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Product descriPtion
The XLamp XP-G LeD delivers unprecedented levels of light output and efficacy for a single die LED. The XLamp XP-G LeD continues Crees history of innovation in LeDs for lighting applications with wide viewing angle, symmetrical package, unlimited floor life and electrically neutral thermal path. XLamp XP-G LeDs are the ideal choice where for high lighting light applications output and
features
Available in white, outdoor white and 80-CRI, 85-CRI and 90-CRI white ANSI-compatible chromaticity bins Maximum drive current: 1500 mA Low thermal resistance: 4 C/W Wide viewing angle: 125 Unlimited floor life at 30 C/85% RH Reflow solderable - JEDEC J-STD-020C Electrically neutral thermal path RoHS and REACH-compliant UL-recognized component (e326295)
table of contents
Flux Characteristics.................... 2 Characteristics .......................... 3 Relative Spectral Power Distribution............................... 3 Relative Flux vs. Junction Temperature ............................. 4 electrical Characteristics ............. 4 Thermal Design ......................... 5 Relative Flux vs. Current ............ 6 Typical Spatial Distribution .......... 6 Relative Chromaticity vs Current and Temperature ....................... 7 Reflow Soldering Characteristics .. 8 Notes ....................................... 9 Mechanical Dimensions..............10 Tape and Reel ..........................11 Packaging ................................12
maximum efficacy are required, such as LeD light bulbs, outdoor lighting, portable lighting, indoor lighting and solar-powered lighting.
WWW. CREE.CoM/XLAMp
Copyright 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300
color
order code
Notes: Cree maintains a tolerance of 7% on flux and power measurements, 0.005 on chromaticity (CCx, CCy) measurements and 2 on CRI measurements. Typical CRI for Cool White (5,000 K - 8,300 K CCT) is 70. Typical CRI for Neutral White (3,700 K - 5,300 K CCT) is 75. Typical CRI for outdoor White (4,000 K - 5,300 K CCT) is 70. Typical CRI for Warm White (2,600 K - 3,700 K CCT) is 80. Minimum CRI for 80-CRI White is 80. Minimum CRI for 85-CRI White is 85. Minimum CRI for 90-CRI White is 90. Calculated flux values are for reference only.
Copyright 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
characteristics
characteristics Thermal resistance, junction to solder point Viewing angle (FWHM) Temperature coefficient of voltage ESD classification (HBM per Mil-Std-883D) DC forward current Reverse voltage Forward voltage (@ 350 mA) Forward voltage (@ 700 mA) Forward voltage (@ 1000 mA) Forward voltage (@ 1500 mA) LeD junction temperature mA v v v v v C 2.9 3.05 3.15 3.25 150 unit C/W degrees mV/C minimum typical 4 125 -2.1 Class 2 1500 5 3.75 maximum
80
60
20
Wavelength (nm)
Copyright 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
100% 90%
80% 70% 60% 50% 40% 30% 20% 10% 0% 25 50 75 100 125 150
1500 1400
1300
1200
1100
1000 900 800 700
600
500
400
300 200 100 0 2.25 2.50 2.75 3.00 3.25 3.50
Copyright 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
thermal desiGn
The maximum forward current is determined by the thermal resistance between the LeD junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. Cool White
1600 1400
= = = =
1200
1000
800
600
400
= = = =
200
Copyright 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
350%
120
100
80
60
40
20
Angle ()
Copyright 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
0.020 0.015
0.010
0.005 0.000
CCx
-0.005
CCy
-0.010 -0.015
-0.020 100 300 500 700 900 1100 1300 1500 Current (mA)
a CCT vs Temp
0.020
0.015 0.010 0.005
CCy
Copyright 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
TP Temperature TL
Critical Zone TL to TP
Tsmax Tsmin ts
Preheat
tS
Ramp-down
25
t 25C to Peak
Time
Profile Feature Average Ramp-Up Rate (Tsmax to Tp) preheat: Temperature Min (Tsmin) preheat: Temperature Max (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) peak/Classification Temperature (Tp) Time Within 5 C of Actual peak Temperature (tp) Ramp-Down Rate Time 25 C to peak Temperature
lead-based solder 3 C/second max. 100 C 150 C 60-120 seconds 183 C 60-150 seconds 215 C 10-30 seconds 6 C/second max. 6 minutes max.
lead-free solder 3 C/second max. 150 C 200 C 60-180 seconds 217 C 60-150 seconds 260 C 20-40 seconds 6 C/second max. 8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
moisture sensitivity
In testing, Cree has found XLamp Xp-G LEDs to have unlimited floor life in conditions 30 C/85% relative humidity (RH). Moisture testing included a 168-hour soak at 85 C/85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. Cree recommends keeping XLamp LeDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LeDS to the resealable moisture-barrier bag and closing the bag immediately after use.
rohs compliance
The levels of environmentally sensitive, persistent biologically toxic (pBT), persistent organic pollutants (pop), or otherwise restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with eU Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS), as amended through April 21, 2006.
Copyright 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
3.3
C
Anode Side
6
NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND 3.2 CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC.
