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400000000
Area of Parallel
300000000
Resonance (A L )
Reactance (ohms)
200000000
FA
100000000 FS
0
32760 32763 32768 32773 32788 32778 32783 32788 32793 32798 32803 32808
-100000000
Frequency (Hz)
-200000000
-300000000
of a Quartz Crystal
1
RTC Time-Base Oscillator
4000000
Frequency at C L = 4pF
3500000
3000000
FL
Reactance (ohms)
2500000
Frequency at C L = 6pF
2000000
1500000
A
Figure 5. RTC Oscillator Circuit Block
1000000
Diagram
500000
0
FS
Benchmarq RTC Oscillator
32760 32762 32764 32766 32768 32770 32772 32774 32776 32778 32780
-500000 FG-9615
The parallel resonant RTC oscillator circuit comprises
Frequency (Hz)
an inverting micro-power amplifier with a PI-type feed-
back network. Figure 5 illustrates a block diagram of
the oscillator circuit with the crystal as part of the PI-
feedback network. The oscillator circuit ensures that
the crystal is operating in the area of parallel resonance
(AL) as shown in Figure 2.
Figure 3. Detailed Area of Parallel Reso-
nance Again, the actual frequency at which the circuit will os-
cillate depends on the load capacitance, CL. A parallel
When a crystal is operating at parallel resonance, it resonant crystal, such as the DT-26 with a specified CL =
looks inductive in a circuit (see Figure 4). Frequency 6pF, is calibrated using a parallel resonant circuit. The
will increase as load capacitance decreases. The load ca- approximate expression of the load capacitance, CL, is
pacitance is the dynamic capacitance of the total circuit computed from CL1 and CL2 as given below:
as measured or computed across the crystal terminals.
In parallel circuit designs, the load capacitance should (CL 1 * CL 2 )
CL ≈
be selected to operate the crystal at a stable point on the (CL 1 + CL 2 )
Fs-Fa reactance curve as close to Fs as possible.
The RTC CL1 and CL2 values are trimmed to provide ap-
proximately a load capacitance of 6pF across the crystal
terminals, thus matching the specified load capacitance
at which the crystal is calibrated to resonate at the
nominal frequency of 32.768kHz. Referring to the im-
pedance curve of Figure 3, “A” indicates the point of
resonance when CL equals the specified load capacitance
CL of the crystal.
FG-9616
Time-Keeping Accuracy
The RTC time-keeping accuracy mostly depends on the
accuracy of the crystal, even though other considera-
Figure 4. Parallel Resonance tions may affect it. The accuracy of the frequency of os-
cillation depends on the following:
■ Crystal frequency tolerance
Aug. 1996
2
RTC Time-Base Oscillator
■ Crystal frequency stability wire fatigue, and frictional wear. Drift with age is typi-
cally 4 ppm for the first year and 2 ppm per year for the
■ Crystal aging life of the DT-26 crystal.
■ Effective load capacitance in oscillator circuit
Load Capacitance
■ Board layout
For a parallel resonant calibrated crystal, the crystal manu-
■ Drive level facturer specifies the load capacitance at which the crystal
will “parallel” resonate at the nominal frequency. As the
Crystal Frequency Tolerance graph in Figure 3 displays, increasing the effective load ca-
pacitance by hanging additional capacitors on either of the
The frequency tolerance parameter is the maximum fre- RTC’s X1 or X2 pins will effectively lower the resonant fre-
quency deviation from the nominal frequency (in this quency, point “A,” toward Fs. The resonant frequency with
case, 32.768kHz) at a specified temperature, expressed load capacitance, FL, is given by the following:
in ppm of nominal frequency. The frequency tolerance,
∆f/f, should typically be around ± 20ppm at 25°C, which C1
is the case for the Grade A, DT-26 crystal. FL = F S (1 + )
2(C0 + CL )
Crystal Frequency Stability
where CL is the effective load capacitance across the
The maximum allowable deviation from nominal fre- crystal inputs, which includes any stray capacitances.
quency over a specified range is the stability tolerance or
temperature coefficient. This factor depends upon the Allowing for capacitance due to board layout traces lead-
angle of cut, the width/length ratio, the mode of vibra- ing to the X1 and X2 pins, the RTC oscillator circuit is
tion, and harmonics. This factor is normally expressed trimmed internally to provide an effective load capaci-
in terms of ppm or % of nominal frequency. Figure 6 tance of less than 6pF. Therefore, if the X1 and X2 pins
shows a typical curve of frequency variation with tem- were bent up from the PCB traces and a crystal speci-
perature for the KDS DT-26 crystal. fied with a CL of 6pF was soldered directly to these pins,
the clock should oscillate approximately 40-50 ppm
faster than the nominal frequency of 32.768kHz.
-30
-40
tional load capacitance on the RTC X2 pin.
-50
-60
-70
-80
-90
-30
-26
-22
-18
-14
-10
-6
-2
10
14
18
22
26
30
34
38
42
46
50
54
58
62
66
70
74
78
2
6
600
Frequency Deviation Around 32768 Hz
Temperature (˚C)
500
400
300
(milli-Hertz)
200
100
0
Figure 6. Typical Temperature Character- -100
istics -200
-300
0.42
0.84
1.26
1.68
2.1
2.52
2.94
3.36
3.78
4.2
4.62
5.04
5.46
5.88
6.3
6.72
7.14
7.56
7.98
8.4
8.82
0
Crystal Aging
Capacitance on X2 (pF)
3
RTC Time-Base Oscillator
Aug. 1996
4
RTC Time-Base Oscillator
5
RTC Time-Base Oscillator
Epson Taiwan, Inc. Epson Hong Kong Limited Epson Singapore PTE LTD
10 F, No. 287, Nanking E. Road 20/F Harbour Centre No. 1 Raffles Place
Sec. 3, Taipei, Taiwan, ROC 25 Harbour Road OUB Centre #25-00
Tel: (02) 717-7360 Wancha, Hong Kong Singapore 048616
Fax: (02) 718-9366 Tel: (852) 2585-4600 Tel: 5330477
Fax: (852) 2827-4346, 2152 Fax: 5345109
Aug. 1996
6
RTC Time-Base Oscillator
External Dimensions
■ DT-26, C-002RX
(Unit : mm)
Aug. 1996
7
RTC Time-Base Oscillator
32.768k
571
Aug. 1996
8
RTC Time-Base Oscillator
32.768k
4.06 MAX.
6571A
Aug. 1996
9
Notes
Aug. 1996
10
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