Adhesives, Coatings and Encapsulants Electronic Materials Training

September 4-5, 2008 Jason Sanders

Company Confidential

INDIANAPOLIS FACILITY PROFILE

90,000+ Square Foot Facility on 7 acres Located In Indianapolis, Indiana - USA Manufacturing 60 Employees 2 Overlapping Shifts 12 Million Pounds Produced Annually TS 16949 and ISO 9001 registered ISO 14001 Consolidated EW, PC and FV Manufacturing, Structural Adhesives Mfg.

Meeting Title, Date Company Confidential

Automotive Electronic Applications

Company Confidential

Meeting Title, Date Company Confidential

Encapsulants, Adhesives and Coatings

Lord Expertise and Capabilities
Experience in supplying products for automotive electronic applications for over 30 years. Electronic materials available in three chemistries; epoxy, urethane and silicone. Materials application and electronics reliability test equipment to support product development Flexible manufacturing from bulk containers to syringes. Global manufacturing and technical support

Meeting Title, Date Company Confidential

Encapsulants, Adhesives and Coatings

Potting and encapsulating materials for: Electronic ignition and engine control modules Ride level and wheel speed sensors Tire pressure sensors Lighting ballasts and HID lighting Capacitors, switches, connectors and relays DC/DC converters Circuit boards Engine/transmission controller Adhesives and Conformal Coatings for: Lid sealing Circuit board component assemblies Battery Assembly Radio boards

Meeting Title, Date Company Confidential

Encapsulants, Adhesives and Coatings

Currently Supplying Delphi with.. Thermally Conductive Adhesive MT-220 EP-870 SC-242

Epoxy Lid Seal Adhesive Silicone Lid Seal Adhesive Current Programs at Delphi Pencil-Type Ignition Coil Epoxy ES-111 Approved at Torreon, MEX, Seixal, Portugal, Korea, China DIS Ignition Coil Epoxy ES-110 Approved at Anderson, IN

Truck Ignition Coil (Gen III, Gen IV, L6, DCX) Epoxy ES-115 Approved at Anderson, Torreon & Seixal

Meeting Title, Date Company Confidential

Currently Supplying Other Automotive Electronics Manufacturing Companies.

Silicone Encapsulants SC-300M, SC-316, SC-319 Silicone Conformal Coatings SC-2002 HV, SC-318 Silicone Thermal Adhesives SC-253, MG-122 Silicone Lid Seal Adhesives SC-212, SC-254, SC-412 Silicone Thermal Greases SG-21, SG-26, Circalok 6754

Meeting Title, Date Company Confidential

Currently Supplying Other Automotive Electronics Manufacturing Companies.

Urethane Encapsulants UR-312, UR-323, UR-325, UR-329 Urethane Lid Seal Adhesives Circalok 6404 Epoxy Encapsulants 302, 340, Circalok 6059, EP-809 EP-830, ES-26U, ES-106, ES-95 Epoxy Lid Seal Adhesives ES-90, ES-107

Meeting Title, Date Company Confidential

AUTOMOTIVE INDUSTRY QUALIFICATIONS

1. Air Bag Sensor Toyota, Ford, Chrysler EP-669, 302/#60, UR-278-5 4. Alternator Bridge Rectifier General Motors SC-254, EP-592, EP-593, EP-540 7. Radio Board Coating Chrysler SC-2002HV 10. Speed Control Sensor Visteon SC-253, ES-41, ME-138 13. Electronic Ignition After Market Ford DC-23 Chrysler EP-680 Flight Systems CK-6055 2. Halogen Headlamp Encapsulant Bosch - DC-23 5. Battery Adhesive General Motors, Ford, Chrysler, Johnson Controls, Enertec EP, 433, EP-672, ES-38, ES-73 8. Alternators Starter Motors Delco Remy -- Reman EP-445, EP-446, EP-447 11. Exhaust Re-circulation Control Visteon, General Motors EP-936 14. Voltage Regulator General Motors SC-139 Chrysler EP-680 Robert Bosch DC-23 Transpo CK-6700 3. Radiator Adhesive Visteon - EP-701 6. Hall Effect Sensor General Motors UR-172, EP-830 Ford, Chrysler 300, EP-930, #67, #64 AEC SC-316 9. SCAP Sensor Visteon UR-164 Motorola UR-285 12. Electronic Spark Control Visteon SC-212 15. Neutral BackUp Switch General Motors UR-212

