SYSTEM AND METHOD FOR GENERATING A TOPOGRAPHY MAP

Author(s): Orbotech Ltd.

Andrei BRUNFELD Ilan LAVER Gregory TOKER Victor TSINKER

IP.com number: IPCOM000008493D IP.com Electronic Publication: June 18, 2002

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[663.V250701]

System and Method for Generating a Topography Map

ABSTRACT [0001] Apparatus for inspecting object including a scanner scanning a spot of

illumination across a surface to be inspected, an optical system receiving a reflection of the spot and projecting it onto an array of sensors, and a height calculator calculating a height of the surface for a multiplicity of locations on the object, each calculation functionally related to a position of the spot on said array.

FIELD OF INVENTION [0002] The present invention generally relates to apparatus and methods for

generating a topography map of a surface, and more particularly to optical systems employed to generate topography maps used in surface inspection applications. BACKGROUND OF THE INVENTION [0003] It is well known to measure distances using optical apparatus. A typical

application of optical distance measurement apparatus is to systematically acquire distance measurements and to construct a topographical map of a surface from the measurements. Such maps are used, for example, in the inspection of assembled or unassembled printed circuit boards, flat panel displays, ball grid array substrates and similar surfaces. Other uses optical distance measurement include non-contact profiling the shape of automobile car bodies and other automotive parts, surface digitization in modeling of medals, sculptures, automotive bodies, quality inspection, dimensional metrology and other suitable applications. [0004] Some conventional height profiling and mapping systems employ one-

dimensional or two-dimensional digital sensor arrays, for example CCD and CMOS sensors. A point or a linear portion of a surface is illuminated, and a height profile is 1

calculated, typically by means of triangulation, as a function of which sensor elements are impinged upon by a reflection of the illumination off the surface being profiled. A full map of the surfaceis generated by acquiring a succession of profiles, for example by scanning the illuminated portion over the entire surface. Conventional systems suffer from one or more of the following drawbacks: inadequate resolution; limited size of the area that can be mapped; and limited speed at which the topography of a surface can be mapped.

SUMMARY OF THE INVENTION [0005] The present invention seeks to provide improved high-speed apparatus for

generating a high-resolution topographical map of a surface, particularly a topographical map that is suitable for inspecting surfaces for the presence of defects and for dimensional metrology. [0006] In accordance with a general aspect of the invention there is provided a

scanner scanning a spot of illumination across a surface to be inspected, an optical system receiving a reflection of the spot and projecting it onto a sensor, and a height calculator calculating a height of the surface at a multiplicity of locations thereon, as a function of a position of the spot on the sensor. [0007] In accordance with an embodiment of the invention, the sensor includes an

array of sensor elements, each sensor element outputting a signal indicative of the strength of light impinging thereupon. A sampler periodically samples the signal output by each of the sensor elements. Each sensor element is indicative, by triangulation, of a height of the surface. At each sampling, the measured height is correlated to a lateral location of the spot as it is scanned across the surface to produce a map of the surface. [0008] Various embodiments of the invention include one or more of the

following additional features: [0009] [0010] The spot of illumination is produced by a laser. The scanner is a polygon scanner, a galvanometer, an acousto-optical

deflector or other suitable scanner.

[0011]

The spot is scanned in two directions Alternatively the spot is repeatedly

scanned along a first axis while simultaneously a mechanical transport provides relative displacement between the object to be inspected and the scanning head in a direction being not parallel to the first axis. [0012] signal. [0013] The sensor elements are linear in shape. Alternatively, the respective Each of the sensor elements are photodiodes, photoresistors,

photomultipliers or any other sensors suitable for transforming light into an electrical

photosensitive surfaces of the sensor are round, square, or any other suitable shape, and light guides or other suitable optics are provided to collect light along a generally linear region and to guide it onto the photosensitive surface. [0014] [0015] Each of the sensor elements outputs an analog signal. The sampler includes analog to digital circuitry periodically sampling the

analog signal output by one or more of the sensors and generating a digital indication of the height at the instant in time that the sensors are sampled. [0016] A time counter in the sampling circuitry is employed to generate

position information along the axis of scanning corresponding to a measured height of the surface at the moment sampled. [0017] Data-reduction techniques are employed so that only a selected number

of analog signals are converted into digital signals used in the generation of the digital indicator of height. [0018] the objects. [0019] Still other general aspects of the invention relate to methods for fabricating Additional general aspects of the invention relate to methods for

inspecting objects, such as electrical circuits, employing apparatus to profile surfaces of

articles of manufacture, such as electrical circuits, employing an inspection step in which a profile map of the surface of the article is inspected in order to ascertain the presence of defects in the article.

