Huawei Mu509 Hsdpa Lga Module Hardware Guide

HUAWEI MU509 HSDPA LGA Module
Hardware Guide
Issue Date
01 2010-11-12
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HUAWEI MU509 HSDPA LGA Module Hardware Guide
About This Document
About This Document

History
Version
01
Date
2010-11-12
Chapter
Descriptions
Creation
Issue 01 (2010-11-12)
Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd.
Contents
Contents
1 Introduction....................................................................................................................................1
1.1 Overview .......................................................................................................................................... 1
2 Overall Description ......................................................................................................................2

2.1 About This Chapter........................................................................................................................... 2 2.2 Function Overview ........................................................................................................................... 2 2.3 Circuit Block Diagram....................................................................................................................... 4 2.4 Application Block Diagram ............................................................................................................... 5
3 Description of the Application Interfaces................................................................................6

3.1 About This Chapter........................................................................................................................... 6 3.2 LGA Interface ................................................................................................................................... 6 3.3 Power Interface .............................................................................................................................. 15 3.3.1 Overview................................................................................................................................ 15 3.3.2 VBAT Interface....................................................................................................................... 15 3.3.3 VCOIN Interface .................................................................................................................... 18 3.3.4 Output Power Supply Interface ............................................................................................. 20 3.4 Power-On and Power-Off Time Sequence..................................................................................... 20 3.4.1 Overview................................................................................................................................ 20 3.4.2 Power-On Time Sequence .................................................................................................... 20 3.4.3 Power-Off Time Sequence .................................................................................................... 21 3.4.4 RESIN_N ............................................................................................................................... 22 3.5 Signal Control Interface.................................................................................................................. 22 3.5.1 Overview................................................................................................................................ 22 3.5.2 Input Signal Control Pins ....................................................................................................... 23 3.5.3 Output Signal Control Pin ...................................................................................................... 24 3.5.4 WAKEUP_IN Signal .............................................................................................................. 27 3.5.5 WAKEUP_ OUT Signal.......................................................................................................... 27 3.6 UART Interface............................................................................................................................... 28 3.6.1 Overview................................................................................................................................ 28 3.6.2 Circuit Recommended for the UART Interface...................................................................... 30 3.7 SIM Card Interface ......................................................................................................................... 30 3.7.1 Overview................................................................................................................................ 30 3.7.2 Circuit Recommended for the SIM Card Interface ................................................................ 31
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Contents
3.7.3 ESD Protection for the SIM Card Interface ........................................................................... 32 3.8 Audio Interface ............................................................................................................................... 33 3.8.1 Analogue Audio...................................................................................................................... 33 3.8.2 Digital Audio........................................................................................................................... 35
4 RF Specifications.........................................................................................................................37
4.1 About This Chapter......................................................................................................................... 37 4.2 Operating Frequencies................................................................................................................... 37 4.3 Conducted RF Measurement ......................................................................................................... 38 4.3.1 Test Environment................................................................................................................... 38 4.3.2 Test Standards....................................................................................................................... 38 4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 38 4.4.1 Conducted Receive Sensitivity.............................................................................................. 38 4.4.2 Conducted Transmit Power ................................................................................................... 39 4.5 Antenna Design Requirements ...................................................................................................... 40 4.5.1 Antenna Design Indicators .................................................................................................... 40 4.5.2 Interference ........................................................................................................................... 41 4.5.3 GSM/WCDMA Antenna Requirements.................................................................................. 41 4.5.4 Radio Test Environment ........................................................................................................ 42
5 Electrical and Reliability Features ...........................................................................................44

5.1 About This Chapter......................................................................................................................... 44 5.2 Extreme Working Conditions.......................................................................................................... 44 5.3 Working and Storage Temperatures and Humidity ........................................................................ 45 5.4 Electrical Features of Application Interfaces .................................................................................. 45 5.5 Power Supply Features.................................................................................................................. 46 5.5.1 Input Power Supply ............................................................................................................... 46 5.5.2 Power Consumption .............................................................................................................. 47 5.6 Reliability Features......................................................................................................................... 50 5.7 EMC and ESD Features................................................................................................................. 52
6 Mechanical Specifications.........................................................................................................53
6.1 About This Chapter......................................................................................................................... 53 6.2 Dimensions and interfaces............................................................................................................. 53 6.2.1 Dimensions and interfaces of MU509 ................................................................................... 53 6.2.2 Dimensions of the LGA Connector ........................................................................................ 54 6.3 Nameplate ...................................................................................................................................... 54
7 Appendix: Acronyms and Abbreviations...............................................................................56
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Tables
Tables
Table 2-1 Feature................................................................................................................................... 2 Table 3-1 Definitions of pins on the LGA interface ................................................................................ 7 Table 3-2 Definitions of the pins on the power supply interface .......................................................... 15 Table 3-3 Power on timing ................................................................................................................... 16 Table 3-4 Power off timing ................................................................................................................... 17 Table 3-5 Keep-alive capacitor values vs. SMPL timer settings .......................................................... 18 Table 3-6 Coin cell characteristics ....................................................................................................... 19 Table 3-7 Definitions of pins of the power-on/power-off and reset interfaces ..................................... 20 Table 3-8 Pins on the signal control interface...................................................................................... 23 Table 3-9 List of the LED_STATUS pin and LED_MODE pin .............................................................. 24 Table 3-10 Definition of the WAKEUP_IN signal ................................................................................. 27 Table 3-11 Definition of the WAKEUP_OUT signal ............................................................................. 28 Table 3-12 UART interface signals ...................................................................................................... 29 Table 3-13 SIM card interface signals ................................................................................................. 31 Table 3-14 Signals on the audio interface ........................................................................................... 33 Table 3-15 Signals on the digital audio interface ................................................................................. 35 Table 4-1 RF bands ............................................................................................................................. 37 Table 4-2 MU509 conducted Rx sensitivity (Unit: dBm) ...................................................................... 38 Table 4-3 MU509 conducted Tx power (Unit: dBm)............................................................................. 39 Table 5-1 Extreme working conditions for the MU509 module ............................................................ 44 Table 5-2 Working and storage temperatures and humidity for the MU509 module ........................... 45 Table 5-3 Electrical features of application interfaces ......................................................................... 45 Table 5-4 Requirements for input power of the MU509 module .......................................................... 46 Table 5-5 Requirements for input current of the MU509 module......................................................... 46 Table 5-6 Averaged standby DC power consumption.......................................................................... 47 Table 5-7 DC power consumption (HSPA/WCDMA) ........................................................................... 47
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Tables
Table 5-8 DC power consumption (GSM/GPRS/EDGE) ..................................................................... 48 Table 5-9 Test conditions and results of the mechanical reliability of the MU509 module .................. 50
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Figures
Figures
Figure 2-1 Circuit block diagram of the MU509 module........................................................................ 4 Figure 2-2 Application block diagram of the MU509 module ................................................................ 5 Figure 3-1 Bottom view of sequence of LGA interface pins ................................................................ 14 Figure 3-2 Power on timing sequence................................................................................................. 16 Figure 3-3 Power off timing ................................................................................................................. 17 Figure 3-4 VCOIN interface circuit ...................................................................................................... 19 Figure 3-5 Power-on time sequence ................................................................................................... 21 Figure 3-6 Power-off time sequence ................................................................................................... 22 Figure 3-7 Connections of the POWER_ON_OFF and RESET pins .................................................. 24 Figure 3-8 Status when the indictor blinks once each time ................................................................. 25 Figure 3-9 Status when the indictor blinks fast.................................................................................... 25 Figure 3-10 Status when the indictor blinks twice each time............................................................... 25 Figure 3-11 Driving circuit.................................................................................................................... 26 Figure 3-12 LED Typical Electro-Optical Characteristics Curves........................................................ 27 Figure 3-13 Connections of the WAKEUP_IN and WAKEUP_OUT pins ............................................ 28 Figure 3-14 Connection of the UART interface in the MU509 module (DCE) with the host (DTE)..... 30 Figure 3-15 Circuit of the SIM card interface ...................................................................................... 31 Figure 3-16 Pin definition of SIM Socket ............................................................................................. 32 Figure 3-17 ESD protection circuit on the SIM card............................................................................ 33 Figure 3-18 Circuit diagram of the interface of the first audio channel ............................................... 34 Figure 3-19 Circuit diagram of the interface of the second audio channel.......................................... 35 Figure 3-20 Circuit diagram of the interface of the PCM..................................................................... 36 Figure 4-1 SATIMO microwave testing chamber................................................................................. 43 Figure 5-1 Power Supply During Burst Emission ................................................................................ 46 Figure 6-1 Dimensions of MU509........................................................................................................ 53
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Introduction
1
1.1 Overview
MU509 module is related to the following products:
Introduction
This document describes the hardware application interfaces and air interfaces that are provided when the Huawei MU509 LGA Module (hereinafter referred to as the MU509 module) is used. This document helps you to understand the interface specifications, electrical features, and related product information of the MU509 module. To facilitate its use in different fields, relevant development guide documents are also provided with the module, which can be obtained from the Huawei website.
UMTS2100/900 MHz GSM850/900/1800/1900 MHzData only or Telematics UMTS1900/850 MHz GSM850/900/1800/1900 MHzData only or Telematics Each product has two editions: Data only or Telematics. Data only does not support the voice function.
Data only Analog voice input function Analog voice output function PCM voice function Telematics
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Overall Description
2
2.1 About This Chapter
Function Overview Circuit Block Diagram Application Block Diagram
Overall Description
This chapter gives a general description of the MU509 module and provides:
2.2 Function Overview

