylene
and flame retardant materials that qualified and met Factory
mutual FM4910 Protocol construction standards.

Applications

a) Disk Media
d) Ultrasonic Cleaning Line
• Class 100 clean room environment
An Environment Friendly Cleaning method for Electronic,
automated Disk media Cleaning station
Disk Drive & Aviation Industries & Research Institution.
• Disk Pre-Texture Cleaning Bench
Multi-Stage/tanks system with Ultrasonic cleaning, multi-
• Disk Post –Texture Cleaning Bench
cascading overflow rinse, High-pressure jet spray rinse,
• Media surface scrubbing machine
vacuum/Hot air dying process, and PLC controlled auto-
• Acid etching Bench
trans robotics system. Available in single piece or
• Wet Conveyor for Disk transfer
batch/continuous production cycle.
• Upgrading/Reconfiguration machine
e) For Aviation Automation: Process cleaning for
b) For semiconductor industry: Acid Cleaning, Solvent
HPVT/LP Vanes, Mini-NDT/FPI inspection cleaning,
Cleaning, Pre-Oxidation Cleaning, Pre-Diffusion
Batch Ultrasonic Processing Cleaning Line
Cleaning, Nitride Etching, Photo-resist Stripping

c) For Research Institution: Wafer Auto-Etching Testing

chamber, Gold plating cleaning bath, AOT analytical
system, VOCs testing mini-lab, Ultrasonic water
analytical tank, Smart lab for wastewater treatment
process

© Copyright 2007 AEM Singapore Pte Ltd

For the continuous improvement of the product, the design and specification given in this document are subject to changes without prior notice.
Reel-to-Reel Selective

• Fully enclosed for safe and clean environment

• Independent Dual Strand processing
• Continuous selective plating
• Brush and Immersion selective plating
• Fully computerized touch screen control system
• Statistical process control
• Adjustable reel speed from 2m ~ 10m/min
AEM808

Reel-to-Reel Spot Plating

• Fully enclosed for safe and clean environment

• Step and repeat system
• Fully computerized touch screen control system
• Statistical process control
De-reeler & accumulator De-reeler and Accumulator
Minimum tension throughout the continuous process is achieved
with careful design of accumulator and re-reel system. (Non
Ag Spot Plating
stopping process without, changing of the reel of material.

Spot Plating
The sparger system is capable for selective silver-plating of 4microns
over a length of 600mm lead within 3 second.
• Specially designed sparger system
• High flow rate systems
• High silver concentration (100g/I) make-up solution
• Two flow system Indexing System

• Stoppers are used to ensure consistent sealing

• Hydraulic system is used instead of air to give consistent pressure Specifications

Indexing System Dimension of Machine : 28000mm x 1500mm x 1350mm

In the step and repeat system, location of the strip is dictated by Machine Capacity: 6m/min x2
LeadFrame Dimension: 20 ~ 70mm (W), 0mm (thickness)
indexing mechanism with carrier pin. An indexing system is use to
Lead Frame Material: Cu/Cu alloy/ A42/Ni Plated
push the strip through the plating cells when the masks are
Plating Specification
opened and the cell is not flooded, the amount of strip push
• Thickness: Ag - 4µm, accuracy: +0.15, area accuracy:
through has to be equal registration on the selective plating +0.20mm, each pad center: +10%

Related chemicals include plating chemicals, pre-cleaning solution, post-cleaning solution, stripper and neutralizer are available too.

© Copyright 2007 AEM Singapore Pte Ltd

For the continuous improvement of the product, the design and specification given in this document are subject to changes without prior notice.
Techplater

• Small and compact

• Flexibility in package application any package size
• Use in clean room environment
• Fully computerized touch screen control system
• Highly recommended to high lead count & Pilot line
• Within same floor space
• No transaction & mixing
• Ownership by shop-floor
• For small volume stand alone machine & flexibility for auto-line
The Techplater is a new age Strip-to-Strip Plating machine. Its modernity is best suited for today’s needs for
space saving and clean room environment. Solder plating can be done for both standard and matrix lead
frames. As a standalone machine, the Techplater is able to plate and produce the needed result and capacity
required of it. However, it can be a ‘team player’ as well when it is interfaced with other machines in an auto-
line. All in all, the Techplater is the plating system for the semiconductor manufacturers towards the next
millennium.

Loading / Unloading System Strip Holder

• Able to perform fully automatic, semi-automatic, manual • Zero droppages
operation • No distortion of thin and high density frames
• Flexibility to link to auto line
• No limitation of strip length, width, and weight
• Both loading / unloading are physical identical, which
• No requirement of minimum rail width for gripping
results in high grade of standardization
• Individual gripping holders are easy to replace
• Fast and easy conversion for different types of packages

Machine Specification

Dimension of Machine

Length: 2000mm, Width: 2000mm, Height: 2000mm

Machine Capacity

Standard: 400 strips/hr

Matrix: 200 strips/hr

Strip Dimension

length: 150mm ~ 250mm, width: 20mm ~ 70mm

Lead Frame Material

Strip holder
Cu/ Cu Alloy/ Ni Plated/ A42
Thickness: More than 2mm
© Copyright 2007 AEM Singapore Pte Ltd
For the continuous improvement of the product, the design and specification given in this document are subject to changes without prior notice.
Electrolytic Strip-to-Strip

• Electrolytic strip-to-strip carrier deflash

• Fully enclosed for safe and clean environment
• Continuous movement conveyor system
• Fully computerized touch screen control system
• High-pressure water jet to remove loosen flash
AEM specializes in the design and
manufacturing of semiconductor deflashing
equipment and its related chemicals.

Loading/Unloading System Strip Holder

• Able to perform fully automatic, semi-
automatic and manual operation
• Both the loading and unloading are
physically identical which results in
high grade of standardization
• Fast and easy conversion for different
types of packages
• Zero droppages
• No distortion of thin and high load density frames
• No limitation of strips in length, width and weight
• No requirement of minimum rail width for gripping
• Individual gripping holders are easy to replace
• Top and bottom contacts for better current distribution
• Individual contact monitoring by computer

AEM offers total solution of both

the Equipment and Chemicals for
our customer to achieve the best
results in all aspects. Related
Chemicals is Electrolytic
Deflashing solution.
Machine Specification

Dimension of Machine Lead Frame Dimension

Length: 8360 to 16850mm Strip length: 150mm ~ 250mm

Width: 1500mm Strip width: 20mm ~ 70mm
Height: 1350mm

Machine Capacity Lead Frame Material

1200 ~ 1800 strip Cu/ Cu Alloy/ Ni Plated/ A42

© Copyright 2007 AEM Singapore Pte Ltd

For the continuous improvement of the product, the design and specification given in this document are subject to changes without prior notice.
Belt Deflashing
• Fully enclosed for safe and clean environment
• Continuous movement conveyor belt system
• Fully computerized touch screen control system
• Belt speed of 8m/min (top speed)
• Strip-on-process tracking System
• Integrated Cassette and Stack
• Stack & Slot magazine loading and unloading system

+ & ,%

• Plug-in flexible buffer

• Solder plating in-line
• Laser deflash in-line
• One ownership
• Flexibility in package type
(able to switch to other products)
• All stations are in independent module
(can be sold as individual)
• Cost effective
• High quality & yield
• Fast cycle time

© Copyright 2007 AEM Singapore Pte Ltd

For the continuous improvement of the product, the design and specification given in this document are subject to changes without prior notice.