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ILD2731M140
Integra
TECHNOLOGIES, INC. Silicon LDMOS FET High Power Gain Excellent thermal stability Gold Metal Gold Metal System Complete Gold System LDMOS with Gold Metal Gold Bond Wires Gold Package Metal Maximum Reliability Class AB Operation Specified with AB bias
Internal Impedance Matching Ease of Use Ultra Low Loss Design BeO Free Package Metal Based Epoxy Seal High Power RF Test / Fixture Broadband Matched to 50 (ohms) Temperature Compensated Bias Long-term Correlation 100% Device RF Screening No External Tuning required
150.0
160.0
170.0
180.0
190.0
200.0
210.0
Pout (W)
Part Number:
ILD2731M140
Integra
TECHNOLOGIES, INC. Min
--0.5 -55 -55 --
Parameter
Drain-Source Voltage Gate-Source Voltage Storage Temperature Range Operating Junction Temperature Range CW Operation Screen 'BD' = parameter qualified By Design.
Symbol
VDS VGS TSTG TJ --
Max
65 12 +150 +200 --
Units
V V C C --
Test Conditions
----Not rated for CW operation.
Parameter
Thermal Resistance Screen 'BD' = parameter qualified By Design.
Symbol
RTH(JC)
Min
--
Max
0.17
Units
C/W
Test Conditions
VDD=V1, IDQ=IDQ1, PW=PW1, DF=DF1, TF=255C, POUT=140W.
Parameter
DC Wafer Probe Wafer DC and RF Qualification Wire Bond Strength Pre-cap visual inspection Gross leak test
Symbol
------
Min
------
Max
------
Units
------
Test Conditions
Per Integra specification. Per Integra specification. Line monitor per Integra specification. Per Integra specification MIL-STD-750D, Method 1071.6, Test Condition C
Screen 'Q1' = parameter is qualified by assembly and test of 3 pieces minimum per wafer. Screen 'LM' = parameter is qualified by assembly line monitor.
Parameter
Drain-Source Breakdown Voltage Drain Leakage Current Operating Gate Voltage Gate Leakage Current
Symbol
BVDSS IDSS VGS IGSS
Min
65 -2.5 --
Max
-10 4.0 1.0
Units
V uA V uA
Test Conditions
IDS =10mA, VGS =0V, TF=255C VDS =32V, VGS =0V, TF=255C VDS =5V, ID=100mA, TF=255C VGS =10V, VDS =0V, TF=255C
Part Number:
ILD2731M140
Symbol
IRL PO ND ID D DIP --
Integra
TECHNOLOGIES, INC. Min
-18 140 38 10.0 -0.5 -30 --
Parameter
Input Return Loss Output Power Drain Efficiency Drain Current Pulse Amplitude Droop Delta Insertion Phase 3:1 Load Mismatch Stability
Max
-7 220 60 15.0 +0.5 +30 --
Units
dB W % A dB DEG --
Test Conditions
VDD=V1, IDQ=IDQ1, PW=PW1, DF=DF1, TF=TF1, PIN=PIN1, F=F1, F2, F3. VDD=V1, IDQ=IDQ1, PW=PW1, DF=DF1, TF=TF1, PIN=PIN1, F=F1, F2, F3. VDD=V1, IDQ=IDQ1, PW=PW1, DF=DF1, TF=TF1, PIN=PIN1, F=F1, F2, F3. VDD=V1, IDQ=IDQ1, PW=PW1, DF=DF1, TF=TF1, PIN=PIN1, F=F1, F2, F3. VDD=V1, IDQ=IDQ1, PW=PW1, DF=DF1, TF=TF1, PIN=PIN1, F=F1, F2, F3. VDD=V1, IDQ=IDQ1, PW=PW1, DF=DF1, TF=TF1, PIN=PIN1, F=F1, F2, F3. VDD=V1, IDQ=IDQ1, PW=PW1, DF=DF1, TF=TF1, PIN=PIN1, F=F1, F2, F3. Rotate 3:1 output VSWR through 360 phase. No oscillatory or pulse break-up characteristics allowed on detected output pulse. All non-harmonically related signals must be at least 65 dBc.
V1 = 32V; IDQ1 = 40mA; PW1 = 300us; DF1 = 10%, PIN1 = 14W. Test Frequencies: F1 = 2.7 GHz, F2 = 2.9 GHz, F3 = 3.1 GHz. TF1 = 255 = Device flange temperature. C Screen 'BD' = parameter qualified By Design.
ZIF ()
2.35 j5.64 2.31 j4.47 2.27 j3.53
ZOF ()
2.47 j4.83 2.59 j3.82 2.71 j3.20
Impedance Definition
Part Number:
ILD2731M140
Integra
TECHNOLOGIES, INC.
C F K I
D G B
Part Number:
ILD2731M140
Integra
TECHNOLOGIES, INC.
CONTACT FACTORY FOR RF TEST FIXTURE CAD DRAWING WITH CIRCUIT DIMENSIONS L:\Public\Controlled Documents\Controlled Drawings\RF Test Fixture Drawings\ILD2731M140 RF TEST FIXTURE REV A.dwg
Part Number:
ILD2731M140
Integra
TECHNOLOGIES, INC.
Vdd
32.0
U1 LM317
ADJUST
IPC75rev3 Schematic
OUT 5
8.05
Vdd C3 39pF
C13 10uF
6.80
C1 1.0uF
C2 39pF
18
18
R1 1K
3.44
18 1
R5 511
C4 1.0uF
C8 1.0uF
C18 1.0uF
18
1.71
3 3 3
R2 3.9K
R6 200
1.47
7
3.04
11 11
Vctrl L2 FB R8 150
3.04
8
C9 39pF
L1 5.5nH
16
R11 5.1
16
R3 3.9K
0.606
2 2 2
Q1 2N2222A
L3 FB R4 2.2K
3.04
12
C17 0.1uF
17
C5 39pF
R9 5.1
3.04
4
C15 12pF
16 16
RF out
M1 ILD2731M140
Part Number:
DEFINITIONS Data Sheet Status
Proposed Specification Preliminary Specification Product Specification
ILD2731M140
Integra
TECHNOLOGIES, INC.
This data sheet contains proposed specifications. This data sheet contains specifications based on preliminary measurements and data. This data sheet contains final product specifications.
Maximum Ratings
Stress above one or more of the maximum ratings may cause permanent damage to the device. These are maximum ratings only operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. Exposure to maximum values for extended periods of time may affect device reliability.
DISCLAIMER
Integra Technologies Inc. makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Integra Technologies Inc. assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Integra Technologies Inc. products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Integra Technologies Inc. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Integra Technologies Inc. for any damages resulting from such improper use or sale.