Technology & Capabilities

Overview
Spring 2006

Introduction
INEX is a research & commercialisation centre for MEMS and nanotechnology and is a part of the University of NewcastleuponTyne. Operational since 2002 and in receipt of funding of 40million from the UK and European governments, INEX works with technology innovators and systems integrationfirmsworldwidetodevelopnewtechnologiesandproductsenabledthroughMNT. INEX is currently the largest publicsector MNT facility in the UK with a total of 1,250m2 facilities incorporating MEMS fabrication cleanrooms, packaging & test facilities, analytical and biohybrid integration laboratories. INEX employs 40 fulltime staff of whom >70% are directly from the semiconductor/optoelectronics/electronicssectorsandwithrelevantindustrialR&Dandmanufacturing expertise. INEX has recently put forward its management procedures and systems for certification to the ISO:9001/2000 standard and has commissioned Lloyds Register Quality Assurance to undertake the certificationprocess.

Our Technology and Competencies

INEX has invested capital and resources into developing an industryclass 100mm/150mm MEMS fabricationcapability.UsingadvancedmicrosystemstechniquessuchasHighAspectRatioProcessing, dry metal etch, advanced oxide etching, and flipchip bonding of ASIC and functional materials (e.g. IIVI). INEX has sufficient breadth of capability to enable our partners to explore and exploit the full potential of microsystems technologies. Our growing portfolio and track record has grown around sensoranddetectiontechnologiesincluding3axisaccelerometersandgyroscopes,chemicaldetectors, biosensors,magneticsensors,andmore. Uniquely, INEX has a strong complementary bioscience capability with experienced and talented biologistsandbioMEMSstaffandfacilities.Examplesoftechnologybeingdevelopedare:biosensors, integratedmicrofluidicsystems,detectionsystems,andtissueengineering.

Our People
On the technology side INEX employs 18 fulltime staff to perform technology development and applicationengineeringinMEMSandmicrofluidics.Themajorityoftechnicalstaffhavebeenrecruited directly from industry and represent a cumulative 150 years relevant experience in the commercialisationofminiaturisedcomponentsacrossawiderangeofindustrysectors. INEXalsoemployscommercialandmanagerialstaffwithexperienceandexpertiseinmanaginglarge contracts and projects within the defence contractor markets. Projects at INEX are run under the Prince2methodologywithinhousepractitioners.

The Opportunity
Wearelookingfornewindustrypartnerswithwhomwecandevelopnewtechnologiesandproducts based on microsystems. Furthermore, we are also interested in exploring R&D and manufacturing outsourcingopportunities. CompetenciesandcapabilitieshavebeendevelopedwithinINEXtoaddressindustryneedsinMEMS fabrication,integrationanddeviceproduction.Theprocessesoutlinedbelowareanintroductiontoour services, for more details on how we can facilitate your business please contact our business developmentteamdirectly.

1: Design, modelling & simulation

INEX designs various MEMS devices, from the initial concepts to 2D/3D drawings, performance modelling and simulation, design optimization, and mask layout for prototype development manufacture.

Design/Modelling
DevicedesignusingCAD tools(AutoCAD, ProEngineer)

Specification
2Dor3Ddesignforcomponentsandsystem,including: layoutformanufacture systemassemblydiagram geometry files for automanufacture tools, e.g. CNC, ebeam geometryfilesforsimulationandoptimization. Modellingcapabilityincludes: Structuralanalysis Nonstructural analysis, including thermal, electrostatics, magnetostatics, electromagnetics, ion optics, piezoelectric, piezoresistiveandacousticsanalysis Fluidics(CFD)analysis Coupled physics analysis e.g. thermalstructural; piezoelectric or piezoresistive structural; electrostatic or magneto structural; acousticsstructural; electromechanical circuit simulation; fluid thermal or structural; thermalelectric or electromagnetic; fluid/electromagnetic. Photomaskdesignderivedfrom: Outlineconceptsofdeviceorprocess Devicegeometrydrawings Directlayoutandconsultation