Table 2-1 Feature Feature
Working bands
Description
UMTS2100/900 MHz GSM850/900/1800/1900 MHz (Data only or Telematics) UMTS1900/850 MHz GSM850/900/1800/1900 MHz (Data only or Telematics) For detailed information about the working bands supported, see Overview.
Working temperature
Normal working temperature: 20C to +70C Extreme working temperatures: 30C to 20C and +70C to +75C 40C to 85C
Ambient temperature for storage Power voltage AT commands Application
3.34.2 V (3.8 V is recommended.) See the HUAWEI MU509 LGA Module AT Command Interface Specification. UART (supporting 8-wire UART)
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Overall Description
Feature
interface (116pin LGA interface)
Description
One standard Subscriber Identity Module (SIM) card interface (3 V or 1.8 V) Audio (OPTION) : (only telematics version supports this function) For detailed information about the working bands supported, see Overview. 2Micphone in 1Handset out 1Speaker out 1PCM USB 2.0(full speed) Power on/off Interface Reset In Interface Wakeup In/Out Interface Network status and mode light-emitting diode (LED) control interface Configurable GPIO Interface Antenna Interface Power Interface
SMS
New message alert, text message receiving, and text message sending Management of text messages: read messages, delete messages, storage status, and message list Support for the protocol data unit (PDU) mode GSM CS: UL 9.6kbps/DL 9.6kbps GPRS/EDGE: Multi-slot Class 12, Class B
data services
WCDMA CS: UL 64kbps/DL 64kbps WCDMA PS: UL 384kbps/DL 384kbps HSDPADL 3.6Mbps
Physical features Certification information
Dimensions (L W H): 30 mm 30 mm 2.6 mm Weight: <7.0 g Restriction of the use of certain Hazardous Substances (RoHS), European Conformity (CE), Federal Communications Commission (FCC)
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Overall Description
2.3 Circuit Block Diagram

Figure 2-1 shows the circuit block diagram of the MU509 module. The application block diagram and major functional units of the MU509 module contain the following parts: Baseband controller Power management Multi-chip package (MCP) memory Radio frequency (RF) transceiver Antenna Switch RF PA Figure 2-1 Circuit block diagram of the MU509 module
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Overall Description
Only telematics version supports the audio function.
2.4 Application Block Diagram

Figure 2-2 Application block diagram of the MU509 module
USIM interface: The USIM interface provides the interface for a USIM card. The USIM card can be inserted into the host side. USB interface: The USB interface supports USB 2.0 full speed standard. UART interface: The module supports 3-line or 5-line or full serial port interface. Voice interface: The module supports one speaker output, two microphone input, one earpiece output and one PCM interface (only telematics version supports the audio function). Power sources: DC 3.8V recommended.
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Description of the Application Interfaces

This chapter mainly describes the external application interfaces of the MU509 module, including: LGA Interface Power Interface Power-On and Power-Off Time Sequence Signal Control Interface UART Interface SIM Card Interface Audio Interface
3.2 LGA Interface

The MU509 module uses a 116-pin LGA as its external interface. For details about the module and dimensions of the LGA, see 6.2 Dimensions and interfaces.
The details about the description, functions and usage methods of each pin are listed in Table 3-1. The NC (Not Connected) pins are internally connected to the module. Therefore, these pins should not be used, otherwise they may cause problems. Please contact us for more details about this information.
You need to define the rear part on user board according to the pin sequence of MU509 Module. Table 3-1 shows the definitions of pins on the 116-pin signal interface of the MU509 module.
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Table 3-1 Definitions of pins on the LGA interface PIN# Pin Name Normal
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 NC NC NC NC PCM_SYNC1 PCM_DIN1 PCM_DOUT1 PCM_CLK1 NC NC WAKEUP_IN VBAT VBAT NC GPIO GPIO GPIO GPIO GPIO GPIO
Description MUX
Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open PCM interface sync PCM I/F data in PCM I/F data out PCM interface clock Not connected, please keep this pin open Not connected, please keep this pin open External system to wake up Module Power supply input Power supply input Reserve General I/O pins. The function of these pins has not been defined. Not connected, please keep this pin open Not connected, please keep open Not connected, please keep this pin open Not connected, please keep this pin open
Direction
DC Characteristics (V) Min Type

2.6 2.6 2.6 2.6 2.6 3.8 3.8 2.6
Max
2.9 2.9 2.9 2.9 2.9 4.2 4.2 2.9
Input/Outp ut Input Output Input/Outp ut input input input Input/Outp ut -
-0.3 -0.3 -0.3 -0.3 -0.3 3.3 3.3 -0.3
16 17 18 19
NC NC NC NC
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PIN#
Pin Name Normal MUX
Description
Direction

1.8
Max
2.1
20 21 22 23 24 25 26 27 28
NC NC NC NC NC NC NC NC GPIO
Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open General I/O pins. The function of these pins has not been defined. General I/O pins. The function of these pins has not been defined. Not connected, please keep this pin open 2.6V POWER output 1.8V POWER output Not connected, please keep this pin open Power supply for SIM card Coin cell input No connect, please keep this pin open Not connected, please keep this pin open
Input/Outp ut Input/Outp ut Output Output Output Input -
-0.3
29
GPIO
-0.3
1.8
2.1
30 31 32 33 34 35 36 37
NC VCC_EXT2 VCC_EXT1 NC SIM_VCC VCOIN NC NC
-0.3 -0.3 -0.3 1.5 -
2.6 1.8 1.8/2 .85 3.0 -
2.9 2.1 2.1/3. 15 3.25 -
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PIN#
Pin Name Normal MUX
Description
Direction

