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EM
Stress Thermal
What is ePhysics?
ePhysics extends the capability of Ansofts Maxwell & HFSS, with new coupled-analysis capabilities.
3D Thermal Transient Analysis 3D Thermal Steady-State Analysis 3D Linear Stress Analysis
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Heat Transfer Mechanisms w Conduction w Convection w Radiation Volumetric and Surface Source/Boundary Conditions Automatic Power Loss Mapping from EM Analysis Executive Parameters w Average Temperature w Temperature of Hot/Cold spots w Coordinates of Hot/Cold spots
Automatic field mapping w EM Thermal Stress Calculates Deformation & Von Mises Stress Distributions Executive Parameters w Maximum Principal Stress w Orientation of Principal Planes w Maximum Von Mises Stress w Maximum Stress Coordinates
ePhysics
Thermal
EM Field
Force Distribution
Stress
Optimetrics
Update Maxwell Parameters Materials, Sources, Geometry
Maxwell - ePhysics
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Coupled-Analysis
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Magnetostatic Thermal Magnetostatic Stress Magnetostatic Thermal Stress Eddy Current Thermal Eddy Current Stress Eddy Current - Thermal Stress Electrostatic Stress Transient - Stress Thermal - Stress
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Electromechanical Applications
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MEMS Motor & Generator Electrical apparatus PCB Packages & IGBT
Example 1: MEMS
Heatuator Electro-Thermal Actuator
Displacement
DC current
Conduction Solver
Thermal Solver
Stress Solver
Example:
DC Current Solver
Sc ala r Po te nt ial
DC
Cu rre nt
Di sp
lac
em en t
Vo
nM ise s
Eq uiv ale
St
ra i
En
nt St re ss
er
gy
De
ns
ity
Eddy Mesh
Rotor Stator
Example : Motor & Generator Claw Pole Alternator: Transient Static Thermal
Stress Distribution In a tooth
Thermal
For Average T
Loop Analysis
Conductivity
Maxwell Optimetrics is needed
Distribution of Temperature
Control Function
Example 4:
Packages
Example 4: PCB
Layer 1 (FR4) Layer 2 (FR4) Copper Layer i (FR4) Layer N (FR4)
-4 layers of FR4 0.25 W/m K -2 inner layerscopper 390 W/m K -35 m copper film (1oz/ft2)
Example 4:
CPGA
Temperature
Q vector
Example 4:
SBGA
<10% heat flow
0.66 W
2W
1.14 W
Example 4: PCB
Analysis
Example 4:
IGBT Application
Hot spots in device
Temperature distribution
Thermal
Temperature
Stress
HFSS-Thermal
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HFSS-Thermal-Structural
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MEMS, Filters
BGA Package
HFSS-Thermal
Temperature Distribution due to losses in: Chip Bond Wires Leads Dielectrics
Deformation
HF Cable
HFSS-Thermal
Convection- radiation thermal boundary condition
ePhysics HFSS
Coax cable (50 Ohm impedance); 1 GHz; 100 Watts; Copper modeled with a surface impedance boundary condition; Losses in copper are applied as thermal sources at the surface of the conductors. Losses in dielectrics are applied as volumetrically distributed thermal sources.
HF Cable
HFSS-Thermal
Summary
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