MEMSdeviceperformance modellingusingFEA (ANSYSMultiphysics, andCFX)

Photomaskdesign(LEdit, AutoCAD,CleWin)

Figure5.1Simulationoftemperatureresponseof microPCR(geneticanalysis)deviceduring thermalcycles

Figure5.2Modellingofheatfluxvectorofmicro PCRdeviceduringcoolingsequence

2: High aspect ratio processing of MEMS

High aspect ratio processing allows highly directional and selective etching of silicon (or ceramics, oxides,nitrides).Thisleadstothecreationofdeepstructures(seeFigure2.1)thatfindapplicationina rangeofsensorsandactuatorsfrommassdetection,inertialsensingtovalveactuation,andmicrofluidic pumps. There is also an emerging trend for the development of solidstate biosensors and chemical sensorsrequiringsuchhighlyverticalstructures.

Figure2.1Anexampleofa3axisgyroscope fabricatedusinghighaspectratioprocessing techniques.HARPcanbeusedacrossabroad rangeoffeaturesizesfromseveralcmsto10sof microns.Averageaspectratiosare1:15.

Figure2.2Amagnifiedsectionofthegyroscope wheretheelectrodeinterfacesanddrivesthering intoresonance.Changesinrotationand movementchangethefrequencyatwhichthering vibratesthusallowingdetectionofmotion.

Figure2.3Anexampleofaverticaltrenchbeing etchedintoSilicon.Notethatnear90degree profileandsmoothsidewalls.Thequalityofthe etch,asillustratedhere,isanimportantfactorin therepeatabilityandreliabilityofdevice performanceandintheyieldofdevicesduring manufacturing.

Figure2.4Exampleofanadvancedoxideetchofa 10mlayerofsiliconoxide.Notethesmoothand controlledangularsidewall.Suchetchprocesses areidealforarangeofoptoelectronicandoptical applications,forexample,awaveguide(asshown here).

3: Packaging and Integration

INEXhasthecapabilitytobondawidevarietyofmaterialsandsubstratesusingarangeoftechniques, asshowninTable3.1below Materials SilicontoSilicon SilicontoGlass Metaltometal Multimaterialsatlow temperature Offchipinterconnection ICintegration MEMStoASICs/CMOS TypeofBond Fusionbonding Anodicbonding Eutecticbonding Adhesionbonding Wirebonding Diebonding Flipchipbonding

Table3.1TypesofbondingprocessavailableatINEX Figure3.1isanexampleofanepoxybondusedtoattachaporttoaglassmicrostructureforusewithin a microfluidic device. Figure3.2 illustrates the ball grid array of a chip prior to flipchip bonding. Figure3.3demonstratesafullypackagedmicrofluidicdevice(actually5parallelmicrofluidicports)of which all components from the microfluidic structures and microelectrodes through to the housing itselfweredesignedandmanufacturedbyINEX.

Figure3.1Anexampleofanadhesivebondusing aUVcurableepoxy.Capillaryflowenables uniformepoxydistribution.Theseflowforcesare nolongeractivewithinthemicrochanneland deviceocclusionisavoided.

Figure3.2AnexampleofaballgridarrayofSnPb solderbumps(assuppliedtoINEX)priortoflip chipbonding.Flipchipbondingisahybrid packagingtechniqueusedbyINEXforintegrating MEMSdeviceswithCMOS.

Figure3.4Awaferof3axismicromachined Figure3.3Amagnifiedsectionofawirebondtoa FR4ceramicboardwithpreprintedcircuits.This gyroscopestriplestackbondedtoglassbyanodic imageshowsagoldwedgebondconnection. bonding.Notethescribelanesforthenextstep, waferdicing.

Figure3.5Abiosensorchip(centre)diebondedto aceramicICpackage.Theouterelectrodesare wirebondedtotheleadpinsonthepackage.

Figure3.6A5parallelflowcellcytometrydevice incorporatingmicroandmillifluidics.Housings suchasthisarefabricatedbyINEXusingits inhouseCNCmicromillingcapability.