-
Max
-
38
MIC2_P2
(Only telematics version supports audio function, Data only version does not support this function) Positive pole of the input of audio interface 2 (Only telematics version supports audio function, Data only version does not support this function) Negative pole of the input of audio interface 2 (Only telematics version supports audio function , Data only version does not support this function) Positive pole of the input of audio interface 1 (Only telematics version supports audio function , Data only version does not support this function) Negative pole of the input of audio interface 1 Not connected, please keep this pin open General I/O pins. The function of these pins has not been defined. General I/O pin. The function of these pins has not been defined. General I/O pins. The function of these pins has not been defined. General I/O pins. The function of these pins has not been defined. Not connected, please keep this pin open GND GND
Input
39
MIC2_N2
Input
40
MIC1_P2
Input
41
MIC1_N2
Input
42 43
NC GPIO
Input/Outp ut Input/Outp ut Input/Outp ut Input/Outp ut -
-0.3
2.6
2.9
44
GPIO
-0.3
2.6
2.9
45
GPIO
-0.3
2.6
2.9
46
GPIO
-0.3
2.6
2.9
47 48 49
NC GND GND
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PIN#
Pin Name Normal MUX
Description
Direction

2.6
Max
2.9
50 51
GND GPIO
GND General I/O pins. The function of these pins has not been defined. GND GND GND General I/O pins. The function of these pins has not been defined. GND GND GND GND Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open GPIO SIM insert or remove detect
Input/Outp ut Input/Outp ut -
-0.3
52 53 54 55
GND GND GND GPIO
-0.3
2.6
2.9
56 57 58 59 60 61 62 63 64 65 66 67 68 69 70
GND GND GND GND NC NC NC NC NC NC NC NC NC NC SIM_DET
-0.3
2.6
2.9
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PIN#
Pin Name Normal MUX

GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO
Description
Direction

2.6 2.6 2.6 2.6 2.6 2.6 2.6 2.6 2.6 2.6 VBA T 1.8/2 .85 1.8/2 .85 1.8/2 .85 -
Max
2.9 2.9 2.9 2.9 2.9 2.9 2.9 2.9 2.9 2.9 2.1/3. 15 2.1/3. 15 2.1/3. 15 -
71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91
WAKEUP_OU T NC UART_DSR UART_RTS UART_DCD UART_TX UART_RING UART_RX UART_DTR UART_CTS POWER_ON_ OFF NC NC NC USB_DM USB_DP NC SIM_RESET SIM_DATA SIM_CLK LED_STATUS
Module to wake up the external system. Not connected, please keep this pin open UART Data Set Ready UART Ready for receive UART Data Carrier Detect UART transmit output UART Ring Indicator UART receive data input Data Terminal Ready UART Clear to Send System power-on or poweroff Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Full-speed USB DFull-speed USB D+ Not connected, please keep this pin open SIM reset SIM Data SIM Clock Status indicator SINK current source Driver current: 10 mA
Output Output Output Output Output Input Input Input Input Input/Outp ut Input/Outp ut Output Input/Outp ut Output Input
-0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -
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PIN#
Pin Name Normal MUX
Description
Direction

-
Max
-
92 93 94 95 96
NC NC NC NC EAR_OUT_N3
Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please keep this pin open (Only telematics version supports audio function , Data only version does not support this function) Negative pole of the output of Earphone interface (Only telematics version supports audio function , Data only version does not support this function) Positive pole of the output of Earphone interface (Only telematics version supports audio function, Data only version does not support this function) Positive pole of the output of speaker interface (Only telematics version supports audio function, Data only version does not support this function) Negative pole of the output of speaker interface Reset module. Mode indicator SINK current source Driver current: 10 mA
Output
97
EAR_OUT_P3
Output
98
SPKR_OUT_P
3
Output
99
SPKR_OUT_N
3
Output
100 101
RESIN_N LED_MODE
Input Input
-0.3 -
1.8 -
2.1 -
102 103
NC NC
Not connected, please keep this pin open Not connected, please keep this pin open
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PIN#
Pin Name Normal MUX
Description
Direction

2.6
Max
2.9
104 105
NC GPIO
Not connected, please keep this pin open General I/O pins. The function of these pins has not been defined. GND RF main antenna interface GND General I/O pins. The function of these pins has not been defined. GND Not connected, please keep this pin open GND General I/O pins. The function of these pins has not been defined.F GND Not connected, please keep this pin open GND
Input/Outp ut Input/Outp ut Input/Outp ut -
-0.3
106 107 108 109
GND MAIN_ANT GND GPIO
-0.3
2.6
2.9
110 111 112 113
GND NC GND GPIO
-0.3
2.6
2.9
114 115 116
GND NC GND
When the MU509 module works on master mode, PCM_CLK and PCM_SYNC pins are in the output status; when the MU509 module works on slave mode, PCM_CLK and PCM_SYNC pins are in the input status
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Figure 3-1 shows the sequence of pins on the 116-pin signal interface of the MU509 module. Figure 3-1 Bottom view of sequence of LGA interface pins
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3.3 Power Interface

3.3.1 Overview
The power supply part of the MU509 module contains: VBAT PIN for the power supply VCOIN PIN for the standby power supply of the real-time clock (RTC) VCC_EXT1 PIN for external power output VCC_EXT2 PIN for external power output SIM_VCC PIN for SIM card power output Table 3-2 lists the definitions of the pins on the power supply interface. Table 3-2 Definitions of the pins on the power supply interface Pin No.
1213 48495052 53545657 5859106108 110112114116 35 32 31
Signal Name
VBAT GND
I/O
P -
Description
Pins for power voltage input GND
VCOIN VCC_EXT1 VCC_EXT2
P P P
Pin for standby power input of the RTC Pin for external power output Pin for external power output
P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal output; AI indicates pins for analog signal input; AO indicates pins for analog signal output
3.3.2 VBAT Interface

When the MU509 module works normally, power is supplied through the VBAT pins and the voltage ranges from 3.3 V to 4.2 V (typical value: 3.8 V). The 116-pin LGA provides two VBAT pins and sixteen GND pins for external power input. To ensure that the MU509 module works normally, all the pins must be used efficiently. When the MU509 module is used for different external applications, pay special attention to the design for the power supply. When the MU509 module transmits signals at the maximum power, the transient current may reach the transient peak value of about 2.0 A due to the differences in actual network environments. In this case, the VBAT voltage drops. Make sure that the voltage does not decrease below 3.3 V in any case. Otherwise, exceptions such as restart of the MU509 module may occur.
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A low-dropout (LDO) regulator or switch power with current output of more than 2 A is recommended for external power supply. Furthermore, a 2 mF or above energy storage capacitor is connected in parallel at the power interface of the MU509 module. As for the energy storage capacitor, a 2.2 mF or above electrolytic capacitor is recommended. In addition, to reduce the impact of channel impedance on voltage drop, you are recommended to try to shorten the power supply circuit of the VBAT interface. After VBAT has been applied and is stable, the module will generate an on board power on reset signal and will remain in reset condition until RST is de-asserted. After de-assertion of RST, the module will boot up. USB D+ becomes high when booting is completed; simultaneously the module starts to communicate with host via USB or UART. Figure 3-2 shows power on timing sequence. During power on timing, it is better recommended that you keep VBAT available to avoid startup delays that will occur when powering down the module. Figure 3-2 Power on timing sequence
Table 3-3 Power on timing Parameter

TPD+ TPW
Comments
POWER_ON_OFF Valid to USB D+ high POWER_ON_OFF Valid to WAKEUP_SLEEP_OUT high
Time(Nominal values)
4 0.8
Units
sec sec
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Parameter
TPD TPRI TPRT
Comments
POWER_ON_OFF Valid to UART_DCD high POWER_ON_OFF Valid to UART_RING high POWER_ON_OFF Valid to UART_RTS de-assert
0.8 0.8 6.0
Units
sec sec sec
If the PC needs to detect the PID/VID of module during the BIOS phase, the detection time should exceed the TPD+ time. Figure 3-3 Power off timing
Table 3-4 Power off timing Parameter

