SN74LVC245A

www.ti.com SCAS218V JANUARY 1993 REVISED SEPTEMBER 2010

OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS

Check for Samples: SN74LVC245A
1

FEATURES
Operates From 1.65 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 6.3 ns at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25C Ioff Supports Partial-Power-Down Mode Operation Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC) Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 2000-V Human-Body Model (A114-A) 1000-V Charged-Device Model (C101)

DB, DGV, DW, N, NS, OR PW PACKAGE (TOP VIEW)

DIR A1 A2 A3 A4 A5 A6 A7 A8 GND

1 2 3 4 5 6 7 8 9 10

20 19 18 17 16 15 14 13 12 11

VCC OE B1 B2 B3 B4 B5 B6 B7 B8

RGY PACKAGE (TOP VIEW)

DIR

20 19 OE 18 B1 17 B2 16 B3 15 B4 14 B5 13 B6 12 B7

DESCRIPTION/ORDERING INFORMATION
This octal bus transceiver is designed for 1.65-V to 3.6-V VCC operation. The SN74LVC245A is designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses effectively are isolated.

A1 A2 A3 A4 A5 A6 A7 A8

2 3 4 5 6 7 8 9 10 11

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 19932010, Texas Instruments Incorporated

GND

B8

VCC

SN74LVC245A
SCAS218V JANUARY 1993 REVISED SEPTEMBER 2010 www.ti.com

ORDERING INFORMATION
TA PDIP N QFN RGY SOIC DW SOP NS 40C to 85C SSOP DB TSSOP PW TVSOP DGV VFBGA GQN VFBGA ZQN (Pb-Free) (1) PACKAGE (1) Tube of 20 Reel of 3000 Tube of 25 Reel of 2000 Reel of 2000 Reel of 2000 Tube of 70 Reel of 2000 Reel of 250 Reel of 2000 Reel of 1000 ORDERABLE PART NUMBER SN74LVC245AN SN74LVC245ARGYR SN74LVC245ADW SN74LVC245ADWR SN74LVC245ANSR SN74LVC245ADBR SN74LVC245APW SN74LVC245APWRG3 SN74LVC245APWT SN74LVC245ADGVR SN74LVC245AGQNR SN74LVC245AZQNR LC245A LC245A LC245A TOP-SIDE MARKING SN74LVC245AN LC245A LVC245A LVC245A LC245A

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. GQN OR ZQN PACKAGE (TOP VIEW) 1 A B C D E 2 3 4

TERMINAL ASSIGNMENTS
1 A B C D E A1 A3 A5 A7 GND 2 DIR B2 A4 B6 A8 3 VCC A2 B4 A6 B8 4 OE B1 B3 B5 B7

FUNCTION TABLE
INPUTS OE L L H DIR L H X OPERATION B data to A bus A data to B bus Isolation

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Copyright 19932010, Texas Instruments Incorporated

SN74LVC245A
www.ti.com SCAS218V JANUARY 1993 REVISED SEPTEMBER 2010

LOGIC DIAGRAM (POSITIVE LOGIC)

DIR 1 19

OE

A1

18

B1

To Seven Other Channels Pin numbers shown are for the DB, DGV, DW, N, NS, PW, and RGY packages.

ABSOLUTE MAXIMUM RATINGS (1)

over operating free-air temperature range (unless otherwise noted)
MIN VCC VI VO VO IIK IOK IO Supply voltage range Input voltage range (2) Voltage range applied to any output in the high-impedance or power-off state (2) Voltage range applied to any output in the high or low state Input clamp current Output clamp current Continuous output current Continuous current through VCC or GND DB package (4) DGV package DW package qJA Package thermal impedance N package (4) NS package (4) PW package (4) RGY package (5) Tstg (1) (2) (3) (4) (5) Storage temperature range 65
(4) (4) (2) (3)

MAX 6.5 6.5 6.5 VCC + 0.5 50 50 50 100 70 92 58 78 69 60 83 37 150

UNIT V V V V mA mA mA mA

0.5 0.5 0.5 0.5

VI < 0 VO < 0

GQN/ZQN package (4)

C/W

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5.

