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BASIC TRANSRECIVER STAION

VIPIN MISHRA
08EI58
I.E.T. M.J.P. ROHILKHAND UNIVERSITY

BAREILLY

ACKNOWLEDGEMENT
The satisfaction that accompanies the successful completion of any task would be incomplete without the mention of the people who made it possible and whose constant guidance and encouragement crown all the efforts with success.

It is my proud privilege to express deep sense of gratitude, regards an appreciation to my guide Mr. SUDHIR SHARMA for his invaluable guidance, deep rooted interest, inspiration and continuous encouragement throughout our summer training which helped me to complete my project successfully. I am blissful to pay my greatest regards to Mr. ANAND for her valuable guidance and advice during the course of this project. I also wish to thank Mr. ANUJ BISWAS for extending their valuable guidance & help about logical aspects of all practical implementations of design & support for literature, critical reviews and above all moral support they provided to me at every stage of training.

I am grateful to those who have directly or indirectly helped me during the project work. Finally, I express my heartfelt gratefulness to my parents, teachers and friends for their wishes and contributions towards carrying out this endeavor.

Certificate
TO WHOM IT MAY CONCERN

This is to certified that Mr. VIPIN MISHRA, a 4th year (EI) student of Institute Of Engineering & Technology, M.J.P.Rohilkhand University, Bareilly, has successfully completed his training/project on:

BTS:BASIC TRANRECEIVER SATION


in partial fulfilment of the requirement for the award of Bachelor Of Technology (B.Tech) from ELECTRONIC PRODUCT DIVISION,I.T.I LIMITED during the period of Six weeks (45 Days).
CERTIFIED BY: MR. M.P.SINGH ASSTT. MANAGER (EDC) I.T.I. LIMITED RAI BARELI

I.T.I. PROFILE
The Rae-Bareli Unit of ITI set up in 1973, has been continuously upgrading to new technologies. Today , the unit produces electronic and mechanical equipments like : GSM BTS (Collaboration with ALCATEL FRANCE) Tower and Shelter for BSNL Installation and commissioning of CDMA equipments in Maharastra& Rajasthan. Installation , commissioning and maintenance of GSM network of BSNL in Maharastra, Gujrat and MP &Chattisgarh.

SURFACE MOUNT TECHNOLOGY


Surface mount technology (SMT) is the practice & method of attaching leaded & nonleaded electrical components to the surface of a conductive pattern that does not utilizes leads in feed through holes. Surface mount technology is the latest trend in electronics manufacturing. It started way back in 1986 that has been more than a decade now.
Type of Surface Mount Devices

There are various types of Surface Mount Components or SMD (Surface Mount Devices) available in the industry
1.

Chip components: These components are very small size. These consist of resistors, capacitors,

diodes, LEDs etc.They are available as small as 0.6(l)

x 0.3(w) mm . .
2.

SOTs: These are known as small outline transistors. This category comprises of components like, standard transistors, UJT, SCR, Triacs, Diacs, etc.

3.

SOICs: These are known as small outline Integrated Circuits These are the ICs that can be directly mounted on the board with no requirement of insertion

4.

TSSOPs: These are known as Thin Shrink Small outline Packages These are also ICs that can be directly mounted on the board but the pitch between pins very less of order 0.5mm & thickness of the ICs very thin of order 1.5 mm..

5. QFPs: These are known as Quad Flat Packages These are also ICs that can be directly mounted on the board but the pitch between pins very less of order 0.5mm & has pins on all four sides.

6. PLCC: These are known as Plastic Leaded Chip Carrier These are also ICs that can be directly mounted on the board but these have J type leads ie. The leads are bend

under the body of the IC. A PLCC has J-type leads on all 4 sides & if it has a J-leads on two sided then it is called SOJ

7. BGA: These are known as Ball Grid Array These are also ICs that can be directly mounted on the board but these have leads in the form of balls underneath the body.These BGAs are the latest trend in the SMT. These BGA have ball size as small as 0.25 mm. Therby reducing the size of the component to a very minimum size.

8. Surface Mount Connectors: These are the connectors which can be directly mounted on the board. The connectors include connectors in which PLCC, SOJ & BGA can be mounted, as well as data bus & power cables etc. can be connected

SMT: INTRODUCTION
Europlacer Line 1
SMT shop was commissioned in July98. Resources Screen Printer : DEK 260 SA Pick and Place : EP 400 & EP 600 (Europlacer) Oven : ETS 2545B, USA Line Speed : 10000 CPH (Max. Rated Speed) Feeder Capacity : 144 of 8 mm Tape Placement Capability : 20 mils Fine Pitch ICs

Europlacer Line 2
Screen Printer : DEK Horizon 02 i Pick and Place : EP 400 & Xpress 50 Oven : XPM 820, VitronicsSoltec, USA Line Speed : 54000 CPH Feeder Capacity : 237 of 8 mm Tape + 30 trays

Europlacer Line 3
Screen Printer : DEK Horizon 02 i

Pick and Place : XP143E & XP243E Oven : MR 933, VitronicsSoltec, USA Line Speed : 90000 CPH Feeder Capacity : 440 of 8 mm Tape + 20 trays

SMD ASSEMBLY PROCESS MAP


Receipt of material

Kitting QC Check Trolley QC loading and feeder programming/ Preparation QC Check Solder Paste Screen-printing

Pick & Place Assembly

Inspection and repair on stop conveyor QC Check Reflow Soldering

Inspection and repair (if required) QC Check Card Dispatch

INTERNAL CKT. TESTING


The In circuit tester tests the components & determines the functionality of the components. But this testing is done in a particular sequence so that whole circuitry is not effected due to a faulty component or an improper joint. The sequence is as mentioned below.
n

Preshort Test: The tester prepares & initializes for testing. During this process the tester verifies that the fixture & board are properly mounted on the tester. It checks that the probes of the fixtures sits on the board smoothly. Short: It checks for unexpected shorts & Opens in the circuit ot make sure that the components are not missing & if not missing then it checks that the components are not short due to any manufacturing process. If it finds any short it gives alarm & stops the testing, in order to avoid the failure of the circuitry. Analog In circuit: During this process first the analog components are checked unpowered then powered testing is done as explained earlier. Digital In Circuit: During this process the digital components are checked as described earlier.