TPD+ TPW TPD
Comments
POWER_ON_OFF Valid to USB D+ high POWER_ON_OFF Valid to WAKEUP_SLEEP_OUT high POWER_ON_OFF Valid to UART_DCD high
0.720 0.023 0.030
Units
sec sec sec
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Parameter
TPRI TPRT
Comments
POWER_ON_OFF Valid to UART_RING high POWER_ON_OFF Valid to UART_RTS de-assert
0.268 0.013
Units
sec sec
For detailed information about power supply design and printed circuit board (PCB) design, see the HUAWEI LGA Module Power Supply Design Guide and the HUAWEI MU509 HSDPA LGA Module PCB Interconnection Design Guide.
3.3.3 VCOIN Interface

VCOIN pin of MU509 module is used as an analog input from the 3V coin cell for SMPL (Sudden Momentary Power Loss), RTC and crystal oscillator keep-alive power. A capacitor (rather than a coin cell) can be used if only SMPL is supported (not RTC or XTAL). VCOIN pin is also used as an analog output for coin cell or capacitor charging also. Sudden momentary power loss The SMPL feature initiates a power-on sequence without software intervention if the monitored VBAT drops out-of-range (< 2.55 V nominal) then returns in-range within a programmable interval of between 0.5 and 2.0 seconds. SMPL achieves immediate and automatic recovery from momentary power loss. A valid voltage on VCOIN is required to run the SMPL timer. If a capacitor is used instead of a coin, it must be connected between VCOIN and the ground. The capacitor must be charged to operate properly as the SMPL power source. The capacitor value depends on the SMPL timer setting. Table 3-5 Keep-alive capacitor values vs. SMPL timer settings SMPL timer setting
0.5 sec 1.0 sec 1.5 sec 2.0 sec
Capacitor value
1.5 uF 3.3 uF 4.7 uF 6.8 uF
Capacitor package (X5R)

0805 0805 0805 1206
If the SMPL counter expires without VBAT returning to its valid range, the MU509 must undergo the normal power-on sequence whenever the VBAT is detected. Real-time clock If RTC is used, a manganese-lithium rechargeable battery is recommended, for example, the SII Micro Parts HB-414 and the Panasonic ML-series. Two sets of coin cell specifications are compared in Table 3-6. When the MU509 is off, the real-time clock (RTC) and its oscillator source are still active, provided by a coin cell battery
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which is installed. This allows continued monitoring of RTC alarms programmed via software. Table 3-6 Coin cell characteristics Parameter Specifications HB-414
Nominal voltage Nominal capacity Continuous standard load Operating temperature Diameter Height Weight 3V 0.3 mAh 5 mA -20 to +60 4.8 mm 1.4 mm 0.07 g
ML-series
3V 3.4 mAh 10 mA -20 to +60 6.8 mm 1.45 mm 0.17 g
An interrupt is generated if the coin cell voltage drops too low (and the main battery is not present). If this interrupt occurs, the RTC might be corrupted. A different interrupt is generated if the crystal oscillator stops; this signifies that handset timing is no longer accurate. Again, the RTC is corrupted. When the VBAT power supply of the MU509 is normal, the coin cell charging is powered from VBAT. The MU509 reads the coin cell voltage and monitors the charging. During normal operation, the VCOIN pin voltage will stay above 2.2V, even when the coin cell charger is turned off. Figure 3-4 shows the reference RTC circuit. Figure 3-4 VCOIN interface circuit
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3.3.4 Output Power Supply Interface

Through the Output Power Supply interface, the MU509 module can supply 2.6 V and 1.8V power externally with an output current of 20 mA (typical value) for external level conversion or other applications. If the MU509 module is in Sleep mode, the Output Power Supply interface is in the low power consumption state (< 500 uA). If the MU509 module is in Power Down mode, the Output Power Supply is in the disabled state.
3.4 Power-On and Power-Off Time Sequence

3.4.1 Overview
The power-on, power-off, and reset control parts of the interface of the MU509 module include power-on/power-off interface signal (TERM_ON) and the hardware reset interface signal (RESIN_N). Table 3-7 lists the definitions of the interface pins. Table 3-7 Definitions of pins of the power-on/power-off and reset interfaces Pin No.
81 100
Signal Name
POWER_ON_OFF RESIN_N
I/O
I I
Description
Pin for controlling power-on and power-off Pin for resetting the hardware
3.4.2 Power-On Time Sequence
Make sure that the MU509 module is powered on at the recommended voltage and working temperature range. Otherwise, the module may get damaged or work improperly. External application interfaces must be powered on after the module is powered on. You can power on the MU509 module through the POWER_ON_OFF interface. The software will report relevant information according to the actual settings after the module is powered on. For example, the AT command automatically reports ^SYSSTART[1].
[1] For specific settings information about the power-on/power-off software, see the HUAWEI MU509 HSDPA LGA Module AT Command Interface Specification.
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Figure 3-5 shows the power-on time sequence. Figure 3-5 Power-on time sequence
When the wireless module is working, the wireless module is powered off if the power-on key is pulled down for more than 0.5s and then released. To ensure the normal power-off of the wireless module, you must ensure that the power-on key is pulled down for more than 0.5s and then released to the OPEN state.
Fetch Ext Code in the figure is a file system in the MU509 module. When powering on the wireless module, do not pull down the power-on key constantly. Otherwise, the wireless module may start abnormally or fail to be powered off normally.
3.4.3 Power-Off Time Sequence

The MU509 module supports power-off through the POWER_ON_OFF interface or the AT^SMSO command. Figure 3-6 shows the power-off time sequence.
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Figure 3-6 Power-off time sequence
The processing of the power-off event depends on the normal stop time of the file system in the MU509 module. The processing varies with the capacity of the file system. When powering off the wireless module, do not pull down the power-on key constantly. Otherwise, the wireless module may start abnormally or fail to be powered off normally.
3.4.4 RESIN_N
The MU509 module supports hardware reset function. If the software of the MU509 module stops responding, you can reset the hardware through the RESIN_N signal. After the hardware is reset, the software starts powering on the module and reports relevant information according to the actual settings. For example, the AT command automatically reports ^SYSSTART.
3.5 Signal Control Interface

3.5.1 Overview
The signal control part of the interface in the MU509 module consists of the following: Power-on/off (POWER_ON_OFF) pin Hardware reset (RESIN_N) pin Network status LED (LED_STATUS/LED_MODE) pin Table 3-8 lists the pins on the signal control interface.
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Table 3-8 Pins on the signal control interface Pin No.