Copyright 19932010, Texas Instruments Incorporated

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SN74LVC245A
SCAS218V JANUARY 1993 REVISED SEPTEMBER 2010 www.ti.com

RECOMMENDED OPERATING CONDITIONS (1)

TA = 25C MIN VCC Supply voltage Operating Data retention only VCC = 1.65 V to 1.95 V VIH High-level input voltage VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 1.65 V to 1.95 V VIL VI VO Low-level input voltage Input voltage Output voltage VCC = 1.65 V IOH High-level output current VCC = 2.3 V VCC = 2.7 V VCC = 3 V VCC = 1.65 V IOL Low-level output current VCC = 2.3 V VCC = 2.7 V VCC = 3 V t/v (1) Input transition rise or fall rate VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V 0 0 1.65 1.5 0.65 VCC 1.7 2 0.35 VCC 0.7 0.8 5.5 VCC 4 8 12 24 4 8 12 24 10 0 0 MAX 3.6 40C TO 85C MIN 1.65 1.5 0.65 VCC 1.7 2 0.35 VCC 0.7 0.8 5.5 VCC 4 8 12 24 4 8 12 24 10 ns/V mA mA V V V V MAX 3.6 UNIT V

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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SN74LVC245A
www.ti.com SCAS218V JANUARY 1993 REVISED SEPTEMBER 2010

ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS IOH = 100 mA IOH = 4 mA VOH IOH = 8 mA IOH = 12 mA IOH = 24 mA IOL = 100 mA IOL = 4 mA VOL IOL = 8 mA IOL = 12 mA IOL = 24 mA II Ioff IOZ ICC ICC Ci Cio (1) (2) Control inputs A or B ports
(1)

VCC 1.65 V to 3.6 V 1.65 V 2.3 V 2.7 V 3V 3V 1.65 V to 3.6 V 1.65 V 2.3 V 2.7 V 3V 3.6 V 0 3.6 V

TA = 25C MIN VCC 0.2 1.29 1.9 2.2 2.4 2.3 0.1 0.24 0.3 0.4 0.55 1 1 1 1 1 500 4 5.5 TYP MAX

40C TO 85C MIN MAX VCC 0.2 1.2 1.7 2.2 2.4 2.2 0.2 0.45 0.7 0.4 0.55 5 10 10 10 10 500

UNIT

Control inputs

VI = 0 to 5.5 V VI or VO = 5.5 V VO = 0 to 5.5 V VI = VCC or GND 3.6 V VI 5.5 V (2) One input at VCC 0.6 V, Other inputs at VCC or GND VI = VCC or GND VI = VCC or GND IO = 0

mA mA mA mA mA pF pF

3.6 V 2.7 V to 3.6 V 3.3 V 3.3 V

For I/O ports, the parameter IOZ includes the input leakage current. This applies in the disabled state only.

SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER FROM (INPUT) TO (OUTPUT) VCC 1.8 V 0.15 V tpd A or B B or A 2.5 V 0.2 V 2.7 V 3.3 V 0.3 V 1.8 V 0.15 V ten OE A or B 2.5 V 0.2 V 2.7 V 3.3 V 0.3 V 1.8 V 0.15 V tdis OE A or B 2.5 V 0.2 V 2.7 V 3.3 V 0.3 V tsk(o) 3.3 V 0.3 V TA = 25C MIN 1 1 1 1.5 1 1 1 1.5 1 1 1 1.7 TYP 6 3.9 4.2 3.8 7 4.5 5.4 4.4 7.8 4 4.4 4.1 MAX 12.2 7.8 7.1 6.1 14.8 10 9.3 8.3 16.5 9 8.3 7.3 40C TO 85C MIN 1 1 1 1.5 1 1 1 1.5 1 1 1 1.7 MAX 12.7 8.3 7.3 6.3 15.3 10.5 9.5 8.5 17 9.5 8.5 7.5 1 ns ns ns ns UNIT

Copyright 19932010, Texas Instruments Incorporated

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SN74LVC245A
SCAS218V JANUARY 1993 REVISED SEPTEMBER 2010 www.ti.com

OPERATING CHARACTERISTICS
TA = 25C
PARAMETER TEST CONDITIONS Outputs enabled Cpd Power dissipation capacitance per transceiver Outputs disabled f = 10 MHz VCC 1.8 V 2.5 V 3.3 V 1.8 V 2.5 V 3.3 V TYP 42 43 45 1 1 2 pF UNIT

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SN74LVC245A
www.ti.com SCAS218V JANUARY 1993 REVISED SEPTEMBER 2010

PARAMETER MEASUREMENT INFORMATION

VLOAD From Output Under Test CL (see Note A) RL S1 Open GND RL TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH S1 Open VLOAD GND