Meeting Title, Date Company Confidential

AUTOMOTIVE INDUSTRY QUALIFICATIONS

16. Mass Air Flow Sensor General Motors EP-139 Visteon ME-138, SC-242, EP-903, EP-870, MH-205 Hitachi EP-729 17. Ignition Coil Visteon DIS EP-697F Visteon E-Core DC-812 Chrysler, Honda EP-760U, EP-929 Shenda Motors ES-44 Bobinadores Unidos, Standard Motor Products, Echlin EP-809 Wells Mfg ES-106 Unison EP-954 Weastec EP-760U, ES-26 19. Brake Fluid Level Detector Chrysler, General Motors - 300#75 22. Engine Control Module Chrysler UR312, SC-300M Thunder Heart Performance UR-324 Kimball SC-254, SC-294 25. Auto Select Transmission Control Tractor/Trailer UR-190 20. Transmission Sensor Chrysler PR-30, ES-100, MT-220 23. Fluorescent Lighting Ballast Ford UR-212

18. Linear Position Sensor Ford UR-190, UR-312 21. Exhaust Leak Detector Pump Chrysler, General Motors UR-310

24. ABS Wheel Speed Sensor Chrysler EP-900#67 Tractor/Trailer UR-190

26. Windshield Washer Reservoir Motor General Motors EP-373

Meeting Title, Date Company Confidential

AUTOMOTIVE INDUSTRY QUALIFICATIONS

27. Windshield Wiper Motor General Motors 300/#25 28. Audio Power Amplifier Chrysler UR-310 29. Heated - Side View Mirrors Gentex CK6404 Magna Donnelly CK-6403 32. Electrical Steering Module Eaton Corp. UR-190

30. ABS Electronic Control Module Delphi MT-220

31. Oil Temperature Sensor Hi-Stat CK6754

Meeting Title, Date Company Confidential

VACUUM PRESSURE AND IMPREGNATION

VPI Materials for:

Automotive ignition coils Alternator and starter windings Television fly-back coils Aircraft ignition coils Electrical and electronic applications Power supplies

Meeting Title, Date Company Confidential

AUTOMOTIVE IGNITION COIL QUALIFICATIONS

Customer
Delphi Corporation

Application
DFI, DIS, COP and Pencil Coils

Product
Epoxy Encapsulant ES-110, ES-115 Epoxy Encapsulant EP-697F Epoxy Encapsulant ES-106 Epoxy Encapsulant EP-809 Epoxy Encapsulant EP-809 Epoxy Encapsulant EP-760U, ES-26U Epoxy Encapsulant EP-809

Visteon Automotive Systems

DIS and Pencil Coils

Wells Manufacturing Automotive Controls Standard Motor Products Weastec, Inc.

After-market Ignition Coils After-market Ignition Coils After-market Ignition Coils OEM Coils Chrysler, GM and Honda Small Motor Coils

Walbro Engine

Meeting Title, Date Company Confidential

Ignition Coil Encapsulants

Epoxy/Anhydride Chemistries 40 60 % Filled Systems Vacuum Impregnation Dispensing Automated Preheat, Dispense and
Cure Lines

Multiple Designs of Coils

Meeting Title, Date Company Confidential

Industrial Electronic Applications

Company Confidential

Encapsulants, Adhesives and Coatings Product Properties

High temperature epoxy and silicones for harsh environment exposures. Low modulus urethane encapsulants for protection of delicate electronics. Low shrink, low stress epoxy encapsulants and adhesives for delicate electronics and harsh environments. Fast cure one-component epoxy and silicone encapsulants, adhesives and coatings. Unique hybrid epoxy-silicone and urethane-polyester chemistries.

Meeting Title, Date Company Confidential

Encapsulants, Adhesives & Coatings Product Selector Guide

Product Name 300/#72 340/#70 EL-636 EP-20/#65 EP-809 EP-830 EP-870 EP-937 ES-73 ES-86 ES-106 SC-102 SC-242 SC-253 SC-254 SC-294 SC-300M SC-308 SC-309 SC-2002HV UR-312 UR-322 UR-325 UR-340
Meeting Title, Date Company Confidential

Description Filled 1 to 1 Epoxy System Thermally Conductive Epoxy System Highest Temperature Resistant Epoxy System Unfilled 2 to 1 Epoxy System General Purpose Epoxy Coil Encapsulant High Tg Epoxy Encapsulant High Viscosity Epoxy One Component Medium Viscosity Epoxy One Component Unfilled 1 to 1 Epoxy System Fire Retardant Epoxy System Economical, Epoxy Coil Encapsulant Unfilled 1 to 1 Silicone System Primerless, Filled Silicone, One Component Thermally Conductive Silicone System High Strength Unfilled Silicone One Component Primerless Unfilled Silicone One Component Low Modulus 1 to 1 Silicone Gel Low Tg Thermally Conductive Silicone Low Viscosity Thermally Conductive Silicone Low Viscosity One Component Silicone Low Modulus Urethane Gel 1 to 1 Unfilled Urethane Systems High Strength Urethane Encapsulant Economical, Urethane Encapsulant