81 100 91 101
Signal Name
POWER_ON_OF F RESIN_N LED_STATUS LED_MODE
I/O
I I I I
Description
Pin for controlling power-on and power-off Pin for resetting the hardware Pin for network status LED Pin for network mode LED
3.5.2 Input Signal Control Pins

The MU509 module implements power-on and power-off and resets the hardware through the input signal control pins. The POWER_ON_OFF pin is used to implement power-on and power-off. If the POWER_ON_OFF pin is pulled down for at least 0.5s, the module is powered on; if the POWER_ON_OFF pin is pulled down for at least 2.5s again, the module is powered off. The RESET pin is used to reset the hardware. When the software stops responding, the RESET pin can be pulled down for at least 10 ms to reset the hardware.
As the RESET and POWER_ON_OFF signals are relatively sensitive, it is recommended that you install a 10 nF capacitor near the RESET and POWER_ON_OFF pins of the interface for filtering. In addition, when you design a circuit on the PCB of the interface board, it is recommended that the circuit length not exceed 20 mm and that the circuit be kept at a distance of 2.54 mm (100 mil) at least from the PCB edge. Furthermore, you need to wrap the area adjacent to the signal wire with a ground wire. Otherwise, the module may be reset due to interference.
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Figure 3-7 shows the connections of the POWER_ON_OFF and RESET pins. Figure 3-7 Connections of the POWER_ON_OFF and RESET pins
3.5.3 Output Signal Control Pin

The MU509 module provides a network status LED pin LED_STATUS and LED_MODE. The pulse signal output through this pin controls the status LED on the user interface board to display the network status. The LEDs are controlled by a sink current source. The high voltage is the voltage of VBAT (with the typical value of 3.8 V). Different blinking modes of the status LED indicate different network status. Table 3-9 describes the status of the LED_STATUS pin and LED_MODE pin. Table 3-9 List of the LED_STATUS pin and LED_MODE pin No.
1 2
Operating Status
The 3G network is successfully registered. The dial-up connection is set up for accessing 3G data services. The software is being downloaded or upgraded. The network is being searched for or no network is detected. The 2G network is successfully registered.
LED_STATUS
The indicator blinks once each time. Light on
LED_MODE
Light off Light off
3 4
Light off Light off
The indicator blinks fast. The indicator blinks twice each time. The indicator blinks once each time.
Light off
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No.
6
Operating Status
The dial-up connection is set up for accessing 2G data services.
LED_STATUS
Light off
LED_MODE
Light on
Blinking Once Each Time Figure 3-8 Status when the indictor blinks once each time
Blinking Fast Figure 3-9 Status when the indictor blinks fast
Blinking Twice Each Time Figure 3-10 Status when the indictor blinks twice each time
External Circuits Figure 3-11 shows the recommended circuits of the LED_MODE and LED_STATUS pins. According to LED feature, you can adjust the LED brightness by adjusting the impedance of resistor R.
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Figure 3-11 Driving circuit
For resistance of R placed on user board, choose the value such that it satisfies the following equation: IF *R+VF = VBAT VF: Forward Voltage IF: Forward current Take the LED 19-213/GVC-AMNB/3T as an example (its manufacturer is Everlight Electronics., Ltd. and the website is http://www.everlight.com). Figure 3-11shows its IF-VF curves. If VBAT is 3.8V and the desired current through the LED IF is 3mA, then the voltage of the LED VF is 1.5V according to IF-VF curves, and the corresponding value for resistance of R is (3.8-1.5)/0.003=767 . The brightness of the LED depends on the current value, and for most of the indicator lights the current from 2mA to 5mA is already enough.
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Figure 3-12 LED Typical Electro-Optical Characteristics Curves
3.5.4 WAKEUP_IN Signal

The DTE controls the sleep and wakeup status of the MU509 module through the WAKEUP_ IN signal. If there is no external WAKEUP_IN signal, the wireless module keeps in the wakeup status by default. After receiving the WAKEUP_ IN signal, the wireless module determines whether to enter the sleep mode according to the level status of the WAKEUP_IN signal. Table 3-10 shows the definition of the WAKE_IN signal. Table 3-10 Definition of the WAKEUP_IN signal Pin Name Description Direction to Module
Input
11
WAKEUP_IN
H: DTE wakeup MU509. L: DTE set MU509 to sleep mode.
3.5.5 WAKEUP_ OUT Signal

The WAKEUP_OUT signal is used to indicate the sleep and wakeup modes of the MU509 module. Table 3-11 shows the definition of the WAKE_OUT signal.
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Table 3-11 Definition of the WAKEUP_OUT signal Pin Name Description Direction to Module
Output
71
WAKEUP _OUT
H: Module is in wakeup mode and module serial/USB is available. L: Module is in sleep mode and serial/USB is not available.
Figure 3-13 Connections of the WAKEUP_IN and WAKEUP_OUT pins
3.6 UART Interface

3.6.1 Overview
The MU509 module provides the RS-232 UART (9-wire UART) interface for one asynchronous communication channel. As the UART interface supports signal control through standard modem handshake, AT commands are entered and serial communication is performed through the UART interface. The UART has the following features: Full-duplex 7-bit or 8-bit data 1-bit or 2-bit stop bit Odd parity check, even parity check, or non-check Baud rate clock generated by the system clock
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Direct memory access (DMA) transmission Baud rate ranging from 600 bps to 230400 bit/s (115200 bps by default) Self-adapted baud rate ranging from 1200 bps to 115200bps Table 3-12 lists the UART interface signals. Table 3-12 UART interface signals Pin
76
Name
UART_TX
Description
Data sending on the wireless module Data receive end of the module Ringing indication on the wireless module Data sending request on the wireless module Data terminal ready on the wireless module Clearing to send on the wireless module Data carrier detection on the wireless module Data ready on the wireless module
Feature
The DTE receives serial data. The DTE transmits serial data. The DTE is notified of a remote call. The DTE notifies the DCE of sending requests. The DTE is ready. The DCE switches to the receiving mode. Data links are connected. The DCE is ready.
Direction
Output
78
UART_RX
Input
77
UART_RIN G UART_RTS
Output
74
Output
79
UART_DTR
Input
80
UART_CTS
Input
75
UART_DCD
Output
73
UART_DSR
Output
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3.6.2 Circuit Recommended for the UART Interface

Figure 3-14 shows the connection of the UART1 interface in the MU509 module (DCE) with the host (DTE). Figure 3-14 Connection of the UART interface in the MU509 module (DCE) with the host (DTE)
The RS-232 chip can be used to connect the MU509 module to the RS-232-C interface. In this connection, the transistor-transistor logic (TTL) level and the Electronic Industries Association (EIA) level are converted mutually. For example, it is recommended that you use the MAX3232 chip with a 2-wire serial port and the SP3238 or MAX3238 chip with an 8-wire serial port.
For detailed application of the MU509 UART interface, see the HUAWEI LGA Module UART Design Guide.
3.7 SIM Card Interface

3.7.1 Overview
The MU509 module provides a SIM card interface complying with the ISO 7816-3 standard and supports automatic detection of a 3.0 V SIM card or a 1.8 V SIM card. Table 3-13 lists the SIM card interface signals.
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Table 3-13 SIM card interface signals Name

SIM_VCC SIM_DATA SIM_CLK SIM_RESET SIM_DET
Pins
34 89 90 88 70
Description
Power source for the external UIM/SIM. External UIM/SIM data signal. External UIM/SIM clock signal. External UIM/SIM reset signal. SIM insert or remove detection
Direction to Module
Output Input/Output Output Output Input
3.7.2 Circuit Recommended for the SIM Card Interface

As the MU509 module is not equipped with a SIM card socket, you need to place a SIM card socket on the user interface board. The SIM card signals are transmitted outwards through the 116-pin LGA interface. Figure 3-15 shows the circuit of the SIM card interface. Figure 3-15 Circuit of the SIM card interface
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Figure 3-16 Pin definition of SIM Socket
pin1 pin2 pin3
SIM_VCC SIM_RESET SIM_CLK
pin4 pin5 pin6
GND NULL SIM_DATA
To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic compatibility (EMC) authentication, the SIM card socket should be placed near the LGA interface (it is recommended that the PCB circuit connecting the LGA interface and the SIM card socket not exceed 100 mm), because a long circuit may lead to wave distortion, thus affecting signal quality. It is recommended that you wrap the area adjacent to the SIM_CLK and SIM_DATA signal wires with a ground wire. The GND pin of the SIM card socket and the GND pin of the SIM card must be well connected to the power GND pin supplying power to the MU509 module. A 0.1 uF capacitor or a 0.22 uF capacitor is placed between the VSIM and GND pins in a parallel manner. Three 33 pF capacitors are placed between the SIM_DATA and GND pins, the SIM_RST and GND pins, and the SIM_CLK and GND pins in parallel to filter interference from RF signals. You do not need to pull the SIM_DATA pin up during design as a 15000-ohm resistor is used to connect the SIM_DATA pin to the VSIM pin.
3.7.3 ESD Protection for the SIM Card Interface