LOAD CIRCUIT INPUTS VCC 1.8 V 0.15 V 2.5 V 0.2 V 2.7 V 3.3 V 0.3 V VI VCC VCC 2.7 V 2.7 V tr/tf 2 ns 2 ns 2.5 ns 2.5 ns VM VCC/2 VCC/2 1.5 V 1.5 V VLOAD 2 VCC 2 VCC 6V 6V CL 30 pF 30 pF 50 pF 50 pF RL 1 k 500 500 500 V 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input tw VI Input VM VM 0V VOLTAGE WAVEFORMS PULSE DURATION VI Input tPLH Output tPHL VM VM VM VM 0V tPHL VOH VM VOL tPLH VOH Output VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) Output Control tPZL Output Waveform 1 S1 at VLOAD (see Note B) tPZH VM VM VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM VM 0V tPLZ VLOAD/2 VOL + V tPHZ VOH - V VOH 0 V VOL Data Input tsu VM th VI VM 0V VM 0V

VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING

NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices.

Figure 1. Load Circuit and Voltage Waveforms

Copyright 19932010, Texas Instruments Incorporated

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PACKAGE OPTION ADDENDUM

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23-Oct-2010

PACKAGING INFORMATION
Orderable Device SN74LVC245ADBLE SN74LVC245ADBR SN74LVC245ADBRE4 SN74LVC245ADBRG4 SN74LVC245ADGVR SN74LVC245ADGVRE4 SN74LVC245ADGVRG4 SN74LVC245ADW SN74LVC245ADWE4 SN74LVC245ADWG4 SN74LVC245ADWR SN74LVC245ADWRE4 SN74LVC245ADWRG4 SN74LVC245AGQNR Status
(1)

Package Type Package Drawing SSOP SSOP SSOP SSOP TVSOP TVSOP TVSOP SOIC SOIC SOIC SOIC SOIC SOIC BGA MICROSTAR JUNIOR PDIP PDIP SO DB DB DB DB DGV DGV DGV DW DW DW DW DW DW GQN

Pins 20 20 20 20 20 20 20 20 20 20 20 20 20 20

Package Qty

Eco Plan TBD

(2)

Lead/ Ball Finish Call TI

MSL Peak Temp Call TI

(3)

Samples (Requires Login) Samples Not Available Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Purchase Samples Purchase Samples Purchase Samples Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Samples Not Available

OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE NRND

2000 2000 2000 2000 2000 2000 25 25 25 2000 2000 2000 1000

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM SNPB Level-1-240C-UNLIM

SN74LVC245AN SN74LVC245ANE4 SN74LVC245ANSR

ACTIVE ACTIVE ACTIVE

N N NS

20 20 20

20 20 2000

Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br)

CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM

Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office

Addendum-Page 1

PACKAGE OPTION ADDENDUM

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23-Oct-2010

Orderable Device SN74LVC245ANSRE4 SN74LVC245ANSRG4 SN74LVC245APW SN74LVC245APWE4 SN74LVC245APWG4 SN74LVC245APWLE SN74LVC245APWR SN74LVC245APWRE4 SN74LVC245APWRG3 SN74LVC245APWRG4 SN74LVC245APWT SN74LVC245APWTE4 SN74LVC245APWTG4 SN74LVC245ARGYR SN74LVC245ARGYRG4 SN74LVC245AZQNR

Status

(1)

Package Type Package Drawing SO SO TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP VQFN VQFN BGA MICROSTAR JUNIOR NS NS PW PW PW PW PW PW PW PW PW PW PW RGY RGY ZQN

Pins 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20

Package Qty 2000 2000 70 70 70

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login) Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Purchase Samples Purchase Samples Purchase Samples Samples Not Available Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office Request Free Samples Contact TI Distributor or Sales Office Purchase Samples Purchase Samples Purchase Samples Request Free Samples Request Free Samples Request Free Samples

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

2000 2000 2000 2000 250 250 250 3000 3000 1000

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU SN Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-2-260C-1 YEAR CU NIPDAU Level-2-260C-1 YEAR SNAGCU Level-1-260C-UNLIM

(1)

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Addendum-Page 2

PACKAGE OPTION ADDENDUM

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23-Oct-2010

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LVC245A :

Enhanced Product: SN74LVC245A-EP

NOTE: Qualified Version Definitions:

Enhanced Product - Supports Defense, Aerospace and Medical Applications

Addendum-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Oct-2011

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing SSOP TVSOP SOIC BGA MI CROSTA R JUNI OR BGA MI CROSTA R JUNI OR SO TSSOP TSSOP TSSOP VQFN BGA MI CROSTA R JUNI OR BGA MI DB DGV DW GQN 20 20 20 20

