Process defects can be a thing of the Past

MTA International and Productronica will both be offering the Process Advice and Lead-Free Defect Clinic. Hosted by Global SMT & Packaging magazine and sponsored by Baler Zinn, Thermo Scientific and DAGE, we hope to make your production trouble free. Basically, during the two shows we will be offering free advice on production problems, specification issues and solutions on testing. Just bring your problem board assemblies and let us take a look for you. You could also win interactive CD-ROMs on lead-free and a copy of Practical Guide to X-Ray Inspection from the SMTA Bookstore. Lets take a look at some recent issues we have examined for clinic visitors and customers. Secondary reflow failure of lead-free joints Figure 1 shows separation of J-lead terminations with lead-free solder. Separation occurred when the previously reflowed board had been exposed at a temperature of 170/180C. Large boards that can warp and larger components tend to suffer more from the strain on the corner terminations during double-sided reflow or during wave soldering. This is not sufficient temperature to reflow the bulk of the leadfree solder joints. Secondary reflow can cause the joint interface to reflow at lower temperatures if it has been contaminated with lead. This can occur during the changeover from 90/10 tin/lead plating on component terminations. Very small amounts of lead at the interface of the joint

are sufficient for the joint to reflow at this lower temperature. This issue was seen in the early days of lead-free introduction in Japan and in some facilities in Europe. Figure 2 is of a gull wing device where you can see the lead and part of the joint has separated from the pad. This is best indicated by the difference in density of the solder coverage on the pad surface. Copper dendrites/surface corrosion Figures 3, 4 and 5 show copper dendrites formed on the surface of printed circuit board assemblies. In each case they lead to intermittent failures in the field. They are not specifically lead-free process related but can occur if the correct controls are not maintained in a manufacturing facility, some engineers have reported this failure mode in lead-free when moving to VOC free fluxes. They will occur with a tin/lead and lead-free process and need to be analysed to find the root cause of the problem. The examples show the formation of a copper dendrite/fern between two conductors. This fault may occur when flux residues remain on the board surface and are then subjected to high temperature and humidity. A circuit with a voltage applied of 5-10 volts can then allow the formation of a conductive path on or through the moisture layer. A copper dendrite often creates an intermittent fault which can be very difficult to pinpoint. One of the examples shown was seen under the solder mask coating hence the contamination was from the printed board manufacture stage

and not assembly. Contamination testing and surface insulation resistance (SIR) assessment are two techniques often used to monitor and control the levels of harmful contamination on finished products to help avoid the possibility of corrosion.

Figure 3. Copper dendrite/fern between two conductors.

Figure 4. Close-up of Figure 3.

Figure 1. X-ray showing separation of J-lead terminations.

Figure 2. X-ray showing leads of a gullwing device separated from the pad.

Figure 5. Close-up of Figure 3.

Bob Willis

Process defects can be a thing of the past

Global SMT & Packaging - August 2007

www.globalsmt.net

Process defects can be a thing of the Past Contamination that causes this failure mode is not only from the flux, it can come from the cleanliness of the printed board prior to use. It can also be caused by the design of the board, the way it is mounted in a product and exposure to changes in temperature and humidity. Incomplete pin in hole reflow Figures 6 and 7 show through-holeconnector joints produced by intrusive reflow with tin/zinc solder paste, which has been found in many trials to give a very poor visual appearance after reflow in air. In this case, the solder joint has formed, but many of the paste particles have not reflowed and coalesced fully into the joint. This can occur when there is too long a delay in the soak period of reflow prior to reaching reflow temperature, which can exhaust the protective layer provided by the paste. It can of course also be due to the joint not reaching reflow temperature, but unlikely as this is a lower temperature alloy. The problem can also be related to the reflow of this paste in air. Although paste suppliers offer this alloy for reflow in air many companies have found nitrogen necessary to get the best results. The profile used did meet the recommendation of the supplier. Mechanically the joints were also sound. The second example shows the same type of defect on a pin using tin/silver/ copper paste. Cracking in BGA solder joints Figures 8 and 9 show balls separated from a reflowed BGA that has been mechanically removed from the surface of a PCB. The joints on the board were questioned after environmental testing showed intermittent electrical results with cracking suspected. X-ray and optical inspection can often find it difficult to determine these types of faults. Using a dye penetrant fluid to detect cracks on a board prior to breaking off the BGA can be very revealing. The so called Dye and Pry test is often used for joint assessment to quickly but destructively assess joints. Further information on the method and the type of results expected are featured on the SMART web site. The first example illustrates the test using a yellow dye showing 75% coverage, virtually all the joint has cracked away from the pad. The red dye used on the second example shows less than 10% crack propagation but in this case under the pad on the surface of the board. Temperature cycling, vibration or drop testing can show up different failure modes. Bear in mind that although lead-free alloys are stronger than tin/lead, mechanical shock can be an issue. Bob Willis will be running his Process Advice & Defect Clinic at SMTA International, Orlando, Florida, in October and Productronica, Germany, in November, sponsored by Global SMT & Packaging magazine. Bob is a process engineer providing engineering support in conventional and surface mount assembly processes including lead-free manufacture. He runs production lines for suppliers at exhibitions and also provides seminar and workshops for engineers worldwide. These complement his own hands on site company workshops and failure analysis service. For further information on how Bob may be able to support your staff with on line consultancy go to www.ASKbobwillis.com

Free Process Consulations

Attending SMTA International? Take advantage of the free Process Advice & Defect Clinic being held at booth #703. Bring your board assemblies, defects and process problems for examination and discussion.

Figure 6. Through-hole connector joint produced by intrusive reflow with tin/zinc solder paste.

Figure 8. Dye and Pry test on a separated ball from a BGA that has been mechanically removed from the surface of a PCB shows that about 75% of the joint has cracked away from the pad.

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Figure 7. Intrusive reflow with tin/zinc solder paste can lead to a very poor visual appearance after reflow in air. Figure 9. Red dye in this example shows less than 10% crack.

www.globalsmt.net

Global SMT & Packaging - August 2007