It is recommended that you take electrostatic discharge (ESD) protection measures near the SIM card socket. Figure 3-17 shows ESD protection circuit of the SIM card, in which the transient voltage suppressor (TVS) diode is placed as close as possible to the SIM card socket, and the GND pin of the ESD protection component is well connected to the power GND pin that supplies power to the MU509 module.
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Figure 3-17 ESD protection circuit on the SIM card
3.8 Audio Interface

3.8.1 Analogue Audio
The MU509 provides two audio I/O channels (Data only doesnt support the voice function). Table 3-14 lists the signals on the audio interface. Table 3-14 Signals on the audio interface Pins
41 40 96 97 39 38 99 98
Name
MIC1_N MIC1_P EAR_OUT_N EAR_OUT_P MIC2_N MIC2_P SPKR_OUT_N SPKR_OUT_P
Description
Negative pole of the audio input signal of the first channel Positive pole of the audio input signal of the first channel Negative pole of the audio output signal of the first channel Positive pole of the audio output signal of the first channel Negative pole of the audio input signal of the second channel Positive pole of the audio input signal of the second channel Negative pole of the audio output signal of the second channel Positive pole of the audio output signal of the second channel
The two audio I/O channels are completely different and thus have good performance of resisting RF interferences. The routes on the printed circuit board (PCB) should be placed in parallel with each other and should be short. The filter circuit on the two sides should be symmetric. The differential signals should be close to each other. The audio output signals in differential pairs and the audio input signals in differential pairs should be separated effectively through ground. In addition, the audio signals should be located away from the circuits of the power supply, RF, and antenna.
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The first audio channel can be used for the handset without requiring any audio amplifier. The output power for the differential ear output is typically 350 mW for a full-scale +3 dBm sine wave into a 32-ohm speaker. The second audio channel can be used for the hands-free without requiring any audio amplifier. The output pins are configured differently, with a rated output of 500 mW into an 8 speaker. Considerable current flows between the audio output pins and the speaker, and thus wide PCB traces are recommended (20 mils). MU509 provides 2.2V and 1.8V power source and 1mA of bias current internally for the microphones of both audio channels. Figure 3-18 Circuit diagram of the interface of the first audio channel
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Figure 3-19 Circuit diagram of the interface of the second audio channel
It is recommended that a TVS be used on the related interface, to prevent electrostatic discharge and protect integrated circuit (IC) components. Data only does not support the voice function.
3.8.2 Digital Audio

The MU509 provides one digital audio channels (Data only doesnt support the voice function). Table 3-15 lists the signals on the digital audio interface. Table 3-15 Signals on the digital audio interface Pins
5 6 7 8
Name
PCM_SYNC PCM_DIN PCM_DOUT PCM_CLK
Description
PCM interface sync PCM I/F data in PCM I/F data out PCM interface clock
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The MU509 PCM interface enables communication with an external codec to support hands-free applications; linear, -law, and a-law codecs are supported. The auxiliary codec port operates with standard long-synchronization timing and a 128 kHz clock. The PCM_SYNC runs at 8 kHz with a 50% duty cycle. Most -law and a-law codecs support the 128 kHz PCM_CLK bit clock. Hands-free applications Standard long-synchronization timing; 128 kHz clock Supports linear, -law, and a-law codecs AUX_PCM_SYNC runs at 8 kHz with 50% duty cycle Figure 3-20 Circuit diagram of the interface of the PCM
It is recommended that a TVS be used on the related interface, to prevent electrostatic discharge and protect integrated circuit (IC) components. Data only edition does not support the voice function.
Primary Mode
On Primary mode MU509 provides a 16-bit linear or 8-bit A-law or -law, with shortsync and 2.048MHz clock (on the PCM_CLOCK pin). Both Master and Slave mode are allowed.
Auxiliary Mode
On Auxiliary mode MU509 provides only 8-bit A-law or -law with padding, with long-sync and 128KHz clock (on the PCM_CLOCK pin). Only Master mode is allowed.
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RF Specifications
4
Operating Frequencies Conducted RF Measurement Conducted Rx Sensitivity and Tx Power Antenna Design Requirements
RF Specifications
This chapter describes the RF specifications of the MU509 module, including:
4.2 Operating Frequencies

Table 4-1 shows the RF bands supported by MU509. Table 4-1 RF bands Operating Band
UMTS 2100 (Band I) UMTS 1900 (Band II) UMTS 900 (Band VIII) UMTS 850(Band V) GSM 850 GSM 900 GSM 1800(DCS) GSM 1900(PCS)
Tx
19201980 MHz 18501910 MHz 880915 MHz 824849MHz 824849 MHz 880915 MHz 17101785 MHz 18501910 MHz
Rx
21102170 MHz 19301990 MHz 925960 MHz 869894 MHz 869894 MHz 925960 MHz 18051880 MHz 19301990 MHz
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RF Specifications
4.3 Conducted RF Measurement

4.3.1 Test Environment
Test instrument: R&S CMU200 Power supply: KEITHLEY 2306 RF cable for testing: L08-C014-350 of DRAKA COMTEQ or Rosenberger Cable length: 29 cm Compensation for WCDMA 850 MHz or WCDMA 900 MHz: 0.6 dB Compensation for WCDMA 2100 MHz or WCDMA 1900 MHz: 0.8 dB
The compensation for different frequency bands relates to the cable and the test environment. The instrument compensation needs to be set according to the actual cable conditions.
4.3.2 Test Standards

Huawei modules meet all 3GPP test standards relating to both 2G and 3G. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed.
4.4 Conducted Rx Sensitivity and Tx Power

4.4.1 Conducted Receive Sensitivity
The conducted receive sensitivity is a key parameter that indicates the receiver performance of MU509. The conducted receive sensitivity refers to the weakest signal that the module at the antenna port can receive. The BER must meet the 3GPP protocol requirements in the case of the minimum signal. The 3GPP Protocol Claim column in Table 4-2 lists the required minimum values, and the Test Value column lists the tested values of MU509. Table 4-2 MU509 conducted Rx sensitivity (Unit: dBm) Item 3GPP Protocol Claim Test Value2 MU509
GSM850 (2.43%1) GSM900 (2.43%) GSM1800 (2.43%) <102 <102 <102 109 109 109
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RF Specifications
Item
3GPP Protocol Claim
Test Value2 MU509
GSM1900 (2.43%) W2100 (0.1%) W1900 (0.1%) W900 (0.1%) W850 (0.1%)
<102 <106.7 <104.7 <104.7 <103.7
107 109 108 110 110
1. % = Bit Error Rate or Block Error Rate. 2. The test values are the average of some test samples.
4.4.2 Conducted Transmit Power

The conducted transmit power is another indicator that measures the performance of MU509. The conducted transmit power refers to the maximum power that the module tested at the antenna port can transmit. According to the 3GPP protocol, the required transmit power varies with the power class. Table 4-3 lists the required ranges of the conducted transmit power of MU509. The tested values listed in the Test Value column must range from the minimum power to the maximum power. Table 4-3 MU509 conducted Tx power (Unit: dBm) Item Minimum Power Required in the 3GPP Protocol
31 31 28 28 21 21 21 21
Maximum Power Required in the 3GPP Protocol

35 35 32 32 25 25 25 25
Test Value MU509

32.5 32.5 29.5 29.5 23 23 23 23
GSM850 GSM900 GSM1800 GSM1900 W2100 W1900 W900 W850
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RF Specifications
4.5 Antenna Design Requirements