3
REV
DESC
Re
2.3
D
2
DRAWN BY
UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX .25 .XXX .125 X .5 FOR SHEET METAL PARTS ONLY .X 1.5 .XX .75 .XXX .25 X .5 SURFACE FINISH:
1.6
D. Seibel
CHECK
3.453.45 8/28/09
DATE DATE DATE TITLE
2.00
A
3.30
0.58
B. Stanton
APPROVED
.73
2.30
.50
MATERIAL
C
25.000
DRAWING NO.
2601-00005
SHEET OF
REV.
B
1 /1
3.453.45
Anode Side
C
Top View
3.3 .50 2.3 0.5
Side View
1.30 .65
0.6 3.2 2.4
Bottom View
.60 1.20 .60
.50
B
0.5
3.3
1.65
0.4
1.60
.40 .50
0.4 1.3 0.5
A
.40 .40
0.4 0.4 1.2
3.20
RECOMMENDED STENCIL PATTERN UNLESS OTHERWISE SPECIFIED (HATCHED AREA IS OPENING) DIMENSIONS ARE IN
3.30
PCB SOLDER PAD
DRAWN BY
DATE
D. Seibel
CHECK
8/28/09
DATE
MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX .25 .XXX .125 X .5
APPROVED
DATE
Copyright 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree trademarks of Cree, Inc.
6 5 4 3
FOR SHEET METAL PARTS ONLY .X 1.5 .XX .75 logo and.XXX .25 XLamp are X .5 SURFACE FINISH:
1.6
MATERIAL
10
6 6
5 5
4 4
3 3
2 2
1 1
4.39 4.39
NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC.
4.0.1
2
REVISONS
DESCRIPTION BY
1
DATE APP'D
1.75.10
C C
8.0.1
12.00 [.472] 12.00 [.472] NOMINAL NOMINAL W W Cathode Side 12.30 [.484] 12.30 [.484] MAX MAX
Released
C
C D E F
C Zone A6, 2.15 was 2.1, tolerance was Zone C2, Added pocket dimensions.
2.5.1
J.L.
6/30/09
10/21/10 Y.Gan
.10 .
J.M. J.M.
D
+.3 12.0 .0
4.39 [.173] 4.39 [.173]
B B
Zone B5, Added tolerance to 4.39 and 3.75. G ADDED CATHODE AND ANODE NOTE .30 [.012] .30 [.012] T T
+.10 +.0039 2.38 +.10 .0937 +.0039 2.38 -.00[ .0937 -.0000] -.00[ -.0000] 7.3 7.3
Ko Ko
B B
1.50 +.10/-.00
Anode Side Ao -- 3.78mm [.149"] Ao 3.78mm [.149"] (denoted by + andBo -- 3.78mm [.149"]+.10/-00 circle) 1.50 Bo 3.78mm [.149"]
Ko Ko 2.38mm [.094"] 2.38mm [.094"]
DATE DATE
END
4.00 .10
A A
2.00 .10
CATHODE SIDE
THIRD ANGLE PROJECTION THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: TOLERANCE UNLESS SPECIFIED: .XX .25 .XX .25 .XXX .125 .XXX .125 X .5 X .5 FOR SHEET METAL PARTS ONLY FOR SHEET METAL PARTS ONLY .X 1.5 .X 1.5 .XX .75 .XX .75 .XXX .25 .XXX .25 X .5 X .5 SURFACE FINISH: 1.6 SURFACE FINISH: 1.6
DRAWN BY DRAWN BY
D. CRONIN D. CRONIN
CHECK CHECK
05/02/11 05/02/11
DATE DATE
--APPROVED APPROVED
--DATE DATE
--MATERIAL MATERIAL
---
TITLE TITLE
A A
START
--2 2
C C
2402-00018 2402-00018
SHEET SHEET OF OF
REV. REV.
SCALE SCALE
6 6
5 5
4 4
3 3
A A
10.25 .10
Trailer 160mm (min) of 1.50 +.10/-.00 empty pockets sealed with tape (20 pockets min.)
8.7 2.10 +.10/-.00
8.00 .10
5.50 .10
Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.)
DRAWN BY DATE
.30 .10
SECTION B-B
UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX .25 .XXX .125 X .5 FOR SHEET METAL PARTS ONLY .X 1.5 .XX .75 .XXX .25 X .5 SURFACE FINISH: 1.6
D. Seibel
CHECK
6/30/09
DATE
4600 Silicon Drive Durham, N.C 27703 Phone (919) 313-5300 Fax (919) 313-5558
APPROVED
DATE TITLE
0.2mm
Cover Tape
MATERIAL FINAL PROTECTIVE FINISH
C
4.000
DRAWING NO.
2402-00003
SHEET OF
REV.
G
1 /1
SCALE
Pocket Tape
13mm 7"
Copyright 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
11
Dessicant Desiccant (inside bag) (inside bag) PackaGinG Humidity Indicator Humidity Indicator Card (inside bag) (inside bag)
Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag
Label with Cree Bin CREE Bin Code & Barcode Label # Code, Qty, Lot Label with CREE Bin Code Cree Bin & Barcode Label Code, Qty, Lot # Labelwith CustomerBin Label with Cree P/N, Qty, Lot Lot # Code, Qty, #, PO # Label with Cree Bin Label with Customer P/N, Qty, Lot #, PO Code, Qty, Lot# #
Patent Label Patent Label Label with Customer Order Code, Qty, Reel ID, PO # Label with Customer Order Code, Qty, Reel ID, PO #
Copyright 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.
12