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WAFER BISCUIT PLANT

WAFER PLANT WT SERIES

Introduction WT Series cream wafer plants are used for the manually operated production of cream wafer biscuits. They are characterized by simple mechanism study and flexibility. These machines are low cost and economical in operation. Depending on the output required they can be supplied with 6, 9 or 12 Wafer baking tongs. Cream spreading table, cutting machine, batter and cream mixer and packing machine ensure that production is continuous. Batter Preparation A mixer of wheat flour, maize starch, vegetable fat and preservative colours is churned into a paste in the batter mixer. Machine Operation (6 WT) The batter is fed to a pre-heated wafer tong by a special dosing device. Baking takes 1-3 minutes. The baked sheets are cooled. Subsequent operations are creaming, sandwiching & cutting. The cut wafers are then ready to be packed.

Process Chart

Supporting Equipment 1. Wafer Tong 2. Batter Mixer 3. Cream Mixer 4. Cream Spreading App. 5. Wafer Cutting M/C 6. Packing Machine

Technical specifications Technical / Output Details 'WT' Wafer Baking Machine - WT2737: This chart details 6 wafer tong station

'WT' Manual wafer plant Output of wafer sheets / Hr Electric Heating : Connected load in KW Current Consumption in KW / Hr Cream filled wafers / Hour ** (Kgs app.) Dimensions (approx. in mm): 6 stations are pkd. as 3 station X 2 Cases Length Width Height Net Weight Weight incl. seaworthy packing Shipping space in M
3

WT1 30** 2.5 2.0 4

WT6 240 ** 15 12 20 - 25

1Tong X 1 750mm 440mm 300mm 80 150 1.0

3 Station X 2 1420 X 2 440 X 2 750 X 2 640 900 2.0

Working Instructions

Instructions 1.0 Initial Set Up and Unpacking 1.1 The baking plates are coated with a "gel" for shipment. Kindly clean it with a clean dry cloth before heating. 1.2 While using the machine for the first time allow the plate to heat slowly. See notes below. Note: With new baking plates and whenever the plates have been cleaned they must be greased well with bees wax or hard fat before regular baking. Then bake for the first time at reduced heat and reduced batter quantity. Increase the batter quantity and heat till you can have proper wafer sheets which release easily without breaking or sticking to the plates. Remove the wafer sheets with a wooden spatula or with a brass wire brush. If baking is done properly a glaze will form on the surface of the tongs which ensures the easy release of the wafer sheets. 2.0 Electrical Connection 2.1 240 volts, single phase, 50Hz,1,5KW/element. Total 2.5 KW. 2.2 There are two heating elements in each baking tongs. 2.3 Earthing is absolutely essential for safe working. 3.0 Baking Procedure 3.1. It takes about 20 minutes for the plates to heat initially. Note: Batter composition, thickness of wafer and baking temperature determines the baking time. 3.2 When the desired temperature is reached set the thermotrol setting of the control box to 70 to 80. 3.3 Thermotrol regulates the time for which the power is to be supplied to the heating element.

3.4 Dip the dosimeter cups in the batter tank and put it on the bracket provided for in the tank. 3.5 The excess batter drains off leaving the desired quantity. 3.6 The quality can be adjusted by means of a screw provided near the lever. The handle raises or lowers the sliding lever which in turn reduces or maintains the quantity the remains in the cups. 3.7 Test if the correct baking temperature is reaches with a trial a small quantity of batter is poured an to the plates. 4.0 Advice on Maintenance & Precautions 4.1 Burnt sugar and fat particles leave a brown crust on the surface of the baking plate when the machine has been in use for a long time. These burnt remnants have to be removed with a normal brass wire brush. In case it is not done regularly, the carbon build up will retard the baking period. 4.2 Never use a wet cloth for cleaning the plates. 4.3 Operational Precaution 4.3.1.Never leave the machine in an "On" position unattended. 4.3.2.Always brief the operator on the standard procedures 4.3.3.Use the side handle only to lower and raise the UPPER tong. 4.3.4.In case after the batter is deposited on the plate the lock does not operate to close it in the first instance DO NOT try to use force to close the tong. 4.3.5.In case any spare part is used in the machine, please ask for additional spare to ensure continuity in operation. 5.0 Batter Recipe 5.1 It is up to the user of the machine to find out the most favorable batter recipe, since customer's taste with regards to colour, taste and hardness of wafers, differ from place to place.

5.2 See Annexure for a sample Wafer Batter recipe. Adjustment for Wafer Sheets Check the thickness of the wafer sheets for even thickness. In order to check the thickness of the wafer sheet collect the produce of each wafer tongs separately then measure the sheets one by one with a thickness gauge/or an accurate verities on all four corners and in the middle and make a note of actual differences. Method A: The thickness of the wafer sheet can be adjusted by means of the fastening bolts of the baking plates.

First loosen all bolts (M10) [not the four threaded bushings (M20).] Turn the treaded bushings on the corner that needs to be adjusted either clockwise (=thinner) or counter clockwise (=thicker). 1/6th of a turn equals to 0.2 mm and a full turn equals to 1.25mm. After adjustment tighten the bolts (M10) on all four corners again. Then tighten the remaining threaded bushings carefully until they touch the plates and lock with the bolts. Any such adjustment has to be done with utmost care otherwise the baking plates may get bent and warped. After adjustment another trial round of wafer sheets has to be produced and measured again.