4.5.1 Antenna Design Indicators
Antenna Efficiency
Antenna efficiency is the ratio of the input power to the radiated or received power of an antenna. The radiated power of an antenna is always lower than the input power due to the following antenna losses: return loss, material loss, and coupling loss. The efficiency of an antenna relates to its electrical dimensions. To be specific, the antenna efficiency increases with the electrical dimensions. In addition, the transmission cable from the antenna port of MU509 to the antenna is also part of the antenna. The cable loss increases with the cable length and the frequency. It is recommended that the cable loss be as low as possible, for example, U.FL-LP-088 made by HRS. The following antenna efficiency (free space) is recommended for MU509 to ensure high radio performance of the module: Efficiency of the master antenna > 40% (4 dB)
S11 or VSWR
S11 (return loss) indicates the degree to which the input impedance of an antenna matches the reference impedance (50 ohm). S11 shows the resonance feature and impedance bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector analyzer. The following S11 values are recommended for the antenna of MU509: S11 of the master antenna < 6 dB
Polarization
The polarization of an antenna is the orientation of the electric field vector that rotates with time in the direction of maximum radiation. The linear polarization is recommended for the antenna of MU509.
Radiation Pattern
The radiation pattern of an antenna reflects the radiation features of the antenna in the remote field region. The radiation pattern of an antenna commonly describes the power or field strength of the radiated electromagnetic waves in various directions from the antenna. The power or field strength varies with the angular coordinates ( and ), but is independent of the radial coordinates. The radiation pattern of half wave dipole antennas is the best for wireless terminals. The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal plane, and the incident waves of base stations are often in the horizontal plane. For this reason, the receiving performance is optimal. The following radiation patterns are recommended for the antenna of MU509: Master antenna: omnidirectional
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RF Specifications
Gain and Directivity

The radiation pattern of an antenna represents the field strength of the radiated electromagnetic waves in all directions, but not the power density that the antenna radiates in the specific direction. The directivity of an antenna, however, measures the power density that the antenna radiates. Gain, as another important parameter of antennas, correlates closely to the directivity. The gain of an antenna takes both the directivity and the efficiency of the antenna into account. The appropriate antenna gain prolongs the service life of relevant batteries. The following antenna gain is recommended for MU509: Gain of the master antenna 2.5 dBi
The antenna consists of the antenna body and the relevant RF transmission cable. Take the RF transmission cable into account when measuring any of the preceding antenna indicators. Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, Pulse, etc.
4.5.2 Interference
Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module. To guarantee high performance of the module, the interference sources on the user board must be properly controlled. On the user board, there are various interference sources, such as the LCD, CPU, audio circuits, and power supply. All the interference sources emit interference signals that affect the normal operation of the module. For example, the module sensitivity can be decreased due to interference signals. Therefore, during the design, you need to consider how to reduce the effects of interference sources on the module. You can take the following measures: Use an LCD with optimized performance; shield the LCD interference signals; shield the signal cable of the board; or design filter circuits. Huawei is able to make technical suggestions on radio performance improvement of the module.
4.5.3 GSM/WCDMA Antenna Requirements

The antenna for MU509 must fulfill the following requirements: GSM/WCDMA Antenna Requirements
Frequency range Depending on frequency band(s) provided by the network operator, the customer must use the most suitable antenna for that/those band(s)
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RF Specifications
GSM/WCDMA Antenna Requirements

Bandwidth 70 MHz in GSM850 80 MHz in GSM900 170 MHz in DCS 140 MHz PCS 70 MHZ in WCDMA850 80 MHz in WCDMA900 140 MHz in WCDMA1900 250 MHz in WCDMA2100 band Gain Impedance Input power Gain < 3dBi 50 Ohm > 33dBm(2 W) peak power in GSM > 24dBm Average power in WCDMA VSWR absolute max VSWR recommended <= 10:1 <= 2:1
Furthermore if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC requirements: This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-users must be provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the UC864-E/G/WD /WDU module. Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating configurations.
4.5.4 Radio Test Environment

The antenna efficiency, antenna gain, radiation pattern, total radiated power (TRP), and TIS can be tested in a microwave testing chamber. Huawei has a complete set of OTA test environments (SATIMO microwave testing chambers and ETS microwave testing chambers). The testing chambers are certified by professional organizations and are applicable to testing at frequencies ranging from 380 MHz to 6 GHz. The test items are described as follows:
Passive Tests
Antenna efficiency Gain Pattern shape Envelope correlation coefficient
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RF Specifications
Active Tests
TRP: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems TIS: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems Figure 4-1 shows the SATIMO microwave testing chamber. Figure 4-1 SATIMO microwave testing chamber
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Electrical and Reliability Features

This chapter describes the electrical and reliability features of the interfaces in the MU509 module, including: Extreme Working Conditions Working and Storage Temperatures and Humidity Power Supply Features Reliability Features EMC and ESD Features
5.2 Extreme Working Conditions
Table 5-1 lists the extreme working conditions for the MU509 module. Using the MU509 module beyond these conditions may result in permanent damage to the module. Table 5-1 Extreme working conditions for the MU509 module Symbol
VBAT VCOIN VI
Specification
External power voltage Input voltage of standby power for the RTC Data pin voltage
Minimum Value
0.4 2.0 0.4
Maximum Value
5.0 3.15 3.3
Unit
V V V
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5.3 Working and Storage Temperatures and Humidity

Table 5-2 lists the working and storage temperatures and humidity for the MU509 module. Table 5-2 Working and storage temperatures and humidity for the MU509 module Specification
Normal working temperatures [1] Extreme working temperatures [2] Ambient temperature for storage Moisture
Minimum Value
20 30 to 20 40 5
Maximum Value
+70 +70 to +75 +80 95
Unit
C C C %
[1]: When the MU509 module works at this temperature, all its RF indexes comply with the 3GPP TS 45.005 specifications. [2]: When the MU509 module works at this temperature, certain RF indexes do not comply with the 3GPP TS 45.005 specifications.
5.4 Electrical Features of Application Interfaces

Table 5-3 lists electrical features (typical values). Table 5-3 Electrical features of application interfaces Parameter
VIH VIL Ileak VOH VOL IOH
Description
High-level input voltage Low-level input voltage Input leakage current High-level output voltage Low-level output voltage High-level output current
Minimum Value
0.65*VDD_PX 0.3 0.2 VDD_PX 0.45 0 1.5
Maximum Value
VDD_PX +0.3 0.35* VDD_PX 0.2 VDD_PX 0.45
Unit
V V uA V V mA
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Parameter
IOL
Description
Low-level output current
Minimum Value
Maximum Value
1.5
Unit
mA
5.5 Power Supply Features

5.5.1 Input Power Supply
Table 5-4 lists the requirements for input power of the MU509 module. Table 5-4 Requirements for input power of the MU509 module Parameter
VBAT
Minimum Value
3.3
Typical Value
3.8
Maximum Value
4.2
Ripple
< 50 mVp-p (0 Hz to 2.5 GHz)
Unit
V
VCOIN
1.5
3.0
3.25
< 30 mVpp
Figure 5-1 lists the Power Supply During Burst Emission Figure 5-1 Power Supply During Burst Emission
The VBAT Minimum Value must be guaranteed during the burst (with 2.75A Peak in GSM, GPRS or EGPRS mode).
Table 5-5 Requirements for input current of the MU509 module Power
3.8 V
Peak (Maximum)
2750 mA1
Normal (Maximum)
1100 mA
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5.5.2 Power Consumption