4: Microfluidic devices for biomolecular processing

In many biohybrid devices a critical step in the process flow is biological sample preparation. Microfluidicdevicesarebeinginvestigatedfortheirabilitytoseparatedifferentcomponentsofafluid system.IntheexamplebelowaDNAextractiondevicewasdesignedbyMolecularIDSystems(aspin outfromINEX)withtheaidofFluentCFDsoftware,seeFigure1.1,toenablehighflowrateactuation withalowpressuredrop.

Figure1.1Velocityflowsimulationusing FLUENTsoftware Figure1.2Prototypeofthedesignfabricatedin siliconusingAdvancedSiliconEtchprocess.

This device incorporates microstructures to provide a high surface area for the efficient capture and purification of DNA molecules during continuous flow operation, as shown in Figure1.2. The device wasfabricatedbyINEXusingtheASE(AdvancedSiliconEtch)deepreactiveionetchingprocess.A packageddeviceispicturedinFigure1.3withfluidicinterfacingtotherealworld. In addition to healthcare applications, there are nearer term prospects to apply the underlying technologytofurtherapplicationsinthedefence and homeland security sector, such as the detection and identification of biothreat agents inairandliquid.

Figure1.3Completedprototypedevicewith fluidicinterfacingtotherealworld

5: Bio-hybrid integration and engineering

With the increasing application of micro and nano technology solutions to biological problems INEX has developed an expertise in understanding and manipulating the relationship between implantable devicesandthecellularenvironment. Ensuring an appropriate interface between living cells and inorganic surfaces, such as implants or microelectrodesisanimportantfactorintheperformanceofmedicalimplantsanddevices.INEXhas the capability to modify biomaterial surfaces to introduce a desired functionality using topographic, chemicalandbiomolecularapproaches. TheEVG520HotEmbossercanbeusedtoproducetopographicfeaturesfromtensofmicronsinsizeto the50nmscaleinsubstratessuchaspolycarbonate. WhilephotolithographictechniquescanbeusedtoproducePDMSstampstoenabletheprintingof biomolecules.

Figure4.1Printingofbiomoleculessuchas collagen,herelabelledwithaflorescentmarker, canbeusedtoinfluencecelladhesion.

Figure4.2Osteoblasts(bonecells)grownona microstructuredsurfaceofpillars(representedby thedots).

6: Nanotoxicology
Thepotentialriskofnanoscaleparticlestohealthandtheenvironmentisbecominganimportantarea ofresearchastheiruseinconsumerproductsandmedicalapplicationsincreases. Particle properties such as size, size distribution, shape, structure, microstructure, composition, and homogeneityarecriticallyimportanttodeterminingthepotentialimpactofsuchmaterials. AtINEXwehaveaccesstoarangeofanalyticalandbiologicalapplicationsthatcanbegintoprobethe likelyeffectsofnanoscaleparticles.OurclassIImicrobiologicalfacilityallowstheinvitrocultureofa range of model cell types. Their response to the presence of nanoscale particles can be investigated usingsuchmethodsasfluorescentmicroscopy,fluorescentandUVspectroscopyandquantitativePCR.

Characteristics
Size,shape&morphology

Description
Atomic Force Microscopy (AFM) and Scanning Electron Microscopy (SEM) can be used to characterise nanoparticles in terms of their size, shapeandmorphology. MultiModeSPM&Jeol6060 MagneticForceMicrosocopy(MFM)canbeusedtostudythemagnetic propertiesofnanoparticles. MultiModeSPM. Raman and infrared spectroscopies are commonly used to identify materialsbycomparisontoknownreferences,obtaininformationabout how chemical species are bound to one another in a sample, and quantifytheconcentrationofspecificchemicalspeciesinasample. HR800LabRamandFTIR

Magneticproperties

Composition

Name
Cellviability/cytotoxicity study Proliferationstudy

Description
Twocolourfluorescenceassayscanbeusedtodeterminecellviability. MolecularProbesLive/DeadAssay Colorimetric methods can be used to determine the proliferation rates ofcellpopulations. PromegaCellTiter96ProliferationAssay Reactive oxygen species generated during oxidative stress can be detected by an increase in fluorescence following oxidation of the compounddichlorofluorescein. MolecularProbesROSDetectionReagents Characterisation of the expression changes of specific genes can be carriedoutusingquantitativePCR.