Functional Testing
This is the type of testing which is done to check the functionality of whole of the circuitry. During this testing all the power supplies inputs & output processors are connected to the board. Then the input processors give input to the circuit & output processor reads output & analyzes how the circuit is behaving according to the input. This process is performed after all the types of Inspection & testing discussed earlier.This is the final testing to check if the board is good or not. The boards which are passed through this are marked Tested OK. & then are shipped. As we have seen that the inspection has some limitations so has the testing. So we can say that the inspection & testing process can be combined together so that the board can be 100% inspected for all type of possible defects. The next page shows the types of faults that may be present in a board & capability of the inspection & testing process to diagnose it.

BTS: BASIC TRANRECIEVER STATION


The BTS provides two-way radio communication between the PSTN, and Mobile Stations located in a single GSM cell. It also provides a similar link between the Mobile Stations and the rest of the PLMN. via the TC. The BTS thus interfaces the digital baseband signals used by the landbased networks and the GSM radio signals used by Mobile Stations. TYPE OF BTS

INDOOR (AC,DC)

OUTDOOR (AC,DC)

(mbi5) (mbo2)

Various card used in MBI5 cabinet are as given below:

SUMAprovides the central management and control of all the BTS A9100 modules. It has responsibility for the following functional areas: Digital transmission Timing and clock generation Management of the BTS internal digital interfaces O&M functions RI Control of the AC/DC converters and check of the battries.

TRE combines digital baseband and analog RF functionality in one module. The architecture is split into three functional blocks: Digital part TRED Analog part TREA (TRED and TREA are realized on TREDA)

Power amplifier TEPA. Power supply TREPS.

ANC provides the intermediate RF stage between the TREs and the antenna. On the downlink, the ANC connects two TRE transmitters to two antennas. On the uplink, it splits the received signals and passes them to the TRE receivers.

FACB monitors the fans and provides power and digital speed control of the FANUs. A FANU consists of a moulded-plastic

frame containing two fan blowers. Three FANUs are controlled by one FACB.

RACK / CABINET DESCRIPTION of BTS


EVOLIUM BTS A9100 INDOOR MBI5

RACK one SUB-RACK five CONNECTION AREA one -

DIMENSIONS AND WEIGHT HIGHT 1940mm(6.36) WIDTH 600mm(1.96) DEPTH 450mm(1.47 ) WEIGHT - 270 kg (595p) - 131 kg

Quality of MBI5 BTS


1. Very high radio performances, in particular.

* Reception sensitivity, -111 dBm, * Improved Output Power, (Standard 45 W). 2. Radio (synthesizer) Frequency Hopping, 3. Antenna Diversity (as standards option), 4. Minimum Service Interruption 5. Very High BTS availability *Due to Module Reliability *Due to System Architecture, 6. Optimized software release migration.

Flexibility of MBI5 BTS


1. Wide possibilities of extensions and sectorization, within the same cabinet, e.g., the MBO2 cabinet can

accommodate up to six sectors with a twelve-TRX total capacity, 2. Outdoor BTS modularity provides flexibility for other equipments (Transmission Equipment, Batteries, Microwave, DDF etc.), 3. System Architecture and Cabinet for GSM 850, GSM 900, GSM 1800 and GSM 1900 remains the same, 4. High modularity, 5. Reduced set of modules and a common interface.

Future Proof BTS


1. GPRS Ready

2. EDGE Ready by add TRE operation 3. UMTS Ready: the MBI5 and MBO2 outdoor cabinet allow mixed configurations GSM + UMTS.

GPRS: EDGE:
SYSTEM

GENERAL PACKET RADIO SERVICE

ENHANCED DATA FOR GSM EVOLUTION

UMTS:UNIVERSAL MOBILE TELICOMMUNICATION IMT


INTERNATIONAL MOBILE TELECOMMUNICATION.

ABREVIATION:

1. MBI5 MULTISTANDARD BTS INDOOR WITH 5 SUBRACK 2. SMT 3. SOIC


4.

SURFACE MOUNT TECHNOLOGY SMALL OUTLINE IC SMALL OUTLINE TRANSISTOR SHRINK SMALL OUTLINE PACKAGE QUAD FLAT PACK IC PLASTIC LEADED CHIP CARRIER BALL GRID ARRAY FAN UNIT FAN CONTROL BOARD BTS REMOTE INVETOR

SOT

5. SSOP 6. QFP 7. PLCC 8. BGA 9. FANU 10.FACB 11.BTSRI

12.XIBM EXTERNAL ALARM INPUT BOARD MULTISTANDARD 13.TRE 14.ANC 15.SUMA TRANS RECEIVE EQUIPMENT ANTENNA NETWORK COMBINER STATION UNIT MODULE ADVANCED

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