Method B: Place four metal strips or shims of the desired thickness of wafer (minus the engraving thickness) on the baking plates. Then all set bolts of the upper plate as well as the adjusting bushings are loosened so that they no longer rust on the upper plate. The pressure screw (M20) is screwed as far down as possible by hand against the plate. Then screw down all fastening bolts (M10) of the plates. Tighten by spanner first the fastening bolts, then the adjusting bushings. Open the plate and remove the strips/shims.

*Note: If it becomes evident in production that the wafer thickness has a slight deviation each wafer sheet must be measured. Any deviation can be readjusted. Note: It may be necessary to adjust the locking handle pressure after any such adjustments Wafer Machine - WT-Wafer Biscuit Cutting Chart

WT :Wafer Baking Tong Plate Size : 273x373 No. 1. 2. 3. 4. Chart for making a cut selection of wafers. Sheet Size Minimum Trimmings the book (1.5mm per side)** Size available for cutting Resultanat Size***+/- 1mm 273 3 270 mm 134 89.0 66.5 53.0 44.0 37.6 32.8 29.0 26.0 23.5 21.5 19.8 18.3 17.0 Note: 1. ** This is an indicative size only .Preferably 5mm 2. ***Deduct -1mm to accomodate for the cutting wire waste 3. Please allow for shrinkage immediately after baking 4. The wafer product has a tendency to expand 1% after keeping WAFER SHEET / ICE CREAM CONE BATTER RECIPE NO-1 Sl.NO 1. 2. 3. INGREDIENTS Wheat Flour Maize Starch Powdered Sugar WEIGHT 7.500 KG 150 gms 100 gms Cuts 2 3 4 5 6 7 8 9 10 11 12 13 14 15 373 3 370 mm 184 122.3 91.5 73.0 60.7 51.9 45.3 40.1 36.0 32.6 29.8 27.5 25.4 23.7

4. 5. 6. 7. 8. 9. 10. PROCEDURE

Fat Soya Lecithin Liquid Sodium Bicarbonate and Ammonium Bicarbonate (3:1) Sodium Meta-bisulphide salt Water Colour

180 ml 20 gms 40 gms 2 gms 20 gms 12 Litres Q.S

1. Put the water in a "TM" Series Mixer. 2. Add 5, 6 & 8 3. Start the mixer, add the starch and then slowly add a small quantity of flour at a time. 4. After the wheat flour is fully mixed add the fat and lecithin emulsion (preferably pre-warmed) 5. Mix for a couple of minutes (approx. 3-4 minutes) till smooth. 6. Strain through a sieve wire mesh to remove lumps. 7. The ready mix will KEEP good for about 2-3 hours, so just prepare sufficient quantity.

Notes on batter dough preparation: Dough Preparation: The wafer quality depends on the accuracy of the dough, particularly as far as weighing and mixing are concerned. In the course of the whole mixing process, the consistency changes due to material dissolving and swelling processes, gluten development and reactions with other raw material, including air. When a certain consistency is reached, the mixing process is finished, particularly when a uniform

mixing of all ingredients allows for a smooth flow of the dough on the baking plates/cone baking dies. We recommend to leave the dough for 5 minutes, and to pass it through a sieve afterwards in order to hold back the particles, which have not dissolved completely. The dough will swell again. If flour with higher level of coarsely ground grain is used, the dough should be left for about 10 minutes. The longer the dough can rest; the better will be its flow. This is referred to as natural slackening of the dough. After the optimum recipe has been found out, it should be modified by the master baker, only after previous check. Mixing of the dough: For beating the wafer dough, High Speed Mixers are best suited. Depending on the type of machine and the charge volume, the mixing period is between 3 and 10 minutes. Sufficient beating is also important for a gleaming surface of the wafer sheet without any pores. For the type of mixing procedure, different requirements have to be met. One-stage procedure: All components, including water are portioned directly into the mixer. Multi-stage procedure: First, mix the whole dry matter with about half of the liquid. Add the remaining liquid afterwards at your own discretion, until the suspension shows adequate flow. All raw material and additives except the flour are beaten together with the remaining amount of liquid, until they are mixed thoroughly. After that, the flour is mixed in together with the remaining liquid. Temperature: The dough should have a temperature of 20-25C. While being prepared warmer dough tends to turn sour due to the addition of soda, if it is stored intermediately. The temperature of the pouring wafer is adjusted according to the temperature of the flour and the mixer.

Material processes during mixing: The important process during mixing is dissolving and swelling of the flour components. This is decisive for the quality of the baking process and the wafer sheet and for the energy demand during baking; the water added during dough preparation has to be vaporized again during baking. Important advice for the preparation of the wafer batter: Use smooth wheat flour with medium content of gluten. Depending on the quality of the flour, the amount of water should be increased or decreased, as every type of flour has different soaking characteristics. In order to get a wafer sheet of good quality, the batter should not be too dilute. Preparation of the oil/fat - lecithin emulsion: Oil / Fat should be heated lukewarm. Lecithin should be added slowly and stirred until it dissolves completely. The quality of the emulsion should correspond to the batter recipe used. Then it is poured into the readily prepared wafer batter and stirred.