Oxidativestress

Molecularcharacterisation

Appendix A: Capability Summary

Allowed Substrates 100mmsilicon,SOI,glassandquartzwafers 150mmsilicon,SOI,glassandquartzwafers Singlewafersorbondedpairs Limitedcapabilitytoprocess3wafersandirregularsubstrates Polyimidefilmandotherflexiblesubstrates Design and Modelling Masklayout(LEdit,AutoCAD) FEAmodelling(Ansys) Lithography Singleanddoublesidedcontactaligners(1:1) Minimumfeaturesize:2.5m Alignmentaccuracy1m(frontsidealign),2m(fronttobackalign) Stepper(1:1) Minimumfeaturesize:~1m Overlayaccuracy:0.16m Ebeamwriter: Minimumfeaturesize~20nm Overlay&stitchingaccuracy~40nm HMDSvapourpriming Spincoatingofphotoresistsandpolyimides Puddle,sprayortankdevelopment Hotplateandovenbaking DeepUVresisttreatment Liftoffprocess(imagereversalandbilayer) Wafer Bonding Ultrasonicwafercleaningstation Siliconfusionbonding Anodicbonding Adhesivewaferbonding Eutecticbonding Bondingatatmosphericpressureorvacuum(to105mbar) Alignedwaferbondingwith<10maccuracy Plasma Etching DRIEofsilicon(Boschprocess) DRIEofsilicondioxideandglass(ICPsource) RIEofsilicondioxide,nitride,polysilicon,polyimideandPZT Metaletching(ICPsource) Emissionandopticalendpointdetectors Resiststrippinganddescum

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 Wet Processing Dedicatedwetprocessstationsforsolvent,acidandalkaliprocessing Anisotropicsiliconetching(TMAHandKOH) HFetchingofsilicondioxideandglass Wetetchingofmetals(e.g.Ti,Cr,Au,Cu,NiCrandAl) Wafercleaning(RCA,Piranhaandsolvent) Solventtoolsforliftoffandresiststripping Photomaskcleaning HFreleaseetchwithsupercriticalCO2drying Metallisation DC&RFsputteringofmetals(e.g.Al,Ti,Cr,Pt,Au,CuandNiCr) Ebeamevaporationofmetals(e.g.Cr,Au,Ti,Al) DCandpulseplatingofmetals(Au,Ni,PtandCu) ThermalProcessing Wetoxidationofsilicon Dryoxidationofsilicon Hightemperatureanneal(N2orO2atmosphere) CVD Processing LPCVDdepositionofpolyandamorphoussilicon(undoped) HighandlowfrequencyPECVDdepositionofsiliconoxide,nitrideoxynitrideandamorphoussilicon MixedfrequencyPECVDdepositionofsiliconnitride(lowstress) PolymerProcessing Hotembossingandnanoimprinting PDMScasting Polymermicromilling Inspection and Metrology Opticalmicroscopy Scanningelectronmicroscopy Metrology Spectroscopicellipsometry(filmthicknessandRI) Reflectancespectrometry(filmthickness) Prismcoupling(RImeasurement) LinewidthandCDmeasurement Waferthickness,bowandstressmeasurement Bulkandsheetresistivity Stylusprofilometry(stepheightandsurfaceroughness) Characterisation FTIRspectrometry Ramanspectrometry EDAXanalysis Scanningprobemicroscopy(AFM&STM) Contactanglemeasurement

