Material and Equipment Technologies for HB-LED Manufacturing

Ram K. Trichur Director, Strategic Business Unit SEMICON West 2011

2011 Brewer Science, Inc.

Brewer Science Delivers Solutions to These Markets

Brewer Science, Inc., SEMICON Taiwan, 2011

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Brewer Science
In 1981, invented the anti-reflective coatings marketplace Maintain market share dominance for BARC 30 years of innovation enabling our customers to overcome critical industry challenges Global supply and support network

Corporate Headquarters, Rolla, Missouri Brewer Science, Inc., SEMICON Taiwan, 2011

Dr. Terry Brewer, President, CEO, Founder

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Brewer Science Solutions for Advanced Packaging

Generic LED Fab Process Flow
Substrate Growth MOCVD Processes Front-End Chip Manufacturing Backend Processes

Thin Wafer Handling Planarization

Surface Modification TSV Creation/ Micromachining

Advanced Interconnects

Brewer Science offers various technology solutions for advanced packaging in LED manufacturing
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Brewer Science, Inc., SEMICON Taiwan, 2011

Brewer Science Solutions for Advanced Packaging

Thin Wafer Handling Temporary Bonding Materials Benchtop Wafer Debonding Tools Adhesion Promoters Low-Surface-Energy Materials Acid- & Base-Resistant Materials Scratch-Resistant Materials for DRIE Self-Leveling Planarization Materials Planarization Contact Planarization Advanced Interconnects
Brewer Science, Inc., SEMICON Taiwan, 2011

Surface Modification

TSV Creation/ Micromachining

Carbon NanotubeBased Conductors

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Brewer Science Solutions for Thin Wafer Handling

High-Temperature-Capable Temporary Bonding Technology

Chemical Release Technology

Perforated Carrier

Slide Debonding Technology

Heat Slide

ZoneBONDTM Technology
Adhesive on Device

Solvent for Chemical Release Slide

Release Zone

Stiction Zone ZB Carrier

Low cost of ownership and low initial investment Suitable for low-volume operations Commercial technology using WaferBOND CR-200 coating

Wafer sizes up to 300 mm Automated and semiautomated debonding tools available Commercial technology using WaferBOND HT-10.10 coating

Alpha-stage technology Room temperature debonding capability Higher throughput capability Compatibility - 100 mm to 300 mm wafers possible

Brewer Science, Inc., SEMICON Taiwan, 2011

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Motivation for Temporary Bonding

Thin Wafer handling
LED chip Cu-filled TSVs AlN Si submount with Cu TSVs

Wafer-Level Electrical Redistribution

An intermediate 3-D TSV interposer can be used between the LED component and the PCB to drive electrical current and heat away from the LED chip Temporary bonding is widely used in the fabrication of Si-based TSV interposers
Courtesy of Shinko

Layer Transfer or Laser Lift-Off (LLO) Process

Temporary bonding demands are increasing with need for LLO technique - creating need to handle thin wafers using temporary bonding
Brewer Science, Inc., SEMICON Taiwan, 2011

Carrier GaN Sapphire Laser

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Mirror

Layer Transfer Process

Sapphire wafer with active epi layer Coat WaferBOND material and bond to temporary carrier Growth substrate separation and nside processing Debond chip wafer from temporary carrier and clean WaferBOND material

Material Requirements for Layer Transfer Processes: Stability during high-temperature processing (~ 250C) Ability to withstand acid or alkaline treatments Stability during vacuum, CVD processes Thin wafer handling capability to support epi and chip carrier Support high shear stress during backgrinding (if not using LLO process)
Brewer Science, Inc., SEMICON Taiwan, 2011
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Temporary Wafer Bonding Process

Supports all thin-wafer processes:

Layer transfer processes Grinding and thinning growth substrates (sapphire or other) Interposer layer or through-via processing

Brewer Science provides complete solution:

Uses standard bonding tools Brewer Science provides bonding materials and process support Brewer Science supplies debonding equipment

Brewer Science, Inc., SEMICON Taiwan, 2011

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Chemical Resistance of WaferBOND HT-10.10 Material