Typical Applications Encapsulant for Electrical/Electronic Devices Encapsulant for Electrical/Electronic Devices Encapsulant for High Temperature, 180 Requirments Encapsulant for Electrical/Electronic Devices Encapsulant for Ignition Coils Encapsulant for Ignition Coils Electronic Modules/Lid Seal Encapsulant/coating for Electronic Devices Battery (Auto/Marine) Encapsulant for Power Devices Encapsulant for Ignition Coils Encapsulant for Electronic Devices Encapsulant/Coating/Adhesive for Electronic Devices Adhesive for Power Components Coating/Sealant for Alternator Encapsulant/coating for Electronic Devices Encapsulant for Electronic Modules Encapsulant for Power Devices Encapsulant for Power Devices Conformal Coating for Circuit Board Encapsulant for Electronic Modules Encapsulant for Electrical/Electronic Devices Encapsulant for Electrical/Electronic Devices Encapsulant for Electrical/Electronic Devices

Type Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Silicone Silicone Silicone Silicone Silicone Silicone Silicone Silicone Silicone Urethane Urethane Urethane Urethane

1 or 2 Component 2 2 2 2 2 2 1 1 2 2 2 2 1 2 1 1 2 2 2 1 2 2 2 2

Manufacturers of Power Converters

Meeting Title, Date Company Confidential

Manufacturers of Instrument Transformers, Metering Devices and Peripherals

Meeting Title, Date Company Confidential

Manufacturers of Power Supplies, Charging Devices, Marine Accessories

Meeting Title, Date Company Confidential

Manufacturers of Cast Coils and High Voltage Commercial Transformers

Meeting Title, Date Company Confidential

CONSUMER ELECTRONICS
Power Transformers

Pumps (Submersible & Ambient Operations) Surge Suppressors Relays Ignition Devices Heating Elements Typically Require Compliance to Underwriters Laboratory Certification Component vs. Material Compliance

Meeting Title, Date Company Confidential

Regulatory Issues

Directive 2002/95/EC of the European Parliament RoHS - Restriction of Hazardous Substances Directive WEEE Waste Electrical & Electronic Equipment Directive Address EU Disparities in Hazardous Substance Regulation Targets Lead,Cadmium,Mercury, Polybrominated FR

Meeting Title, Date Company Confidential

Application Chemistry
Parameter Urethane Epoxy Silicone Cost Moderate Moderate High Processing Most Difficult Best Moderate Operating Range -50C to + 105C -40C to + 130C -120C to + 200C Repairability Good Poor Excellent Adhesive Strength Moderate High Low Modulus Moderate High Low Chemical Resistance Moderate High Low Electrical Insulation Good Excellent Excellent Dielectric Constant Moderate Moderate Low

Meeting Title, Date Company Confidential

Epoxies

Company Confidential

Epoxies for E/E Applications

Excellent electrical properties Good adhesion due to presence of polar groups Low shrinkage Good impact resistance Superior Moisture & Chemical resistance

Meeting Title, Date Company Confidential

Epoxy Encapsulant EP-20 Resin

Industry Standard, Two Component, RT or
Heat Cured

Black, Unfilled Epoxy Resin Available with Multiple Hardeners

Typical Application Small Switches, Relays, Sensors
Meeting Title, Date Company Confidential

EP-20 Resin Product Line

No. 18 Mix Ratio (resin to hardener) By weight By volume Mixed Viscosity @ 25C (cps) Working Life @ 25C Typical Cure Schedules 100:14 100:16 3,200 20 min (100g) 24 hrs @25C No. 66 Variable Variable 30,000 75 min (400g) 24 hrs @25C No. 65 100:40 100:50 1,200 50 min (200g) 24 hrs @25C No. 67 100:24 100:30 2,000 60 min (200g) 2 hrs @100C No. 71 100:100 100:120 3,000 60 min (200g) 24 hrs @25C

Physical Properties: Hardness (Shore D) ASTM D 2240 Specific Gravity @ 25C Temperature Rating Guide* Tensile Strength (psi) Tensile Elongation Izod Impact Strength (ft lb/in) Water Absorption (24 hours) Electrical Properties: Dielectric Constant Dissipation Factor Volume Resistivity (ohms/cm) @ 25C @ 105C @ 130C

88 1.04 130C 11,200 3.6% 0.38 0.18%

82 1.06 105C 7,500 4.5% 1.50 0.35%

85 1.09 130C 9,000 4.5% 0.55 0.22%

92 1.11 155C 10,900 5.2% 0.32 0.20%

60 1.08 130C 2,300 55% 2.50 0.85%

3.9 0.02 1015 1013 <1010

3.7 0.016 1015 1011* <109

4.2 0.016 1015 1011 <109

4.4 0.038 1016 1014 1013

4.2 0.021 1014 1010 109

Meeting Title, Date Company Confidential

Epoxy Encapsulant 300 Resin

Industry Standard, Two Component, RT or
Heat Cured

Black, Silica-filled Epoxy Resin Available with Multiple Hardeners

Typical Application Transformer Encapsulant, Power Supplies
Meeting Title, Date Company Confidential