The power consumptions of MU509 in different scenarios are respectively listed in Table 5-6,Table 5-7 and Table 5-8. T The power consumption listed in this section is tested when the power supply of MU509 module is 3.8V. Typical values are measured at room temperature, and minimum and maximum values are measured over the entire operating temperature range. Table 5-6 Averaged standby DC power consumption Description Bands Test Value Uni ts Notes/Configuration
Standby current consumption with Sleep mode activate d- Suspend (assumes USB bus is fully suspended during measurements) HSDPA / WCDMA GSM/ GPRS / EDGE HSDPA / WCDMA UMTS bands GSM bands UMTS bands GSM bands 4 4 75 mA mA mA DRX cycle = 8 (2.56 s) MFRM = 5 (1.175 s) Module power up and idle DRX cycle = 8 (2.56 s) 75 mA Module power up and idle MFRM = 5 (1.175 s)
GSM/ GPRS / EDGE
Low Power Mode (LPM) / Offline Mode RF disabled but module is operational Not supported mA State is entered when Watcher shuts down / turns off the radio. LPM is the lowest possible (rock bottom) state in Sleep mode.
Standby current consumption with Sleep mode deactivated-Idle (assumes USB bus is fully suspended during measurements)
Table 5-7 DC power consumption (HSPA/WCDMA) Description

WCDMA
Band
Band I (IMT2100)
Test Value
295 320 535
Units
mA
Power (dBm)
1 dBm Tx Power 10 dBm Tx Power 24 dBm Tx Power
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Description
Band
Band II (PCS 1900)
Test Value
300 330 555
Units
mA
Power (dBm)
Band V (850M)
280 310 570
mA
Band VIII (900M)
190 310 540
mA
HSDPA
Band I (IMT2100)
315 340 550
mA
Band II (PCS 1900)
320 345 540
mA
Band V (850M)
305 328 575
mA
Band VIII (900M)
200 320 540
mA
1d Bm Tx Power 10 dBm Tx Power 24 dBm Tx Power
Table 5-8 DC power consumption (GSM/GPRS/EDGE) Description

GPRS850
Test Value
310 470 690 165 250 410
Units
mA
PCL
5
Configuration
1 Up/1 Down 2 Up/1 Down 4 Up/1 Down
mA
10
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Description
GPRS900
Test Value
290 440 625 155 235 380
Units
mA
PCL
5
Configuration
mA
10
GPRS1800
180 290 460 110 145 185
mA
mA
10
GPRS1900
215 315 450 135 195 285
mA
mA
EDGE850
210 320 410 126 166 223
mA
mA
15
EDGE900
185 285 375 115 155 205
mA
mA
15
EDGE1800
175
mA
1 Up/1 Down
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Description
Test Value
265 345 110 145 185
Units
PCL
Configuration
2 Up/1 Down 4 Up/1 Down
mA
10
EDGE1900
176 255 322 117 148 186
mA
mA
10
In idle mode, the module is registered to the network, USB bus is active, and no voice or data call connection is ongoing. The above values are the average of some test samples.
5.6 Reliability Features

Table 5-9 lists the test conditions and results of the mechanical reliability of the MU509 module. Table 5-9 Test conditions and results of the mechanical reliability of the MU509 module Item
Low-temperature storage High-temperature storage Low-temperature working High-temperature working
Test Condition
Temperature: 402C Test duration: 24 h Temperature: 852C Test duration: 24 h Temperature: 302C Test duration: 24 h Temperature: 752C Test duration: 24 h
Standard
IEC60068
IEC60068
IEC60068
IEC60068
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Item
Damp heat cycling
Test Condition
High temperature: 552C Low temperature: 252C Humidity: 95% Repetition times: 4 Test duration: 12 h + 12 h
Standard
IEC60068
Temperature shock
Low temperature: 402C High temperature: 852C Temperature change interval: < 30s Test duration: 15 min Repetition times: 100
IEC60068
Salty fog test
Temperature: 35C Density of the NaCl solution: 51% Spraying interval: 8 h Duration of exposing the module to the temperature of 35C: 16 h
IEC60068
Sine vibration
Frequency range: 5 Hz to 200 Hz Acceleration: 10 m/s2 Frequency scan rate: 1 oct/min Test period: 3 axial directions. Five circles for each axial direction.
IEC60068
Shock test
Half-sine wave shock Peak acceleration: 300 m/s2 Shock duration: 11 ms Test period: 6 axial directions. One shock for each axial direction.
IEC60068
Clash test
Half-sine wave Peak acceleration: 180 m/s2 Pulse duration: 6 ms Repetition time: 6 directions. 1000 times for each direction.
IEC60068
Drop test
First case: 0.3 m in height. Drop the MU509 module on the marble terrace with one surface facing downwards twice. Six surfaces should be tested. Second case: 0.8 m in height. Drop the MU509 module on the marble terrace with one surface facing downwards twice. Six surfaces should be tested.
IEC60068
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5.7 EMC and ESD Features

EMC tests have to be performed on the application as soon as possible to detect any potential problems. When designing, special attention should be paid to the following: Possible harmful emissions radiated by the application to the RF receiver in the receiver band. ESD protection is mandatory on all signals which are externally accessible Typically, ESD protection is mandatory for the following:

SIM (if accessible from outside) Serial link USB Audio
Length of the SIM interface lines (preferably <10cm). EMC protection on audio input/output (filters against 900MHz emissions). Biasing of the microphone inputs. Ground plane: HUAWEI Wireless recommends a common ground plane for analog/digital/RF grounds. A metallic case or plastic casing with conductive paint is recommended, except for the area around the antenna.
The HUAWEI MU509 Embedded Module does not include any protection against over voltage.
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Mechanical Specifications
6
Nameplate
This chapter describes the following aspects of the MU509 module: Dimensions and interfaces
6.2 Dimensions and interfaces

6.2.1 Dimensions and interfaces of MU509
The dimensions of MU509 are 30 mm (length) 30 mm (width) 2.6mm (height). Figure 6-1 shows the dimensions of MU509 in details. Figure 6-1 Dimensions of MU509
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6.2.2 Dimensions of the LGA Connector
6.3 Nameplate
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The picture mentioned above is only for reference. Please contact us for more details about the nameplate. Make the film according to the drawing. The silk-screen should be clear, without burrs, and dimension should be accurate. This nameplate shouldnt be covered by film. The material and surface finishing and coatings which used have to make satisfied with the EU WEEE and RoHS directives. The label must be heated up for 20-40s and able to endure the high temperature of 260 degree. And the color of the material of the nameplate cant change.
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Appendix: Acronyms and Abbreviations

Acronym or Abbreviation
WCDMA CE CS CSD DC DCE DMA DTE EIA EMC ESD EU FCC FDD-TDMA GMSK GPRS ISO LCP LDO LED MCP
Expansion
Wideband CODE division multiple access European Conformity Coding Scheme Circuit Switched Data Direct Current Data Circuit-terminating Equipment direct memory access Data terminal Equipment Electronic Industries Association Electromagnetic Compatibility Electrostatic Discharge European Union Federal Commnications Commission Frequency Division Duplexingtime Division Multiple Access Gaussian MinimumSshift Keying General Packet Radio Service International Standards Organization Liquid Crystal Polyester Low-Dropout Light-Emitting Diode Multi-chip Package
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Acronym or Abbreviation
NTC PBCCH PCB PDU RF RoHS RTC SIM TTL TVS UART VSWR
Expansion
Negative Temperature Coefficient Packet Broadcast Control Channel Printed Circuit Board Protocol Data Unit Radio Frequency Restriction of the Use of Certain Hazardous Substances Real-time Clock Subscriber Identity Module Transistor-transistor Logic Transient Voltage Suppressor Universal Asynchronous Receiver-Transmitter Voltage Standing Wave Ratio
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Huawei Mu509 Hsdpa Lga Module Hardware Guide - (v100r001b01 - 01, English) - 20101112

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