WaferBOND HT-10.10 bonding material has been shown to be stable through a wide variety of wet chemical processes used during TSV creation
Chemistry Acetone Bath Temperature 25C 60C 60C 60C 25C 25C 25C 25C 25C 25C 25C 25C 25C 25C 25C 85C Time 25 min 30 min 30 min 40 min 30 min 20 min 5 min 5 min 5 min 5 min 5 min 5 min 5 min 90 min 1 hr 1 hr Results film unchanged film unchanged film unchanged film unchanged film unchanged film unchanged film unchanged film unchanged film unchanged film unchanged film unchanged film unchanged film unchanged film unchanged film unchanged film intact, but peeling at edges

I will insert 2 images

0.26N TMAH* 6N HCL 15% H2O2 30% NH4OH 10% KI in H2O EtOH MeOH IPA Cyclohexanone Ethyl Lactate PGMEA PGME 30% HCL 70% HNO3 30% KOH

15-m film on 4-inch Si wafer hot plate baked at 100C for 2 min followed by a hot plate bake at 160C for 2 min *HMDS pretreatment must be used for TMAH processing stability
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WaferBOND Technology in TSV Application

WaferBOND HT-10.10 material coated on device wafer Bonded to carrier

Thinned device wafer

TSV creation

70-m thick wafer, 1:1 aspect ratio vias, copper redistribution layer

Silicon interposer, RDL - Fuji

Debonded TSV wafer

All processing, including via etching, passivation, and metallization, is completed at wafer level
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Brewer Science Solutions for Thin Wafer Handling

High-Temperature-Capable Temporary Bonding Technology

Chemical Release Technology

Perforated Carrier

Slide Debonding Technology

Heat Slide

ZoneBONDTM Technology
Adhesive on Device

Solvent for Chemical Release Slide

Release Zone

Stiction Zone ZB Carrier

Low cost of ownership and low initial investment Suitable for low-volume operations Commercial technology using WaferBOND CR-200 coating

Wafer sizes up to 300 mm Automated and semiautomated debonding tools available Commercial technology using WaferBOND HT-10.10 coating

Alpha-stage technology Room temperature debonding capability Higher throughput capability Compatibility - 100 mm to 300 mm wafers possible

Debonding Process Chemical Release

Features
Spin-applied thermoplastic bonding material - WaferBOND CR-200 material Debonded and released in a solvent low-stress process Compatible with most wafer sizes Low equipment cost for demounting Suitable for low-volume applications
Thinned device substrate

Perforated wafer as carrier

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Debonding Process Chemical Release

Low-stress solvent bath demounting from carrier
Removal Solvent Perforated Carrier

Separation Jig

Separated Device Wafer

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Debonding Process - Slide Debonding

Heat Thinned device substrate Thinned device
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Spin rinse with solvent & spin dry carrier

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Reuse carrier

Features
Semi-automated or automated debonding process Compatible with wafer sizes up to 300 mm Suitable for R&D to high-volume applications

Enabled by WaferBOND family of temporary bonding materials

Cee 1300DB thermal slide-off debonding tool
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Brewer Science, Inc., SEMICON Taiwan, 2011

Cee 1300DB Slide Debonding Tool

Proven on:
Sapphire Silicon Silicon carbide GaAs, InP Multiple diameters (3, 4, 6, 8, and 12 in)

Semiautomatic, tabletop thermal slide-off debonding tool for use with WaferBOND temporary bonding material.

Brewer Science, Inc., SEMICON Taiwan, 2011

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Room Temperature Separation ZoneBOND System

Device 1 3 2 ZB Carrier Stiction Zone Adhesive on Device Device Polymer Adhesive Carrier Carrier 4 Thin Device Release Zone

Basic Process Flow: 1. Coat polymer adhesive on device 2. Create carrier: Release zone & stiction zone 3. Bond face to face 4. User processes: Thin, pattern, etc. 5. Remove stiction zone adhesive 6. Mount device side on film frame 7. Separate carrier from adhesive 8. Clean adhesive from device

5 &

Alpha-stage technology

Room Temperature Separation ZoneBOND System

Features
Low mechanical & thermal stress on device wafer Separate carrier away from adhesive, not device Room temperature debonding Enables the use of adhesives that are tolerant of higher temperatures Eliminates the conflict of adhesive temperature capability versus temperature requirements for debonding Designed for higher debonding throughput Compatible with wafer sizes 100 mm to 300 mm
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Summary
Brewer Science is an established technology partner in the microelectronics industry with strong expertise in IC, MEMS, optoelectronics, nanotechnology, and compound semiconductors We provide strong expertise in thin wafer handling and advanced packaging with material and equipment technologies for LED manufacturing

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