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 Back-End and Packaging Waferdicing(glass,siliconandceramicsubstrates) Wirebonding(AlandAu) Bondpull/sheartesting Flipchipbonding(PbSnandPbfree) Diebonding Testing Semiautomatedandmanualprobestations Electricaltesting Testingofresonantdevices DNA Manipulation PCRandQPCR Surface functionalisation Hotembossing Surfacechemistry Biomolecularsurfacefunctionalisation Microcontactprinting FarfieldAnalightBio200Dualbeaminterferometry In vitro studies Cellcultureofprimaryandsecondarycelllines Cellviabilitystudies Cellproliferationstudies Imaging Phasemicroscopy Fluorescentmicroscopy Immunocytochemistry Imaging System Fura2ratiometricimagingofintracellularcalcium Ratiometricimagingofcellmembranepotentialusingvoltagesensitivedyes BCECFmonitoringofintracellularpH Analytical tools Spectroscopy Autolabpotentiostatandgalvanostat AutolabsurfacePlasmonresonance Microparticleimagevelicometry(PIV)

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Appendix B: Equipment Summary

Lithography Ultratech1500stepper EVG620contact/bondaligner KarlSussMA6aligner Raith150ebeamwriter EV101spincoatstation EMS5000spincoater Headwayspincoater EV102developstation SolitechS110Dspraydeveloptool YES310HMDSandimagereversaloven EMShotplates Lablineoven DispatchLLD1polyimideoven FusionM150PCDUVfloodexposuretool Fortexdryfilmlaminator Wafer Bonding and Embossing EVG301wafercleaner EVG501waferbonder EVG520hotembosser Logitechsinglestationwaferbonder Wet Processing Larmaflowetstations Felconsolventstation MAGacidwetstation MAGalkaliwetstation ExpertDevelopmentelectroplatingsystem Semitool470Sand870SSRDs SSEC203solventprocessor Plasma Processing STSASEHRM(advancedsiliconetcher) STSAOE(advancedoxideetcher) STSICPcluster(metaletcher) Tegal902ereactiveionetcher STSdualfrequencyPECVD OxfordPlasmalab80+PECVD Tepla300microwaveasher PVD BalzersBAK550ebeamevaporator BOCEdwardsAuto500ebeamevaporator BOCEdwardsAuto500sputterer Nordikosputterer Varian3290sputterer

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 Furnaces TempressTSC603furnacestack Wellmanannealfurnace Metrology, Inspection & Characterisation J.A.WoollamM2000spectroscopicellipsometer FilmetricsF20reflectancespectrometer Metricon2100prismcoupler VeecoDektak6Mstylusprofiler Jandelfourpointresistivityprobe TencorMGauge Tencor4500Surfscan JEOLJSM6060SEM OlympusMX50inspectionmicroscopes MueTec50linewidthmeasurementsystem BRSLDavidCDmeasurementsystem MTIProforma200Swafermeasurementtool DigilabFTS7000FTIRspectrometer JobinYvonLabRamRamanmicroscope VeecoNanoscopeIV(AFM&STM) Back-End & Packaging LoadpointMicroAce3dicingsaw DatronM9machiningcentre K&S4123ballbonder K&S4523wedgebonder KarlSussFC150flipchipbonder Dage4000bondtester CammaxPrecimadiebonder UltronUH114filmframeapplicator Emitechcriticalpointdryer Testing WentworthAWP200semiautomaticprobestation Agilent/HP:35670Asignalanalyser,4140BIV/CVtest,4275ALCRmeter Keithley:237sourcemeter,617picoammeter,195,2000seriesmultimeters DNA Manipulation EppendorfPCRMastercycler StratgeneMX4000QPCR UVitecBTS20.MUVimagingstation Imaging OlympusBX41Mfluorescentmicroscope JVCvideocapturesuite Imageproplussoftware Imaging System OlympusBX51WIfluorescentmicroscope AndoriXonEMCCDcamera AndorIQsoftware

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 Cell Culture SanyoCO2incubators Class2safetycabinets Spectroscopy Fluorescenceplatereader,VarianCareyEclipse UVvisualSpectrophotometer,VarianCarey50 Analytical tools Autolabpotentiostatandgalvanostat AutolabsurfacePlasmonresonance DANTECmicroparticleimagevelicometry FarfieldAnalightBio200Dualbeaminterferometry

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