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 330.0 16.4 12.4 24.4 12.4 8.2 6.9 10.8 3.3

B0 (mm) 7.5 5.6 13.0 4.3

K0 (mm) 2.5 1.6 2.7 1.5

P1 (mm) 12.0 8.0 12.0 8.0

W Pin1 (mm) Quadrant 16.0 12.0 24.0 12.0 Q1 Q1 Q1 Q1

SN74LVC245ADBR SN74LVC245ADGVR SN74LVC245ADWR SN74LVC245AGQNR

2000 2000 2000 1000

SN74LVC245AGQNR

GQN

20

1000

330.0

12.4

3.3

4.3

1.6

8.0

12.0

Q1

SN74LVC245ANSR SN74LVC245APWR SN74LVC245APWRG3 SN74LVC245APWT SN74LVC245ARGYR SN74LVC245AZQNR

NS PW PW PW RGY ZQN

20 20 20 20 20 20

2000 2000 2000 250 3000 1000

330.0 330.0 330.0 330.0 330.0 330.0

24.4 16.4 16.4 16.4 12.4 12.4

8.2 6.95 6.95 6.95 3.8 3.3

13.0 7.1 7.1 7.1 4.8 4.3

2.5 1.6 1.6 1.6 1.6 1.6

12.0 8.0 8.0 8.0 8.0 8.0

24.0 16.0 16.0 16.0 12.0 12.0

Q1 Q1 Q1 Q1 Q1 Q1

SN74LVC245AZQNR

ZQN

20

1000

330.0

12.4

3.3

4.3

1.5

8.0

12.0

Q1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Oct-2011

Device

Package Package Pins Type Drawing CROSTA R JUNI OR

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm)

B0 (mm)

K0 (mm)

P1 (mm)

W Pin1 (mm) Quadrant

*All dimensions are nominal

Device SN74LVC245ADBR SN74LVC245ADGVR SN74LVC245ADWR SN74LVC245AGQNR SN74LVC245AGQNR SN74LVC245ANSR SN74LVC245APWR SN74LVC245APWRG3 SN74LVC245APWT SN74LVC245ARGYR SN74LVC245AZQNR SN74LVC245AZQNR

Package Type SSOP TVSOP SOIC BGA MICROSTAR JUNIOR BGA MICROSTAR JUNIOR SO TSSOP TSSOP TSSOP VQFN BGA MICROSTAR JUNIOR BGA MICROSTAR JUNIOR

Package Drawing DB DGV DW GQN GQN NS PW PW PW RGY ZQN ZQN

Pins 20 20 20 20 20 20 20 20 20 20 20 20

SPQ 2000 2000 2000 1000 1000 2000 2000 2000 250 3000 1000 1000

Length (mm) 346.0 346.0 346.0 340.5 340.5 346.0 346.0 364.0 346.0 346.0 340.5 340.5

Width (mm) 346.0 346.0 346.0 338.1 338.1 346.0 346.0 364.0 346.0 346.0 338.1 338.1

Height (mm) 33.0 29.0 41.0 20.6 20.6 41.0 33.0 27.0 33.0 29.0 20.6 20.6

Pack Materials-Page 2

MECHANICAL DATA
MPDS006C FEBRUARY 1996 REVISED AUGUST 2000

DGV (R-PDSO-G**)
24 PINS SHOWN 0,23 0,13 13

PLASTIC SMALL-OUTLINE

0,40 24

0,07 M

0,16 NOM 4,50 4,30 6,60 6,20

Gage Plane

0,25 0 8 1 A 12 0,75 0,50

Seating Plane 1,20 MAX 0,15 0,05 0,08

PINS ** DIM A MAX A MIN

14 3,70 3,50

16 3,70 3,50

20 5,10 4,90

24 5,10 4,90

38 7,90 7,70

48 9,80 9,60

56 11,40 11,20

4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins MO-153 14/16/20/56 Pins MO-194

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001

DB (R-PDSO-G**)
28 PINS SHOWN 0,65 28 0,38 0,22 15 0,15 M

PLASTIC SMALL-OUTLINE

0,25 0,09 5,60 5,00 8,20 7,40

Gage Plane 1 A 14 0 8 0,25 0,95 0,55

Seating Plane 2,00 MAX 0,05 MIN 0,10

PINS ** DIM A MAX

14

16

20

24

28

30

38

6,50

6,50

7,50

8,50

10,50

10,50

12,90

A MIN

5,90

5,90

6,90

7,90

9,90

9,90

12,30 4040065 /E 12/01

NOTES: A. B. C. D.

All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

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