[0020]

Additional features of the invention will be understood from the following

detailed description and accompanying drawings.

DESCRIPTION OF THE INVENTION [0021] Reference is made to Fig. 1, seen below, which is a simplified schematic

diagram of a system for generating a surface topography map in accordance with the invention. In the embodiment of the invention seen in Fig. 1, the system includes a scanner scanning a spot of light across a surface to be topographically mapped, a linear transport subsystem providing relative displacement between the scanned spot and the surface to be mapped in the cross-scan direction, optics receiving light reflected from the surface as the spot of light is scanned across the surface, and a sensor comprising an array of elongated high-speed parallel photosensitive analog detectors. In the embodiment seen in Fig. 1, the photodetectors are elongated in the scan direction, however in other embodiments of the invention, the photodetectors are elongated transverse to scan direction. [0022] Suitable photodetectors include elongated photodiodes, lightguides with

elongated entrance and terminating in analog photodetectors, such as a photodiodes, photoresistors, photo-multiplier tubes, or other suitable analog photodetectors. It is appreciated that while an elongated detector arrangement is seen in Fig. 1, optics, such as a cylindrical lens, or other sutiable lightguides may be employed to direct light collected over an elongated path onto a photosensitive region of any suitable photodetector. The spot of light may be provided by a laser or other suitable light source, and the scanner may be a rotating polygon mirror, vibrating mirror, galvanometer, acousto-optical deflector or any other suitable scanning device. [0023] It is appreciated from Fig. 1 that when a laser spot is projected onto the

surface to be mapped, as it is scanned across the surface, a reflection of the spot, when passing through suitable optics, forms a moving point image in the plane of the sensor. As the image of the spot scans across the sensor, photocurrents are output by one or more of the photodetectors in the sensor.

[0024]

It is further appreciated that inasmuch as a spot is scanned across a

perfectly uniform surface, the sensor, scanner, optics and surface are configured and arranged so that an image of the spot on the photodetector array remains at a generally uniform height in the image plane such that only its lateral position along the length of the sensor changes as a result of scanning. Thus, due to the linear arrangement of the photodetector elements in the sensor seen in Fig. 1, inasmuch as the surface is of substantially uniform height, the image of the spot continuously impinges on the same photodetector element in the sensor to produce a uniform non-zero signal, notwithstanding noise. The other photodetector elements, which are not impinged upon by the image of the spot, output a generally null signal, notwithstanding noise. [0025] However, inasmuch as the surface being mapped is not perfectly uniform,

the height of the image of the spot on the sensor changes as a function of the height (or depth) of local non-uniformities on the surface, in addition to its translation across the sensor. Thus inasmuch as the surface is not uniform, the image of the spot impinges on different photodetector elements in the sensor, and each of the photodetector elements outputs a modulated non-uniform signal. The instantaneous strength of the signal output by each photodetector element in the sensor is a function of whether the spot impinges upon the particular photodetector element and the location of the spot on an element in the cross scan direction. [0026] Consequently, by sampling the signals output by each of the photodetector

elements at a particular instant in time, the height (or depth) of the surface at that instant of sampling is ascertained by triangulation by determining which photodetector element in the array is outputting the largest non-zero current. [0027] It is appreciated that by correlating the height which is found at a given

sampling instance to a location of the scanned spot in the scan direction, for example by timing or by measurement against a ruler, and by knowing the location of a surface to be inspected in the across scan direction, all three coordinates, X Y planar location and height, of the sampled surface point are determined and may be stored in memory. The collection of heights at a multiplicity of locations are combined to generate a topography map of the surface.

