Anjan Kumar, N, A Umeshchandra EIS Bangalore-October , 2005 Abstract Growing demand for high performance electronic devices and

the need to cool them has created a huge requirement for developing a new effective thermal management system. The emphasis is not only to develop a new cooling technology, but to package it to a specific requirement and make it cost effective. This need for developing and packaging a cooling system for specific requirement provides a business opportunity in the growing market for high performance electronics. Moreover, the growth in the semiconductor industry, where thermal management of chip is very important, has led to the development of a newer cooling system based on MicroNano scale devices. The focus of this paper is to provide an overview of the different types of cooling technologies currently in use and the future of device cooling technology.

1. Introduction
The removal of unnecessary heat from the electronic devices in recent times has become a core design problem for Electronic and Product Design engineers all over the world. Extensive research is being carried out in this field to develop new cost effective cooling technologies which can be packaged to suit the requirement of present day electronics. To develop an effective cooling system, basic understanding about heat transfer is a must; heat dissipation from any device takes place through a combination of Conduction, Convection and Radiation-the three basic modes of heat transfer. However, the rate of cooling required will determine the type of heat transfer mode suitable for a given application and in turn influence the development of the cooling system.

2. Importance of a cooling system for Electronic Devices

Any cooling system designed to remove unnecessary heat from electronic devices should satisfy the following basic criteria. It should reduce thermal flux on the surface of the chips /electronic circuit reduce thermal path between electronic package and the cooling system (less thermal resistance) quick cooling effect, i.e. good thermal response be compact and maintenance free be cost effective and environment-friendly

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3. Classification of Cooling Systems

Cooling systems can be basically classified into two types:-

3.1

Active Cooling System

a. b. c. d. Forced Air & Liquid Cooling Refrigeration & Cryo Cooling Thermoelectric Cooling Micro Cooling System

Active Cooling System: An Active Cooling System is one in which the rate of

cooling can be controlled, i.e. if the coolant is a liquid, it is circulated (pumped) through cooling jackets and if the coolant is air, then the cooling is done by blowing air from the blower (fan)

3.2

Passive cooling system

e. Standard Conduction f. Natural Convection g. Evaporation/Condensation Cooling

Passive Cooling System: In a Passive Cooling System, the amount of cooling is fixed for a given set of conditions and cannot be easily controlled. Conduction through metals and natural convection are some of the examples of passive cooling. Cooling systems can be further classified based on the area of application and whether the cooling takes place at the system level or at the device level.

3.3

Electronic Device Cooling System

The type of cooling required for a given electronic device/chip depends on the amount of unnecessary heat which needs to be removed from the system, the space available and the cost factor. Following are some of the cooling technologies currently in use: 3.3.1 Passive Heat Sink & Active Heat Sink 3.3.2 Liquid Cooled Plate-Coolant Circulation 3.3.3 Solid State Cooling System-Peltier based 3.3.4 Heat Pipes 3.3.5 Immersion Cooling

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1.3.1

Passive Heat Sink & Active Heat Sink

Fig.1

Fig.2

The Passive Heat Sink uses a mass of high thermal conductive material to conduct heat from the device into the air stream. The Passive Heat Sink provides large surface area to allow the heat to be carried away by the air. This is used for cooling ICs and small electronic devices where the heat dissipation is low. Active Heat Sink has a forced convection, wherein a small fan is used to provide a steady stream of air which will remove the heat at a faster rate. The selection of a heat sink for a given application depends on the following criteria: Air Flow (Natural or forced) Thermal Resistance path (governed by equation R = Space available T/Q)

Fig a

Fig b

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1.3.2 Liquid Cooled Plate-Coolant Circulation

Fig .4

A Liquid Cooled Plate is used where the heat flux is high, especially for cooling high power electronic devices, lasers, electronic drive boards etc. As shown in the Fig.4 the Cooled Plate has cooling coils sandwiched between aluminum honeycomb structures, which have good thermal conductivity. An appropriate chiller unit with required cooling capacity is used to pump the coolant through the plate to cool it. The performance of a Cold Plate depends on the thermal resistance; lower thermal resistance means better cooling. The graph below indicates the performance of various cold plates. Based on the cooling requirement and the space available, an appropriate Cold Plate can be designed.

