LV 3109L VLSI Physical Design Lab EDWinXP

Report 11

EDWinXP is an EDA software package for automated design of electronic products. This integrated tool covers all stages of electronic design process -schematic capture, simulation, PCB layout design, generation of PCB manufacturing and testing documentation. EDWinXP is a fully integrated package. Circuit designs can be front and back annotated i.e. a design may be started either from Schematic Editor or PCB Layout and design information is automatically updated. All parts of the designed project are simultaneously accessible by task-oriented modules of the system. These task oriented modules are Schematics Editor, PCB Layout Editor, Fabrication Manager, Library Editor, Simulators and Board Analyzers. Schematics Editor: Schematic Editor captures the circuit in the form of a schematic diagram. The Schematic Diagram Editor contains a full set of manual and automated tools for placement of circuit elements on the diagram and for routing the connection. Design rules may also set for auto placement and interactive auto routing. Automatic component packaging feature generates pin-out texts on the diagram and prepare the circuit for PCB layout design. Circuits defined in VHDL or in SPICE format netlists may be also imported and converted into schematic diagrams. Due to the integrated structure of EDWin, subsequent design changes in real-time are front annotated to the PCB layout. PCB Layout Editor: PCB Layout editor includes full set of manual and automated function for designing 32 layered boards. Dedicated full board auto router module is integrated with PCB Layout Editor. Design rules for manual, semi-automatic and automatic routing of traces and component placement can be defined and may be set individually for each project. There are provisions to check design rules violation, clearance errors and missing or incomplete connections of the circuits in this module. Fabrication Manager: CAM tools grouped in this module allow generating all necessary documents for manufacturing, testing and assembly of printed circuit boards. Fabrication manger also includes reverse engineering tools for reconstructing circuit designs from available manufacturing data in graphical form (artworks in Gerber formats, DXF format drawings etc). RS-274D and RS-274X are supported by EDWin. Gerber ASCII file viewer, an integral part of this module enables to verify artworks before sending them for plotting and manufacturing. Library Editor: EDWinXP component libraries may be updated, customized or enhanced with the help of Library Editor. Functionality of this module allows definition of graphical representation of components in schematic diagram (Symbol Editor) and on Printed Circuit Board (Package Editor). These elements are included then in the component description, which also contains the packaging information, thermal parameters and link to simulation modules. 2D and 3D views of component packages are created according to IPC, JEDEC and EIA standards.

Simulators: Simulator supports various analyses of digital, analog and mixed circuits. It allows testing of the circuits without having to build them thereby reducing the development time and cost on a wide parameter range easily. EDWinXP provides two types of simulators

Dept. of Electronics Engg.

CEC, CHENGANNUR

LV 3109L VLSI Physical Design Lab

Report 11

one is Mixed Mode Simulator, the system's native circuit level analyzer and other is EDSpice Simulator, the full implementation of XSPICE as defined by Georgia Tech. Board Analyzers: The Electromagnetic Analyzer and Thermal Analyzer checks the integrity and correctness of layout design. Electromagnetic Analyzer presents graphically the predicted intensity of electromagnetic fields inside and outside board boundaries. The Signal Integrity Analyzers detects distortion, noise and crosstalk for critical signals. The temperature distribution on a finished PCB may be analyzed graphically with the help of Thermal Analyzers.

EDWinXP Project Explorer

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Dept. of Electronics Engg.

CEC, CHENGANNUR