Fig. 1. Scanning Spot Triangulation With a Photodiode Array

Scanner

LASER

Photodiode array

Surface under inspection

Imaging lens

Scan Direction Cross - Scan (motion) Direction

Fig. 2. Photodiode Array Geometry

normalized outputs address line

Array of Photodetector elements

Parallel outputs and data reduction

Sensitive area Gap area

[0028]

Reference is made to Fig. 2 which is a diagram of an array of

photodetectors suitable for use in the system seen in Fig. 1, in accordance with the invention. Each element in the array corresponds to a height on the surface to be inspected. In the embodiment of the invention seen in Figs. 1 and 2, each of the photodetector elements outputs, in parallel, an analog signal, that over time, is indicative of when light reflected from the surface being inspected impinges on the element. Circuitry normalizes the analog signals and samples each of the signals at a predetermined time interval to determine which of the signals is being impinged upon by an image of the spot, and thereby determine the height of the surface, at the given instant in time that the sample is taken. The Circuitry outputs a digital indication of height at the sampled moment in time. [0029] Reference is made to Fig. 3 which is a diagram illustrating an array of

three photo-detectors in accordance with the invention, showing the path of an image of a spot on an array of photodetectors, as the spot is scanned across a non-uniform surface, and the corresponding signals output by each of the photodetectors. It is appreciated that

each of the photodetectors outputs a non-zero signal only when the image of the spot impinges on the photodetector. Path of Scanned Spot Image

FIG. 3
Photodetector Array

Photodetector Signals

[0030]

It is appreciated from Figs. 2 and 3 that typically there is a gap between

various elements of the photo-detector in the photodetector array.

Sampling Point

TIME

FIG. 4
6 5 4 3 2 1
Signal Sensor 3

Scan Path of Spot on Sensor Array as Scanned Over a Non-Uniform Surface

Defocused Spot

Signal Sensor 4 Respective Strengths of Signals 3 and 4 at Sampling Time Signal Sensor 5

Photo Current

Time

[0031]

Reference is made to Fig. 4 showing an arrangement of the invention in

which a scanning height detection system is arranged so that the image of the scanned spot is larger in diameter than the width of an individual photodetector element. In this embodiment, depending on the size of the spot relative to the width of a photodector element, the image of the spot impinges on a single photodetector element, or simultaneously on two or more adjacent photodetector elements. If the spot impinges on two or more photodetector elements simultaneously, then the sampling circuitry determines which photodetector elements are outputting the strongest signal and the actual height of the surface at the sampling interval is subsequently determined by interpolating between the relative strengths of the signals of two or more adjacent photodetector elements upon which the spot impinges.

[0032]

As seen in Fig. 4, at the moment in time that the system is sampled, the

spot impinges on both detectors 3 and 4, however because a larger portion of the area of the spot impinges on detector 4, the signal output by detector 4 is stronger than the signal output by detector 3. The difference between these relative outputs indicates that the height of the surface at the sampling point is greater than the height corresponding solely to detector 3, but less than the height corresponding solely to detector 4. [0033] Thus by interpolating between the relative strengths of adjacent

photodetector elements, for example using any suitable linear or non-linear interpolation algorithm, a value for the height of the surface at a sampling point can be determined to a higher degree of precision than possible if only the output of the strongest photo-detector is relied upon. In this manner it is possible to obtain enhanced resolution in the height dimension. [0034] It is appreciated that one of the advantages of the present system over

conventional topography map generators is that the system of the present invention provides for a significant data reduction at signal input because only a small number of non-zero signals need to be transmitted, along with their respective address, namely the number of the first of the group of photodetector elements outputting non-zero signals. Alternatively, it is possible to directly transmit the height as given by the number of the element with the strongest signal, or an interpolated height dimension as described hereinabove. In accordance with the embodiment of the invention seen in Figs. 3 - 4, the respective signal outputs of the photodetectors are normalized. This is accomplished, for example, by division of the signal strength of each detector element by its maximum signal in the group, so that the output analog signals occupy the full range of 0 1. With such normalization, it is possible to digitize the signal to a much lesser depth (smaller number of bits), than is possible without normalization, without impairing system resolution. [0035] It is appreciated that the above described system is extremely flexible and

scalable in the sense that resolution may be changed by altering the scanning speed or the sampling interval of the analog signal output by the photodetectors. The principal limits on resolution in the scan direction reside in the speed at which a spot can be scanned