The equation stated below is used to determine the thermal resistance and inturn, the heat dissipation rate:
R= T/Q

R= thermal resistance C /Watts T= Temperature Difference C Q = Heat Transfer -Watts

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1.3.3 Solid State Cooling System- Peltier based cooler

Fig.5

The Peltier Cooler, also known as the Thermoelectric Cooler, works on the principle of peltier effect, electric current of a given magnitude flowing across the junction of two different conductors produces heat proportional to the rate of current flow. The direction of the current flow will determine the heating or the cooling effect produced at the junction. Peltier Cooler has a good response rate and finds its application in processor cooling. The advantage of a Peltier cooler is that it has no moving parts, hence is more reliable. To select an appropriate thermoelectric cooler, following parameters need to be considered: Hot surface temperature (Th) Cold surface temperature (Tc) Heat load to be absorbed at the cold surface (Qc) The equation stated below can be used to calculate the heat dissipated at the hot junction: I. Th=Tamb+()(Qh) Th= hot side temperature (C) Tamb= ambient temperature (C) =thermal resistance of heat exchanger (C/watt) II. Qh=Qc+Pin Qh=heat released to the hot side of the thermoelectric (watts) Qc=heat absorbed from the cold side (watts) Pin=electrical input power to the thermoelectric (watts)

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1.3.4 Heat Pipes

Fig.6

A Heat Pipe uses liquid phase change-capillary pumping principle for coolant circulation to remove heat from the electronic devices. A Heat Pipe is a cost effective solution, have no moving parts and conducts the heat uniformly through the heat sink condenser section. The selection of a Heat Pipe depends on a number of criteria which include the heat dissipation limit, operating temperature, material compatibility etc. Further, to design a Heat Pipe its, the following parameter needs to be considered. Working Fluid Properties Viscosity , Heat carrying capacity, Surface tension Wick Design - Dimension and type of Wick will determine the capillary pressure which the wick can develop Material of Construction Aluminium or copper based on the working fluid. Capillary Limit is the limit which determines the performance limitation of a Heat Pipe.
(Ref Graphs below)

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1.3.5 Immersion Cooling In Direct Immersion Cooling system, the electronic board is directly immersed in a non-conductive liquid which cools the electronic board. Direct liquid immersion cooling offers a high heat transfer coefficient which reduces the temperature rise of the chip Fig 7 surface above the liquid coolant temperature. Water is the most effective coolant and the boiling mode Fig 7 offers the highest heat transfer coefficient. Direct liquid immersion cooling also offers greater uniformity of chip temperatures than what is provided by air cooling. In Direct Immersion Cooling, the mode of heat transfer is by convection which takes place in three stages: Natural Convection Forced Convection Film Boilinggoverned by equ.----- Q= C'sf A (Twall - Tsat)n The Graph shown below indicates different stages of heat transfer in Immersion Cooling.

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Comparison of Different Electronics Cooling Technology

Sl No 1 Type of Cooling Active/Passive Heat sink Advantages 1.Simple Design 2.Adequate for cooling most "standard" systems 3.simple to install and maintain Disadvantage Application Area 1.Cooling of Electronics 1.Cooling range limited by ambient air used in Computers 2.Consumer Electronic temperature devices ,PCB 's etc 2.Technology has reached its limit 1.Good Surface finish on the bonding surface 2.Proper thermal contact with the 1.Power Electronics heat source is a must 2.Devices which have high 3. Coolant leak might be a problem heat dissipation. 4.Expensive compared to heat sink 1. Expensive 2. Need addition devices like fan, to aid cooling 1.Cooling of IR detectors 2.CCDs 3.Lasers and light-emitting diodes 4.Fiber-optic and photonic equipment

Liquid Cooled Plate

1.Excellent Thermal Performance per Unit Volume 2.High rate of Heat dissipation 3.No noise or moving Parts 4.Better Temperature consistency

Thermoelectric cooler

1.Has no moving Parts 2.Increased heat flux density 3.Short cool-down time

Heat pipe

1. Has no moving parts, no vibration and needs no maintenance 2. Excellent heat transportation capability 3. Has quick thermal response

1. High Manufacturing cost for some types of heat pipe 2. Needs very good thermal bonding

1.Used in Space crafts, Satellite 2. Cooling Electronic Micro Processors

Immersion Cooling

1.Opportunity to remove heat directly from the chip(s) with no intervening thermal conduction resistance, 2.Offers a high heat transfer coefficient 3.Direct liquid immersion cooling also offers greater uniformity of chip temperatures

1. Non Conductive Liquid should be used 2. per fluorocarbons are not exactly environmentally friendly

1.Military 2.Differential scanning 3.calorimeter 4.super computer.