10

across a surface and the response frequency of the photo-detectors. Although the length of a scanned line and speed of scanning are related to the length of the elongated elements forming the photodetector array, suitable optics may be used to compress a relatively long scan line onto a relatively short photodetector array. It is appreciated that the system described herein is capable of providing a surface topography map having a resolution in the scan direction that is substantially greater than is possible with conventional digital imagers employing CCD and CMOS sensors. [0036] Resolution in the height direction is limited primarily by the quantity of

stacked photodetectors, and/or by the degree of interpolation. Thus, resolution in the height dimension may be enhanced by projecting an image of the spot on the photodetectors which has a diameter larger than the width of an individual photodetector and then interpolating between the signals output by adjacent photodetectors. FIG. 5: A Stereo Profiling Configuration scanning laser beam

photodiode array

photodiode array

lens lens scan direction

[0037]

Reference is now made to Fig. 5 which shows a stereo profiling

configuration comprising twin-sensor triangulation. The embodiment shown in Fig. 5 employs a single scanning laser beam and twin detection systems disposed symmetrically 11

to the axis of scanning. This configuration generally is not affected by objects obscuring the field of view or by unevenness along the surface. Generally this embodiment provides improved accuracy relative to a single sensor system by averaging the height determination of each of the two sensor subsystems. As a result, the system seen in Fig. 5 provides accurate readings of the height even when the distribution of the reflected light is not symmetric. It is appreciated that non-symmetric light distribution is a relatively common occurrence along non-planar surfaces, and that such non-symmetric distribution typically impairs the accuracy of triangulation based height measurement systems. [0038] Reference is now made to Fig.6, which is an array of special-type of

photodetectors that may be used in the system described above, but arranged in an alternative configuration.

FIG 6

scan height direction

[0039]

As seen in Fig. 6, the array of photodetectors is arranged transversally

with respect to the direction of scanning. Suitable photodetectors include for example position sensitive devices (lateral-effect photodiodes) whose photocurrent is directly proportional to the spot position on the diode. In accordance with this embodiment of the invention, as a spot is scanned across the photodetector, a signal is output only when a spot impinges on a sensor. The value of the photodetector output corresponds to the height dimension, whereas the location of the photodetector element in the array provides the a location of the spot in the scan direction. [0040] In accordance with some embodiments of the invention, a topography map

generated using the apparatus described above may be employed to inspect object for 12

surface defects. Thus, the topograghy map may be used, for example, to optically inspect electrical circuits for various defects, including: the location of conductors deposited on the surface of an electrical circuit (the conductors being set off from the substrate); the depth of vias formed in electrical circuit substrates; the location and orientation of electronic components, such as semiconductor or integrated circuit components, on loaded printed circuit boards; the presence, location and quantity of solder adhering electronic components to loaded printed circuit boards; and the location and quantity of solder paste applied to printed circuit boards prior to adhering electronic components thereto. [0041] Additionally, in accordance with the present invention a process of

inspecting printed circuit boards employing the apparatus described above is integrated into the fabrication process of printed circuit boards. Thus, for example, a printed circuit board fabrication process includes the steps of depositing conductive members on a printed circuit board substrate and employing the above described apparatus to map the surface topography of the substrate. The topography map is then employed to ascertain conformance of the conductors to design specifications, check the substrate for the presence of defects on its surface. Defective boards are reworked or discarded. [0042] In another stage of electrical circuit fabrication, a solder paste is deposited

on a fabricated printed circuit board. The surface of the fabricated printed circuit board having solder paste deposited thereupon is profiled using the apparatus and methods described above, and the profile is inspected to ascertain defects in deposition of the solder paste. Defective boards are reworked or discarded. [0043] In still another stage of electrical circuit fabrication, electronic

components such as integrated circuits are assembled onto a fabricated printed circuit board. The surface topography of the fabricated printed circuit board bearing integrated circuits mounted thereupon is mapped using the apparatus and methods described above. The topography of the surface of the printed circuit board bearing electronic components is inspected to ascertain defects in the location, orientation and/or soldering of the electronic components. Defective boards are reworked or discarded.

13