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4. Future Technologies
4.1 4.2 4.3 4.1 Spray and Jet Cooling Nano-lightning Cooling Cool Chip Micro Spray and Jet Cooling (advanced cooling technology)

Fig.8

Impinging jets are used for many industrial applications where high heat and mass transfer rates are required (e.g. drying paper, textiles, tempering of glass and cooling of electronic components). This technology finds its application in areas of high heat flux and on micro chips where packaging (space constraint) is critical. 4.2 Nano-lightning Cooling

Fig.9

Engineers at Perdue University are in the process of developing a new cooling technology known as Nanolightning Cooling for Electronic Chips. This new technique works by generating ionsor electrically charged atomsusing electrodes placed close to one another on a computer chip. Negatively charged electrodes, or cathodes, made of Carbon nanotubes" are used to generate a stream line air flow (sort of nano-lightning to create tiny wind currents) to remove heat from the chip.

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4.3

Cool Chip (advanced cooling technology)

Fig.10

Cool Chip works on the principle of quantum thermo tunneling effect. The above pictures explain the working principle of cool chips. In a Cool Chip, the electrons move across a gap between two metals (Unidirectional) and this gap acts as an excellent insulator. Once the heat is trapped on one side, it cannot return easily.

5 Market for Thermal Management Products

The growing demand for high performance electronic goods has accelerated the need for compact, efficient, and low cost cooling system. It is estimated that the world market for Thermal Management Products in 2003 was US $3.3 billion and is projected to show an average growth rate of 12.1% to reach US $ 5.9 billion by 2008
(report from Business Communications Company, Inc.).

Revenues in World Thermal Management Market, through 2008 ($ millions)

2002 2003 2008 AAGR% 2003-2008 12.1

Thermal Management Revenue

3,125.2

3,324.5

5,885.4

Source: BCC, Inc.

Knowledge of different devices available is very essential to position in growing market of electronic packaging. As we continue to work on determining our positioning in the space of electronic packaging, knowledge of different methods available will be helpful.

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Conclusion
Development of Micro, Nano scale cooling system for next generation electronic chips is the current focus area for thermal engineers and scientists all over the world. The sizes of these cooling devices are in the order of micro-nano meters and are integrated directly with the electronic chip, thus eliminating the need for addition space. Micro Loop Heat Pipes, Cool chips, Nano lighting Cooling System, Micro Channels, and MEMS Thermo Electric Cooler are some of the developments in this field. Semiconductor Industries and R&D labs all over the world are investing millions of dollars to develop Micro and Nano Cooling devices which can meet the cooling needs of the 21st century electronic chips and to revolutionize the Chip Cooling Technology.
Micro CPL Heat Pipe a. b. MEMS Thermal Electric Cooler a.

Fig.11

Acknowledgement
This paper is the result of support, encouragement and guidance from our colleagues in EIS Bangalore to whom we acknowledge a debt of gratitude and appreciation. We would like to thank Mr. G Narayanan who gave us valuable inputs on different cooling technology, Mr. G Bhat who reviewed the paper, Mr. G Mahalingam who facilitated the meeting with embedded group ,Mr. Suresh Kumar and Mr. Rajaram Naik from embedded group for there valuable suggestion. I would also like to thank all my seniors and friends who encouraged during the preparation of this paper.

REFERENCE
1. Cooling of Electronic Components Using Impinging Jet in a Cross-flow in the Presence of Pin Fin Heat Sinks Research project BY Daniel Rundstrm Division of Energy and Mechanical Technology Department of Technology and Built Environment, University of Gvle Direct liquid immersion cooling for high power density microelectronics Robert E. Simons, Electronics Cooling Applications Spray Cooling Technology Market Investigation Cool Chip web

2. 3. 4.

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5. 6. 7.

Basics of Package cooling - web Introduction to Heat Pipe Heat and Mass Transfer by SC Arora & S.Domkundwar Cooling - Methods and Madness - III"

8. 'Nano-lightning' could be harnessed to cool future computers Purdue News , http://news.uns.purdue.edu 9. Cooling effect of MEMS based Micro Capillary Pump Loop for chip level Temperature Control Jeffery Krishberg - University of California, Kirk Yerkes -Air Force Research Lab

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